Growth of GaN and AlN thin films by laser induced molecular beam epitaxy

Hexagonal GaN and AlN thin films were grown by laser induced molecular beam epitaxy using Al or Ga metal as target material and N₂as nitrogen source. The films were deposited on sapphire (0001) and SiC (0001) substrates. Epitaxial growth of GaN has been achieved at 730°C and 10⁻³ mbar N₂ pressure. The AlN films were polycrystalline with predominant (0001) orientation.     

Preparation of Pt-PtOx thin films as electrode for memory capacitors

Pt-PtO_x thin films were prepared on Si(100) substrates at temperatures from 30 to 700°C by reactive r.f. magnetron sputtering with platinum target. Deposition atmosphere was varied with O₂/Ar flow ratio. The deposited films were characterized by X-ray diffraction, X-ray photoelectron spectroscopy and scanning electron microscopy. Resistively of the deposited films was measured by d.c. four probe method. The films mainly consisted of amorphous PtO and Pt₃O₄ (or Pt₂O₃) below 400°C, and amorphous Pt was increased in the film as a deposition temperature increased to 600°C. When deposition temperature was thoroughly increased, (111) oriented pure Pt films were formed at 700°C. Compounds included in the films strongly depended on substrate temperature rather than O₂/Ar flow ratio. Electrical resistivity of Pt-PtO_x films was measured to be from the order of 10⁻¹ Ω cm to 10⁻⁵ Ω cm, which was related to the amount of Pt phase included in the deposited films.     

Growth of columnar aluminum nitride layers on Si(111) by molecular beam epitaxy

Single crystalline aluminum nitride (AlN) thin films are deposited by molecular beam epitaxy (MBE) using thermally evaporated aluminum and RF-plasma excited nitrogen gas. In this paper we report on films grown on Si(111) at substrate temperatures of 800° with growth rates between 65 and 350 nm h⁻¹. All layers consist of hexagonal and exactly c-axis oriented AlN crystals with column-like structure. For the smoothest layers surface roughness (rms) around 1 nm is obtained. In the XRD-spectra (ω-scan) we have achieved a minimum FWHM of 0.4° (=25′) for the AlN(00.2) reflex. At maximum growth rates (350 nm h⁻¹) for AlN a transition zone of about 200 nm is formed with high defect density compared to the subsequent growth. For lower growth rates (65 nm h⁻¹) no transition zone exists. Application of a substrate nitridation leads to a partial loss of epitaxial relation between AlN layer and Si(111)-substrate.     

Structure-composition-property dependence in reactive magnetron sputtered ZnO thin films

Thin films of zinc oxide (ZnO) were prepared by dc reactive magnetron sputtering on glass substrates at various oxygen partial pressures in the range 1×10⁻⁴–6×10⁻³ mbar and substrate temperatures in the range 548–723 K. The variation of cathode potential of zinc target on the oxygen partial pressure was explained in terms of target poisoning effects. The stoichiometry of the films has improved with the increase in the oxygen partial pressure. The films were polycrystalline with wurtzite structure. The films formed at higher substrate temperatures were (0 0 2) oriented. The temperature dependence of Hall mobility of the films formed at various substrate temperatures indicated that the grain boundary scattering of charge carriers was predominant electrical conduction mechanism in these films. The optical band gap of the films increased with the increase of substrate temperature. The ZnO films formed under optimized oxygen partial pressure of 1×10⁻³ mbar and substrate temperature of 663 K exhibited low electrical resistivity of 6.9×10⁻² Ω cm, high visible optical transmittance of 83%, optical band gap of 3.28 eV and a figure of merit of 78 Ω⁻¹ cm⁻¹.     

The crystalline properties of nitrogen doped hydrogenated microcrystalline silicon thin films

The crystalline properties of nitrogen doped hydrogenated microcrystalline silicon thin films deposited by plasma enhanced chemical vapor deposition were studied. Gas phase doping density in the order of 10⁻² and 10⁻¹ leads to changes in the crystalline properties of the films. Raman scattering signals indicate that nitrogen doping causes a more significant reduction in crystallite size than does an increase in SiH₄ concentration. In addition, the size reduction occurs with a less significant increase in amorphous fraction volume than in the case of SiH₄ concentration increase. The N in the Si crystalline induces disorder or stress as a result of the higher electronegativity and smaller atomic size of N compared to Si. Thus, the crystallite size reduction is thought to occur to reduce the disorder in crystalline grain induced by doped nitrogen.     

(Fe,Ti) 16N2 films with high saturation magnetization prepared by facing target sputtering

(Fe,Ti)-N films with a Ti concentration of 10 at.% were prepared on Si(100) and NaCl substrates by facing targets sputtering. The effects of the nitrogen pressure (P_N) and the substrate temperature (T_s) on the formation of various (Fe,Ti)-N phases and their microstructures were investigated in detail. X-ray diffractometer and transmission electron microscope provided complete identification of the phases present in the films and the characterization of their microstructures. Films deposited at a lower P_N = 1 3 × 10⁻² Pa or a lower T_s = RT consist of mainly -phase. Films deposited at a higher P_N = 1.3 2 × 10⁻¹ Pa or a higher T_s = 200 °C contain a great many γ' and Fe₂N phases with a higher nitrogen content. When P_N = 4 7 × 10⁻² Pa and T_s = 100 150 °C, it is advantageous to the formation of ′' phase. These films exhibit a high saturation magnetization (M_s) up to the range of 2.3 2.5 T, which is larger than that of pure iron.     

Surface and electrical studies of CuO:V2O5 thin films

Results from the studies of multicomponent CuO:V₂O₅ bulk material and thermally evaporated thin films of highly conducting bulk composition prepared at different substrate temperatures are thus compared and discussed. The electronic conductivity is enhanced on increase in the substrate temperature T_s and reaches a maximum value of 12.3 × 10⁻⁶Ω⁻¹ cm⁻¹ for T_s = 423 K. X-ray photoelectron spectroscopy studies indicate an increase in the reduced states of vanadium and copper ions in going from the bulk glass to the thin film. Dynamic secondary-ion mass spectroscopy studies on thin films over a depth of 3000 Å show a strong dependence of T_s on the Cu-to-V intensity ratio. Even though stoichiometric values for thin films are achievable by varying the T_s, the oxidation states of Cu in these films are predominantly monovalent. The electrical behaviors of these materials and their thin film counterparts are finally being discussed in relation to the surface analysis data.     

Highly conducting indium tin oxide (ITO) thin films deposited by pulsed laser ablation

Highly conducting and transparent indium tin oxide (ITO) thin films were prepared on SiO₂ glass and silicon substrates by pulsed laser ablation (PLA) from a 90 wt.% In₂O₃-10 wt.% SnO₂ sintered ceramic target. The growths of ITO films under different oxygen pressures (P_O2) ranging from 1×10⁻⁴–5×10⁻² Torr at low substrate temperatures (T_s) between room temperature (RT) and 200°C were investigated. The opto-electrical properties of the films were found to be strongly dependent on the P_O2 during the film deposition. Under a P_O2 of 1×10⁻² Torr, ITO films with low resistivity of 5.35×10⁻⁴ and 1.75×10⁻⁴ Ω cm were obtained at RT (25°C) and 200°C, respectively. The films exhibited high carrier density and reasonably high Hall mobility at the optimal P_O2 region of 1×10⁻² to 1.5×10⁻² Torr. Optical transmittance in excess of 87% in the visible region of the solar spectrum was displayed by the films deposited at Po₂≥1×10⁻² Torr and it was significantly reduced as the P_O2 decreases.     

Preparation of strontium titanate thin films by mirror-confinement-type electron cyclotron resonance plasma sputtering

Using mirror-confinement-type electron cyclotron resonance (ECR) plasma sputtering method, strontium titanate (SrTiO₃) thin films have been prepared on Si and Pt/Ti/SiO₂/Si substrates at a low substrate temperature (below 450 K) in a low pressure (2.7×10⁻² Pa) environment of pure Ar and Ar/O₂ mixture. Prepared film surfaces were very smooth regardless of high deposition rate (8.5 nm/min). The composition ratio Sr/Ti of Sr to Ti in the films varied with the distance between the target and the substrate. All as-deposited films on Si substrates were found to be amorphous and were crystallized by post-deposition annealing using an electric furnace at 650 K, i.e. approximately 250 K lower than annealing for films obtained by conventional RF magnetron sputtering. Post-deposition annealing of these films using millimeter-wave radiation decreased the crystallization temperature to a value of 550 K. Furthermore, all as-deposited films on Pt/Ti/SiO₂/Si substrates by a plasma of Ar and O₂ gas mixture were found to be crystallized regardless of no substrate heating.     

Influence of conventional furnace and rapid thermal annealing on the quality of polycrystalline β-FeSi2 thin films grown from vapor-deposited Fe/Si multilayers

Thin films of polycrystalline β-FeSi₂ were grown on (100) Si substrates of high resistivity by electron beam evaporation of Si/Fe ultrathin multilayers and subsequent annealing by conventional vacuum furnace (CVF) and rapid thermal annealing (RTA) for 1 h and 30 s, respectively, in the temperature range from 600 to 900°C. X-ray diffraction, Raman spectroscopy, spectroscopic ellipsometry, resistivity and Hall measurements were employed for characterization of the silicide layers quality in terms of the annealing conditions. For the silicide layers prepared by CVF annealing, although the grain size increase with increasing the annealing temperature, the optimum temperature to obtain the higher material quality (carrier mobility of the order of 100 cm² Vs⁻¹ and carrier concentration of about 1 × 10¹⁷ cm⁻³) is about 700°C. At higher annealing temperatures, the quality of the material is degraded due to the presence of the oxide Fe₂O₃. In the case of the silicides prepared by RTA, the quality of the material is improved progressively with increasing the annealing temperature up to 900°C.     

Preparation of AlN thin films by nitridation of Al-coated Si substrate

AlN thin films have been grown on Al-coated Si(100) and Si(111) substrates by using nitridation in high-purity nitrogen ambient, where the Al layer was previously deposited on Si by ultra-high vacuum (UHV) electron beam evaporation. The temperature of nitridation was found to play an important role in the formation of AlN films. XRD results showed AlN films formed by nitridation at 1000°C for 30 min exhibited good crystallinity with the preferred orientation of (002) for both Si(111) and Si(100) cases. Other analysis techniques, like Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy have been used to evidence the formation and purity of the AlN films. Scanning electron microscope observations of the films revealed a closely-packed granular texture.     

High polysilicon TFT field effect mobility reached thanks to slight phosphorus content in the active layer

The paper deals with the effect of slightly phosphorus atoms introduced during deposition of polysilicon films. Polysilicon films are used as an active layer in thin film transistors (TFTs) fabricated on glass substrates at a maximum temperature of 600 °C.Three phosphorus atoms contents, determined by the value of the phosphine to silane ratio: Γ (3.7 × 10^− 7, 8 × 10^− 7, 26 × 10^− 6), are used to optimize the active layer quality. The in-situ doped layers induce a better stability of the electrical characteristics, a higher mobility and lower value of the threshold voltage for the slightly doped active layers [M. Zaghdoudi, M.M. Abdelkrim, M. Fathallah, T. Mohammed-Brahim and F. Le-Bihan Control of the weak phosphorus doping in polysilicon, Materials Science and Forum, Vols. 480–481 (2005) pp.305.]. The present work shows that the effect of slightly phosphorus content improves the quality of oxide/polysilicon interface and decreases the defects density. Degradation of electrical properties is shown to originate from the creation of defect at the channel-interface oxide and in the grain boundaries. The effect of temperature change on the electrical properties was studied and the behaviour was also analyzed.     

The effect of the isopoly tungstate anion on the composition and conductivity of polypyrrole composite films

The polypyrrole composite films were prepared by the electropolymerization of pyrrole from the aqueous solution containing isopoly tungstate (poly-W) and the chloride anion (Cl⁻) at various ratios. The film formation was traced by electrochemical quartz crystal microbalance, and the tungsten concentrations in the films were measured by the inductively coupled plasma spectroscopy. The electric conductivities of the films were measured by the four-point probe method. In the ratio of poly-W concentration to Cl⁻ concentration, ((poly-W)/Cl⁻)), higher than 1.26 × 10⁻² in the solution the concentration of tungsten in the films showed a constant value at 51 wt.% and the chloride anion was not included in the film. The conductivities of these films showed the constant value about 40 S cm⁻¹. In the ratio lower than (poly-W)/(Cl⁻) = 1.26 × 10⁻², the conductivity decreased with the decrease of poly-W concentration and the composite films consisted of two layers; the inner layer initially formed contained larger amount of tungsten than that of the outer layer.     

Characterization of TBP containing polysiloxane membrane/insulator/semiconductor structures for hexavalent chromium detection

A hexavalent chromium-sensitive EMIS sensor (electrolyte membrane insulator semiconductor sensor) is prepared by deposition of a tributylphosphate (TBP) ionophore-containing siloprene membrane on a Si/SiO₂/Si₃N₄ structure. The developed EMIS sensor was studied by means of impedance spectroscopy, capacitance–voltage, X-ray photoelectron spectrometry and FT-IR spectroscopy. From the flat-band shift of the EMIS structure, the nersntian response to the anionic species Cr₂O₇⁻ was demonstrated. The linear range of detection is 10^− 4 M to 10^− 1 M and the detection limit is 10^− 5 M. Sulfate and chloride anions are shown not to be interfering whereas carbonate ions present a pK^pot equal to 0.19.     

A comparative study of Co thin film deposited on GaAs (1 0 0) and glass substrates

The structural, magnetic and transport properties of Co/GaAs (1 0 0) and Co/glass thin films have been investigated. The structural measurements reveal the crystalline nature of Co thin film grown on GaAs, while microcrystalline nature in case of glass substrate. The film grown on GaAs shows higher coercivity (49.0 G), lower saturation magnetization (3.65 × 10⁻⁴) and resistivity (8 μΩ cm) values as compared to that on glass substrate (22 G, 4.77 × 10⁻⁴ and 18 μΩ cm). The grazing incidence X-ray reflectivity and photoemission spectroscopy results show the interaction between Co and GaAs at the interface, while the Co layer grown on glass remains unaffected. These observed results are discussed and interpreted in terms of different growth morphologies and structures of as grown Co thin film on both substrates.     

Atomic layer deposition growth of zirconium doped In2O3 films

Zirconium doped indium oxide thin films were deposited by the atomic layer deposition technique at 500 °C using InCl₃, ZrCl₄ and water as precursors. The films were characterised by X-ray diffraction, energy dispersive X-ray analysis and by optical and electrical measurements. The films had polycrystalline In₂O₃ structure. High transparency and resistivity of 3.7×10⁻⁴ Ω cm were obtained.     

Preparation and characterization of C60S16 and C70S48 thin films

In this study, we have investigated different methods for preparation of thin films of C₆₀ and C₇₀-sulfur compounds. Films of good quality were obtained by reaction of amorphous C₆₀ and C₇₀ films with a saturated sulfur solution in toluene at 40°C or with saturated sulfur vapour at a temperature of 140°C for several hours. The quality of the fullerene-sulfur films were strongly dependent on the microstructure of the initially deposited fullerene film and the synthesis temperature. X-ray diffraction analyses showed that both methods lead to the formation of films consisting of C₆₀S₁₆ and C₇₀S₄₈ (space groups C 2/c and Amm2, respectively). C₆₀S₁₆ films synthesised on Al₂O₃(012) and Si(100) substrates were texture-free while C₇₀S₄₈ films typically exhibited a preferential (100) orientation. The films were also characterised by Raman and IR- spectroscopy, which confirmed that the interactions between the fullerene molecules and the S₈ rings are weak. The fullerene-sulfur compounds were found to be unstable at high vacuum conditions. Both materials C₆₀S₁₆ and C₇₀S₄₈ are non-conductive at room temperature with conductivities less then 10⁻⁵ (Ω/cm).     

MBE growth and characterization of buried silicon oxide films on Si(100)

Silicon molecular beam epitaxy (Si-MBE) has been used to produce silicon oxide (SiO_x) films by evaporating Si on a heated Si(100) substrate in an ultra high vacuum system with an O₂ pressure of 10⁻⁶ to 10⁻⁴ mbar. Then the SiO_x films were overgrown with pure Si. The influence of the substrate temperature, the O₂ pressure and the Si deposition rate on the oxygen content in the SiO_x films and on the crystalline quality of the Si top-layer was investigated by Rutherford backscattering spectrometry and ion channeling. Epitaxial growth of the Si top-layer was observed up to a maximum concentration of ≈20 at.% oxygen content in the SiO_x film. Cross-sectional transmission electron microscopy shows that the structure of the SiO_x film changes duringa subsequent annealing procedure. Electron energy loss spectrometry proves that amorphous SiO₂ is formed and the development of holes indicates that the density of the as-grown SiO_x film is much lower than that of SiO₂. The specific for the as-grown SiO_x films was determined by I–V measurements.     

Thin resistive film with temperature coefficient of resistance close to zero

A new structure of a thin resistive film based on NiCr with a temperature coefficient of resistance (TCR) close to zero is described. The resistor is formed from two nitrogen-doped NiCr films with a sputtered aluminium film between them. This structure, deposited on glass or alumina substrates, has a sheet resistance of 100 Ω, a TCR value less than ±10×10⁻⁶K⁻¹, low tracking of the TCR on the individual substrates and high long-term stability of the sheet resistance. The deposition process is characterized by high reproducibility of electrical properties. The surface and bulk chemical composition of the films have been monitored by secondary ion mass spectrometry and electron spectroscopy for chemical analysis.     

Characterization of intermetallic phases and oxides formed in annealed Ni/Al multilayer structures

Two different multilayer structures composed of ten alternating Ni and Al thin films were sputter deposited on Si (111) substrates. These multilayers with individual Ni and Al thin film thicknesses of about 25 nm and 38 nm and of 25 nm and 13 nm, respectively, have the average compositions of Ni_0.50Al_0.50 and Ni_0.75Al_0.25. The samples were heat treated in a differential scanning calorimeter instrument with a constant heating rate of 40 °C min ⁻¹ in Ar from room temperature to 550 °C. The compositions of as-deposited and heat-treated samples were studied with high-resolution Auger electron spectroscopy (AES) rotational depth profiling. X-ray photoelectron spectroscopy (XPS) analyses show an excess of Ni in both annealed samples. X-ray diffraction measurements of annealed multilayers show the formation of Ni₂Al₃ and NiAl₃ phases in the Ni_0.50Al_0.50 sample and the presence of Ni₃Al and Ni A1₃ phases with some excess of Ni in the Ni_0.75Al_0.75 sample. AES and XPS investigations of the reacted layers after 15 min annealing in air at 500 °C disclose considerably different surface oxide thin films: on the Ni_0.50Al_0.50 layer the oxide thin film consists of Al₂O₃ with a small amount of NiO, whereas that on the top of the Ni_0.75Al_0.25 layer is thicker and consists of NiO on top and some Al₂O₃ below.