聚合物基复合材料导热性的研究

讨论了聚合物基高导热高绝缘纳米复合材料的导热机理与常用的导热理论模型。考虑到填充率、温度等的影响，采用不同理论模型计算了用氧化铝纳米颗粒填充环氧树脂时材料的热导率，并结合相关研究实验对不同导热理论模型进行了分析比较。     

聚合物复合材料导热性能的研究

论述了填充聚合物复合材料的导热性及其变化规律;总结了复合材料导热的理论模型和导热系数预测方程,对比研究了各种导热模型的区别与联系;分析了影响复合材料导热特性的因素。     

填充型聚合物基复合材料的导电和导热性能

研究了高密度聚乙烯为基体、炭黑和炭纤维为填料复合体系的导电和导热性能。发现当导电填料的含量达到渗流阈值时,复合材料的电导率急剧升高;而在渗流阈值附近,其热导率未出现突变。这表明电导渗流现象不完全是由导电粒子通过物理接触生成导电链所致。其导电机制是相当数量的导电粒子相互发生隧道效应。     

聚合物纳米石墨烯复合材料导热性能研究进展

集成电路伴随着电子、航天和航空领域的发展而快速发展,但往往伴随着散热困难的问题,影响着使用效率和仪器寿命。从质量、耐蚀性、加工工艺和成本等方面考虑,聚合物复合材料是导热材料中最具发展前景的材料。然而聚合物固有的导热率非常低,因此,提高聚合物的导热率对于其在这些领域的应用显得非常重要,这在过去的20年中已经成为一个非常重要的研究课题。主要从以下两个方面进行介绍:(1)从分子链形态、链结构和链间耦合3个方面分析总结了聚合物的微观导热机理;(2)重点介绍近年来石墨烯填充聚合物纳米复合材料导热性能的主要研究进展以及未来的研究挑战。     

导热型碳纤维增强聚合物基复合材料的研究进展

综述了导热型连续碳纤维增强聚合物基复合材料(CFRP)的研究与应用现状和进展,阐述了CFRP的声子导热和光子导热机理,介绍了不同铺层角度和铺层比的CFRP面内和厚度方向热导率计算模型及测试方法,分析了环氧树脂、氰酸酯、双马来酰亚胺等3类树脂体系和聚丙烯腈基(PAN)碳纤维、中间相沥青基碳纤维、气相生长碳纤维、碳纳米管纤维等4类增强体以及工艺方法等因素对CFRP热导率的影响.     

粒子填充聚合物基复合材料导热性能的数值模拟

根据电镜照片中观察的微观结构信息,基于两套新设计的算法建立了代表体积元(RVE)模型,基于此模型研究了粒子填充聚合物基复合材料的导热性能与微观结构的关系。通过对电镜照片的处理得到两个参数即稀疏区比重和稀疏区半径,建立了与实际体系相符的具有非均匀粒子分布结构的 RVE模型。制备了氧化铝/高温硫化硅橡胶导热复合材料,并测试了不同填充量下体系的热导率,用以验证模型的有效性。采用有限元方法求解RVE模型得到的热导率预测值与实验值进行对比,结果表明：填料用量在宽范围内预测结果与实验值均吻合很好; 与均匀分布或随机分布相比,存在稀疏区和富集区的非均匀分布的体系具有更高的热导率,这种差异在高填充量下当颗粒间形成导热网链时更为显著;在相同填充量下,不同的粒子空间分布结构可使体系热导率差别很大,是影响体系热导率的关键因素。     

聚合物基复合材料的界面结构与导热性能

在整理近年来国内外对聚合物基导热复合材料性能的研究工作的基础上,总结界面结构与界面处理对聚合物基复合材料界面和导热性能的影响,分析目前已有研究中的缺点和不足,提出未来改善界面结合、提高聚合物基复合材料导热性能的具体方法,并指出探究界面结构与热流散射的关系,特别是弱界面结合情况下的热流传导规律,对提高聚合物基复合材料的热导率有很大的指导意义。     

聚合物基导热复合材料研究进展

概述了聚合物基导热复合材料的应用开发背景,从理论上阐述了聚合物基导热复合材料的导热机理及导热理论模型.综述了国内外聚合物基导热复合材料研究开发状况,提出了今后的研究方向.     

三维网络填料增强聚合物基复合材料导热性能的研究进展

聚合物在超导技术、航天航空、电子电路、动力电池、换热器等领域的应用十分广泛。随着器件的小型化、密集化和高功率,对于整体的散热要求越来越高,但是聚合物作为器件和设备粘接、封装等工艺的关键材料,热导率仅为0.2 W/(m∙K),完全不能满足目前的散热需求,因此亟需提升聚合物的导热性能。由于在聚合物基体中构建连续的导热路径能极大提高聚合物的导热系数,往往能提高数倍或数十倍,因此采用三维网络填料增强聚合物导热性能是最为常用的一种方法之一。本文主要对用构建三维网络填料来增强高分子材料的导热性能的相关研究进行了整理,以制备方式的不同,将其归类为自组装法、相分离法、模板法、取向分布法等方法。最后,从制备方法的热导率提高值、可行性、稳定性等方面进行了总结分析,并对三维网络填料增强的聚合物基导热复合材料的未来发展前景进行了展望。     

Application of photoacoustic and photothermal techniques for heat conduction measurements in a free-standing chemical vapor-deposited diamond film

Heat conduction in a free-standing chemical vapor-deposited polycristalline diamond film has been investigated by means of combined front and rear photoacoustic signal detection techniques and also by means of a “mirage” photothermal beam deflection technique. The results obtained with the different techniques are consistent with a value of α=(5.5±0.4)×10⁻⁴ m² · s⁻¹ for thermal diffusivity, resulting in a value ofκ=(9.8±0.7)×10² W·m⁻¹·K⁻¹ for thermal conductivity when literature values for the density and heat capacity for natural diamond are used.     

非连续增强钛基复合材料的热处理研究进展

综述了非连续增强钛基复合材料热处理的研究现状,主要分析了热处理工艺对复合材料微观组织与力学性能的影响,提出了当前研究中存在的问题和今后潜在的发展方向.     

纤维增强聚合物基复合材料的低温性能

对纤维增强聚合物基复合材料在低温领域的实际应用进行了分类介绍,通过对纤维增强聚合物基复合材料的低温性能、性能影响因素和作用机理、低温应用安全性等方面的研究工作进行总结,突出各类纤维增强聚合物基复合材料低温下的性能优势,阐明了材料性能的不足之处及相应改进措施.对于实际低温应用中纤维增强聚合物基复合材料的选择、性能设计优化,系统安全性的增强提供了参考作用.     

Analytical study for the estimation of thermal properties of processed meat based on hyperbolic heat conduction model

This study proposes an analytical method in conjunction with existing experimental temperature to estimate the unknown relaxation time and thermal diffusivity of processed meat based on the hyperbolic heat conduction model. This analytical method is a combination of the Laplace transform and least squares methods. The thermal contact resistance at the interface between adjacent samples at different temperatures is assumed to be negligible. The relaxation time is estimated from the temperature jump at a specific measurement location. The thermal diffusivity is determined from the definition of the dimensionless spatial coordinate and the resulting relaxation time. The results show that the relaxation time and thermal diffusivity obtained are in good agreement with the existing results. The obtained dimensionless temperature history at a specific measurement location is close to the experimental temperature data. This means that the Cattaneo–Vernottee (CV) model can be suitable for this study. The proposed analytical inverse method can be applied to determine a more accurate estimate of such problems. A comparison of the estimate obtained from CV and dual phase lag models is made.     

Coupled heat conduction and thermal stress analyses in particulate composites

This study introduces two micromechanical modeling approaches to analyze spatial variations of temperatures, stresses and displacements in particulate composites during transient heat conduction. In the first approach, a simple micromechanical model based on a first order homogenization scheme is adopted to obtain effective mechanical and thermal properties, i.e., coefficient of linear thermal expansion, thermal conductivity, and elastic constants, of a particulate composite. These effective properties are evaluated at each material (integration) point in three dimensional (3D) finite element (FE) models that represent homogenized composite media. The second approach treats a heterogeneous composite explicitly. Heterogeneous composites that consist of solid spherical particles randomly distributed in homogeneous matrix are generated using 3D continuum elements in an FE framework. For each volume fraction (VF) of particles, the FE models of heterogeneous composites with different particle sizes and arrangements are generated such that these models represent realistic volume elements “cut out” from a particulate composite. An extended definition of a RVE for heterogeneous composite is introduced, i.e., the number of heterogeneities in a fixed volume that yield the same expected effective response for the quantity of interest when subjected to similar loading and boundary conditions. Thermal and mechanical properties of both particle and matrix constituents are temperature dependent. The effects of particle distributions and sizes on the variations of temperature, stress and displacement fields are examined. The predictions of field variables from the homogenized micromechanical model are compared with those of the heterogeneous composites. Both displacement and temperature fields are found to be in good agreement. The micromechanical model that provides homogenized responses gives average values of the field variables. Thus, it cannot capture the discontinuities of the thermal stresses at the particle-matrix interface regions and local variations of the field variables within particle and matrix regions.     

Analysis on effect of electroless coated SiCp on mechanical properties of polymer matrix composites

ABSTRACT

The versatility of polymer matrix composites in industrial applications has gained reputation and adaptability among advanced materials. Still, treatment of reinforcement for these composites has emerged as a vital domain to be explored. With a continuance to this fact, the present paper aims to analyze the effect of reinforced electroless coated silicon carbide particulates on mechanical properties of composites. The composite is developed using epoxy polymer as matrix and glass fibers as primary reinforcement. The electroless coated and uncoated silicon carbide particulates were used as secondary reinforcement. The phase identification of copper on secondary reinforcement was identified using X-ray powder diffraction technique. Fracture analysis during tensile testing and bonding behavior between matrix and reinforcement is examined using field emission scanning electron microscopy with energy dispersive spectroscopy. The presence of copper particles on secondary reinforcement results in improved interfacial bonding and resistance against fracture during loading.     

Application of viscoelastic fracture criteria to progressive crack propagation in polymer matrix composites

With the view of comparing local and global viscoelastic fracture criteria, an extension of Christensen's criterion to composite materials with stiff elastic fibers is proposed. Several versions of this criterion are compared with Schapery's local approach of the same phenomenon. The asymptotic version of Christensen's criterion for rapid crack propagation is found suitable for the material investigated, at room temperature. Dissipation in the specimen has two main sources: the undamaged material on one hand, and the damaged material inside the `failure zone' close to the crack tip on the other. The respective roles of these two kinds of dissipation are assessed.     

树脂基复合材料增韧研究进展

经过几十年的发展,国内高韧性树脂基复合材料的研究有了很大进展,但其在工程上的应用才刚刚开始,仍存在一些问题。基于国内外树脂基复合材料的增韧研究现状,总结了不同的增韧方法,从基体增韧、层间增韧和Z向增韧3个方面出发,归纳出不同增韧方法的机理以及优缺点。     

导热聚酰亚胺及其复合材料的研究进展

随着电子设备朝着小型化、集成化和多功能化的趋势不断发展,实现电子材料的高导热性能对电子设备的稳定运行和使用寿命至关重要。聚酰亚胺(PI)因其优异的耐热性能和力学性能被广泛应用于热管理领域,然而传统PI的本征导热系数较低,难以满足电子器件的快速散热需求,发展新型高导热PI及PI复合材料成为目前国内外的研究重点。本文从PI分子链结构、分子链取向及分子间相互作用等方面阐述了非晶型与液晶型两类本征型导热PI的制备与性能调控,系统探讨了填料表面修饰、杂化改性、取向设计、三维网络构筑等方法对PI复合材料结构与性能的影响规律,最后对高导热PI及PI复合材料研究中面临的挑战进行了总结与展望。