408nm InGaN/GaN LED的材料生长及器件光学特性

通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.     

408nm InGaN/GaN LED的材料生长及器件光学特性

通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.     

InGaN/GaN多量子阱电池的垒层结构优化及其光学特性调控

InGaN基量子阱作为太阳电池器件的有源区时,垒层厚度设计以及实际生长对其光学特性的影响极为重要.采用金属有机化学气相沉积(MOVCD)技术,在蓝宝石衬底上外延生长了垒层厚度较厚的InGaN/GaN多量子阱,使用高分辨X射线衍射和变温光致发光谱研究了垒层厚度对InGaN多量子阱太阳电池结构的界面质量、量子限制效应及其光学特性的影响.较厚垒层的InGaN/GaN多量子阱的周期重复性和界面品质较好,这可能与垒层较薄时对量子阱的生长影响有关.同时,厚垒层InGaN/GaN多量子阱的光致发光光谱峰位随温度升高呈现更为明显的“S”形(红移-蓝移-红移)变化,表现出更强的局域化程度和更高的内量子效率.     

硅衬底GaN基LED外延生长的研究

采用在AlN缓冲层后原位沉积SiN掩膜层,然后横向外延生长GaN薄膜.通过该法在硅衬底上获得了1.7 μm无裂纹的GaN薄膜,并在此基础上外延生长出了GaN基发光二极管(LED)外延片,其外延片的总厚度约为1.9 μm.采用高分辨率双晶X-射线衍射(DCXRD)、原子力显微镜(AFM)测试分析.结果表明,GaN薄膜(0002)面的半峰全宽(FWHM)降低到403 arcsec,其表面平整度得到了很大的改善;InGaN/GaN多量子阱的界面较平整,结晶质量良好.光致发光谱表明,GaN基LED峰值波长为469.2 nm.     

Si衬底InGaN/GaN多量子阱LED外延材料的微结构

用透射电子显微镜(TEM)和X射线双晶衍射仪(DCXRD)对在Si(111)衬底上生长的InGaN/GaN多量子阱(MQW)LED外延材料的微结构进行了观察和分析.从TEM高分辨像观察到,在Si和AlN界面处未形成SixNy非晶层,在GaN/AlN界面附近的GaN上有堆垛层错存在,多量子阱的阱(InGaN)和垒(GaN)界面明锐、厚度均匀;TEM和DCXRD进一步分析表明MQW附近n型GaN的位错密度为10acm-2量级,其中多数为b=1/3〈112-0〉的刃位错.     

Si衬底InGaN/GaN多量子阱LED外延材料的微结构

用透射电子显微镜(TEM)和X射线双晶衍射仪(DCXRD)对在Si(111)衬底上生长的InGaN/GaN多量子阱(MQW)LED外延材料的微结构进行了观察和分析.从TEM高分辨像观察到,在Si和AlN界面处未形成SixNy非晶层,在GaN/AlN界面附近的GaN上有堆垛层错存在,多量子阱的阱(InGaN)和垒(GaN)界面明锐、厚度均匀;TEM和DCXRD进一步分析表明MQW附近n型GaN的位错密度为10acm-2量级,其中多数为b=1/3〈112-0〉的刃位错.     

LP—MOCVD生长InGaN及InGaN／GaN量子阱的研究

利用MOCVD系统在Al2O3衬底上生长InGaN材料和InGaN/GaN量子阱结构材料，研究发现InGaN材料中In组份几乎不受TMG与TMI的流量比的影响，而只与生长温度有关，生长温度由800℃降低到740℃，In组份的从0.22增加到0.45；室温InGaN光致发光光谱（PL）峰全半高宽（FWHM）为15.5nm;InGaN/GaN量子阱区InGaN的厚度2nm，但光荧光的强度与100nm厚InGaN的体材料相当。     

GaN{11-22}半极性面上生长InGaN/GaN多量子阱的研究

利用选择性横向外延技术生长{11-22}半极性面GaN模板,并利用半极性面模板生长InGaN/GaN多量子阱结构。结果表明,生长出的GaN模板由半极性面{11-22}面和c面组成,多量子阱具有390nm和420 nm的双峰发光特性,局域阴极发光(CL)测试表明390 nm附近的发光峰来源于半极性面上的量子阱发光,而420 nm左右的发光峰源于c面量子阱发光。c面量子阱发光相对于斜面量子阱发光发生显著红移是因为在选择性横向外延生长过程中,In组分相比Ga较易从掩模区域向窗口中心区域迁移,形成了中心高In组分的c面量子阱,而半极性面上InGaN/GaN多量子阱量子限制斯塔克效应相比于极性面会减弱,此外,相同生长条件下半极性面的生长速率低于极性c面的生长速率。     

MOCVD生长Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱的结构和光学特性

采用金属有机物化学气相淀积(MOCVD)技术,在蓝宝石衬底上生长了Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱(MQWs)结构。通过双晶X射线衍射(DCXRD)、原子力显微镜(AFM)和阴极荧光(CL)等测试技术,分别对样品的结构和光学特性进行了表征。在DCXRD图谱中,可以观察到明显的MQWs衍射卫星峰,通过拟和,MQWs结构中阱和垒的厚度分别为2.1和9.4nm,Al组分分别为0.48和0.54。在AFM表面形貌图上,可以观察到清晰的台阶流,表明MQWs获得了二维生长;与此同时,MQWs结构存在一些裂缝,主要原因为AlGaNMQWs结构和下层GaN层间存在很大的应力。CL测试表明,AlGaNMQWs结构的发光波长为295nm,处于深紫外波段,同时观察到处于蓝光、绿光波段的缺陷发光。     

生长温度对InGaN/GaN多量子阱LED光学特性的影响

利用低压MOCVD系统,在蓝宝石衬底上外延生长了InGaN/GaN多量子阱蓝紫光LED结构材料.研究了生长温度对有源层InGaN/GaN多量子阱的合金组分、结晶品质及其发光特性的影响.结果表明当生长温度从730℃升到800℃时,LED的光致发光波长从490nm移到380nm,室温下PL谱发光峰的半高全宽从133meV降到73meV,表明了量子阱结晶性的提高.高温生长时,PL谱中还观察到了GaN的蓝带发光峰,说明量子阱对载流子的限制作用有所减弱.研究表明,通过改变生长温度可以对LED发光波长及有源层InGaN的晶体质量实现良好的控制.     

Effects of growth interruption on the properties of InGaN/GaN MQWs grown by MOCVD

These applications normally employ an InGaN/GaN mul- tiple quantum wells (MQWs) as the active layer. But the growth of high quality MQWs is very difficult. Firstly, the growth condition is strict due to the high volatility of InN and the low thermal pyrol…     

预应变InGaN/GaN多量子阱发光特性调控研究

为了减弱InGaN/GaN量子阱内的压电极化场,在蓝紫光InGaN/GaN多量子阱激光器结构中采用了预应变InGaN插入层,通过变温电致发光和高分辨X射线衍射测量研究了预应变插入层对量子阱晶体质量和发光特性的影响。实验结果显示,常温下有预应变层的量子阱电致发光谱积分强度显著提高。模拟计算进一步表明,预应变层对量子阱内压电极化场有调制效果,有利于量子阱中的应力弛豫,可以有效减弱量子限制斯塔克效应,有助于提高量子阱的发光效率。     

Structural and optical investigation of InGaN/GaN multiple quantum well structures with various indium compositions

We have studied the influence of indium (In) composition on the structural and optical properties of In_x Ga_1−xN/GaN multiple quantum wells (MQWs) with In compositions of more than 25% by means of high-resolution x-ray diffraction (HRXRD), photoluminescence (PL), and transmission electron microscopy (TEM). With increasing the In composition, structural quality deterioration is observed from the broadening of the full width athalf maximum of the HRXRD superlattice peak, the broad multiple emission peaks oflow temperature PL, and the increase of defect density in GaN capping layers and InGaN/GaN MQWs. V-defects, dislocations, and two types of tetragonal shape defects are observed within the MQW with 33% In composition by high resolution TEM. In addition, we found that V-defects result in different growth rates of the GaN barriers according to the degree of the bending of InGaN well layers, which changes the period thickness of the superlattice and might be the source of the multiple emission peaks observed in the In_xGa_1−xN/GaN MQWs with high in compositions.     

低温生长n型氮化镓插入层提高LED抗静电能力

在这篇论文里,我们通过在InGaN/GaN 多量子阱和n型氮化镓层中间插入一层低温生长的n型氮化镓显著提高了LED的抗静电能力。通过引入低温生长的氮化镓插入层使得LED抗击穿电压超过4000V的良品率从9.9%提升到74.7%。低温生长的氮化镓插入层作为后续生长的多量子阱的缓冲层,释放了量子阱中的应力并且改善了量子阱的界面质量。另外,我们证明了在氮气气氛下生长低温氮化镓插入层对于LED抗静电能力的改善要强于氢气气氛,同时也进一步证明低温插入层对量子阱中应力的释放有利于提高LED的抗静电能力。光电测试结果表明,在引入低温nGaN缓冲层后,LED的电学特性并没有衰退,并且LED的光输出功率提高了13.9%。     

Edge-emitting electroluminescence polarization investigation of InGaN/GaN light-emitting diodes grown by metal-organic chemical vapor deposition on sapphire (0001)

The edge-emitting electroluminescence (FL) state of polarization of blue and green InGaN/GaN light-emitting diodes (LEDs) grown in EMCORE’s commercial reactors was studied and compared to theoretical evaluations. Blue (∼475 nm) LEDs exhibit strong EL polarization, up to a 3:1 distinction ratio. Green (∼530 nm) LEDs exhibit smaller ratios of about 1.5:1. Theoretical evaluations for similar InGaN/GaN superlattices predicted a 3:1 ratio between light polarized perpendicular (E⊥c) and light polarized parallel (E‖c) to the c axis. For the blue LEDs, a quantum well-like behavior is suggested because the E⊥c mode dominates the E‖c mode 3:1. In contrast, for the green LEDs, a mixed quantum well (QW)-quantum dot (QD) behavior is proposed, as the ratio of E⊥c to E‖c modes drops to 1.5:1. The EL polarization fringes were also observed, and their occurrence may be attributed to a symmetric waveguide-like behavior of the InGaN/GaN LED structure. A large 40%/50% drop in the surface root mean square (RMS) from atomic force microscopy (AFM) scans on blue/green LEDs with and without EL fringes points out that better surfaces were achieved for the samples exhibiting fringing. At the same time, a 25%/10% increase in the blue/green LED photoluminescence (PL) intensity signal was found for samples displaying EL interference fringes, indicating superior material quality and improved LED structures.     

Influence of Mg Doping on the Morphological, Optical, and Structural Properties of InGaN/GaN Multiple Quantum Wells

In this report, the influence of magnesium doping on the characteristics of InGaN/GaN multiple quantum wells (MQWs) was investigated by means of atomic force microscopy (AFM), photoluminescence (PL), and X-ray diffraction (XRD). Five-period InGaN/GaN MQWs with different magnesium doping levels were grown by metalorganic chemical vapor deposition. The AFM measurements indicated that magnesium doping led to a smoother surface morphology. The V-defect density was observed to decrease with increasing magnesium doping concentration from ∼10⁹ cm⁻² (no doping) to ∼10⁶ cm⁻² (Cp₂Mg: 0.04 sccm) and further to 0 (Cp₂ Mg: 0.2 sccm). The PL measurements showed that magnesium doping resulted in stronger emission, which can be attributed to the screening of the polarization-induced band bending. XRD revealed that magnesium doping had no measurable effect on the indium composition and growth rate of the MQWs. These results suggest that magnesium doping in MQWs might improve the optical properties of GaN photonic devices.     

Hot-electron induced degradations in GaN-based LEDs fabricated on nanoscale epitaxial lateral overgrown layers

We report investigations on the hot-electron hardness of GaN-based multiple quantum wells (MQWs) fabricated on nanoscale epitaxial lateral overgrown (NELO) GaN layers. This layer was deposited using a SiO₂ growth mask with nanometer-scale windows. The active regions of the devices consist of five-period GaN/InGaN MQWs. Structural analyses of the material indicate significant reduction in the threading dislocation density of the devices compared to the control which were fabricated without the use of the NELO GaN layers. The hot-electron degradation of the devices due to the application of a large dc. current was characterized by detailed examination of the electroluminescence (EL), I-V, thermoreflectance and the current noise power spectra of the devices as a function of the stress time. Significant improvements in the hot-electron hardness were observed in the device compared to the control.     

Effects of the p-AlInGaN/GaN superlattices’structure on the performance of blue LEDs

The advantages of the p-AIInGaN/GaN superlattices＇ （SLs） structure as an electron blocking layer （EBL） for InGaN blue light-emitting diodes （LEDs） were studied by experiment and APSYS simulation. Elec- troluminescence （EL） measurement results show that the LEDs with the p-AllnGaN/GaN SLs＇ structure EBL ex- hibited better optical performance compared with the conventional A1GaN EBL due to the enhancement of hole concentration and hole carrier transport efficiency, and the confinement of electrons＇ overflow between multiple quantum-wells （MQWs） and EBL.     

Enhanced carrier confinement in AlInGaN-InGaN quantum wells in near ultraviolet light-emitting diodes

To increase carrier confinement, the GaN barrier layer was substituted with an AlInGaN quaternary barrier layer which was lattice-matched to GaN in the GaN-InGaN multiple quantum wells (MQWs). Photoluminescence (PL) and high-resolution X-ray diffraction measurements showed that the AlInGaN barrier layer has a higher bandgap energy than the originally used GaN barrier layer. The PL intensity of the five periods of AlInGaN-InGaN MQWs was increased by three times compared to that of InGaN-GaN MQWs. The electroluminescence (EL) emission peak of AlInGaN-InGaN MQWs ultraviolet light-emitting diode (UV LED) was blue-shifted, compared to a GaN-InGaN MQWs UV LED and the integrated EL intensity of the AlInGaN-InGaN MQWs UV LED increased linearly up to 100 mA. These results indicated that the AlInGaN-InGaN MQWs UV LED has a stronger carrier confinement than a GaN-InGaN MQWs UV LED due to the larger barrier height of the AlInGaN barrier layer compared to a GaN barrier layer.