TA17钛合金板材对接焊缝显微组织表征研究

利用电子背散射衍射(EBSD)取向成像技术,对TA17钛合金板材对接焊缝的显微组织、晶界特征和晶体学取向进行表征研究。结果表明其母材呈典型的轧制变形组织,且由α相和少量晶间分布的β相组成,大部分为小角度晶界,为基面织构。热影响区晶粒呈梯度长大分布。在焊接热传导下,热影响区晶粒得到回复和长大,大角度晶界逐渐增多。其织构继承了母材织构的特点,只是织构密度有所减弱。熔区为粗大的α'马氏体相交织成的网篮状组织,大部分为大角度晶界,织构比较漫散。     

激光焊接TRIP590钢焊缝微观结构及形成机理研究

通过扫描电子显微镜(SEM)、电子背散射分析(EBSD),研究了TRIP590钢激光焊接接头的界面微观结构和形成机理。SEM分析表明,焊接接头焊缝区组织为马氏体组织,热影响区组织主要是贝氏体和铁素体,离焊缝位置越近,马氏体量越多。EBSD分析表明,母材区的晶粒分布均匀,都是大角度晶界,没有明显的择优取向。热影响区晶粒大小不均,贝氏体有相同或相近的取向。焊缝区板条尺寸最为粗大,有明显的织构。残余奥氏体弥散分布在晶粒内部或晶界,焊缝和热影响区晶界取向差都是1°~5°之间的小角度晶界,大量的小角度晶界导致焊缝与热影响区的塑性要小于母材。     

N80 ERW套管调质前后焊缝组织演变的EBSD研究

本文采用SEM和EBSD等显微分析技术研究了一种N80油套管调质处理（Q＆T）前后焊缝组织的演变规律。实验结果表明,经调质处理N80套管焊缝中心区的{101}〈101〉织构明显增强,而热影响区从较弱的{101}〈101〉织构变为较强的近{111}〈101〉织构。并且,焊缝和热影响区组织中取向差角小于10°的小角度晶界和大于50°的大角度晶界数量显著增加,而介于10°-50°之间的晶界数量下降。调质处理前焊缝和热影响区中晶粒尺寸分布较为均匀,而调质处理后主要以小尺寸晶粒为主。     

5052铝合金渐进成形件变形区微观分析与研究北大核心CSCD

为认识5052铝合金在渐进成形过程中的塑性变形特点,使用热场发射扫描电镜,结合电子背散射衍射技术(EBSD)对制件变形区的微观组织、微区晶粒取向和微区织构演变进行了研究。结果表明:在"一拉两压"三向应力作用下,晶粒沿壁向受拉,径向、切向受压。成形角较小时,径向压力较大,晶粒破碎现象明显,随着成形角变大,碎晶现象有所减弱。成形角增大,坯料塑性变形增加,变形区中小角度晶界的比例明显增加,大角度晶界的分布趋于均匀。渐进成形试样变形区的织构含量较低,有利于提高坯料的塑性成形能力。     

高强铝合金的激光焊接头组织及力学性能

采用CO2激光器对高强铝合金2519-T87进行焊接,研究了其激光焊接头组织和力学性能特征,并与熔化极气体保护焊(MIG)焊接头的组织和力学性能进行了对比。实验结果表明,激光焊焊缝组织细小,晶界共晶相呈短棒状均匀分布,时效后焊缝中有大量细小θ′相均匀析出,且熔合线附近没有形成等轴晶区,而熔化极气体保护焊焊缝组织晶粒粗大,晶界共晶相呈长条网络状分布,时效后焊缝中的θ′相尺寸大,数量少,且分布不均匀,熔合线附近还存在一个较宽的等轴晶区。焊后时效激光焊接头抗拉强度可达到母材的74%,并且随着焊接速度的增加,接头抗拉强度随之增加,而熔化极气体保护焊焊接头抗拉强度仅仅只有母材的61%,且激光焊接头的热影响区(HAZ)中没有明显的软化区。     

激光熔化沉积TC17钛合金光纤激光焊接特性

利用光纤激光对激光熔化沉积TC17钛合金与锻造TC17钛合金薄板进行了激光热导熔化焊接,利用光学显微镜、扫描电镜、X射线衍射仪和显微硬度计分析了接头的组织结构及显微硬度分布。结果表明,TC17钛合金激光熔化沉积件及锻件薄壁板状试样激光焊接接头凝固组织为沿未熔母材外延定向生长的细小树枝晶组织。锻造钛合金焊缝热影响区(HAZ)大且热影响区β晶粒发生了严重的长大现象,而激光熔化沉积钛合金焊缝热影响区小且热影响区β晶粒尺寸几乎无明显变化,表现出优异的焊接热稳定性。无论锻造钛合金还是激光熔化沉积钛合金,其焊缝区显微硬度高于母材,热影响区显微硬度低于母材。     

基于X70高级管线钢多道焊缝和单道焊缝组织EBSD研究

本文选用X70管线钢两种不同形式焊接接头为研究对象,使用EBSD技术对径向焊缝的横截面的Fe3C相分布、取向差角分布、晶粒有效尺寸、大角度晶界和小角度晶界的比率以及Taylor因子进行表征.结果发现,多道焊缝析出相分布很均匀、随机;各种颜色的晶粒取向均有分布且少量呈柱状存在;晶粒有效尺寸起伏较大,大小不一,但总是交替进行;大角度晶界比率较大,韧性较好;Taylor因子灰度图分布略有起伏,平均数值较大,抵抗塑形变形能力较差.单道焊缝则反之.     

N18锆合金再加工组织的EBSD分析

采用电子背散射衍射（EBSD）技术,对N18锆合金在780℃下沿原板材横向热轧、冷轧及再结晶退火过程中的晶粒组织、晶界特征及织构进行了测试和分析。结果表明：N18锆合金板材在热轧、冷轧后为长条状形变晶粒和一些细小动态再结晶晶粒,并出现大量的小角度晶界,交叉轧制织构基本上保持了原板材的织构特点,只是基面织构有所增强。580℃,3 h退火后出现大量再结晶晶粒,并且大角度晶界增加,其基面织构有所下降,但依然占据主导地位。     

CSP冷轧低碳钢板再结晶晶粒长大阶段微区织构的研究

利用电子背散射衍射（EBSD）技术研究了CSP冷轧低碳钢板再结晶晶粒长大阶段组织和微区织构的变化。结果表明具有{111}取向晶粒的数量和尺寸在再结晶刚完成时都具有很大的优势,并一直保持到退火完成。这是再结晶织构中γ取向线密度很高的一个重要原因。但是{111}晶粒的生长在晶粒长大后期停滞,造成了γ取向线密度的下降。晶粒长大动力学的差异对应着取向差的变化,{111}晶粒生长的停滞可以用{111}晶粒同周围晶粒取向差的减小来解释。     

激光冲击强化TC4微观组织演化及纳米晶形成

为了揭示激光冲击强化诱导的表面纳米晶形成机制,通过电子背散射衍射(EBSD)和透射电镜(TEM)对TC4钛合金表层微观组织进行了分析。结果表明,试件表面冲击区域的相分布无明显变化,但平均晶粒尺寸由3.78μm下降至3.18μm,且高水平应变的分布更均匀。激光冲击强化使小角度晶界向大角度晶界转变,织构强度减弱且极向呈多向化分布,晶粒取向分布更随机。截面微观组织依次为表层纳米晶、次表层位错胞、高密度位错和内部带有低密度位错的基体粗晶。分析认为,表面纳米晶是由一系列复杂的位错运动引起的,符合连续动态再结晶机制。试件表面晶体畸变能最大,且瞬态温升高达755℃,因此动态再结晶过程进行得最充分。     

Structure of [110] tilt grain boundaries in zirconia bicrystals

Cubic stabilized zirconia bicrystals with [110] symmetric tilt grain boundaries were fabricated by diffusion bonding of two single crystals with the composition of ZrO2-9.6mol%Y2O3. The structures of symmetric tilt small angle grain boundary and two types of symmetric tilt sigma3 grain boundaries with different grain boundary planes were observed by transmission electron microscopy (TEM). High-resolution transmission electron microscopy (HREM) observations clarified that the [110] small angle tilt grain boundary consists of periodic array of b = a/2[110] type edge dislocations. This result is consistent with Frank's dislocation model for small angle grain boundary. HREM observation also revealed that the 70.5 degrees sigma3 grain boundary shows atomically coherent grain boundary structure with the boundary plane of [111], while the 109.5 degrees sigma3 grain boundary accompanies grain boundary facets taking [111]/[115] asymmetric grain boundary plane. Because of the very low surface energy of [111] plane and/or high lattice matching of [111] and [115] type planes, the grain boundary faceting may be preferred in spite of increasing grain boundary area to about 6%. TEM-energy-dispersive X-ray spectroscopy (EDS) analyses were performed on both sigma3 grain boundaries, and the segregation of yttrium ions to the boundaries was detected in both cases. The amount of segregation is about the same in both sigma3 boundaries. It can be concluded that the segregation of yttrium ions to sigma3 grain boundary exists in cubic zirconia.     

热轧对N18合金板材显微组织及织构的影响

本文以我国自主开发的Zr-Sn-Nb系N18锆合金为研究对象,利用配备在扫描电镜中的EBSD自动分析技术,研究了该合金板材在750℃、780℃、820℃下热轧过程中的晶粒组织、晶界特征及微织构的演化规律。结果表明,N18合金板材在热轧过程中发生了动态回复及局部动态再结晶,并产生了大量的小角度晶界及亚结构等缺陷,且热轧温度越高其动态再结晶晶核的密度越高,缺陷密度有所增加。N18合金板材的织构类型主要为（0002）[12 10]和（0002）[10 10]基面织构以及（10 14）[12 10]锥面织构。热轧样品中观察到了（10 11）[1012]压型孪生,说明压型孪生变形促进了N18合金热轧变形。     

Grain boundary segregation in multicrystalline silicon: correlative characterization by EBSD,EBIC, and atom probe tomography

This study aims to better understand the influence of crystallographic structure and impurity decoration on the recombination activity at grain boundaries in multicrystalline silicon. A sample of the upper part of a multicrystalline silicon ingot with intentional addition of iron and copper has been investigated. Correlative electron‐beam‐induced current, electron backscatter diffraction, and atom probe tomography data for different types of grain boundaries are presented. For a symmetric coherent Σ3 twin boundary, with very low recombination activity, no impurities are detected. In case of a non‐coherent (random) high‐angle grain boundary and higher order twins with pronounced recombination activity, carbon and oxygen impurities are observed to decorate the interface. Copper contamination is detected for the boundary with the highest recombination activity in this study, a random high‐angle grain boundary located in the vicinity of a triple junction. The 3D atom probe tomography study presented here is the first direct atomic scale identification and quantification of impurities decorating grain boundaries in multicrystalline silicon. The observed deviations in chemical decoration and induced current could be directly linked with different crystallographic structures of silicon grain boundaries. Hence, the current work establishes a direct correlation between grain boundary structure, atomic scale segregation information, and electrical activity. It can help to identify interface–property relationships for silicon interfaces that enable grain boundary engineering in multicrystalline silicon. Copyright © 2015 John Wiley & Sons, Ltd.     

Grain boundary diffusion mechanisms in metals

In recent years it has become well established that fast diffusion along grain boundaries plays a key role in many important metallurgical processes including cases where net mass is transported along boundaries which act as sources and/or sinks for the fluxes of atoms. In addition, considerable advances have been made in understanding grain boundary structure, and new techniques have become available for studying kinetic phenomena in grain boundaries. This lecture will attempt to review our current knowledge of the atomistic mechanisms responsible for these grain boundary diffusion phenomena. Relevant aspects of the structure of grain boundaries and the point and line defects which may exist in grain boundaries are described first. The important experimental observations are then discussed. Diffusion models are then taken up, and it is concluded that the atomic migration occurs by a point defect exchange mechanism which, in at least the vast majority of boundaries in simple metals, most likely involves grain boundary vacancies. The grain boundary sources and/or sinks required to support divergences in the atomic (vacancy) fluxes are grain boundary dislocations. Phenomena therefore occur which resemblethe Kirkendall Effect in the bulk lattice in certain respects. Additional topics are discussed which include effects of boundary structure on boundary diffusion and the question of whether or not boundary diffusion is faster along migrating than stationary boundaries.     

N元素偏聚对2205双相不锈钢微观组织结构的影响

采用金相、SEM、XRD和EBSD等分析方法,对双相不锈钢管N元素偏聚区域组织进行成分及结构的分析.结果表明:双相不锈钢管有100μm宽的带状N元素偏聚区,中心开裂,该区域基本为奥氏体单相组织,内部晶粒粗大且为等轴晶,以Σ3重位点阵(CSL)晶界为主,出现频率约为40%.而远离偏聚区中,铁素体奥氏体双相组织的相比例正常,奥氏体晶粒细小呈条状,也以Σ3晶界为主,出现频率降为27%.N偏聚区奥氏体与正常区奥氏体组织均可形成<111>∥RD及<110>∥ND方向的织构,但偏聚区奥氏体织构强度较之正常区域弱.     

Microtexture and mesotexture in high-Jc Bi-2223

The microstructure of high-J_c Bi-2223 powder-in-tube tapes was studied using x-ray and electron diffraction. Although the c-axis is nominally aligned perpendicular to the tape surface (FWHM∼20‡), x-ray phi scans and pole figures show no evidence of any in-plane texture, either macroscopically or locally. Electron backscatter diffraction patterns acquired in a scanning electron miscroscope (SEM) were used to measure individual grain orientations. Grain boundary misorientation between adjacent grains was described by rotation angles and axes (i.e. the disorientation) and compared with theoretical values of ideal coincidence site lattices (CSLs). Data collected from over 113 spatially correlated grains resulting in 227 grain boundaries, show that over 40% of the boundaries are small angle. In addition, 8% of the boundaries were found to be within the Brandon criterion for CSLs (larger than ⌆1 and less than ⌆50). Grain boundary “texture maps” derived from the SEM image and orientation data reveal the presence of percolative paths between low energy boundaries.     

Effect of film thickness on the evolution of annealing texture in sputtered copper films

Microstructural evolution during elevated temperature annealing of sputter deposited copper (Cu) films was investigated by electron backscatter diffraction (EBSD). Analysis of films was performed both in situ using a heating stage, and by ex-situ observation of microstructural evolution. It was noted that not only is the Cu film texture and grain size a function of film thickness, but also that the fraction of twin boundaries present in the material is strongly dependent upon film thickness. This is explained by means of a simple model that considers the energy of the system. Surface and interface energies, as well as grain boundary energies for random high angle boundaries and for twin boundaries (both coherent and incoherent planes) are used in the determination. The model was shown to accurately predict the twin boundary size in self-annealed films. This type of analysis also results in a texture map similar to that presented by Thompson,¹² but incorporates the development and effect of twin boundaries, so that additional texture components (in addition to 111 and 100 fibers) are included.     

Microstructural evolution of ultrasonic-bonded aluminum wires

The evolution of microstructural gradients, especially crystallographic texture gradients, after ultrasonic wire bonding process and after active power cycling (APC) of high purity, heavy aluminum (Al) wires is studied by electron backscatter diffraction (EBSD) and nanoindentation. The results improve the knowledge about microstructural changes and arrangements after wire bonding and during APC. After ultrasonic deformation by wire bonding, the evolution of a distinct rotated cube (RC) textured area within the wedge was proved by EBSD analysis. The RC texture is discussed as a result of shear deformation and oriented grain growth. Decreased hardness within the RC textured area provides evidence for local softening effects during wire bonding. During APC, besides crack propagation, grain coarsening as well as local low angle boundary migration occurs and the wedge texture changes to an overall random orientation. Effects of microstructure on the crack growth behavior were discussed and suggestions for the improvement of wire bond reliability were derived.