Physical design of testable VLSI: techniques and experiments

It is shown that the layout of VLSI circuits can affect testability and in some cases reduce the number of faults likely in a design, easing test generation. A method for analyzing circuits at the symbolic layout level and enhancing testability using local transformations is presented. To demonstrate the application of the technique a set of CMOS standard cells was redesigned. The standard cells are used in the MIS synthesis system, allowing the designer to modify interactively designs to perform tradeoff analysis on testable designs. To show the usefulness of the technique, an experiment was performed: example circuits were synthesized, and test vectors were generated and then used in a transistor-level fault simulator. It was found that the modified designs have significantly higher fault coverage than unmodified designs. A strategy for the synthesis of easily testable combinational random logic circuits is presented     

Test generation and scheduling for layout-based detection of bridgefaults in interconnects

This paper presents a new approach to detecting faults in interconnects; the novelty of the proposed approach is that test generation and scheduling are established using the physical characteristics of the layout of the interconnect under test. This includes critical area extraction and a realistic fault model for a structural methodology. Physical layout information is used to model the adjacencies in an interconnect and possible bridge faults with a weighted graph, which is then analyzed to appropriately compact the tests and schedule their execution for (early) detection of bridge faults. Generation and compaction of the test vectors are accomplished by calculating node and edge weight heuristics from the weighted adjacency graph. Simulation has been performed for unweighted and weighted fault models. Results on random interconnects and the local interconnect of a commercially available field-programmable gate array are provided. The advantage of the proposed approach is that, on average, early detection of faults is possible using significantly fewer tests than with previous approaches. A further advantage is that it represents a realistic alternative to adaptive testing because it avoids costly on-line test generation, while still having a small number of vectors     

Test Generation and Fault Simulation for Cell Fault Model using Stuck-at Fault Model based Test Tools

Cell Fault Model (CFM) is a well-adopted functional fault model used for cell-based circuits. Despite of the wide adoption of CFM, no test tool is available for the estimation of CFM testability. The vast majority of test tools are based on the single stuck-at fault model.In this paper we introduce a method to calculate the CFM testability of a cell-based circuit using any single stuck-at fault based test tool. Cells are substituted by equivalent cells and Test Generation and Fault Simulation for CFM are emulated by Test Generation and Fault Simulation for a set of single stuck-at faults of the equivalent cells. The equivalent cell is constructed from the original cell with a simple procedure, with no need of knowledge of gate-level implementation, or its function. With the proposed methodology, the maturity and effectiveness of stuck-at fault based tools is used in testing of digital circuits, with respect to Cell Fault Model, without developing new tools.     

Testability analysis and fault modeling of BiCMOS circuits

Defect models have been used for testability analysis of BiCMOS circuits and the results have been compared with an analysis of CMOS circuits. Using a nominal point approach, faults generated are classified as logical or performance degradation faults. It is found that logical fault testing can only cover a small percentage of the total fault set, 54% for BiCMOS, versus 69% for equivalent CMOS gates. Delay faults and current faults are analyzed as applied to BiCMOS and CMOS gates. It is shown that logical fault testing in conjunction with either delay fault testing or current fault testing promises the highest fault coverage for BiCMOS logic gates, around 95%.This research was partially supported by the Department of National Defence of Canada, Academic Research Program, grant # 3705-921.     

CMOS circuit testability

CMOS circuits present unique testing problems. Although open faults in CMOS circuits can be statistically tested, a sequence of patterns is required to guarantee a test. In addition, connections in the circuit layout affect testability. An automatic test generator has been developed to generate test sequences which will detect open CMOS faults.     

Highly testable design of BiCMOS logic circuits

Most of the work reported in the literature to date on the testability of BiCMOS circuits has concentrated on fault characterization and the need for a suitable testing method that can address the peculiarities of BiCMOS circuits. The problem of adequately testing large BiCMOS logic networks remains open and complex. In this paper, we introduce a new design for testability technique for BiCMOS logic gates that results in highly testable BiCMOS logic circuits. The proposed design incorporates two features: a test charge/discharge path and built-in current sensing (BICS). The test charge/discharge path is activated only during testing and facilitates the testing of stuck-open faults using single test vectors. BICS facilitates testing of faults that cause excessive IDDQ. HSPICE simulation results show that the proposed design can detect stuck-open faults at a test speed of 10 MHz. Faults causing excessive IDDQ are detected by BICS with a detection time of 1 ns and a settling time of 2 ns. Impact of the proposed design on normal operation is minimal. The increase in propagation delay in normal operation is less than 3%. This compares very favorably with CMOS BICS reported in the literature, where the propagation delay increase was 20%, 14.4% respectively. The increase in the area is less than 15%     

CMOS design technique to eliminate the stuck-open fault problem of testability

A dynamic CMOS design style is described, which utilises both N-type and P-type logic blocks and avoids the problems in generating tests for stuck-open faults. The testability of the resultant logic is examined analytically and fault simulation results are presented.     

Fault Models for Quantum Mechanical Switching Networks

In classical test and verification one develops a test set separating a correct circuit from a circuit containing any considered fault. Classical faults are modelled at the logical level by fault models that act on classical states. The stuck fault model, thought of as a lead connected to a power rail or to a ground, is most typically considered. A classical test set complete for the stuck fault model propagates both binary basis states, 0 and 1, through all nodes in a network and is known to detect many physical faults. A classical test set complete for the stuck fault model allows all circuit nodes to be completely tested and verifies the function of many gates. It is natural to ask if one may adapt any of the known classical methods to test quantum circuits. Of course, classical fault models do not capture all the logical failures found in quantum circuits. The first obstacle faced when using methods from classical test is developing a set of realistic quantum-logical fault models (a question which we address, but will likely remain largely open until the advent of the first quantum computer). Developing fault models to abstract the test problem away from the device level motivated our study. Several results are established. First, we describe typical modes of failure present in the physical design of quantum circuits. From this we develop fault models for quantum binary quantum circuits that enable testing at the logical level. The application of these fault models is shown by adapting the classical test set generation technique known as constructing a fault table to generate quantum test sets. A test set developed using this method will detect each of the considered faults.     

Automated System-Level Test Development for Mixed-Signal Circuits

While in the digital domain, test development is primarily conducted with the use of automated tools, knowledge-based, ad hoc test methods have been in use in the analog domain. High levels of design integration and increasing complexity of analog blocks within a system necessitate automated system-level analog test development tools. We outline a methodology for specification-based automated test generation and fault simulation for analog circuits. Test generation is targeted at providing the highest coverage for each specified parameter. The flexibility of assigning analog test attributes is utilized for merging tests leading to test time reduction with no loss in test coverage. Further optimization in test time is obtained through fault simulations by selecting tests that provide adequate coverage in terms of several components and dropping the ones that do not provide additional coverage. A system-level test set target in the given set of specifications, along with fault and yield coverages in terms of each targeted parameter, and testability problems are determined through the proposed methodology.     

Test Challenges in Nanometer Technologies

Device scaling has led to the blurring of the boundary between design and test: marginalities introduced by design tool approximations can cause failures when aggressive designs are subjected to process variation. Larger die sizes are more vulnerable to intra-die variations, invalidating analyses based on a number of given process corners. These trends are eroding the predictability of test quality based on stuck-at fault coverage. Industry studies have shown that an at-speed functional test with poor stuck-at fault coverage can be a better DPM screen than a set of scan tests with very high stuck-at fault coverage. Contrary to conventional wisdom, we have observed that a high stuck-at fault test set is not necessarily good at detecting faults that model actual failure mechanisms. One approach to address the test quality crisis is to rethink the fault model that is at the core of these tests. Targeting realistic fault models is a challenge that spans the design, test and manufacturing domains: the extraction of realistic faults has to analyze the design at the physical and circuit levels of abstraction while taking into account the failure modes observed during manufacture. Practical fault models need to be defined that adequately model failing behavior while remaining amenable to automatic test generation. The addition of these fault models place increasing performance and capacity demands on already stressed test generation and fault simulation tools. A new generation of analysis and test generation tools is needed to address the challenge of defect-based test. We provide a detailed discussion of process technology trends that are responsible for next generation test problems, and present a test automation infrastructure being developed at Intel to meet the challenge.     

Functional Fault Equivalence and Diagnostic Test Generation in Combinational Logic Circuits Using Conventional ATPG

Fault equivalence is an essential concept in digital design with significance in fault diagnosis, diagnostic test generation, testability analysis and logic synthesis. In this paper, an efficient algorithm to check whether two faults are equivalent is presented. If they are not equivalent, the algorithm returns a test vector that distinguishes them. The proposed approach is complete since for every pair of faults it either proves equivalence or it returns a distinguishing vector. The advantage of the approach lies in its practicality since it uses conventional ATPG and it automatically benefits from advances in the field. Experiments on ISCAS’85 and full-scan ISCAS’89 circuits demonstrate the competitiveness of the method and measure the performance of simulation for fault equivalence.     

Testability of parity checkers

Checkers are used in digital circuits to detect both intermittent and stuck-at faults. The most common error detectors are parity checkers. Such circuits are themselves subject to failures. The use of parity trees is outlined, and techniques for testing them are surveyed. The effect of the checker's structure on its testability is discussed. Several fault models are considered: single stuck-at, multiple stuck-at, and bridging faults. The effectiveness of single stuck-at fault test sets in detecting multiple stuck-at and bridging faults is described. Upper bounds for the double fault coverage of the minimal single fault test are given for different tree structures. The testabilities of some selected checkers are examined to illustrate the concepts developed. A built-in self-test is proposed     

A Binary Decision Diagram based on-line testing of digital VLSI circuits for feedback bridging faults

Classical manufacturing test verifies that a circuit is fault free during fabrication, however, cannot detect any fault that occurs after deployment or during operation. As complexity of integration rises, frequency of such failures is increasing for which on-line testing (OLT) is becoming an essential part in design for testability. In majority of the works on OLT, single stuck at fault model is considered. However in modern integration technology, single stuck at fault model can capture only a small fraction of real defects and as a remedy, advanced fault models such as bridging faults, transition faults, delay faults, etc. are now being considered. In this paper we concentrate on bridging faults for OLT. The reported works on OLT using bridging fault model have considered non-feedback faults only. The basic idea is, as feedback bridging faults may cause oscillations, detecting them on-line using logic testing is difficult. However, not all feedback bridging faults create oscillations and even if some does, there are test patterns for which the fault effect is manifested logically. In this paper it is shown that the number of such cases is not insignificant and discarding them impacts OLT in terms of fault coverage and detection latency. The present work aims at developing an OLT scheme for bridging faults including the feedback bridging faults also, that can be detected using logic test patterns. The proposed scheme is based on Binary Decision Diagrams, which enables it to handle fairly large circuits. Results on ISCAS 89 benchmarks illustrate that consideration of feedback bridging faults along with non-feedback ones improves fault coverage, however, increase in area overhead is marginal, compared to schemes only involving non-feedback faults.     

Multiple Stuck-at Fault Testability Analysis of ROBDD Based Combinational Circuit Design

Automatic test pattern generation (ATPG) is the next step after synthesis in the process of chip manufacturing. The ATPG may not be successful in generating tests for all multiple stuck-at faults since the number of fault combinations is large. Hence a need arises for highly testable designs which have 100% fault efficiency under the multiple stuck-at fault(MSAF) model. In this paper we investigate the testability of ROBDD based 2×1 mux implemented combinational circuit design. We show that the ROBDD based 2×1 mux implemented circuit is fully testable under multiple stuck-at fault model. Principles of pseudoexhaustive testing and multiple stuck-at fault testing of two level AND-OR gates are applied to one sub-circuit(2×1 mux). We show that the composite test vector set derived for all 2×1 muxes is capable of detecting multiple stuck-at faults of the circuit as a whole. Algorithms to derive test set for multiple stuck-at faults are demonstrated. The multiple stuck-at fault test set is larger than the single stuck-at fault test set. We show that the multiple stuck-at fault test set can be derived from the Disjoint Sum of Product expression which allows test pattern generation at design time, eliminating the need of an ATPG after the synthesis stage.     

On Maximizing the Coverage of Catastrophic and Parametric Faults

The purpose of this paper is to analyze an optimization method to improve the testability of structural and parametric faults in analog circuits. The approach consists of finding an optimum sub-set of tests which maximizes the fault coverage with minimum cost. The method is based on covering a discrete set of intervals by taking advantage of strategies effectively used in digital synthesis. A simple application example is given to illustrate the proposal by studying the fault coverage obtained using different test sets on the ITC97 benchmark op-amp.     

Stuck-open testable scan-based CMOS sequential circuits

A testing methodology for applying two-pattern tests for stuck-open faults in scan-testable CMOS sequential circuits is presented. This method requires shifting in only one pattern and requires no special latches in the scan chain. Sufficient conditions for robust testability of all single field-effect transistor (FET) stuck-open faults and design techniques for robustly scan-testable CMOS sequential circuits are presented. This technique leads to realizations with at most two additional inputs and some additional FET's in the first-level gates     

Fundamentals of testability-a tutorial

A review is presented of electrical testing, failure mechanisms, fault models, fault simulation, testability analysis, and test-generation methods for CMOS VLSI circuits. The relationships between the most commonly used fault models are explored. Various fault simulation methods are contrasted. The basic mechanisms used in test-vector generation are illustrated by examples. The importance of testability analysis as a guide to design and test generation is discussed. Algorithms for automatic test-pattern generation are summarized     

Distributed BIST Architecture to Combat Delay Faults

To successfully combat delay faults there is an urgent need for a proper design for testability (DFT). The foundation of any DFT methodology rests on its scan design. This paper describes three versions of a new design of a shift register latch that lend themselves to distributed self-test and delay test. The advantages of this new SRL is faster application of test vectors, higher DC and AC fault coverages, with low performance impact. Adoption of this new DFT methodology brings us closer to the ideal target of one test-per-clock as opposed to one test-per-scan. Operation, cost, and other attributes are studied in detail. Results of adopting one of these SRLs are reported on ten pilot chips.