Impurity states in cobalt-doped silicon

Cobalt was diffused into p⁺ pn⁺ silicon structures at 900° and 1150°C for 2−4 hours followed by various quenching conditions. Four primary hole traps and two electron traps associated with cobalt in these devices were observed. The hole traps are labeled H1(E_v + 0.22 eV), H2(E_v + 0.29 eV), H3 (E_v + 0.40 eV) and H4(E_v + 0.45 eV) while the electron traps labeled E1 and E2 are located at E_c − 0.36 eV and E_c − 0.44 eV, respectively. The concentrations, thermal emission rates, and the capture cross sections for the majority carriers at these defects are reported. The behavior of these defects under heat treatment and the emergence of secondary defects, H5(E_v +0.22 eV) and H6 (E_v +0.34 eV), will be discussed.     

Electron trap behaviour in Te-doped GaAs0.6P0.4

An electron trap spectrum has been obtained in Te-doped GaAsP by DLTs and transient capacitance measurements. The two traps identified display non-exponential emission and capture characteristics, the capture rate depending on temperature. The dominant trap A has an activation energy, E_a = 0.20 ± 0.02 eV and a constant concentration in the epilayer of typically 0.1N_d, trap B has an activation energy, E_a = 0.4 eV.The defect is donor related and characterised by non-radiative capture and lattice-relaxation multiphonon emission. Photocapacitance measurements provide the electron photoionization cross-section of the centre, and in agreement, a phonon broadened lineshape theory gave a threshold of 0.62 eV supporting the large lattice relaxation model. Evidence for persistent photoconductivity is also presented.     

Deep levels in undoped Si1−xGex grown by gas-source molecular beam epitaxy

Deep levels have been identified and characterized in undoped Si_1−xGe_x alloys grown on silicon substrates by gas-source molecular beam epitaxy. Hole traps in the p-type layers have activation energies ranging from 0.029–0.45 eV and capture cross sections (σ_∞ ranging from 10⁻⁹ to 10⁻²⁰ cm². Possible origins of these centers are discussed.     

Controlled vapor-pressure heat-treatment effect on deep levels in liquid-encapsulated czochralski-grown GaP crystals

Photocapacitance (PHCAP) measurements have been carried out on GaP crystals grown by the liquid-encapsulated Czochralski (LEC) method with heat treatment under various phosphorus-vapor pressures at different temperatures. Electron traps of E_C−1.1 eV, E_C−1.6 eV, E_C−1.9 eV, and a hole trap of E_V+2.26 eV are mainly detected. The phosphorus-vapor pressure dependence of the E_C−1.9 eV trap density and their diffusion behavior indicate that they are interstitial phosphorus atoms. The densities of both E_C−1.1 eV and E_C−1.6 eV traps are strongly dependent on the shallow impurity concentrations. Moreover, the density of E_C−1.1 eV traps increases with increasing phosphorus-vapor pressure. From these results, we suggest that E_C−1.1 eV traps are the complexes of shallow donors and antisite phosphorus atoms. Deep-level densities in GaP crystals after annealing at 860°C or 960°C for 60 min are decreased almost one order of magnitude lower than those in untreated substrate crystals, which should have occurred via out-diffusion of interstitial phosphorus atoms. However, such an effect is not prominent for 800°C treatment for 60 min.     

Effects of Illumination on Ar<Superscript>+</Superscript>-Implanted <Emphasis Type="Italic">n</Emphasis>-Type 6H-SiC Epitaxial Layers

Argon ions were implanted into n-type 6H-SiC epitaxial layers at 600°C. Postimplantation annealing was carried out at 1,600°C for 5 min in an Ar ambient. Four implantation-induced defect levels were observed at E_C-0.28 eV, E_C-0.34 eV, E_C-0.46 eV, and E_C-0.62 eV by deep level transient spectroscopy. The defect center at E_C-0.28 eV is correlated with ED₁/ED₂ and with ID₅. The defect at E_C-0.46 eV with a capture cross section of 7.8 × 10⁻¹⁶ cm² is correlated with E1/E2, while the defect at E_C-0.62 eV with a capture cross section of 2.6 × 10⁻¹⁴ cm² is correlated with Z1/Z2. Photo deep level transient spectroscopy was also used to study these defects. Upon illumination, the amplitudes of the deep level transient spectroscopy (DLTS) peaks increased considerably. Two emission components of Z1/Z2 were revealed: one fast and the other slow. The fast component could only be observed with a narrow rate window. In addition, a new defect was observed on the low-temperature side of the defect at E_C-0.28 eV when the sample was illuminated. [rl](Received ...; accepted ...)     

Effect of composition on deep levels in heteroepitaxial GexSi1−x layers and evidence for dominant intrinsic recombination-Generation in relaxed ge layers on Si

Electron traps, hole traps, and the dominant recombination-generation (R-G) centers have been investigated with deep level transient spectroscopy and current-voltage/temperature measurements in heteroepitaxial Ge_xSi_1-x alloys with x ranging from 0.15 to 1, grown on graded Ge_y.Si_1−y/Si substrates. For all samples with compositions x < 0.85, which retain the Si-like conduction band structure, we detect a dominant electron trap and R-G center whose activation energy is ΔE = 0.5 eV, independent of composition. This energy agrees with that of electron traps previously reported for plastically deformed (PD) Si, suggesting a connection to the Si-like band structure. This 0.5 eV level dominates the reverse leakage current over a wide range of growth and annealing conditions for the 30% Ge samples, indicating that the electronic state at ΔE = 0.5 eV is a very efficient R-G center, as would be expected from its midgap position. Alternatively, for strain relaxed, pure Ge (< 1), we detect electron traps at E_c − 0.42 eV and E_c − 0.28 eV, in agreement with the literature on PD Ge and Ge bicrystals. These energies are significantly different from those observed for x < 0.85, and we conclude that these changes in activation energy are due to changes in the conduction band structure for high Ge content. Moreover, in contrast with the Si-like samples (x < 0.85), the reverse leakage current in the relaxed Ge cap layer is not controlled by deep levels, but is rather dictated by intrinsic, band-to-band generation due to the reduced bandgap of Ge as compared to Si-like alloys. Only for reverse bias magnitudes which incorporate a significant portion of the graded buffer within the depletion region do R-G centers dominate the reverse leakage current. These results confirm the high quality of the strain-relaxed, pure Ge cap region which was grown on a Ge_ySi_1−y/Si step graded heterostructure (where y was increased from 0 to 1) by ultra high vacuum chemical vapor deposition. Finally, we report for the first time, what is apparently the dislocation kink site state at E_c − 0.37 eV, in a Ge_xSi_1−x alloy.     

Study of electrically active defects in n-GaN layer

Deep level defects in both p⁺/n junctions and n-type Schottky GaN diodes are studied using the Fourier transform deep level transient spectroscopy. An electron trap level was detected in the range of energies at E_c−E_t=0.23–0.27 eV with a capture cross-section of the order of 10⁻¹⁹–10⁻¹⁶ cm² for both the p⁺/n and n-type Schottky GaN diodes. For one set of p⁺/n diodes with a structure of Au/Pt/p⁺–GaN/n–GaN/n⁺–GaN/Ti/Al/Pd/Au and the n-type Schottky diodes, two other common electron traps are found at energy positions, E_c−E_t=0.53–0.56 eV and 0.79–0.82 eV. In addition, an electron trap level with energy position at E_c−E_t=1.07 eV and a capture cross-section of σ_n=1.6×10⁻¹³ cm² are detected for the n-type Schottky diodes. This trap level has not been previously reported in the literature. For the other set of p⁺/n diodes with a structure of Au/Ni/p⁺–GaN/n–GaN/n⁺–GaN/Ti/Al/Pd/Au, a prominent minority carrier (hole) trap level was also identified with an energy position at E_t−E_v=0.85 eV and a capture cross-section of σ_n=8.1×10⁻¹⁴ cm². The 0.56 eV electron trap level observed in n-type Schottky diode and the 0.23 eV electron trap level detected in the p⁺/n diode with Ni/Au contact are attributed to the extended defects based on the observation of logarithmic capture kinetics.     

Identification of Cu-related thermally stimulated current trap in undoped semi-insulating GaAs

In the thermally stimulated current spectra of semi-insulating GaAs, a unique trap T_a at 170K is sometimes observed. The activation energy and capture cross section of T_a are 0.43 eV and 3.7×10⁻¹⁵ cm², respectively. Based on a good correlation with the Cu-related photoluminescence emission at 1.36 eV and the Cu-related deep level transient spectroscopy hole traps HL4 and HB4, we argue that T_a is a Cu-related hole trap.     

Deep levels and a possible d-x-like center in molecular beam epitaxial inxal1−xas

The work reported here was performed in order to establish whether or not complex defects like the D-X center can be present in InAlAs. Dominant deep electron and hole traps in lattice-matched In_0.52Al_0.48As/InP have been identified and characterized. The traps have activation energies ranging from 0.25 to 0.95 eV. The electron traps have very large capture cross-sections,~10⁻¹²-10⁻¹¹ cm², similar to attractive centers. The lattice-matched samples do not show any persistent photoconductivity effects at low temperatures. In strained In_1−xAl_xAs with 0.48 <x ≤ 0.57, an electron trap with a thermal ionization energy of 0.35 eV, a strong dependence of its concentration on donor doping and very small thermal capture cross-section, 10¹⁸ cm², is identified. These samples exhibit persistent photoconductivity. We believe this trap is similar to the D-X center commonly observed in Al_xGa_1−xAs forx ≥ 0.28. He was on leave with the Solid State Electronics Laboratory, Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109. He is with the Institute of Radio Physics and Electronics, The University of Calcutta, Calcutta, India 700 009.     

Current transport in porous p-Si and Pd-porous Si structures

Mechanisms are investigated for current transport in porous p-Si and Pd-p-por-Si structures in the temperature range 78–300 K. It is shown that at 78 K drift transport is decisive, with the participation of deep traps with a concentration N _t≈1.3×10¹³ cm⁻³. At higher temperatures the diffusion mechanism takes over, with I∼exp(−qV/nkT) and n=10–20. Relaxation processes for the reverse current and photocurrent (ascending branch) have a delayed character (up to t⋍100 s) and are determined by the effect of traps at a depth E _t=0.80 eV. The temperature behavior of the photocurrent (without a bias) is connected with recombination at a level E _r=0.12 eV, and its value essentially depends on the contribution of the basal region of the diode structure. Fiz. Tekh. Poluprovodn. 32, 1073–1075 (September 1998)     

On-wafer RF stress and trapping kinetics of Fe-doped AlGaN/GaN HEMTs

In this paper, we investigate the trapping effects, of iron doped AlGaN/GaN HEMTs, before and after on-wafer 24 hour RF stress test. First, we study the trap centers responsible of the current collapse at different on-state bias and temperature conditions. Second, we investigate 24 hour RF stress effect on the trapping kinetics.By filling traps under off-state condition with high drain-source voltage, we have identified two prominent traps labelled E₁ and E₂ with activation energies of 0.7 eV and 0.6 eV under the conduction band, respectively. An increase of the amplitude of the trap centers E₁ and E₂ by 22.9% and 15.8% respectively is noticed during the RF stress. This result suggests that the degradation observed during RF stress might have induced a density increase of the traps involved in the E₁ and E₂ trap signatures responsible on the current collapse.     

Deep level studies in MBE GaAs grown at low temperature

The photo-induced current transient spectroscopy (PICTS), thermoelectric effect spectroscopy (TEES) and thermally stimulated current (TSC) spectroscopy have been used to characterize the deep levels in the GaAs materials grown at low temperature by molecular beam epitaxy. At least five hole traps and five electron traps have been identified by the TEES measurement employing a simplified sample arrangement. We have studied the behavior of various traps as a function of the growth temperature and the post-growth annealing temperature. Some of the shallower hole traps were annealed out above 650‡ C. Electron traps atE _c- 0.29 eV andE _c- 0.49 eV were present in the material, and have been identified as M3 and M4, respectively. The dominant electron trap, atE _c- 0.57 eV, is believed to be associated with the stoichiometric defect caused by the excess As in the material, and our data show evidence of forming a defect band by this trap. A possible model involving As precipitates is proposed for this trap atE _c-0.57 eV.     

Effect of Se-doping on deep impurities in AlxGa1−xAs grown by metalorganic chemical vapor deposition

We have studied the effect of Se-doping on deep impurities in Al_xGa_1−xAs (x = 0.2∼0.3) grown by metalorganic chemical vapor deposition (MOCVD). Deep impurities in various Se-doped Al_xGa_1−xAs layers grown on GaAs substrates were measured by deep level transient spectroscopy and secondary ion mass spectroscopy. We have found that the commonly observed oxygen contamination-related deep levels at E_c-0.53 and 0.70 eV and germanium-related level at E_c-0.30 eV in MOCVD grown Al_xGa_1−xAs can be effectively eliminated by Se-doping. In addition, a deep hole level located at E_y + 0.65 eV was found for the first time in Se-doped Al_xGa_1-xAs when Se ≥2 × 10¹⁷ cm⁻³ or x ≥ 0.25. The concentration of this hole trap increases with increasing Se doping level and Al composition. Under optimized Se-doping conditions, an extremely low deep level density (N_t less than 5 × 10¹² cm⁻³, detection limit) Al_0.22Ga_0.78As layer was achieved. A p-type Al_0.2Ga_0.8As layer with a low deep level density was also obtained by a (Zn, Se) codoping technique.     

Minority carrier traps in epitaxial gallium arsenide phosphide

The optical injection of minority carriers in the depletion region of a reverse biased Schottky barrier has permitted the study of deep levels in vapour phase epitaxial n-type GaAsP (Te) structures. The deep level transient spectroscopy (DLTS) experiments have yielded two hole traps at (E_v + 0.60)eV and (E_v + O.36)eV. Additional subsidiary transient capacitance, photocurrent and capture experiments are analysed, the details of which give electron and hole capture cross-sections, trap densities and activation energies. Derived values of minority carrier lifetime (~1 ns) agree with experimental values and with injection-level dependent LED efficiency.     

Evidence for causality between GaN RF HEMT degradation and the EC-0.57 eV trap in GaN

The degradation of industry-supplied GaN high electron mobility transistors (HEMTs) subjected to accelerated life testing (ALT) is directly related to increases in concentrations of two defects with trap energies of E_C-0.57 and E_C-0.75 eV. Pulsed I-V measurements and constant drain current deep level transient spectroscopy were employed to evaluate the quantitative impact of each trap. The trap concentration increases were only observed in devices that showed a 1 dB drop in output power and not the result of the ALT itself indicating that these traps and primarily the E_C-0.57 eV trap are responsible for the output power degradation. Increases from the E_C-0.57 eV level were responsible for 80% of the increased knee walkout while the E_C-0.75 eV contributed only 20%. These traps are located in the drain access region, likely in the GaN buffer, and cause increased knee walkout after the application of drain voltage.     

Thermal emission rates and capture cross sections of majority carriers at vanadium centers in silicon

The thermal emission rates and capture cross sections of majority carriers on the vandium associated centers in the depletion region of reverse biased silicon p-n junctions have been measured by the dark capacitance transient method. The three vanduim associated levels observed, two donor levels and a deep acceptor level, belong to the same vandium center. Least square fits of the emission data give the following emission rates; e_nl^t = 1.047 × 10⁶T² exp [?0.179±0.004 eV/kT], e_n0^t = 3.55 × 10⁷T² exp [?0.426±0.004 eV/kT] and e_p-2^t = 1.514 × 10⁶T² exp [?0.450±0.003 eV/kT]. The activation energy of the hole emission rate at the lower donor level is about 0.1 eV larger than the equilibrium thermal activation energy. The capture cross sections are σ_n0 = 3 × 10^?17cm² and σ_p0 = 8 × 10^?16cm² for the electron capture process at the deep acceptor level and the hole capture process at the upper donor level, respectively. The hole capture cross section on the lower donor level (σ_p-1) depends significantly on temperature. The large temperature dependence of the hole capture cross section can be expected due to the nonradiative multiphonon emission process.     

Electrically Active Defects in GaN Layers Grown With and Without Fe-doped Buffers by Metal-organic Chemical Vapor Deposition

Electrically active defects in n-GaN films grown with and without an Fe-doped buffer layer have been investigated using conventional and optical deep-level transient spectroscopy (DLTS). Conventional DLTS revealed three well- defined electron traps with activation energies E _a of 0.21, 0.53, and 0.8 eV. The concentration of the 0.21 and 0.8 eV defects was found to be slightly higher in the sample without the Fe-doped buffer, whereas the concentration of the 0.53 eV trap was higher in the sample with the Fe-doped buffer. A minority carrier trap with E _a ≈ 0.65 eV was detected in both samples using optical DLTS; its concentration was ∼40% higher in the sample without the Fe-doped buffer. Mobility spectrum analysis and multiple magnetic-field measurements revealed that the electron mobility in the topmost layer of both samples was similar, but that the sample without the Fe-doped buffer layer was affected by parallel conduction through underlying layers with lower electron mobility.     

Traps with near-midgap energies at the bonded Si/SiO<Subscript>2</Subscript> interface in silicon-on-insulator structures

Capture centers (traps) are studied in silicon-on-insulator (SOI) structures obtained by bonding and hydrogen-induced stratification. These centers are located at the Si/SiO₂ interface and in the bulk of the split-off Si layer. The parameters of the centers were determined using charge deep-level transient spectroscopy (Q-DLTS) with scanning over the rate window at fixed temperatures. Such a method allows one to study the traps near the Si midgap at temperatures near 295 K. It is shown that the density of traps with a continuous energy spectrum, which are located at the bonded Si/SiO₂ interface, decreases by more than four orders of magnitude at the mid-gap compared with the peak density observed at the activation energy E _a ≈0.2–0.3 eV. The capture centers are also found in the split-off Si layer of the fabricated SOI structures. Their activation energy at room temperature is E _a =0.53 eV, the capture cross section is 10^?19 cm², and the concentration is (0.7–1.7)×10¹³ cm^?3. It is assumed that these capture centers are related to deep bulk levels induced by electrically active impurities (defects) in the split-off Si layer close to the Si/SiO₂ interface.     

The effects of gate length variation and trapping effects on the transient response of AlGaN/GaN HEMT’s on SiC substrates

In AlGaN/GaN heterostructure field-effect transistors, the surface defects and dislocations may serve as trapping centers and affect the device performance via leakage current. In this paper we report results of our investigation of the trapping characteristics of Al_0.25Ga_0.75N/GaN HEMT using the Conductance Deep Level Transient Spectroscopy (CDLTS). Two deep level electronic defects were observed labeled E₁ and HL₁, with activation energies E_a1 = 1.36 eV and E_a2 = 0.63 eV. The hole-trap HL₁ is characterized for the first time in our studies. We identified the characteristics of the traps at the AlGaN/GaN interface adjoining the channel and the surface along the ungated region between the gate and the drain, as well as the effects of the surface traps.