Development of system specification for laser-optimized 50-/spl mu/m multimode fiber for multigigabit short-wavelength LANs

This paper presents the scientific arguments used in the specification development process by the Telecommunications Industry Association (TIA) Working Group FO-2.2.1 to develop the new multimode fiber and vertical-cavity surface-emitting laser specifications for high-speed application in data communications. Numerous engineering and commercial tradeoffs are described. The specification minimizes the link failure rate and overall link cost through utilization of communication-theory-based modeling and experimental verification. This was balanced against the reality of manufacturing costs attempting to maximize the yield of individual link components. The specific application used as an example has 50-/spl mu/m graded-index multimode fiber operating at 10 Gb/s (e.g., 10 Gb/s Ethernet and fiber channel). The link performance is determined by the interaction of the fiber intermodal dispersion measured by the differential modal delay, and the transceiver launch distribution into the multimode fiber measured by encircled flux. A theoretically based model and the simulation approach that were used to simulate 40 000 links are described. The information from these simulations was used to determine the specification limits. In addition, sensitivity to the specification limits was evaluated. The experimental results of a round robin conducted by the TIA are presented, which confirm that the modeled performance would yield the expected results in actual practice.     

RF noise in 0.18-/spl mu/m and 0.13-/spl mu/m MOSFETs

Studied the gate finger number and gate length dependence on minimum noise figure (NF/sub min/) in deep submicrometer MOSFETs. A lowest NF/sub min/ of 0.93 dB is measured in 0.18-/spl mu/m MOSFET at 5.8 GHz as increasing finger number to 50 fingers, but increases abnormally when above 50. The scaling gate length to 0.13 /spl mu/m shows larger NFmin than the 0.18-/spl mu/m case at the same finger number. From the analysis of a well-calibrated device model, the abnormal finger number dependence is due to the combined effect of reducing gate resistance and increasing substrate loss as increasing finger number. The scaling to 0.13-/spl mu/m MOSFET gives higher NF/sub min/ due to the higher gate resistance and a modified T-gate structure proposed to optimize the NF/sub min/ for further scaling down of the MOSFET.     

30-GHz bandwidth 1.55-/spl mu/m strain-compensated InGaAlAs-InGaAsP MQW laser

High-speed 1.55 /spl mu/m laser diodes with a 3-dB modulation bandwidths of 30 GHz were fabricated by using short-cavity mushroom structures with undoped, strain-compensated InGaAlAs-InGaAsP twenty-quantum-well active regions. The bandwidths were achieved at low bias current of 100 mA. The laser exhibited a high differential gain of 1.54/spl times/10/sup -15/ cm/sup 2/ and a small K factor of 0.135 ns. These results were achieved by using an In/sub 0.386/Ga/sub 0.465/AlAs barrier with 0.83% tensile strain to reduce the thermal emission time of holes from wells and hence the hole transport time.     

1.58-/spl mu/m broad-band erbium-doped tellurite fiber amplifier

This paper describes the development of a 1.58-/spl mu/m broad-band and gain-flattened erbium-doped tellurite fiber amplifier (EDTFA). First, we compare the spectroscopic properties of various glasses including the stimulated emission cross sections of the Er/sup 3+4/ I/sub 13/2/ /sup 4/I/sub 15/2/ transition and the signal excited-state absorption (ESA) cross sections of the Er/sup 3+4/ I/sub 13/2/ - /sup 4/I/sub 9/2/ transition. We detail the amplification characteristics of a 1.58-/spl mu/m-band EDTFA designed for wavelength-division-multiplexing applications by comparing it with a 1.58-/spl mu/m-band erbium-doped silica fiber amplifier. Furthermore, we describe the 1.58-/spl mu/m-band gain-flattened EDTFA we developed using a fiber-Bragg-grating-type gain equalizer. We achieved a gain of 25.3 dB and a noise figure of less than 6 dB with a slight gain excursion of 0.6 dB over a wide wavelength range of 1561-1611 nm. The total output power of the EDTFA module was 20.4 dBm and its power conversion efficiency reached 32.8%.     

Efficient thulium-doped 2-/spl mu/m germanate fiber laser

We report an efficient fiber laser operating near 2 /spl mu/m. The glass for the fiber is germanate that is highly doped with thulium. The effect of cross relaxation energy transfer between thulium ions as observed from emission spectrum of the glass samples results in the laser having a very high slope efficiency of 58% with respect to launched power. This corresponds to a quantum efficiency of 1.79, indicating that each pump photon leads to near 1.8 excited Tm/sup 3+/ ions.     

An enhanced fully scaled 1.2-/spl mu/m CMOS process for analog

An n-well CMOS technology has been developed for high-speed/precision 10-V analog operation while retaining VLSI packaging densities and performance. Several enhancements to a fully scaled 1.2-/spl mu/m CMOS process were made to attain performance levels necessary for state-of-the-art data-conversion applications. The technology incorporates components essential for analog circuit design such as high-gain/low-noise n-p-n BJTs, laser trimmable Cr-Si resistors, and extremely accurate interpoly oxide capacitors. Inclusion of an optimized LDD structure on n-channel transistors has permitted 10-V CMOS capabilities down to 2.5-/spl mu/m drawn gate lengths.     

Plug-in type 1.3-/spl mu/m fiber amplifier module for rack-mounted shelves

We have successfully developed a plug-in type PDFA module for rack mounted shelves which is assembled on a printed-board. In this module, we use a newly developed Pr/sup 3+/-doped high-NA PbF/sub 2//InF/sub 3/-based fluoride fiber and wavelength stabilized 1.017-/spl mu/m laser diodes (LDs). We have obtained a small-signal gain of 24 dB and a noise figure of 6.6 dB at 1.30 /spl mu/m with an LD drive current of 240 mA/spl times/2. We achieved an output power of 10 dBm with a signal input power of 0 dBm. The total power consumption of this module, including that of a Peltier cooler, was 3.5 W when the LD drive current was 240 mA/spl times/2.     

A K-band down-conversion mixer with 1.4-GHz bandwidth in 0.13-/spl mu/m CMOS technology

A low power and low voltage down conversion mixer working at K-band is designed and fabricated in a 0.13/spl mu/m CMOS logic process. The mixer down converts RF signals from 19GHz to 2.7GHz intermediate frequency. The mixer achieves a conversion gain of 1dB, a very low single side band noise figure of 9dB and third order intermodulation point of -2dBm, while consuming 6.9mW power from a 1.2V supply. The 3-dB conversion gain bandwidth is 1.4GHz, which is almost 50% of the IF. This mixer with small frequency re-tuning can be used for ultra-wide band radars operating in the 22-29GHz band.     

Neodymium-doped cladding-pumped aluminosilicate fiber laser tunable in the 0.9-/spl mu/m wavelength range

A tunable high-power cladding-pumped neodymium-doped aluminosilicate fiber laser is demonstrated. The maximum power reached was 2.4 W with a slope efficiency of 41% and a threshold pump power of 1.68 W, both with respect to launched pump power, when cladding pumped by two 808-nm diode pump sources at both fiber ends. The dependence of the tuning range on the fiber length is investigated. The tuning range changed from 922 to 942 nm for a 25-m-long fiber to 908-938 nm with a 14-m-long fiber, because of reabsorption effects. The output linewidth was 0.26 nm in a diffraction-limited beam. Operation on the challenging 0.9-/spl mu/m three-level transition in neodymium-doped double-clad fiber laser was facilitated by a W-type core refractive index profile. This filtered out the unwanted and competing strong transition at 1.06 /spl mu/m while guidance of 0.9 /spl mu/m remained intact.     

Dual-modulus 127/128 FOM enhanced prescaler design in 0.35-/spl mu/m CMOS technology

The dual-modulus prescaler is a critical block in CMOS systems like high-speed frequency synthesizers. However, the design of high-moduli, high-speed, and low-power dual-modulus prescalers remains a challenge. To face the challenge, this paper introduces the idea of using transmission gates and pseudo-PMOS logic to realize the dual-modulus prescaler. The topology of the prescaler proposed is different from prior designs primarily in two ways: 1) it uses transmission gates in the critical path and 2) the D flip-flops (DFFs) used in the synchronous counter comprise pseudo-PMOS inverters and ratioed latches. A pseudo-PMOS logic-based DFF is introduced and used in the proposed prescaler design. Based on the proposed topology, a dual-modulus divide-by-127/128 prescaler is implemented in 0.35-/spl mu/m CMOS technology. It consumes 4.8 mW from a 3-V supply. The measured phase noise is -143.4 dBc/Hz at 600 kHz. The silicon area required is only 0.06 mm/sup 2/. There are no flip flops or logic gates in the critical path. This topology is suitable for high-speed and high-moduli prescaler designs. It reduces: 1) design complexity; 2) power consumption; and 3) input loading. Measurement results are provided. An improvement in the figure of merit is shown.     

A 3.3-mW /spl Sigma//spl Delta/ modulator for UMTS in 0.18-/spl mu/m CMOS with 70-dB dynamic range in 2-MHz bandwidth

A quadrature fourth-order, continuous-time, /spl Sigma//spl Delta/ modulator with 1.5-b quantizer and feedback digital-to-analog converter (DAC) for a universal mobile telecommunication system (UMTS) receiver chain is presented. It achieves a dynamic range of 70 dB in a 2-MHz bandwidth and the total harmonic distortion is -74 dB at full-scale input. When used in an integrated receiver for UMTS, the dynamic range of the modulator substantially reduces the need for analog automatic gain control and its tolerance of large out-of-band interference also permits the use of only first-order prefiltering. An IC including an I and Q /spl Sigma//spl Delta/ modulator, phase-locked loop, oscillator, and bandgap dissipates 11.5 mW at 1.8 V. The active area is 0.41 mm/sup 2/ in a 0.18-/spl mu/m 1-poly 5-metal CMOS technology.     

500 /spl mu/m diameter CMOS compatible avalanche photodiodes with 500 MHz bandwidth

Novel silicon-on-insulator, large area (500 /spl mu/m diameter), CMOS avalanche photodiodes for use with plastic optical fibre are presented. Patterns have been formed on the devices to reduce junction capacitance. Measurements on the patterned devices, at 650 nm and 26 V reverse bias, revealed bandwidths of >500 MHz.     

1.5-2.0-/spl mu/m multiwatt continuum generation in dispersion-shifted fiber by use of high-power continuous-wave fiber source

We demonstrated the generation of multiwatt single-mode infrared continuum by using highly nonlinear dispersion-shifted optical fiber pumped by a continuous-wave erbium fiber source. A smooth 1000-nm at -20-dB-wide continuum is demonstrated with a remarkable 450-nm full-width at half-maximum bandwidth. A maximum spectral power density of 4.5 mW/nm is obtained.     

Improved high-temperature performance of 1.3-1.5-/spl mu/m InNAsP-InGaAsP quantum-well microdisk lasers

We report for the first time lasing action in the InNAsP-InGaAsP material system. Dramatic improvement in lasing action in a microdisk cavity was observed at elevated temperature up to 70/spl deg/C, which is about 120/spl deg/C higher than that of InGaAs-InGaAsP microdisk. This resulted in the first optically pumped InNAsP-InGaAsP microdisk lasers capable of above room-temperature lasing. The improvement of lasing temperature can be attributed to a large conduction band offset between the quantum well and barriers in the InNAsP-InGaAsP material system.     

Damascene W/TiN gate MOSFETs with improved performance for 0.1-/spl mu/m regime

W/TiN gate CMOS technologies with improved performance were investigated using a damascene metal gate process. 0.1-/spl mu/m W/TiN stacked gate CMOS devices with high performance and good driving ability were fabricated successfully by optimizing the W/TiN stacked gate structure, improving the W/TiN gate electrode sputtering technology, and reducing W/TiN stacked gate MOSFET surface states and threshold voltages. A super steep retrograde (SSR) channel doping with heavy ion implantation, /sup 115/In/sup +/ for NMOS and /sup 121/Sb/sup +/ for PMOS, was applied here to obtain a reasonably lower threshold voltage and to suppress short-channel effects (SCEs). Non-CMP technology, used to replace CMP during the damascene metal gate process, was also explored. The propagation delay time of 57 stage W/TiN gate CMOS ring oscillators was 13 ps/stage at 3 V and 25 ps/stage at 1.5 V, respectively. Better performance would be achieved by using Co/Ti salicide source/drain (S/D) and thinner gate dielectrics.     

A Bluetooth radio in 0.18-/spl mu/m CMOS

This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.     

Optimized retrograde N-well for 1-/spl mu/m CMOS technology

Using experiment and simulation, transistors in a high-energy implanted N-well are designed for optimum device performance suitable for 1-/spl mu/m CMOS technology. The effect of process parameters on device performance is obtained. Superior body effect, junction capacitance, punchthrough voltage, and subthreshold slope are achieved for 1-/spl mu/m n- and p-channel transistors. With shallow P/P+ epitaxial material, this retrograde N-well approach also provides latch-up immunity for high-density CMOS.     

A 1-/spl mu/m Bipolar VLSI Technology

A 1-/spl mu/m VLSI process technology has been developed for the fabrication of bipolar circuits. The process employs electron-beam slicing writing, plasma processing, ion implantation, and low-temperature oxidation/annealing to fabricate bipolar device structures with a minimum feature size of 0.9 /spl mu/m. Both nonisolated I/sup 2/L and isolated Schottky transistor logic (STL) devices and circuits have been fabricated with this process technology. The primary demonstration vehicle is a seated LSI, I/sup 2/L, 4-bit processor chip (SBP0400) with a minimum feature size of 1 /spl mu/m. Scaled SPB0400's have been fabricated that operate at clock speeds 3X higher than their full-size counterparts at 50-mA chip current. Average propagation delay has been measured as a function of minimum feature size for both I/sup 2/L and STL device designs. Power-delay products of 14 fJ for I/sup 2/L and 30 fJ for STL have been measured.     

35-GHz intrinsic bandwidth for direct modulation in 1.3-/spl mu/m semiconductor lasers subject to strong injection locking

Significant enhancement in modulation bandwidth of semiconductor lasers subject to strong optical injection is experimentally and theoretically studied. At least two folds of improvement is achieved under study. By using an optical probing method, a modulation bandwidth of 35 GHz that is free from electrical parasitic effects is observed in the injection-locked laser system. The achieved bandwidth approaches the maximum modulation bandwidth set by the K factor for the free-running laser. Discussions are presented for an even larger modulation bandwidth using the injection-locking technique.