半导体测试调度研究

半导体测试是资金高度密集、涉及产品种类与设备种类繁多的半导体生产环节.半导体测试需要同时使用测试机、送料机台和使能器等资源.资源组合及其可加工的产品类型的对应关系错综复杂,大多数半导体测试调度问题是考虑多资源约束和作业换型时间的平行机调度问题.分别从问题和方法两个角度对半导体测试调度研究进行分析,归纳了附加资源充足的测试调度和附加资源受限的测试调度两大类问题,并对目前半导体测试调度的各类方法进行总结对比,分析了各类方法的特点.     

走近硅谷

半导体设备制造业面临新挑战 半导体制造设备主要用于生产芯片,这些设备通常价值高达数百万美元,在半导体工业的大本营--硅谷,许多大半导体设备企业的管理人员已经接近退休年龄,但一些企业甚至没有选定后备的接班人.高级管理人员要么从企业内部提拔,要么从别的同类企业挖过来.     

半导体晶圆制造车间层控制的内容及方法

半导体晶圆制造企业是资本密集、技术密集型产业,晶圆制造厂也是公认生产最为复杂的工厂之一。产品更新换代快、市场竞争激烈等特点使得投资者对设备产能和设备利用率高度重视。这已不仅仅是技术问题,而是生产制造过程管理的问题。本文介绍了半导体晶圆制造车间层控制的内容及方法。     

创新立业 服务为本——记深圳市丰德微电子有限公司

半导体新品的涌现,生产周期的缩短,相应地要求半导体设备必须加快更新换代的步伐。在我国,虽然半导体工业正在以惊人的速度发展,但与国外先进国家相比,还要落后10-15年。因此,国外技术领先企业已淘汰的半导体专用设备在我国却有很大的市场需求。这种市场需求导致了“半导体专用设备的引进消     

半导体装备工程化批产脉动生产线技术应用与研究

国产半导体装备在国家政策及国内市场的双重推动下迎来了新发展机遇，未来设备交货能力将成为半导体工艺设备厂商竞争的重点，为进一步提高设备出货及市场交货能力，加强企业竞争力，通过脉动生产线技术应用，使得国产半导体装备工程化批产能力建设进一步得到加强，目前该生产线年产能180台套装备，其中200 mm(8英寸)立式炉、150 mm(6英寸)SiC外延设备等半导体装备已实现研转批工程化批产生产。该技术在半导体设备制造过程中具有重要的应用价值，可以有效提高生产效率和产品质量。然而，目前该技术在实际应用中还存在一些问题，需要进一步研究和改进。希望本文的研究成果对相关领域的研究者和实践者有所启示和借鉴。     

半导体后段制造自动化

越来越多的半导体厂商开始考虑在半导体后段生产中采用自动化控制，目前还没有开发出非常成功的技术能够满足变化多端的后段工厂。本文介绍了半导体制造自动化的概况，分析了半导体制造自动化的需求，进而提出了一种基于SECS／GEM标准接口的半导体制造全自动化生产线解决方案。所有设备全部都通过使用SECS标准接口连接到单元控制器及更高级别的MES和工厂计划信息系统，系统除了能完成通常的设备监视和控制、数据搜集、配方管理等功能外，还实现了单一元件追踪，具有Stripmap管理，缺陷管理及多芯片管理等功能。半导体厂商通过实施全自动化改善了生产力，同时减少生产周期和场地占用率，并通过最小化人工操作和过程的连贯性带来质量和可靠性的提升．     

新形势下中国半导体设备的发展对策

随着半导体生产热点全球性地向中国转移,国内的半导体设备行业面临着空前的巨大机会和前所未有的严峻挑战。在全面深入分析半导体设备特性以及行业发展特点的基础上,指出核心技术是产品性能和成本即市场生命力的决定性因素。针对当前国内半导体设备开发中普遍存在的偏差与误区,提出了努力促进企业自身对核心技术全面深入的掌握,不断增强其自主持续创新能力的半导体设备发展对策。以全自动引线键合机开发和市场的具体详细实例印证这一论断。     

国际要闻

美国台湾商会呼吁美政府支持对华出口半导体美国台湾商会目前公布了“2005年第四季半导体报告”,这是该商会分析美国与中国台湾、中国大陆半导体业之间关系趋势的最新一份季报。在今年的第一季度中,一个重要的事件是美国政府决定对不予考虑向中芯国际出口价值7.69亿美元的美国半导体生产设备的贷款申请。美国台湾商会会长鲁伯特-哈蒙德-钱伯斯称:“美国进出口银行反对此项贷款的决定不仅对美国的设备提供商而言非常重要--他们本来可以从交易中获利,而且对未来的美国半导体业和我们的整体经济产生影响。问题的关键是,美国的半导体设备业依赖…     

集束型半导体制造设备的预防维修计划优化

研究了生产200mm以上晶圆的半导体制造企业中的主要设备--集束型设备(cluster tools)的预防维修计划优化问题.基于半导体集成电路生产线的复杂性及集束型设备的特点,建立了基于系统观的集束型设备预防维修计划实时优化模型,设计了用遗传算法求解模型的方法,最后以一个实例及运行结果说明了研究的实用性.     

半导体光学器件在电子信息领域的实际应用浅析

随着电子信息技术的快速发展,目前,半导体光学器件在生产和生活领域应用范围不断拓宽,利用半导体光学技术的新型设备不断涌现,本文主要探讨半导体激光光源和激光接收器.     

Optimized operations by extended X-factor theory including unithours concept

The relationships between tool performance, cycle time, and throughput have been described to achieve the highest productivity. Though tool utilization is low for manually operated tools, long waits prior to product processing lead to a productivity loss in our production line. We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. This paper introduces an online/offline unit hour analysis method, which has been designed to optimize operator allocation and headcount in our production line, using X-factor theory in order to achieve the shortest cycle time. By using online/offline unit hour analysis with X-factor theory, the root cause of waiting time can be identified and the relationship between operator headcount and cycle time can be described. The waiting time can be reduced by 35% and the cycle time can be reduced by 25%, according to a simulator with optimized operator allocation and headcount based on online/offline unit hour analysis     

The development of the complete X-factor contribution measurement for improving cycle time and cycle time variability

Reducing variability in a manufacturing process lowers system cycle times. Semiconductor manufacturing is a variable process due in part to product mix, reentry lot flows, batching, and machine breakdowns. This paper examines the issue of identifying machines that introduce variability into the system and constrain the system capacity. We develop a new X-factor contribution measurement, the complete X factor, that considers processing time variability and lot arrival variability among the constraining qualities of the machine groups. This new measure uses machine level data to indicate the normalized system cycle time which has typically been estimated by the ratio of the entire process time and the raw processing time at the end of production. With this measure it becomes possible for factory floor managers to identify a capacity constraining machine and its impact on the overall cycle time directly. We first qualitatively present the justification of the complete X factor for representing the normalized cycle time using queuing theory. Then, the complete X-factor measure was tested on a full-scale simulation model to demonstrate its accuracy for detecting capacity constraining machine groups and for representing normalized cycle time. We also explore the propagation of variability and the effect a highly variable machine group has on product cycle time and cycle time variability in relation to process routing. In a full-scale model machines identified by the complete X-factor contribution measure (CXC) measure lowered cycle time as effectively as highly utilized machines by adding capacity or streamlining breakdowns but had a more prominent effect on lowering cycle time variability. After a brief study on the propagation of variability, the CXC measure identified a lower utilized backend process that reduced cycle time and cycle time variability of the system.     

半导体封装测试厂库存控制系统的研究

在制品库存控制是生产制造系统的一项重要活动,它直接关系到工厂的产出、生产周期和物料投放。当前很多半导体封装测试厂还没有形成一个系统化的库存管理模式,导致库存过高或不均, 直接影响产出和生产成本。文章将阐述半导体封装测试厂如何选用并有效实施CONWIP系统,以及它在生产控制、降低库存和缩短生产周期上发挥的积极作用。     

Implementation of modeling and simulation in semiconductor waferfabrication with time constraints between wet etch and furnaceoperations

In semiconductor wafer fabrication, time constraints between process steps in furnace and wet etch make it difficult to achieve cycle time targets and maximize machine utilization. For capacity planning, it is difficult to estimate the impact of these time constraints on the machine capacity. Infineon Technologies Dresden has conducted a study using discrete event simulation, to investigate the actual situation in the factory and to identify recommendations to eliminate or to reduce the impart of time constraints. The work in this paper yields a two-day reduction in total cycle time after implementation of findings in the factory     

看板在晶圆厂清洗-炉管间的派工应用及仿真

看板是实现拉式派工的有效工具,它可以用于晶圆制造厂清洗区和炉管区之间的动态派工.用Extend仿真建模软件建立了有"重入特性"的晶圆厂仿真模型.通过晶圆厂仿真模型进行模拟,结果显示看板可以解决晶圆生产在清洗工艺后存在违反"等待时间限制"的情况,可以显著提高炉管设备的利用率,并且明显降低产品的生产周期时间.     

Statistical Approach for Cycle Time Estimation in Semiconductor Packaging Factories

In the semiconductor industry, to enhance customer satisfactions and ability of quick responses, the development of cycle time estimation model is very important. Cycle time estimation is an essential planning basis, which has many applications, especially on the analyses of performance indexes, capacity planning, and the assignments of due dates. In this paper, we provide a statistical approach for cycle time estimation in semiconductor plastic ball grid array (PBGA) packaging factories. Due to today's fierce competitive environments in the semiconductor industry, planners involved in PBGA packaging factories need an approach to obtain estimated cycle times with different confidence to ensure the due date assignments more accurately. Therefore, upper confidence bounds of estimated cycle times at various confidence coefficients are also presented in this paper. We demonstrate the applicability of the proposed cycle time estimation model incorporating the upper confidence bounds by presenting a real-world example taken from a PBGA packaging shop floor in a semiconductor packaging factory located in the Science-Based Industrial Park in Hsinchu, Taiwan.      

An examination of variability and its basic properties for a factory

Variability is a key performance index of a factory. In order to characterize variability of a factory, definitions of bottleneck, utilization, and variability of a single machine are reexamined and clarified. The clarification leads to the introduction of a detail expression for the relationship between cycle time and work-in-progress. In order to quantify variability for factories, the author uses a single machine system to gauge the behaviors, and subsequently derives an explicit expression for the variability, of a simple factory, making use of analogy and the clarified definitions. The obtained results can be applied to many subjects in the field of manufacturing management, such as factory performance analysis, capacity planning, and cycle time reduction. With the derived results, properties of variability for a simple factory in the aspects of utilization versus throughput bottlenecks and nonthroughput bottlenecks, gap effects, and bounds on variability, are examined in detail to shed light on the insights of the stochastic behaviors of a complex factory.     

多标签无线供电反向散射通信网络能效优化算法

为了提高物联网(IoT)节点的运行周期和能量利用率,该文提出一种多标签无线供电反向散射通信网络能效最大化资源分配算法。考虑传输速率约束、能量收集约束以及发射功率约束,建立了基于系统能效最大化的资源分配模型。利用Dinkelbach理论、2次变换以及变量替换法,将原分式非凸问题转化为可求解的凸优化问题。通过拉格朗日对偶理论求得优化问题的全局最优解。仿真结果表明,该算法具有较好的收敛性和能效。     

Dynamic bottleneck control in wide variety production factory

At a factory which produces a wide variety of products such as ASIC's or microcomputers, it is necessary to detect any machine causing a bottleneck and return it to a high level of performance for fast and effective production. This paper introduces a workflow control system called “JUSTICE/MORAL” (just time process control system/method of optimum-buffer restriction and adjustment logic) which dynamically detects a machine causing a bottleneck and feeds work to that machine at an appropriate time. The advantages of this system are as follows: (1) manufacturing cycle time can be reduced by an average of 13% and a maximum of 50% and (2) throughput can be increased up to approximately 10%. Part of this system has been installed in our factory. We have seen factory cycle time improve by approximately 20% in the two month period from July to September 1998. Also, the machine causing the bottleneck was found quickly; as a result, the utilization of this machine increased by 3%,     

A new manufacturing control system using Mahalanobis distance for maximizing productivity

Primary productivity in the semiconductor manufacturing industry, which includes cycle time, cost, and production, depends to a great extent on the capability of manufacturing administrators (MA), particularly with regards to the critical tradeoff between cycle time and tool utilization. The Mahalanobis distance (MD) has significance in pattern recognition, and the authors have found a method to make use of the MD as the core of a manufacturing control system. By using this system, one can easily distinguish deviations from normality in respect to productivity, specify the root cause of the abnormality, and decide how to prioritize the problem. As a result, one can efficiently concentrate limited resources on the root cause in the absence of a capable MA and restore productivity on a minimum timescale.