聚酰胺酸粒子亚胺化的研究

以均苯四酸二酐(PMDA)和4,4,-二氨基二苯醚(ODA)为原料合成了均苯型的聚酰胺酸(PAA)粒子.并以乙酸酐/吡啶为脱水剂,对PAA粒子进行化学亚胺化和不同温度下进行热亚胺化处理.通过红外光谱(IR),紫外光谱(UV),示差热量扫描(DSC)探讨了PAA的亚胺化条件.     

含酮柔性共聚型聚酰亚胺性能研究

为了考察柔性二酐共聚对聚酰亚胺(PI)薄膜性能的影响,用含柔性基团的酮酐单体3,3',4,4'-二苯酮四酸二酐(BTDA)、刚性二酐单体均苯四甲酸二酐(PMDA)和芳香二胺4,4'-二氨基二苯醚(ODA)共聚,制得共聚聚酰亚胺薄膜.分别用FT-IR(ATR)、TMA、TGA、万能试验机对薄膜的结构、热性能及力学性能进行了测定.结果表明,聚合物亚胺化程度完全,且随着柔性二酐的加入聚合物的热性能得到明显改善,同时力学性能数据也表明,共聚物柔性增强,材料的加工性得到提高.     

含三(4-氨基苯基)苯的超支化聚酰亚胺的合成及表征

合成了三胺单体1,3,5-三(4-氨基苯基)苯(TAPB),将其与3,3′,4,4′-二苯酮四酸二酐(BTDA)缩合,采用化学亚胺化和热亚胺化两种方法合成了一种新型超支化聚酰亚胺(HBPIs).经红外光谱和核磁共振确认产物结构.对聚合物的性能进行分析,结果表明,聚合物的溶解性得到很好的改善.     

P-PDA/MDA/BTDA三元共聚聚酰亚胺胶黏剂的制备及性能

采用二酐单体3,3′,4,4′-二苯甲酮四羧酸二酐(BTDA)与4,4′-二氨基二苯甲烷(MDA)、对苯二胺(P-PDA)2种二胺单体通过三元共聚的方法合成聚酰胺酸(PAA)。采用傅里叶变换红外光谱仪(FTIR)、核磁共振氢谱(¹H-NMR)、X射线衍射仪(XRD)表征PAA的结构；利用热重分析仪(TG)、差示扫描量热仪(DSC)表征PAA的耐热性能；除此以外，在不同固化条件下，研究了PAA粘接聚四氟乙烯纤维布的性能。结果表明，当P-PDA、MDA和BTDA的摩尔比例为2∶1∶3.03、固含量为20%时，PAA的玻璃化转变温度大于350℃,初始分解温度为568.3℃,特性黏度为0.45 dL/g的PAA。涂胶后，在240℃、0.1 MPa、5 min条件下固化，试样可剥离断裂变形，剥离强度为4.085 2 N/mm。     

化学亚胺化法合成三元共聚聚酰亚胺

以N,N-二甲基甲酰胺为溶剂,用3,3′,4,4′-二苯酮四酸二酐(BTDA)、2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和4,4′-二氨基二苯砜(DDS)合成3种聚酰亚胺(PI)。先用BAPP和/或DDS与BTDA反应生成一系列聚酰胺酸(PAA),然后将得到的PAA化学亚胺化制备相应的PI。用傅里叶变换红外光谱(FTIR)仪、核磁共振仪和黏度计等表征了聚合物的结构和性能。FTIR谱图中1780,1720,725 cm~(-1)附近出现了PI的特征吸收峰。制备的PI有很好的热稳定性,N_2气氛中低于500℃没有明显的降解。     

微波辐射合成聚酰胺酸和聚酰亚胺的研究

在N,N’-二甲基甲酰胺溶剂中,以均苯四甲酸酐和3,3’,4,4’-二苯酮四羧酸二酐为二酐单体,4,4’-二氨基二苯醚和4,4’-二氨基二苯甲烷为二胺单体,采用微波辐射低温溶液共缩聚,合成了聚酰胺酸(PAA)预聚体,然后亚胺化脱水、环化,生成共缩聚聚酰亚胺(PI)。通过红外光谱(FT-IR)、特性粘度[η]和热重分析(TG)等对聚合物进行了一系列的结构表征和性能测试。结果表明,微波辐射溶液聚合能够提高PAA的特性粘数及产率,微波的引入大大缩短了反应时间;FT-IR表明,在1 775 cm-1和1 724 cm-1处观察到聚酰亚胺特征峰;TG表明,PI的5%热失重温度(Td5%)为477℃,10%热失重温度(Td10%)为553℃。     

含烷基取代基柔性聚酰亚胺薄膜的制备

以柔性二胺单体1,3-双(4-氨基苯氧基)苯(134BAPB)和含支链二胺单体3,3′-二乙基-4,4′-二氨基二苯甲烷(DEMMD)与3,3′,4,4′-二苯酮四酸二酐(BTDA)进行三元共聚,制备了一系列聚酰亚胺(PI)薄膜。通过傅里叶红外光谱、差示扫描量热仪、热重分析仪、热机械分析仪及电子万能材料试验机对材料的结构、热性能和力学性能进行了表征。结果表明PI薄膜已经成功制备,热性能与力学性能良好。     

聚酰亚胺纤维热亚胺化过程研究

为考察柔性、刚性和半刚性三种不同结构聚酰亚胺（PI）的热亚胺化过程,通过差式扫描量热（DSC）测试,得到三种PI的前驱体聚酰胺酸（PAA）在不同升温速率下亚胺化反应的热过程,根据Kissinger法和Flynn-Wall-Ozawa法计算得到不同结构PI的亚胺化反应动力学方程。经过原位升温红外光谱判断出在亚胺化反应过程中柔性结构PI-1几乎没有解离反应,刚性结构PI-2和半刚性结构PI-3在亚胺化过程中伴随酐的产生,其解离过程占优势的温度为150～300℃。结果表明：半刚性结构PI-3亚胺化反应活化能较低,亚胺化过程中力学性能较好,产生酐的解离过程比较缓和,是制备高性能PI纤维较为理想的聚合体系。     

共缩聚聚酰胺酸和聚酰亚胺的微波辐射合成研究

在N,N′-二甲基甲酰胺(DMF)溶剂中,选用3,3,′4,4′-二苯酮四羧酸二酐(BTDA)、均苯四甲酸酐(PMDA)和4,4′-二氨基二苯醚(ODA)为单体,微波辐射低温溶液缩聚合成一种共缩聚聚酰亚胺的前驱体聚酰胺酸(PAA),然后亚胺化脱水环化生成共缩聚聚酰亚胺(PI)。通过特性黏数([η])、红外光谱(FT-IR)和热重分析(TGA)对聚合物进行了结构表征和性能测试。结果表明,微波辐射溶液聚合能够提高PAA的特性黏数及产率,微波的引入大大缩短了反应时间;IR表明,在1778 cm-1和1723 cm-1处观察到聚酰亚胺特征峰;TG表明,PI在氮气中535℃左右开始降解,10%热失重温度(Td10%)为587℃。     

聚酰胺酸薄膜热环化过程热分析

用差热扫描量热仪(DSC)和傅立叶红外光谱仪(FTIR),考察了梯度升温过程中聚酰胺酸PAA[由4,4-二胺基二苯醚(ODA)和3,3,4,4-二苯醚四酸二酐(ODPA)制备]薄膜环化度和玻璃化温度(Tg)随反应温度的变化。结果表明,随着温度的升高,聚合物薄膜的亚胺化程度和Tg不断增大,且各恒温点的薄膜Tg均高于反应温度。另外,由亚胺化程度与Tg的关系曲线可见,在环化程度低时,薄膜Tg增长缓慢;随着亚胺化程度继续增高,薄膜的Tg迅速增大。用热环化过程中分子活动性的变化解释了酰亚胺化反应过程中环化速率的变化。     

含羟基聚酰亚胺改性环氧胶的制备及性能研究

将3,3'-二氨基-4,4'-二羟基联苯(DADHBP)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAH-PFP)和3,3',4,4'-四羧酸二苯醚二酐(ODPA)、3,3',4,4'-四羧酸二苯甲酮二酐(BTDA)单体聚合,再经亚胺化得到含羟基聚酰亚胺(HPI)粉末,采用傅里叶红外光谱对其进行了表征。由HPI、烯丙基双酚A、双马来酰亚胺、2-乙基-4-甲基咪唑与N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷(TGDDM)共聚反应制得胶粘剂,并对胶粘剂的热性能、力学性能及吸水性进行了研究,结果表明:该胶拉伸剪切强度为21.1 MPa,固化后吸水率为0.49%。通过凝胶化时间法计算胶粘剂的表观活化能为64.5 kJ/mol。     

Solvent effect on the curing of polyimide resins

The effect of the solvent 1-methyl-2-pyrrolidinone (NMP) on the curing of polyimide resins synthesized from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) has been investigated. Three polyimide precursors, i.e., the polyamic acid (PAA), with controlled amount of NMP were prepared. The study was aimed first to independently investigate the decomplexation process, which involved the evolution of hydrogen-bonded NMP from PAA, without interference from imidization. This was accomplished by TGA at varying heating rates using different solvent content in PAA. The observed one-stage decomplexation process suggested that the complex formation of NMP and PAA was not the same as the model compound studied by others. An average value of 150 kJ/mol for the activation energy of the decomplexation process was obtained. The study then sought to identify the effect of the decomplexation on the imidization kinetics by employing DSC at several drying temperatures and also varying heating rates. This allowed one to control the extent of plasticization that occurred to facilitate the imidization process. Our DSC data showed that over-drying PAA resulted in prolonged imidization due mainly to the lack of plasticization by decomplexed NMP. The estimated enthalpy of imidization and that of decomplexation were 114 KJ/mol and 53 kJ/mol NMP, respectively. Finally, the imidization kinetics was independently investigated using FTIR, without the interference from decomplexation process. The results indicated that there were four stages during the entire imidization process. Up to a temperature of 150°C, less than 20% of amide groups had reacted to give imide groups and the reaction was slow. Most of the imidization took place between 150 and 180°C with conversion as high as 90%. The imidization process was completed after the temperature was further raised to 250°C. Above 250°C, the reverse reaction became more significant (due probably to configurational and packing preference) and resulted in a lowering of final conversion back to 80%. © 1992 John Wiley & Sons, Inc.     

Polyether–polyimide thermoplastic elastomers. I. Synthesis and properties

A series of polyether–polyimides based on polycondensation of poly(tetramethylene oxide) glycol di-p-aminobenzoate with different molecular weights (650, 1000, 2000) and benzenetetracarboxylic acid dianhydride (BTDA) or 3,3′,4,4′-benzenetetracarboxylic acid anhydride (BPTDA) was synthesized. Infrared spectroscopy (IR), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and stress–strain tests were used to follow the imidization process and to study the structure–property relations of this family of polymers. FTIR data showed that the imidization was completed after 6 h at 140°C, which is a much lower temperature than that required for polyimides synthesized from low molecular weight diamines. DSC and DMA results indicated that the block copolymer exhibited a well-phase-separated structure and had a broad rubbery plateau from about ?70°C to 260°C, which varied with dianhydride type and hard-segment content. The BTDA series had enhanced mechanical properties compared to the BPTDA series. The excellent tensile properties of the polyether–polyimides suggest that they could be potentially used as heat-resistant thermoplastic elastomers.     

化学亚胺化合成含吡啶环共聚聚酰亚胺

用2,2-双[4-（4-氨基苯氧基）苯基]丙烷（BAPP）和4-苯基-2,6-双（4．氨基苯基）吡啶（PBAP）作为二胺,3,3’,4,4＇-二苯酮四酸二酐（BTDA）作为二酐,以N,N-二甲基甲酰胺（DMF）为溶剂,合成了3种聚酰亚胺。先用BAPP和PBAP同BTDA反应生成一系列聚酰胺酸（PAA）,然后将得到的PAA用化学亚胺化制备相应的聚酰亚胺。用FT-IR、^1H—NMR、粘度测试、溶解性测试和TGA对聚合物的结构和性能进行了表征。结果表明,FT—IR测试在1780cm^-1、1720cm^-1和725cm^-1左右出现了聚酰亚胺的特征吸收峰,所得聚酰胺酸的特性粘数为0．32～0．46dL／g,大部分聚酰亚胺在常见有机溶剂NMP中可溶,它们有很好的热稳定性,氮气氛中,在500℃以前没有明显的降解。     

亚胺化对聚酰亚胺热学性能的影响

用均苯四甲酸二酐(PMDA)与4,4’-二氨基二苯醚(ODA)为单体,聚合得到一定表观黏度的聚酰胺酸(PAA)。通过调节温度和时间两个变量,并采用红外光谱仪、高温综合热分析试着分别对PAA凝胶膜热亚胺化过程以及热学稳定性进行了研究,结果表明:亚胺化程度随时间的增加而增大,亚胺化程度随着亚胺化温度的提高同样增大;通过热重分析仪对聚酰亚胺薄膜热学性能进行了研究,随着薄膜亚胺化程度的增大,薄膜的热稳定性提高。     

一种新型共聚酰亚胺的合成与表征

以3,3’-二氨基二苯砜（DDS）和4,4’-二氨基二苯醚（ODA）作为共缩聚二胺单体,与3,3’,4,4’-二苯酮四羧酸二酐（BTDA）进行缩合聚合,合成了一系列具有一定溶解性的共聚酰亚胺。采用升温红外光谱监控了聚酰胺酸热环化为聚酰亚胺的过程,对所得产物的热稳定性和力学性能进行研究,发现二胺单体的组成对共聚酰亚胺的性能产生较为明显的影响。     

Reactive dye dyeability of cellulose fibers with cellulase treatment

Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophe-nonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum the Fourie, transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out. © 1996 John Wiley & Sons, Inc.     

以BAPP为原料的热塑性PI薄膜的合成及性能

以芳香长链二胺2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为二胺原料,与最具商业价值的四种酸酐均苯四甲酸二酐(PMDA)、3,3′,4,4′-联苯四酸二酐(BPDA)、3,3′,4,4′-二苯酮四酸二酐(BTDA)、3,3′,4．4′-二苯醚四酸二酐(ODPA)为二酸酐原料,采用二步溶液缩聚法制得了一系列均聚和共聚聚酰亚胺薄膜。利用FTIR表征了聚酰亚胺的结构,并用DSC、TOA、TMA DMA等手段测得了不同聚酰亚胺的Tg、5%与10%热失重温度、线膨胀系数、拉伸强度、断裂延伸率、热压粘接T型剥离强度等性能数据。