Fibre reinforced composites of multifunctional epoxy resins

Glass and carbon fibre reinforced epoxy composites were fabricated for N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenyl methane (TGDDM) and its formulated systems with tri- and di-functional reactive epoxy diluents using 30% diaminodiphenyl sulphone (DDS) as a curing agent. The epoxy laminates were evaluated for their physical, chemical and mechanical properties [at room (26°C) and high (100°C) temperatures]. A marginal increase (<20%) in the mechanical properties of CFRP was found compared with GFRP laminates. Incorporation of epoxy diluents altered the mechanical properties of the composites significantly. The incorporation of triglycidyl-4-aminophenol diluent to TGDDM systems resulted in an improvement in mechanical properties of about 2–6%.     

Curing behavior,thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

A novel di‐carboxylic acid curing agent (DACA) was successfully synthesized and cured with three different epoxy resins: glycidyl end‐capped poly(bisphenol‐A‐co‐epichlorohydrin) (pDGEBA, M_n = 377), N,N‐diglycidyl‐4‐glycidyloxyaniline (TGAP), and 4,4′‐methylenebis(N,N‐diglycidylaniline) (TGDDM). The cured epoxy exhibited excellent thermal stability, which was indicated by high initial degradation temperature (T_id) and char yield. The T_id values of cured epoxy were in the range of 327–338°C, and the char yields increased with increasing epoxy functionality. The char yields of cured DACA/pDGEPA, DACA/TGAP, and DACA/TGDDM samples were 21.1, 60.4, and 66.9%, respectively. In addition, the cured epoxy samples also showed low coefficients of thermal expansion and high storage moduli (E′), which were around 60 ppm/°C and 2800 MPa, respectively. The failure surfaces were ductile and rough, so the cured epoxy samples are expected to have high fracture toughness and impact strength. POLYM. ENG. SCI., 54:695–703, 2014. © 2013 Society of Plastics Engineers     

Epoxy resins based on aromatic glycidylamines. IV. Preparation of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane from aniline and analysis of the product by GPC and HPLC

Epoxy resins containing N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) were prepared from aniline and epichlorohydrin and analyzed by GPC and HPLC. The product composition was compared with that of resins prepared from 4,4′-diaminodiphenylmethane (DDM) and epichlorohydrin, which had been analyzed in our previous work. A new byproduct designated Y4 was isolated by semipreparative HPLC and identified by NMR and mass spectroscopy. The course of formaldehyde condensation with N,N-dichlorohydrin of aniline (DCHA) was followed by GPC and HPLC and the mechanism of formation of Y4 was proposed on the basis of obtained results. Attention was also paid to the differences in reactivity of DCHA diastereoisomers.     

Epoxy resins based on aromatic glycidylamines. VI. Toughening of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane by reactive additives

Mechanical properties of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane and its mixtures with liquid bisphenol A-type epoxy resins, bisphenol A and ε-caprolactone have been studied. 4,4′-Diaminodiphenylsulfone was used as hardener. Materials with improved fracture toughness and good mechanical strength in the temperature range 20–200°C have been formulated.     

Structure and Properties Relationships of Epoxy Resins Part 1: Crosslink Density of Cured Resin: (II) Model Networks Properties

Carefully designed resin precursors of high purity, viz. N,N-bis-(2,3-epoxypropyl)-N',N-dimethyl-4,4′-diaminodiphenylenemethane (G2A) and N,N-bis-(2,3-epoxypropyl)-N,N-dimethyl-4,4′-diamino-diphenylenemethane (G2S) were used in combination with N,N,N',N-tetrakis-(2,3-epoxypropyl)-4,4′-diaminodiphenylene methane, TGDDM, and cured with stoichiometric amounts of 4,4′-diamino-diphenylene methane (DDM) to produce networks with a range of controlled crosslink density. The tensile moduli E of the networks in the rubbery state, at T_g+30°C, T_g+45°C and T_g+60°C, were measured using a thermal mechanical analyser. Using the statistical theory of rubber elasticity and the observed values of E, the number average molecular weights between crosslink points M_c for the cured resins were deduced. The experimental M_c values were then compared with those derived by calculations based on a probabilistic model of the network proposed by Chu and Seferis.¹ The experimental M_c values were 2.5 to 5.5 times larger than the calculated ones. The differences were attributable to a consumption of only 40% of the available secondary amino hydrogen via epoxy-amine reaction. A direct relationship was established between the glass transition temperature and the crosslink density 1/M_c for the resins, and the dynamic mechanical properties were studied. The thermal stability of cured resins studied by thermo-gravimetric analysis indicated an enhancement of stability as 1/M_c was reduced. The amount of water absorbed by cured resin was directly proportional to 1/M_c.     

Synthesis and properties of silicon-containing bismaleimide resins

Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis[4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (T_p > 240°C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4′-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (T_ds) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.     

Effect of isomerization on thermal behaviour of bisitaconimides

The effect of isomerization of N,N′‐bisitaconimido‐4,4′‐diphenyl ether to the corresponding biscitraconimide on the curing characteristics and thermal stability of cured resins is described. Resins having bisitaconimide:biscitraconimide ratios of 23:77–93:7 were prepared by reacting 4,4′‐diaminodiphenyl ether with itaconic anhydride in solvents of different polarities and under different reaction conditions. Resins containing a higher proportion of citraconimide had a lower melting point (191 vs 208 °C). The curing exotherm was observed immediately after melting in all the resins and exothermic peak temperature reduced with increase in citraconimide content. Resins having a higher proportion of citraconimide on isothermal curing (200 °C, 2 h) and subsequent heating in nitrogen atmosphere degraded at a slightly lower temperature. However, the char yield at 800 °C did not show any systematic dependence on citraconimide content. © 2002 Society of Chemical Industry     

Preparation and properties of bismaleimide resins of aromatic sulfone ether diamine

Aromatic sulfone ether diamine, bis[4-(4-aminophenoxy)phenyl]-sulfone (SED), was prepared by the nucleophilic aromatic substitution of 4,4′-dichlorodiphenylsulphone by p-aminophenolate. The reaction was conducted in the presence of excess potassium carbonate as a weak base, toluene as the dehydrating agent and N-methylpyrrolidone as the dipolar aprotic solvent. SED showed good solubility in common organic solvents, such as dioxan, tetrahydrofuran, butanone and acetone. SED was reacted with maleic anhydride to obtain aromatic sulfone ether bismaleimide, bis[4-(4-maleimidophenoxy)phenyl]-sulfone (SEM). The compounds were characterized by FTIR and ¹H NMR analysis. Furthermore, copolymer resins of SED with 4,4′-bismaleimidodiphenyl methane (BMI) and SEM were prepared. After curing, crosslinked resins with better thermal stability resulted. The temperature at maximum rate of weight loss (T_max) and the heat-resistant temperature index (T_i) in air were found to be 426°C, 208°C and 579°C, 221°C for BMI/SED and SEM/SED resins, respectively. Compared with the corresponding 4,4′-diaminodiphenyl methane (DDM) system, BMI/SED and SEM/SED showed a slight decrease in T_max and T_i SED-modified BMI/amine resin based glass cloth laminates for printed circuit boards showed higher mechanical properties than those of the corresponding unmodified system. With SED instead of the original amine component in 3–5% weight fraction, the tensile strength, flexural strength and impact strength of the laminates increased markedly. Meanwhile, the stripping strength and weld resistance were also improved by the addition of SED.     

Structure and properties relationships of epoxy resins part 1: Crosslink density of cured resin: (I) model resins synthesis

Two model epoxy resin precursors based on the N-glycidyl derivatives of 4.4'-diaminodiphenylene methane (DDM) were prepared: N,N bis-(2,3-epoxypropyl)-N′,N″-dimethyl-4.4'-diaminodiphenylene methane (G2A); N.N′ bis-(2,3-epoxypropyl)-N,N′-dimethyl-4,4'-diaminodiphenylene methane (G2S). To prepare these, aniline or N-methyl aniline was reacted with epichlorohydrin, using acetic acid as catalyst. The products were coupled via acid-catalysed condensations in the presence of formaldehyde or with N,N-dimethylaminobenzyl alcohol. The coupled chlorohydrins formed were then dehydrochlorinated to form the desired product. All reactions were monitored and purifications of the crude products were effected by high pressure liquid chromatographic techniques. The products were characterised by proton and carbon-13 nuclear magnetic resonance, infrared and mass spectroscopy, elemental and titrametric analysis. Results were compared with those obtained for tetra-N-glycidyl-4,4'-diaminodiphenylene methane (TGDDM). All the data confirmed the structures of the model resins. These, together with TGDDM. will be used to prepare epoxy resin networks of controlled crosslink density and chemical homogeneity.     

Characterization of the cure of TGDDM/DDS epoxy resins by chemiluminescence I. Spectral and thermal analysis

The emission of weak visible chemiluminescence (CL) during the cure of a tetraglycidyl 4,4′-diaminodiphenyl methane (TGDDM)-based epoxy resin, with three different concentrations of 4,4′-diaminodiphenylsulfone (DDS) has been studied at 135°C. Spectral analysis indicates that the CL originates from trace oxidation of the TGDDM resin and the emission intensity is sensitive to the viscosity changes during cure. From thermal analysis data, sharp discontinuities in CL intensity are shown to occur at the gel point. The temperature dependence of CL from a cured resin also shows a sharp discontinuity at T_g. These results indicate that CL provides a sensitive monitor of both the kinetics of gelation and the network formation in this epoxy resin.     

High temperature laminating resins based on maleimido end-capped pyromellitimide

A novel class of bismaleimides, biscitraconimides, and bisdichloromaleimides chain-extended by pyromellitimide was prepared and characterized by infrared and proton nuclear magnetic resonance spectroscopy. These polymer precursors were prepared by reacting maleic/citraconic/dichloromaleic anhydride (1 mol) with an equimolar amount of a diamine and subsequently with pyromellitic dianhydride (0.5 mol). The tetraamic acid formed was cyclodehydrated by chemical or thermal means. The curing behavior of polymer precursors was investigated by differential thermal analysis. Bismaleimide was thermally polymerized at a relatively higher temperature than the corresponding biscitraconimide and at lower temperature than bisdichloromaleimide. The curing temperature of monomers fluctuated between 209 and 318°C. Dynamic thermogravimetric analysis of the cured aromatic resins showed that they were approximately stable up to 370°C both in nitrogen and air. Their char yield was 53–63% at 800°C under anaerobic conditions. The relative thermal stability of the cured resins, with respect the diamine utilized for imidization, was of the order p-phenylenediamine > 4-aminophenyl ether > 4,4′-diaminodiphenylmethane > 4,4′-diaminodiphenylsulfone > hexamethylenediamine. In addition, the thermal and thermooxidative stability of polymers was ascertained by isothermal gravimetric analysis.     

Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

Tris(3-aminophenyl)Phosphine oxide-based nadimide resins. II

A series of phosphorus-containing nadimide end-capped resins having different backbones was prepared by reacting endo-5-norbornene-2-3-dicarboxylic acid anhydride (nadic anhydride), pyromellitic dianhydride (PMDA)/3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6F) and tris(3-aminophenyl)phosphine oxide (TAP) in glacial acetic acid/acetone. Structural characterization of the resins was done by elemental analysis, FTIR, and ¹H-NMR. Thermogravimetric studies revealed a multistep decomposition reaction for uncured resins. Residual weight at 800°C in nitrogen was found to be 50–60%. Resins cured at 300°C for 1 h in air atmosphere were stable up to 440 ± 20°C and decomposed in a single step above this temperature. The char yields of cured resins were in the range 63–71.5%. © 1992 John Wiley & Sons, Inc.     

Biobased thermosetting resins composed of L‐lysine methyl ester and bismaleimide

Lysine methyl ester (LME), which was generated in situ by the reaction of lysine methyl ester dihydrochloride and triethylamine in dimethyl sulfoxide (DMSO), was prepolymerized with 4,4′‐bismaleimidodiphenylmethane (BMI) at 80°C for 2 h in DMSO. Then, the formed prepolymer was precipitated in water. The obtained LME/BMI prepolymers with molar ratios of 2:2, 2:3, and 2:4 were compression‐molded at a final temperature of 230°C for 2 h to produce cured lysine methyl ester/4,4′‐bismaleimidodiphenylmethane resins (cLBs; cLB22, cLB23, and cLB24, respectively). Fourier transform infrared (FTIR) analyses revealed that the Michael addition reaction of amino groups to the C?C bonds of the maleimide group occurred in addition to the homopolymerization of the maleimide group. The glass‐transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI feed content, and cLB24 showed the highest T_g (343°C) and T₅ (389°C). The flexural strengths (131–150 MPa) and moduli (3.0–3.6 GPa) of the cLBs were comparable to those of the conventionally cured resins of BMI and 4,4′‐diaminodiphenylmethane. Field emission scanning electron microscopy analysis revealed that there was no phase separation for all of the cured resins. Although cLB23 and cLB24 were not biodegradable, cLB22 had a biodegradability of 8.5% after 30 days in an aerobic aqueous medium containing activated sludge. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40379.     

Tertiary‐amine‐free,non‐planar,sulfone‐containing,tetrafunctional epoxy and its application as a high temperature matrix

Non‐amine‐derived tetrafunctional epoxies have several advantages over the amine‐derived N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenyl methane (TGDDM) in high temperature applications. Although two non‐amine‐derived tetrafunctional epoxies were developed in our laboratory, further improvements in toughness using less loading amount is still desirable. Thus, a tertiary‐amine‐free, non‐planar and triphenylmethane‐containing tetrafunctional epoxy (STFE) with a sulfone spacer was synthesized. When it was mixed with diglycidyl ether of bisphenol A (DGEBA) and cured with 4,4′‐diaminodiphenylsulfone (DDS), both thermal and mechanical performances outperformed TGDDM. Moreover, STFE modified system shows the highest toughness (35.7 kJ m^–2) among three amine‐free and triphenylmethane‐containing epoxies at merely 5 wt% loading. Molecular simulation and thermomechanical analysis results suggest that the improved mechanical properties could be related to the geometry of the molecule and larger free volume. Despite a marginal drop in T_g, the thermal degradation temperature is better than that of TGDDM/DDS. In addition, the moisture resistance of STFE/DGEBA/DDS is much better than that of TGDDM/DDS. Thus, STFE modified DGEBA could be a potential replacement for TGDDM in some high temperature applications. © 2020 Society of Chemical Industry     

Phosphorus‐containing epoxy resins: Thermal characterization

Three novel aromatic phosphorylated diamines, i.e., bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl} pyromellitamic acid (AP), 4,4′‐oxo bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AB) and 4,4′‐hexafluoroisopropylidene‐bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AF) were synthesized and characterized. These amines were prepared by solution condensation reaction of bis(3‐aminophenyl)methyl phosphine oxide (BAP) with 1,2,4,5‐benzenetetracarboxylic acid anhydride (P)/3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride (B)/4,4′‐(hexafluoroisopropylidene)diphthalic acid anhydride (F), respectively. The structural characterization of amines was done by elemental analysis, DSC, TGA, ¹H‐NMR, ¹³C‐NMR and FTIR. Amine equivalent weight was determined by the acetylation method. Curing of DGEBA in the presence of phosphorylated amines was studied by DSC and curing exotherm was in the temperature range of 195–267°C, whereas with conventional amine 4,4′‐diamino diphenyl sulphone (D) a broad exotherm in temperature range of 180–310°C was observed. Curing of DGEBA with a mixture of phosphorylated amines and D, resulted in a decrease in characteristic curing temperatures. The effect of phosphorus content on the char residue and thermal stability of epoxy resin cured isothermally in the presence of these amines was evaluated in nitrogen atmosphere. Char residue increased significantly with an increase in the phosphorus content of epoxy network. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2235–2242, 2002     

Novel modified bismaleimide resins with improved ablativity

To improve the ablativity of bismaleimide-type resins, a series of novel allyl compounds containing boron in their molecular structure, designated as ACB, were synthesized and characterized. The copolymers made up of 4,4′-bismaleimidodiphenyl methane (BDM) and each ACB were prepared. The properties of the prepolymers and cured resins were all studied in detail. Results show that the prepolymers of BDM/ACB systems have similar processing characteristics such as solubility in acetone and reactivity to those of ordinary BMI resins made up of BDM and allyl compounds without boron, such as the famous BDM/BA (O,O′-diallylbisphenol A) system, while the thermal resistance and ablativity of the former are better than those of the latter. Thermogravimetric analysis (TGA) in a nitrogen atmosphere revealed that the BDM/ACB systems were stable up to 480°C and their char yields at 800°C under anaerobic conditions were more than 50%. However, the char yield at 700°C of the BDM/BA system is only about 21%. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1623–1631, 1999     

Synthesis and characterization of novel polyaspartimides derived from 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl and various diamines

A novel bismaleimide, 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl, containing noncoplanar 2,2′‐dimethylbiphenylene and flexible ether units in the polymer backbone was synthesized from 2,2′‐dimethyl‐4,4′‐bis(4‐aminophenoxy)biphenyl with maleic anhydride. The bismaleimide was reacted with 11 diamines using m‐cresol as a solvent and glacial acetic acid as a catalyst to produce novel polyaspartimides. Polymers were identified by elemental analysis and infrared spectroscopy, and characterized by solubility test, X‐ray diffraction, and thermal analysis (differential scanning calorimetry and thermogravimetric analysis). The inherent viscosities of the polymers varied from 0.22 to 0.48 dL g⁻¹ in concentration of 1.0 g dL⁻¹ of N,N‐dimethylformamide. All polymers are soluble in N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide, dimethylsulfoxide, pyridine, m‐cresol, and tetrahydrofuran. The polymers, except PASI‐4, had moderate glass transition temperature in the range of 188°–226°C and good thermo‐oxidative stability, losing 10% mass in the range of 375°–426°C in air and 357°–415°C in nitrogen. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 279–286, 1999     

Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.