Preparation and characterization of 3,3′,4,4′-benzophenone tetracarboxylic dianhydride-pyromellitic diahydride alternating polyimides

Four kinds of 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA)-pyromelliitic dianhydride (PMDA) alternating polyimide (BTDA-PMDA API) were obtained by reacting 1 mol BTDA with 2 mol diamines to form BTDA chain-extended diamines (BTDA CED), followed by the addition of 1 mol PMDA to yield the BTDA-PMDA alternating polyamic acids (BTDA-PMDA APA), and finally by imidizing them thermally. BTDA CED were characterized by elemental analysis, infrared (IR), and ¹H-NMR spectroscopy. The structures of BTDA-PMDA APA and BTDA-PMDA API were investigated by IR and ¹H-NMR spectroscopy, and their thermal properties and interfacial tension were also studied. Furthermore, the characteristic properties of BTDA-PMDA API were compared with their corresponding homopolyimides from BTDA (BTDA HPI) and from PMDA (PMDA HPI). It was found that the alternating condensation polymerization is an effective method to modify polyimides interfacial tension with a small influence on the thermal stability. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1585–1593, 1997     

基于异构联苯二酐的热塑性聚酰亚胺性能研究

制备了一系列基于异构联苯二酐[2,2’,3,3’-联苯四甲酸二酐(3,3’-BPDA)、2,3’,3,4’-联苯四甲酸二酐(3,4’-BPDA)和3,3’,4,4’-联苯四甲酸二酐(4,4’-BPDA)]的聚酰亚胺(PI)均聚物和共聚物,比较研究了这些聚合物的热学和力学性能。结果表明,当二胺结构相同时,基于3,3’-BPDA和3,4’-BPDA的PI均聚物或共聚物较基于4,4’-BPDA的均聚物有更高的玻璃化转变温度(Tg)和更好的热加工性;当二酐结构相同时,基于对苯二胺(PDA)的PI的Tg高于基于4,4’-二氨基二苯醚(ODA)的PI。基于3,4’-BPDA/PDA的PI具有最高的Tg,其值为382℃,由其制备的薄膜的拉伸强度为100 MPa,拉伸弹性模量为1.8 GPa,断裂伸长率为12%。基于4,4’-BPDA/PDA的PI薄膜具有最高的拉伸性能,其拉伸强度为307 MPa,拉伸弹性模量为4.1 GPa,断裂伸长率为23%。基于3,4’-BPDA/ODA和3,3’-BPDA/4,4’-BPDA(1/1)/ODA的PI模塑料均具有高于300℃的Tg和较好的力学性能,其冲击强度分别达到82.3 kJ/m2和94 kJ/m2。     

Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

The thermal properties and the moisture absorption of three types of polyimide/montmorillonite nanocomposite were investigated: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride‐4,4′‐oxydianiline (BPDA‐ODA); pyromellitic dianhydride‐ODA (PMDA‐ODA); and 3,3′,4,′‐benzophenone tetracarboxylic dianhydride‐ODA (BTDA‐ODA). The inhibition effect on in‐plane coefficients of thermal expansion (CTE) and moisture absorption of these polyimide nanocomposites by layered silicates from montmorillonite was found to decrease with the crystallinity in the pristine polyimides. The largest reduction, 30% in in‐plane CTE occurred in the case of amorphous BTDA‐ODA containing 5 wt % montmorillonite as compared with that of pure BTDA‐ODA, while the reduction in in‐plane CTE was 20% for the case of semicrystalline BPDA‐ODA. The maximum reduction in moisture absorption, 43%, also took place for the case of 3/97 ODA‐Mont/BTDA‐ODA as compared with that of pure BTDA‐ODA, whereas the semicrystalline 1/99 PPD‐Mont/BPDA‐ODA showed a 30% reduction as compared with that of pure BPDA‐ODA. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1742–1747, 2001     

一种新型共聚酰亚胺的合成与表征

以3,3’-二氨基二苯砜（DDS）和4,4’-二氨基二苯醚（ODA）作为共缩聚二胺单体,与3,3’,4,4’-二苯酮四羧酸二酐（BTDA）进行缩合聚合,合成了一系列具有一定溶解性的共聚酰亚胺。采用升温红外光谱监控了聚酰胺酸热环化为聚酰亚胺的过程,对所得产物的热稳定性和力学性能进行研究,发现二胺单体的组成对共聚酰亚胺的性能产生较为明显的影响。     

Synthesis and characterization of novel borosiloxane‐containing aromatic copolyimides with excellent thermal stability and low coefficient of thermal expansion

The properties of borosiloxane‐containing copolyimides with borosiloxane in the main chain and in the side chain were studied. Two series of borosiloxane‐containing copolyimides were synthesized by the reaction of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA ) and 2,3′,3,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA ) with p ‐phenylenediamine (PDA ), 4,4′‐oxydialinine (4,4′‐ODA ) and different borosiloxane diamine monomers (BSiAs ). The synthesized borosiloxane‐containing copolyimides exhibited better solubility than borosiloxane‐free copolyimides and showed high glass transition temperatures (320–360 °C), excellent thermal stability (570–620 °C for T ₁₀), great elongation at break (10% ? 14%) and a low coefficient of thermal expansion (14–24 ppm °C^?1). More specifically, the copolyimides containing BSiA‐2 formed nano‐scale protrusions and the copolyimides containing BSiA‐1 formed micro‐scale protrusions. The contact angles of the copolyimides increased from 72° for neat copolyimide to 96° for 5% of borosiloxane in the main chain of the copolymer up to 107° for 10% of borosiloxane in the side chain of the copolymer. © 2017 Society of Chemical Industry     

Properties of copolyimides prepared from different tetracarboxylic dianhydrides and diamines

Various copolymides were prepared from two acid dianhydrides (BPDA, 3,3′,4,4′-biphenyl tetracarboxylic dianhydride; PMDA, pyromelitic dianhydride) and two diamines (PPD, p-phenylene diamine; ODA, 4,4′-oxydianiline). The thermal and mechanical properties of these polyimides were examined in detail. By appropriately selecting the ratios of the acid dianhydride component and the diamine component, polyimide films having desirable mechanical and thermal characteristics can be obtained. Further, it was proved that there is a correlation between the properties and the compositions of the copolyimides and that the properties could be estimated from the compositions by the use of multiple regression analysis. © 1996 John Wiley & Sons, Inc.     

Chemical modification of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride polyimides by a catechol‐derived bis(ether amine)

Having previously demonstrated that the polyimide derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 1,2‐bis(4‐aminophenoxy)benzene [termed triphenyl ether catechol diamine (TPEC)] exhibited superior tensile properties in addition to good thermal properties, we now provide a preliminary assessment of the properties of the copolyimides prepared from BPDA, TPEC, and another aromatic diamine. The homopolyimides derived from BPDA and many aromatic diamines generally possessed good mechanical properties and thermal properties; however, they were insoluble in available organic solvents. In several cases, organosoluble BPDA copolyimides could be prepared from BPDA and equimolar mixtures of TPEC and another aromatic diamine. All the copolyimides could be formed into tough films with high moduli and strengths and, in most cases, high extensions to break. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 351–358, 2002; DOI 10.1002/app.10342     

Effect of chemical structure of aromatic dianhydrides on the thermal, mechanical and electrical properties of their terpolyimides with 4,4′-oxydianiline

Aromatic terpolyimides were synthesized by the reaction of 3,3′,4,4′-oxydiphthalicdianhydride(ODPA), 3,3′,4,4′-biphenyldianhydride(BPDA) and 3,3′,4,4′-benzophenonetetracaboxylicdianhydride(BTDA) with 4,4′-oxydianiline(ODA) via thermal imidization with the view to enhance their tensile properties without compromising thermal properties compared to their homo and copolyimides. Their films were characterized by FTIR, TGA, DSC and XRD. Their FTIR spectra established formation of polyimide by the characteristic vibrations at 1375cm⁻¹(C-N stretch) and 1113 cm⁻¹(imide ring deformation). TGA results showed imidization of residual polyamide acid close to 250 °C and decomposition of polyimides at about 540 °C. XRD results showed amorphous nature for all terpolyimides. Their tensile strength and tensile modulus were higher than either homo or copolyimides. Incorporation of BPDA, without bridging groups between the aromatic rings into the backbone of ODPA/BTDA-ODA is suggested as the cause for such an enhancement. Such terpolyimide can find application as adhesives in making flexible single/multilayer polyimide metal-clad laminates in flexible printed circuits and tape automated bonding applications. In addition, the terpolyimide, BPDA/BTDA/ODPA-ODA (mole ratio 0.5:0.25:0.25:1), showed low dielectric constant (3.52) as BPDA could offer slight rigidity by which the orientation of polar groupings could be reduced.     

Polyimide foams with ultralow dielectric constants

To explore ultralow dielectric constant polyimide, the crosslinked polyimide foams (PIFs) were prepared from 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA), and 2,4,6‐triaminopyrimidine (TAP) via a poly(ester–amine salt) (PEAS) process. FTIR measurements indicated that TAP did not yield a negative effect on imidization of PEAS precursors. SEM measurement revealed the homogeneous cell structure. Through using TAP as a crosslinking monomer, the mechanical properties of PIFs could be improved in comparison with uncrosslinked BTDA/ODA based PIF. The crosslinked PIFs still exhibited excellent thermal stability with 5% weight loss temperatures higher than 520°C. In the field with frequency higher than 100 Hz, the dielectric constants of the obtained PIFs ranged from 1.77 to 2.4, and the dielectric losses were smaller than 3 × 10^?2 at 25–150°C. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1734–1740, 2006     

Synthesis and characterization of alternating copolyimides containing aliphatic spacers

Summary Alternating copolyimides and homopolyimides of pyromellitic dianhydride and benzophenonetetracarboxylic dianhydride containing aliphatic spacers have been synthesized by the solution polycondensation of N,N-bis(isocyanatoalkyl)-1,2,4,5-benzenetetracarboxylic-1,2:4,5-diimides and N, N-bis(isocyanatoalkyl)-3,3: 4,4-diimides with pyromellitic dianhydride (PMDA) and benzophenonetetracarboxylic dianhydride (BTDA) in dimethylacetamide. These polyimides are semicrystalline, thermally stable and soluble in polar aprotic solvents with inherent viscosities in the range 0.29 – 0.62 dL/g in m-cresol.NCL Communication No. 4896     

Effect of monomer composition on properties of copolyimides derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride/4,4′‐oxydianiline/1,3‐bis (4‐aminophenoxy)benzene

A series of uncontrolled molecular weight homopolyimides and copolyimides based on 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA)/4,4′‐oxydianiline (4,4′‐ODA)/1,3‐bis(4‐aminophenoxy)benzene (TPER) were synthesized. All the polyimides displayed excellent thermal stability and mechanical properties, as evidenced by dynamic thermogravimetric analysis and tensile properties testing. A singular glass transition temperature (T_g) was found for each composite from either differential scanning calorimetry (DSC) or dynamic mechanical analysis (DMA), but the values determined from tan δ of DMA were much different from those determined from DSC and storage modulus (E′) of DMA. The Fox equation was used to estimate the random T_g values. Some composites exhibited re‐crystallization after quenching from the melt; upon heating, multi‐melting behavior was observed after isothermal crystallization at different temperatures. The equilibrium melting temperature was estimated using the Hoffman‐Weeks method. Additionally, DMA was conducted to obtain E′ and tan δ. Optical properties were strongly dependent on the monomer composition as evidenced by UV‐visible spectra. X‐ray diffraction was used to interpret the crystal structure. All the results indicated that composites with TPER composition ≥ 70% were dominated by the TPER/s‐BPDA polyimide phase, and ≤40% by the 4,4′‐ODA/s‐BPDA polyimide phase. When the ratio between the two diamines was close to 1:1, the properties of the copolyimides were very irregular, which means a complicated internal structure. Copyright © 2011 Society of Chemical Industry     

Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper‐clad laminates

BACKROUND: Polyimide films coated on copper are a potential new substrate for fabricating printed circuit boards; however, adhesion between the copper and polyimide films is often poor. The relations between residual stress and adhesion strength according to the development of molecular orientation of polyimide films with different chemical backbone structure coated on copper were studied. RESULTS: The effect of chemical structures on properties including the residual stress and the adhesion strength were widely investigated for four different polyimides. Diamine 4,4′‐oxydianiline (ODA) and dianhydrides 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA), 4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) were used to synthesize polyimide. In an attempt to quantify the interaction of thermal mismatch with the polyimide films depending on various structures, residual stress experiments between polyimide film and Cu? Si wafer were carried out over a range of 25–400 °C using in situ thin film stress analysis. A universal test machine was used to conduct 180° peel test (ASTM D903‐98) of polyimide film from cooper foil. The residual stress on Cu? Si (100) wafer decreased in the order 6FDA‐ODA > BTDA‐ODA > ODPA‐ODA > PMDA‐ODA, and the interfacial adhesion strength decreased in the order BTDA‐ODA (5 N mm^?2) > ODPA‐ODA > PMDA‐ODA > 6FDA‐ODA. The results may suggest that the morphological structure, degree of crystallinity of chain orientation and packing significantly relate to the residual stress and adhesion strength in polyimide films. Wide‐angle X‐ray diffraction was used for characterizing the molecular order and orientation and X‐ray photoelectron spectroscopy was used for the analysis of components on copper after polyimide films were detached to confirm the existence of copper oxide chemical bonding and to measure the binding energy of elements on the copper surface. CONCLUSION: In this research, it is demonstrated that BTDA‐ODA polyimide has a low residual stress to copper, good adhesion property, good thermal property and low dielectric constant. Therefore, BTDA‐ODA would be expected to be a promising candidate for a two‐layer copper‐clad laminate. Copyright © 2007 Society of Chemical Industry     

Synthesis of new sulfonated copolyimides in organic and ionic liquid media for fuel cell application

New sulfonated copolyimides containing ether, carbonyl, and bulky naphthyl group in backbone were synthesized in two reaction media: organic solvent and ionic liquid media. For this purpose a new sulfonated diamine (BANBPDS) and an unsulfonated diamine (BANBP) was prepared through reactions of 4,4′‐dichlorobenzophenone‐3,3′‐disulfonic acid, and also 4,4′‐dichlorobenzophenone with 5‐amino‐1‐sodium naphthoxide, respectively. Three series of sulfonated copolyimide with different sulfonation contents (40–80%) were prepared by reaction of the sulfonated diamine (BANBPDS) in companion with three unsulfonated diamines including BANBP, 4,4′‐oxydianiline (ODA), and 1,8‐diamino‐3,6‐dioxaoctane (DADO) with 1,4,5,8‐naphthalene tetracarboxylic dianhydride (NTDA). Two media were selected for preparation of copolyimides. Copolyimides synthesized in ionic liquid had higher inherent viscosity and higher molecular weight in comparison with similar copolyimides that were synthesized via common organic solvent method. Incorporation of flexible groups in polyimide structures increased solubility and processability of the copolyimides. After characterization of polymers with common methods, their water uptake, water stability, ion exchange capacity (IEC), thermal behavior and stability, crystallinity, and morphology were studied. The polymers showed suitable properties including high thermal stability and ion exchange capacity, which were the basic requirements for application as fuel cell membranes. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Preparation and characterization of siloxane-containing thermoplastic polymides

Copolyimides and homopolyimides of bis(γ-aminopropyl)tetramethyldisiloxane and 3,3′-diaminobenzophenone have been prepared with benzophenonetetracarboxylic dianhydride. The properties of the copolyimides were compared with those of the homopolyimides to assess the effect of incorporation of siloxane groups in the backbone. Applications of the polymers as adhesives and mouldings are discussed.     

含苯环侧基三元共聚PI的合成及其表征

以4,4’-二胺基二苯醚(ODA)、2,2’-双[3-苯基-4(4-氨基苯氧基)苯基]丙烷(BPAPOPP)和均苯四甲酸酐(PMDA)为单体,采用溶液共缩聚方法合成了一系列共聚聚酰亚胺(PI)薄膜;采用傅里叶红外光谱仪(FTIR)、差示扫描量热仪(DSC)等分析了PI薄膜的结构和性能。结果表明:随着高聚物中柔性体系含量的增加,PI薄膜的热学性能和力学性能都有一定程度降低;但其加工性能得到了改善。     

Preparation and properties of poly(methyltrifluoropropylsiloxane‐b‐imide) copolymer. I

Poly(methyltrifluoropropylsiloxane‐block‐imide) copolymers (PSBPI), containing various contents of fluorosiloxane, were prepared by the thermal imidization of 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA), and α,ω‐aminopropyl‐terminated poly(methyltrifluoropropylsiloxane) prepolymer (APMFS). APMFS was prepared from an equilibrium polymerization of (3,3,3‐trifluoropropyl)methylcyclotrisiloxane (D₃^{Me,CH2,CH2,CF3}) with 1,3‐bis(3‐aminopropyl)‐1,1,3,3‐tetramethyldisiloxane in the presence of the tetramethylammoniumhydroxide (TMAH) catalyst. The content of APMFS, in the reaction mixture, was varied from 0 to 30 wt % of diamine. The structure of copolymer was confirmed by FTIR spectroscopy. The thermal stability, linear coefficient of thermal expansion, modulus, X‐ray pattern, and other properties, such as surface enrichment behavior and solubility, were investigated. PSBPI exhibited relatively low crystallinity regardless of the APMFS content in the copolymer. On the other hand, thermogravimetric, thermomechanical, dynamic mechanical, and surface properties were affected by the content of APMFS segment in the copolymer backbone. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2867–2874, 2002     

Preparation of novel copoly(bis[4‐(3‐aminophenoxy)phenyl]sulfone/ 3,3′,4,4′‐benzophenonetetracarboxyl/ pyromellite)imide derivatives

Copolyimide derivatives were prepared from two carboxylic dianhydrides [3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and pyromellitic anhydride (PMDA)] and a single diamine (bis[4‐(3‐aminophenoxy)phenyl]sulfone [BAPS]) following one‐step polymerization. Copolymers could be arranged in sequence through different molar ratios of dianhydride compounds. These polymers were characterized by viscosity, thermal and mechanical properties, solubility, etc. To understand the behavior of the properties, according to the ratio of the dianhydride compound, a copolymer having various properties could be obtained. Further, it was proved that their properties could be determined from the compositions. The solubility of copolyimides with a large molecular weight was moderately improved. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 853–859, 2003     

Low-dielectric-constant aromatic homopolyimide and copolyimide derived from pyromellitic dianhydride, 4,4′-oxydianiline, 2,2-bis[4-(4-aminephenoxy)phenyl]propane, 1,4-bis(4-aminophenoxy)benzene,or 1,3-bis(4-aminophenoxy)benzene

Low-dielectric-constant aromatics, homopolyimide and copolyimide, were introduced. Homopolyimides were prepared by pyromellitic dianhydride (PMDA) as an anhydride monomer and 4,4′-oxydianiline (ODA), 2,2-bis[4-(4-aminephenoxy)phenyl]propane, 1,4-bis(4-aminophenoxy)benzene, or 1,3-bis(4-aminophenoxy)benzene as an amine monomer. The copolyimides were prepared with PMDA as an anhydride monomer, ODA as an amine monomer with the addition of 2,2-bis[4-(4-aminephenoxy)phenyl]propane, 1,4-bis(4-aminophenoxy)benzene, or 1,3-bis(4-aminophenoxy)benzene as another amine monomer. The polyimides were well characterized by Fourier transform infrared spectroscopy, thermogravimetric analysis, thermomechanical analysis, dielectric measurements, and tensile testing. The homopolyimide and copolyimides showed lower dielectric constants than the homopolyimide formed by ODA and PMDA. The results also indicate that the interchain distance, the quantities of phenyl ether, and the position of the substitute are factors that not only affected the thermal performance of polyimide by improving the molecular flexibility but also reduced the dielectric constant of polyimide by increasing the free volume of the molecular chain and decreasing the polarization points per unit volume. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47405.     

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

A series of block and random copolyimide films were synthesized from various molar ratios of two diamines, rigid 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (APBI) and flexible 4,4′‐oxydianiline (ODA) by polycondensation with dianhydride 3,3′,4,4′‐biphenyltetracarboxylic dianhydride. The contents of APBI ranged from 10 to 60 mol % in copolyimides. The copolyimide films obtained by thermal imidization of poly(amic acid) solutions, were characterized by TMA, DMA, TGA, DSC, wide‐angle X‐ray diffraction, FTIR, tensile testing, water uptake (WU), and dielectric constant measurements. Rigid heterocyclic diamine APBI with interchain hydrogen bonding capability, led to low coefficient of thermal expansion (CTE), high T_g, high thermal stability and better mechanical properties. Increasing the APBI mol % caused a gradual decrease in the CTE and increase in T_g, thermal stability and tensile strength properties of the copolyimides films. Moreover, significantly enhanced thermal and mechanical properties of the block copolyimides were also found as compared to random copolyimides. The block copolyimide with APBI content of 60 mol %, achieved excellent properties, that is, a low CTE (4.7 ppm/K), a high T_g at 377°C, 5% weight loss at 562°C and a tensile strength at 198 MPa. This can be interpreted because of comparatively higher degree of molecular orientation in block copolyimides. These copolyimides also exhibited better dielectric constant and WU. This combination of properties makes them attractive candidates for base film materials in future microelectronics. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Copolyimides with trifluoromethyl or methoxy substituents. NMR characterization

In the first stage, a series of aromatic diamine compounds such as 2-methoxy-5,4′-diaminodiphenyl ether (ODAOMe) and 2-trifluomethyl-4,4′-diaminodiphenyl ether (ODACF₃) were synthesized. These aromatic diamines and 4,4′-diaminodiphenyl ether (ODA) were then used to prepare copolyimides with 4,4′-oxydiphthalic anhydride (ODPA) and bicyclo[2.2.2]-oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BCDA). Both chemical composition and the arrangements of repetitive units were characterized by ¹H and ¹⁹F NMR. It was shown that solubility and thermal stability are related to the BCDA fraction in the copolymers and to the chemical structure of the diamine.