INDEP approach for leakage reduction in nanoscale CMOS circuits

Complementary metal oxide semiconductor (CMOS) technology scaling for improving speed and functionality turns leakage power one of the major concerns for nanoscale circuits design. The minimization of leakage power is a rising challenge for the design of the existing and future nanoscale CMOS circuits. This paper presents a novel, input-dependent, transistor-level, low leakage and reliable INput DEPendent (INDEP) approach for nanoscale CMOS circuits. INDEP approach is based on Boolean logic calculations for the input signals of the extra inserted transistors within the logic circuit. The gate terminals of extra inserted transistors depend on the primary input combinations of the logic circuits. The appropriate selection of input gate voltages of INDEP transistors are reducing the leakage current efficiently along with rail to rail output voltage swing. The important characteristic of INDEP approach is that it works well in both active as well as standby modes of the circuits. This approach overcomes the limitations created by the prevalent current leakage reduction techniques. The simulation results indicate that INDEP approach mitigates 41.6% and 35% leakage power for 1-bit full adder and ISCAS-85 c17 benchmark circuit, respectively, at 32 nm bulk CMOS technology node.     

DOIND: a technique for leakage reduction in nanoscale domino logic circuits

A novel DOIND logic approach is proposed for domino logic, which reduces the leakage current with a minimum delay penalty. Simulation is performed at 70 nm technology node with supply voltage 1V for domino logic and DOIND logic based AND, OR, XOR and Half Adder circuits using the tanner EDA tool. Simulation results show that the proposed DOIND approach decreases the average leakage current by 68.83%, 66.6%, 77.86% and 74.34% for 2 input AND, OR, XOR and Half Adder respectively. The proposed approach also has 47.76% improvement in PDAP for the buffer circuit as compared to domino logic.     

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

High leakage current in deep-submicrometer regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, the identification and modeling of different leakage components is very important for estimation and reduction of leakage power, especially for low-power applications. This paper reviews various transistor intrinsic leakage mechanisms, including weak inversion, drain-induced barrier lowering, gate-induced drain leakage, and gate oxide tunneling. Channel engineering techniques including retrograde well and halo doping are explained as means to manage short-channel effects for continuous scaling of CMOS devices. Finally, the paper explores different circuit techniques to reduce the leakage power consumption.     

A reliable ground bounce noise reduction technique for nanoscale CMOS circuits

Power gating is the most effective method to reduce the standby leakage power by adding header/footer high-V_TH sleep transistors between actual and virtual power/ground rails. When a power gating circuit transitions from sleep mode to active mode, a large instantaneous charge current flows through the sleep transistors. Ground bounce noise (GBN) is the high voltage fluctuation on real ground rail during sleep mode to active mode transitions of power gating circuits. GBN disturbs the logic states of internal nodes of circuits. A novel and reliable power gating structure is proposed in this article to reduce the problem of GBN. The proposed structure contains low-V_TH transistors in place of high-V_TH footer. The proposed power gating structure not only reduces the GBN but also improves other performance metrics. A large mitigation of leakage power in both modes eliminates the need of high-V_TH transistors. A comprehensive and comparative evaluation of proposed technique is presented in this article for a chain of 5-CMOS inverters. The simulation results are compared to other well-known GBN reduction circuit techniques at 22 nm predictive technology model (PTM) bulk CMOS model using HSPICE tool. Robustness against process, voltage and temperature (PVT) variations is estimated through Monte-Carlo simulations.     

Introduction of a new technique for simultaneous reduction of the delay and leakage current in digital circuits

By the reduction in the size of transistors and the development of submicron technology, as well as the construction of more integrated circuits on chips, leakage power has become one of the main concerns of electronic circuit designers. In this article, we first review techniques presented in recent years to reduce leakage power and then present a new technique based on the gate-level body biasing technique and the multi-threshold CMOS technique to minimize leakage power in digital circuits. Afterward, we develop another new method by improving the first proposed technique to achieve higher efficiency and simultaneously reduce leakage power and propagation delay in digital circuits. In the proposed technique, we use two dynamic threshold MOSFET transistors to reduce leakage current. In this paper, the body biasing generator structure is applied to reduce propagation delay. The proposed technique has been successfully validated and verified by post-layout simulation with Cadence Virtuoso based on the 32 nm process technology.We evaluate the efficiency of the proposed techniques by examining factors including power, delay, area, and the power delay product. The simulation results using HSPICE software and performance analysis to process corner variations based on the 32 nm process technology show that the proposed technique, in addition to having proper performance in different corners of the technology, significantly reduces leakage power and propagation delay in logic CMOS circuits. In general, the proposed technique has a very successful performance compared to previous techniques.     

PVT variations aware low leakage INDEP approach for nanoscale CMOS circuits

Increasing in device parameter variations is the critical issue in very deep sub-micron regime due to continue scaling of the transistor dimensions. The overall performance yield of the logic circuit is diminished by raising leakage current and variability issues in scaled devices. In this article; we have proposed an approach called INDEP, based on Boolean logic calculation for the input signals of the extra inserted transistors between the pull-up and pull-down network of the CMOS logic. INDEP approach is not only reduces the leakage current but also mitigates the variability issues with minimum susceptible delay paths. Various process, voltage and temperature (PVT) variations are analyzed at 22 nm BSIM4 bulk CMOS PTM technology node for chain of 5-inverters using HSPICE tool. Several guidelines are provided to design the variability aware CMOS circuits in nanoscale regime by considering the leakage current variation. INDEP approach works effectively in both active as well as standby state of the circuit and keeping the modal performance characteristics of the CMOS gate. The electrical simulation results show that our proposed INDEP approach is less susceptible to PVT variations as compared to conventional circuit. The Monte-Carlo simulation results confirm that average INDEP leakage current reduction is 62.31% at ±20% PVT variations under 3σ Gaussian distribution for chain of 5-inverters.     

Low-voltage dynamic biasing technique for CMOS class ABcurrent-mode circuits

A novel dynamic biasing technique that can be used for the design of CMOS class AB current-mode circuits is presented. The approach takes advantage of the switched capacitor (SC) technique and enables extremely low voltage operations. An application of the proposed technique to the design of a basic input stage is given and simulations showing good agreement with the expected results are provided     

Impact of gate induced drain leakage on overall leakage ofsubmicrometer CMOS VLSI circuits

In this paper, the impact of gate induced drain leakage (GIDL) on the overall leakage of submicrometer VLSI circuits is studied. GIDL constitutes a serious constraint, with regards to off-state current, in scaled down complimentary metal-oxide-semiconductor (CMOS) devices for DRAM and/or EEPROM applications. Our research shows that the GIDL current is also a serious problem in scaled CMOS digital VLSI circuits. We present the experimental and simulation data of GIDL current as a function of 0.35-μm CMOS technology parameters and layout of CMOS standard cells. The obtained results show that a poorly designed standard cell library for VLSI application may result in extremely high leakage current and poor yield     

Transmitter leakage cancellation technique for CMOS SAW-less radio front-ends

Digital audio sensors have been used in microphone-embedded portable electronics. This paper shows a mixed-signal adaptive readout ASIC for digital audio sensor, which includes a programmable-gain-amplifier, a switched-capacitor sigma-delta modulator, digital signal processing, and power management circuits. The digital part comprises a digital low-pass filter, a digital-gain-compensation and a digital automatic-gain-controller. The clear advantage of this system is to obtain high signal-to-noise ratio (SNR) and wide input range simultaneously. In addition, both a normal operation mode and a sleep mode are realized to address a flexible current budget. The ASIC is fabricated in a 0.18-um CMOS process. Experimental results show the expected adaptive readout function over the input range from 94 to 136 dB SPL. In the normal mode, a system SNR of 68 dB (A-weighted) at 1 kHz 94 dB SPL input is achieved under 600 uA. Further, an impressive acoustic overload point (AOP) of 136 dB SPL is guaranteed. In the standby condition, the sleep mode with current less than 20 uA is obtained, so that the battery life can be extended. Compared to other existing solutions, this adaptive readout ASIC shows the best combination of achievable SNR, AOP and current budget for digital audio sensors.     

Threshold voltage mismatch and intra-die leakage current in digital CMOS circuits

Due to device and voltage scaling scenarios for present and future deep-submicron CMOS technologies, it is inevitable that the off-state current (I/sub off/) of MOSFET transistors increases as the technology minimum dimensions scale down. Experimental evidence shows that the leakage current distribution of modern deep-submicron designs not only has a higher mean value but it also presents a larger variability as well. In this paper, we investigate the impact of threshold voltage mismatch as one plausible source for this increased variability. In digital circuit design, it is commonly assumed that the threshold voltage difference (mismatch) of static CMOS cells is negligible. However, threshold voltage mismatch (/spl Delta/V/sub to/) has a two-sided effect on the off-state current. Namely, the total cell's current can increase or decrease depending upon the direction of the V/sub t/ mismatch shift. This effect can be so severe that I/sub off/ can increase by more than one order of magnitude with respect to its nominal value due only to V/sub to/ mismatch. We further show through experimental results that the V/sub to/ mismatch of paired transistors working in the subthreshold regime can be worse by a factor of two as compared to transistors working in the saturation or linear regions. A factor of two larger spread is obviously quite devastating in terms of area, speed, and power consumption, should it be desired to attain the same I/sub off/ level as for a V/sub to/ mismatch characterized out of the subthreshold regime.     

Gate oxide leakage current analysis and reduction for VLSI circuits

In this paper we address the growing issue of gate oxide leakage current (I/sub gate/) at the circuit level. Specifically, we develop a fast approach to analyze the total leakage power of a large circuit block, considering both I/sub gate/ and subthreshold leakage (I/sub sub/). The interaction between I/sub sub/ and I/sub gate/ complicates analysis in arbitrary CMOS topologies and we propose simple and accurate heuristics based on lookup tables to quickly estimate the state-dependent total leakage current for arbitrary circuit topologies. We apply this method to a number of benchmark circuits using a projected 100-nm technology and demonstrate accuracy within 0.09% of SPICE on average with a four order of magnitude speedup. We then make several observations on the impact of I/sub gate/ in designs that are standby power limited, including the role of device ordering within a stack and the differing state dependencies for NOR versus NAND topologies. Based on these observations, we propose the use of pin reordering as a means to reduce I/sub gate/. We find that for technologies with appreciable I/sub gate/, this technique is more effective at reducing total leakage current in standby mode than state assignment, which is often used for I/sub sub/ reduction.     

Impact of gate tunnelling leakage on CMOS circuits with full open defects

Interconnecting lines with full open defects become floating lines. In nanometric CMOS technologies, gate tunnelling leakage currents impact the behaviour of these lines, which cannot be considered electrically isolated anymore. The voltage of the floating node is determined by its neighbours and leakage currents. After some time an equilibrium is reached between these effects. Theoretical analysis and experimental evidence of this behaviour are presented.     

Dynamic SVL and body bias for low leakage power and high performance in CMOS digital circuits

In this article, a new complementary metal oxide semiconductor design scheme called dynamic self-controllable voltage level (DSVL) is proposed. In the proposed scheme, leakage power is controlled by dynamically disconnecting supply to inactive blocks and adjusting body bias to further limit leakage and to maintain performance. Leakage power measurements at 1.8?V, 75°C demonstrate power reduction by 59.4% in case of 1?bit full adder and by 43.0% in case of a chain of four inverters using SVL circuit as a power switch. Furthermore, we achieve leakage power reduction by 94.7% in case of 1?bit full adder and by 91.8% in case of a chain of four inverters using dynamic body bias. The forward body bias of 0.45?V applied in active mode improves the maximum operating frequency by 16% in case of 1?bit full adder and 5.55% in case of a chain of inverters. Analysis shows that additional benefits of using the DSVL and body bias include high performance, low leakage power consumption in sleep mode, single threshold implementation and state retention even in standby mode.     

Standby power consumption estimation by interacting leakage current mechanisms in nanoscaled CMOS digital circuits

Leakage currents are gaining importance as design parameters in nanometer CMOS technologies. A novel leakage current estimation method, which takes into account the dependency of leakage mechanisms, is proposed for general CMOS complex gates, including non-series-parallel transistor arrangements, not covered by existing approaches. The main contribution of this work is a fast, accurate, and systematic procedure to determine the potentials at transistor network nodes for calculating standby static currents. The proposed method has been validated through electrical simulations, showing an error smaller than 7% and an 80× speed-up when comparing to electrical simulation.     

A mechanism and a reduction technique for large reverse leakage current in p-n junctions

The origin of anomalously large p-n junction leakage current in Si is investigated. The leakage has strong electric field dependence and weak temperature dependence, and therefore cannot be explained by either generation-recombination current or diffusion current. It may be explained by the local Zener effect at local enhancement of the electric field around small precipitates in the depletion layer. Supposing a spherical precipitate, the electric field will be enhanced as much as 1.3 times for a SiO/sub 2/ precipitate and 3 times for a metal precipitate. The leakage features are explained by the electric field dependence and the temperature dependence of the local Zener probability. A new approach to reduce the local Zener probability by controlling the profile of the electric field is proposed, and the validity of the approach is confirmed by direct experiment and by improvement in the refresh operation of DRAM cells.<>     

A new approach to power estimation and reduction in CMOS digital circuits

Modelling and optimization of dynamic capacitive power consumption in digital static CMOS circuits, taking into consideration a reason of a gate switching—gate control mode, is discussed in the present paper. The term ‘gate control mode’ means that a number and type of signals applied to input terminals of the gate have an influence on total amount of energy dissipated during a single switching cycle. Moreover, changes of input signals, which keep the gate output in a steady state, can also cause power consumption. Based on this observation, complex reasons of power losses have been considered. In consequence, the authors propose a new model of dynamic power consumption in static CMOS gates. Appropriate parameters’ calculation method for the new model was developed. The gate power model has been extended to logic networks, and consequently a new measure of the circuit activity was proposed. Switching activity, which is commonly used as a traditional measure, characterizes only the number of signal changes at the circuit node, and it is not sufficient for the proposed model. As the power consumption parameters of CMOS are dependent on their control mode, the authors used probability of the node control mode as a new measure of the circuit activity. Based on the proposed model, a procedure of combinational circuit optimization for power dissipation reduction has been developed. The procedure can be included in a design flow, after technology mapping. Results of the power estimation received for some benchmark circuits are much closer to SPICE simulations than values obtained for other methods. So the model proposed in this study improves the estimation accuracy. Additionally, we can save several percent of the consumed energy.     

Testing and diagnostics of CMOS circuits using light emission from off-state leakage current

In recent years, innovative applications based on the detection of emission sources such as the light emission from off-state leakage current (LEOSLC) of CMOS transistors have been developed for testing and diagnosing modern ultralarge-scale integration circuits. In this paper, we show that LEOSLC can be used to effectively debug circuits, localize defects with a quick turn around time, read the logic state of gates, and extract the internal voltage drop of power distribution grids among others.