合金元素对含稀土低锡钎料抗氧化性和润湿性的影响

研究了合金元素对含稀土低锡钎料抗氧化性和氧化前后润湿性能的变化。试验结果表明，波峰钎焊时，高锡和低锡钎料都有不同程度的氧化，含锡量愈低，抗氧化性愈差。稀土对低锡钎料抗氧化性影响不大。合金元素Ｓｂ，Ｂｉ能提高钎料的抗氧化性，Ｃｕ在高温时提高钎料的抗氧化性，Ｚｎ降低抗氧化性。钎料氧化后，润湿性变化不大。     

合金元素对含稀土低锡钎料抗氧化性和润湿性的影响

研究了合金元素对含稀土低锡钎料抗氧化性和氧化前后润湿性能的变化，试验结果表明，波峰钎焊时，高锡和低锡钎料都有不同程度的氧化，含锡量愈低，抗氧化性愈差，稀土对低锡钎料抗氧化性影响不大，合金元素Ｓｂ，Ｂｉ能提高钎料的抗氧化性Ｃｕ在高温时提高钎料的抗氧化性，Ｚｎ降低抗氧化性，钎料氟化后，润湿性变化不大。     

稀土对锡铅钎料润湿性和接头强度的影响

研究了稀土对含锡１５％和３０％锡铅钎料系统润湿性、填缝性和接头强度的影响。结果表明，加入适量稀土ＲＥ（混合稀土），能明显提高锡铅钎料的润湿性和接头强度，但对锡铅钎料的填缝性影响不大。     

SnZnPr-xAu无铅钎料性能与组织

研究了微量纳米Au颗粒对SnZnPr无铅钎料性能与组织的影响。研究结果表明,微量的纳米Au颗粒可以显著改善SnZnPr钎料的润湿性和焊点力学性能,通过优化设计证明纳米Au颗粒的最佳添加量为0.1%,但添加纳米Au颗粒过量时,钎料的润湿性明显下降,焊点的力学性能基本不变。对SnZnPr和SnZnPr-0.1Au钎料组织研究发现0.1%纳米Au颗粒可以显著细化基体组织,特别是减小富Zn相的尺寸,通过纳米压痕实验证明0.1%纳米颗粒可以显著提高SnZnPr钎料的抗蠕变性能,热循环实验证明0.1%纳米Au颗粒可以将QFP100器件SnZnPr焊点热疲劳寿命提高12.3%,主要归因于纳米颗粒对位错的钉扎作用。     

非晶态合金钎料真空钎焊接头组织研究

研究了铜的添加对Ｎｉ－Ｃｒ－Ｂ－Ｓｉ系非晶态太合金纤料真空纤焊１Ｃｒ１８Ｎｉ９Ｔｉ母材的钎缝的组织特征和临界钎焊间隙值的影响规律,并与相同成分的晶态粉状钎料进行了对比。结果表明：在钎焊工艺规范确定情况下,随着钎料中铜的质量分数的增大,钎缝中固溶体含量增加,危性相厚度减小,钎焊接头的ＣＢＣ值增大;非晶态钎料钎焊接头中的元素和组织分布比较均匀,其ＣＢＣ值较晶态的大。     

多元无铅软钎料的计算机优化设计

利用二次回归正交设计法得到27组试验钎料配方，分别测定了它们的液相线温度和润湿性；选取液相线温度和润湿性的试验数据作为参数，依据回归设计理论，通过计算机辅助设计，建立了钎料的液相线温度、润湿性与Bi、Sb、Ag、Cu、Re之间关系的二次回归方程；根据最优化原理，通过建立数学模型计算机优化运算，得到了Sn-Bi-Sb-Ag-Cu-Re系优化钎料.试验结果表明，Sn-Bi-Sb-Ag-Cu-Re系优化钎料的熔化温度和润湿性均比较好.     

合金元素对Pb-Sn-Sb-Bi-P-Cd系软钎料性能的影响

研究了Sn、Sb、Bi、P、Cd五种合金元素对Pb-Sn-Sb-Bi-P-Cd系软钎料的熔化温度、润湿性能、抗剪强度等性能的影响.结果表明,加入适量的Sn、Bi、Sb、Cd可以降低液相线温度;加入适量的Sn、Cd可改善润湿性能;加入适量的Sb、Sn、P可提高抗剪强度.     

钎料、钎剂对PCD刀具焊接性能的影响

针对PCD层易石墨化,硬质合金基底难被钎料润湿的这些缺点,通过应用根据剪切原理自制的试验专用夹具进行抗剪切强度测试、钎焊试验,研究了在空气条件下高频感应钎焊PCD刀具过程中钎料、钎剂对刀具焊接性能的影响,提出了当母材分别为T8钢和YG16、YG16和YG8时,钎料、钎剂的优化搭配方案.     

Preparation and properties of particle reinforced Sn-Zn-based composite solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu₅Zn₈ particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn. Funded by the Major Scientific and Technical Project Program of Jiangxi Province (No.2005008) and the Science & Technology Project of Education Department of Jiangxi Province (No.[2007]53 and No.GJJ09416)     

Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder.The effects of Ag particle addition on the microstrueture of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound (IMC) layer of the Sn-0.7Cu solder and the composite solder reinforced with l vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.     

合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响

研究了合金元素Bi、Sb、Ag、Cu、Re对锡基无铅多元钎料性能和组织的影响.研究结果表明，增加Bi、Ag、Cu含量可以降低液相线温度，Sb可以提高液相线温度；Bi、Cu有提高润湿性能的作用，Sb、Ag、Re在低含量范围内可提高润湿性能；Cu有提高剪切强度的作用，Bi明显使剪切强度降低.钎料的相组成是由在β Sn的基体上分布着金属间化合物Ag3Sn、SnBi和Cu6Sn5构成的，Sb和Re则基本上是固溶在基体中.     

Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys

To improve the properties of Sn10Sb8Cu solder alloy, two new solders(SnSbCuAg and SnSbCuNi)were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder.The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni,Cu_6Sn_5 and (Cu,Ni)_6Sn_5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy,which makes the viscosity of the melting solder increase and the spreading property of the solder decline.     

Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface

The intermetallic compound (IMC)is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability. The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges. The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis(EPMA)determines the chemical compositions and confirms that the IMC is changed into the(Cu,Co,Ni)_6Sn_5+(Cu,Co,Ni)_3Sn_4 mixed type from the type of Cu_6Sn_5 with the elements Ni and Co in the solder.     

Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

The formation and the growth of Cu-Sn intermetallic compound （IMC） layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce （only 0.1%,mass fraction） into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.     

脉冲电弧离子源镀膜均匀性研究

薄膜厚度的均匀性是影响沉积方法应用的一个重要因素，利用脉冲电弧离子镀技术在硅基片上沉积类金刚石薄膜，并用轮廓仪对薄膜的厚度进行测量，研究了不同参数对薄膜均匀性的影响。结果表明：离子源阴极和基片的距离、主回路工作电压以及沉积频率都不同程度地影响薄均匀性，文章还就不同类型离子源对薄膜均匀性的影响进行了探讨。     

Effect of Various Carbides on the Wettability in Ni/Ti（C,N） System

The wettability in Ni / Ti （ C, N ） systems with various carbides additions was investigated by the sessile drop technique. The substrates prepared by HP at 2073 K for 1 h before and after wetting were characterized by XRD . The microstructure ca metall ceramics interfaces was observed via SEM in a back scattered mode. Furthermore , an X-ray energy-dispersive spectrometer （ EDS ） attached to SEM was used to study the element diffusion in interfacial regions. The resalts reveal that reactive wetting takes place in the system in high tempercature wetting procedure , which is controlled by diffusion and dissolution mechanism. Results also show that the contact angles decrease with various carbides additions, iuelnding WC , Mo2 C, TaC , NbC and VC , and decrease continuously with the increasing of additions. The order of the contact angles in Ni/Ti （ C, N ） systems with 10 wt% carbides acMitions is Mo2 C 〈 TaC 〈 WC 〈 VC 〈 NbC. The enhancement of the wettability is due to an alloying procedure during high temperature wetting when metallic atoms diffuse into Ni phase, which decreases the interfacial energy of Ni/ Ti （ C, N） systems.     

基体粗糙度和硬度对TiAlCN附着力的影响

在不同粗糙度和硬度的GCr15轴承钢基体上,利用多弧离子镀技术低温(175℃)沉积TiAlCN涂层.利用扫描电子显微镜(SEM)、AFM、EPMA、XRD和附着力测试仪等研究了薄膜形貌和性质.结果表明:基体越平整,制备的涂层表面也就越平整;薄膜附着力随着表面粗糙度的增大而减小,在基体粗糙度为0.01μm时,薄膜附着力达到最大值42.8N;基体硬度越高,膜/基附着力越大,在基体硬度为835HV0.01时,附着力达到最大值31.2N;在涂层中,发现了晶体结构为fcc-TiN结构,衍射图中没有AlN相出现,这是TiN相优于AlN相而形成的缘故.