Inorganic powder electroluminescence (IPEL) devices with the insertion of a carbon nanotube (CNT) layer were investigated to verify the effect of the increased local field produced by CNTs on electroluminescence (EL). To increase the field strength effectively, the CNTs were shortened using the cryogenic crushing method. IPEL devices with the insertion of a short CNT layer exhibited an increase in brightness and efficiency with increasing amount of CNTs. The local field enhancement by CNTs, further enlarged by the triple-junction, could increase the field strength applied to the phosphor, resulting in improved EL performance. In addition, short CNTs in an EL device can lead to field enhancement without an unintentional current flowing into the device. 相似文献
Summary: We demonstrate the use of polyisobutene (PIB) in a glass encapsulation method suitable for organic devices. The PIB viscosity at environmental temperatures provides a fast and non‐aggressive passivant layer formation method for device protection with glass. Due to its fully aliphatic character, PIB is suitable for passivating organic light‐emitting and photovoltaic devices. The observed preservation of encapsulated Ca films demonstrates the PIB suitability for air‐unstable metals passivation. Stable I(V) characteristics and increased operational lifetime were observed in PIB‐encapsulated organic devices. This encapsulation method is cheap, simple, and dispenses intensive equipment use, so that it is appropriate even for laboratories with restricted experimental facilities.
Setup used for Ca samples testing. The right Ca contact was encapsulated with PIB and a glass cover plate (dashed square). The electrical diagram of the apparatus used to obtain the resistance behavior is also shown. 相似文献
We demonstrate the formation of a light-emitting porous silicon (PSi) layer by photoetching in an HF/I2 solution. The use of a Xe lamp makes possible a large and homogeneous PSi layer on an n-type Si(100) wafer. An insulating
layer has been formed on the PSi layer by chemical oxidation in an acidic solution. These techniques are used to fabricate
electroluminescent (EL) devices of metal/insulator/semiconductor (MIS) type. It is shown that the present device is superior
with respect to emission efficiency to the conventional Schottky- or metal/semiconductor-type device. 相似文献
New polyfluorenes (PF)-based conjugated copolymers, containing oxadiazole and carbazole units as pendants, were prepared as the electroluminescent (EL) layer in light-emitting diodes (LEDs) to show that most of them have higher maximum brightness and EL efficiency as compared to poly(2,7-(9,9-bis(2-ethylhexyl)fluorene)) (PF2/6). The prepared polymers, poly[(9-(6-(N-carbazolyl)-hexyl)-9-hexyl)-fluorene-2,7-diyl]-co-[(9-hexyl-9-(6-(4-(5-phenyl-1,3,4-oxadiazolyl)-phenoxy)-hexyl)-fluorene-2,7-diyl)] (Oxd-PF-co-Cz-PF), were soluble in common organic solvents and used as the EL layer in double layer light-emitting diodes (LEDs) (ITO/PEDOT/polymer/Al). All polymers show photoluminescence around λmax=430 nm (exciting wavelength, 370 nm) and blue EL around λmax=426 nm. The current–voltage–luminance (I–V–L) characteristics of the polymers show turn-on voltages of 3.5–5.5 V which are lower than that of PF2/6. The maximum brightness and EL efficiency of the device with the configuration of ITO/PEDOT/polymer/Al were 3000 cd/m2 at 10 V and 2.13 cd/A at 10.6 mA/cm2, respectively, which are all higher than those of PF2/6. 相似文献
Catalysts containing metals such as Cu, Ni, Fe, Co in their reduced state are often subjected to passivation procedures prior
to characterization. Passivation with N2O or O2 to create a protective oxide layer also results in a certain degree of sub-surface oxidation. The heat released during oxidation
is a critical parameter. The extent of bulk oxidation depends on the type of oxidant as well as on the size of the metal particles,
as shown for copper catalysts. The final, meta-stable passivation layer requires a certain thickness to sustain exposure to
ambient atmosphere. The encapsulation of metal particles in carbon is an efficient method for preserving the metallic state,
as demonstrated for metallic nickel and iron with carbon nanofibers. The use of passivated samples for characterization of
the active, i.e., reduced, catalyst has limited value. 相似文献
An inorganic electroluminescent (EL) device on a flexible polyethylene terephthalate (PET) substrate and its properties were investigated. The transparent conducting film (TCF) made from carbon nanotubes (CNTs) (CNT-TCF) was employed in the flexible EL device. CNT-TCF was formed by filtration of CNT solution and was transferred to the PET film. It was found that the brightness of the inorganic EL device was strongly dependent on the quality of the CNT composite films. After a 3-aminopropyltriethoxysilane treatment of the PET substrate, CNTs uniformly were dispersed and showed a good adhesion to the substrate, and the resulting EL device showed better performance. The flexible EL device showed the brightness of 96.8 cd/m2 at 28 kHz and 50 V. 相似文献
Resistive random access memory (RRAM) has been developed as a next-generation nonvolatile memory because of its fast operation speed, low power consumption, high density, and simple structure. Non-oxide materials such as AlN-based RRAM also exhibit low operation energy and large on/off ratios. However, AlN-based RRAM may deteriorate upon oxidation when exposed to air/moisture. In addition, chemical reactivity between the electrode and the switching layer material affects device stability. In this study, four kinds of top electrode materials (Al, Ti, TiN, and Pt) were used in an AlN/TiN stack and a water-resistant encapsulation layer was used to prevent the degradation of AlN-based RRAM. The electrical properties of the device were measured at weekly intervals for 7 weeks. The devices containing Al and Ti top electrodes showed degradation of resistance states despite being encapsulated in a thin Al2O3 layer. In contrast, the devices with TiN and Pt electrodes maintained their resistance states and switching properties regardless of the encapsulation layer. These trends in degradation can be explained by the electrode and AlN reactivity with moisture based on fundamental thermodynamics. 相似文献
The origin of the device instability of chemical vapor deposited graphene metal oxide semiconductor field effect transistor has been investigated while varying the characterization time scale from milliseconds to a few tens of seconds. When oxygen diffusion to the graphene interface was suppressed with Al2O3 passivation layer, the hysteresis activated with a time scale over a few tens of seconds was reduced significantly at both electron and hole branches of current–voltage curves. However, a fast charge trapping process occurring within a few milliseconds was not affected by the passivation and became a dominant mechanism of hysteresis. 相似文献
This paper describes the synthesis of new copolyfluorenes (P05-P5) slightly doped with 2,5-bis(2-phenyl-2-cyanovinyl)thiophene (GM, <3.4 mol%) and their application in electroluminescent (EL) devices. In film state, EL spectra of the copolyfluorenes are very different from photoluminescence (PL) spectra, which have been ascribed to charge trapping in GM and energy transfer from fluorene segments to GM chromophores. The maximum brightness and current efficiency of EL device from P05 (5230 cd/m2, 0.65 cd/A) are significantly enhanced when compared with those from poly(9,9-dihexylfluorene) (PF) (1310 cd/m2, 0.18 cd/A). The EL device using blend of P5 and PF (w/w = 10/1) as emitting layer exhibits near-white emission with CIE coordinate being (0.26, 0.32). The results demonstrate that the copolyfluorenes slightly doped with GM chromophore are promising emitting materials for optoelectronic devices. 相似文献
Perovskite light emitting diodes (PeLEDs) now emerge as a promising new optoelectronic application field for these amazing semiconductors. However, most PeLEDs contain organic components, which make them unstable in the air. For fabricating the air-stable all inorganic green PeLEDs, we have designed green PeLEDs based on the ZnO/CsPbBr3/NiO heterojunction structure. The emission layer inorganic perovskite CsPbBr3 film with small grain sizes was prepared using a two-step method. The device exhibits a typical rectification behavior with turn-on voltage of ~ 3 V. The working mechanism of the device is discussed. The EL emission bands are narrow with small FWHM values. The continuous working air-stability was also monitored. The results reveal our PeLED can maintain a good color purity and a stable EL intensity when it works continuously in the air. Our present work suggests great potential for the development and practical commercial application of PeLEDs. 相似文献
Summary Poly(2-trimethylsilyl-1,4-phenylenevinylene) (TMS-PPV) was synthesized through a organic-soluble precursor polymer, and its properties were characterized by UV-visible, FT-IR spectroscopy and thermal anaylsis. The EL devices were fabricated with TMS-PPV as an emitting layer, and ITO and aluminum as positive and negative electrodes, respectively. Threshold voltage of the device was about 15 V and the emission maximum was at about 540 nm with quantum efficiency of 3.5x10-4% photons per electron in air and room temperature condition. 相似文献
The underfill material is a polymeric adhesive used in flip chip packaging. It encapsulates the solder joints by filling the gap between a silicon die and an organic substrate or board. Within a typical flip chip structure, there are interfaces between the various components, namely, substrate, solder mask, flux residue, underfill encapsulant and die passivation layer, etc. Maintaining a good adhesion condition, both as-made and after temperature/humidity aging, is vital for these interfaces because of the expected performance of the flip chip device, where the underfill material is employed to enhance the reliability of the flip chip interconnect. We have studied the adhesion strength between the various components for different process variables as measured with the lap shear and die shear test configurations. The effects of the assembly factors, i.e. solder mask, flux residue, underfill, and die passivation, etc., were evaluated and the adhesion strength was found to depend greatly on these factors. The die shear strength of a passivated die assembled onto an organic board coated with a solder mask was much higher after using a no-clean flux on the solder mask than for the assembly without such a no-clean flux. The influence of some accelerated aging tests on the adhesion durability was also investigated. A die passivation layer of benzocyclobutene exhibited better capability in retaining the die shear strength than a passivation layer of silicon nitride or polyimide, especially for the initial aging period. The knowledge obtained in this study should provide insights into the interfacial adhesion in the flip chip assembly structure. 相似文献