基于低压高精度运放的带隙基准电压源设计

基于传统带隙基准源的电路结构,采用电平移位的折叠共源共栅输入级和甲乙类互补推挽共源输出级改进了其运算放大器的性能,并结合一阶温度补偿、电流负反馈技术设计了一款低温度系数、高电源电压抑制比(PSRR)的低压基准电压源。利用华润上华公司的CSMC 0.35μm标准CMOS工艺对电路进行了Hspice仿真,该带隙基准源电路的电源工作范围为1.5～2.3 V,输出基准电压为(600±0.2)mV;工作温度为10～130℃,输出电压仅变化8μV,温度系数为1.86×10-6/℃,低频时PSRR为-72 dB。实际流片进行测试,结果表明达到了预期结果。     

高性能CMOS带隙基准电压源及电流源的设计

介绍了一种高性能CMOS带隙基准电压源及电流源电路,基准电压源使用两个二极管串联结构来减小运放失调影响结果的系数,同时采用大尺寸器件减小运放的失调;采用共源共栅电流镜提供偏置电流来减小沟道长度调制效应带来的影响;在此基准电压源的基础上,利用正温度系数电流与负温度系数电流求和补偿的方法,设计了一种基准电流源。使用CSMC公司0.5μm CMOS工艺模型,利用Spectre工具对其仿真,结果显示:电源电压为5 V,在-40～85℃的温度范围内,基准电压源温度系数为20.4×10-6/℃,直流电源抑制比为1.9 mV/V,电流源温度系数为27.3×10-6/℃,电源抑制比为57 dB。     

一种高精度电压基准源设计方法

高精度带隙基准源是高性能模拟和数模混合集成电路的重要组成部分,其精度影响了整个系统的稳定。基于此,对带隙基准源的高阶温度补偿和分段曲率补偿原理进行了分析,设计了一种新颖的基于亚微米工艺的带隙基准源并获得了极低的温度系数。     

采用曲率补偿的高PSRR基准电压源

设计了一种输出电压为1.5 V的带隙基准电路.该电路采用标准CMOS工艺,工作电压为3～6.5 V.采用一种简洁的曲率补偿技术,使输出基准电压温度系数达到3×10-6V/℃.由于采用共源共栅输出结构,在室温27℃、频率小于1 kHz时,电源抑制比达到97 dB,电源影响率小于15×10-6V/V.另外,还设计了启动电路和电流源偏置电路,可以整体应用到SOC系统.     

基于数字电位器的可编程电压基准源设计

在电子设计中为了灵活准确地设置电压基准值,设计了可编程电压基准源电路。详细阐述了电路的设计思路和工作原理。利用5片2.048 V带隙电压基准源芯片串联产生10.24 V电压作为基准。随后创新地利用单片机控制1024抽头的数字电位器对基准电压进行分压,结合精准运放的反向放大电路,最后输出-10.24 V到10.22 V的可编程精准电压值,输出电压分辨力达20 mV。测试结果表明,该电路具有输出线性度好、精度高、性能稳定等优点。     

一种高性能带隙基准电压源设计

在传统一级温度补偿带隙基准电路的基础上,对电路进行了改进,实现二级温度补偿,该电路可以在-35～125℃范围内,达到平均低于2×10^-6/℃的温度系数。整个电路采用SMIC的标准的0.35μm CMOS工艺实现,使用Hspice仿真器进行仿真。仿真结果证明此基准电压源具有很低的温度系数。     

曲率补偿低温漂带隙基准电压源设计

设计了一种曲率补偿低温漂带隙基准电压源。采用放大器钳位的传统实现方式,在电路中加入两种不同的分段曲率补偿电路,低温阶段,设计节点电流相减产生一段负温度系数补偿电流,高温阶段,控制晶体三极管导通产生一段正温度系数补偿电流,实现了对基准电压曲率补偿,同时采用共源共栅结构以提高电路的电源抑制比。在0.18μm的TSMC工艺下,使用Cadence Spectre对电路进行仿真,仿真结果表明,在3.3 V的电源电压下,基准输出电压为1.241 V,在–40~+125℃范围内,基准电压的温度系数为3.02×10–6/℃,低频时电源抑制比(PSRR)低于–57 d B。     

一种带隙基准电压源的设计

经分析带隙基准电压源的温度补偿原理，进行一阶温度补偿，然后提出了新型的二阶温度补偿的方法，用Hspice仿真，得到温度系数为5ppm／℃，电源抑制比可达到60dB，取得了比较理想的效果。     

一种带隙基准电压源设计

基准电压源是在电路系统中为其它功能模块提供高精度的电压基准,它是模拟集成电路和混合集成电路中非常重要的模块。文中主要研究了带隙基准基本原理的基础上,设计了一款应用于折叠插值ADC中粗量化电路部分CMOS带隙基准源。最后通过Pspice仿真给出了实验仿真的结果。     

超低温漂带隙基准电压源设计

在对传统带隙基准电压源进行理论分析的基础上,结合当前IC设计中对基准电压源低温漂、高电源抑制比的要求,设计了一种超低温漂的带隙基准电压源电路。该电路带有启动电路和高阶温度补偿电路。仿真结果表明,在-55~125℃的温度范围内获得了1.65×10-6/℃的温漂系数,低频时的电源抑制比达到-62 d B。     

一种带曲率补偿的高精度带隙电压基准源

本文提出了一种带运放失调电压补偿结构和分压式二阶曲率补偿结构的低温度系数带隙基准电路。设计目标为对便携设备提供0.8V的电压。基于华虹CZ6H工艺在CADENCE软件TT模型下仿真,仿真结果表明,带隙基准电压源在-40℃-120℃温度范围内温度系数仅为1.77×10-6/℃,电源抑制比(PRSS)在低频下为86.9dB。在3V-6V的电源电压工作范围内,输出电压摆幅为0.171mV。     

一种新颖的片内高压转低压电源转换方案

A novel power supply transform technique for high voltage IC based on the TSMC 0.6μm BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm^2 area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/℃. Compared with the traditional LDO （low dropout） regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.     

A novel on-chip high to low voltage power conversion circuit

A novel power supply transform technique for high voltage IC based on the TSMC 0.6μm BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm2 area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/℃. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.     

用于高分辨率ADC的高精度可编程带隙电压参考设计

A programmable high precision bandgap reference is presented, which can meet the accuracy requirements for all technology corners while a traditional bandgap reference cannot.This design uses SMIC 0.18 μm 1P4M CMOS technology.The theoretically achievable temperature coefficient is close to 0.69 ppm/°C over the whole temperature range.     

A high precision programmable bandgap voltage reference design for high resolution ADC

temperature coefficient is close to 0.69 ppm/℃ over the whole temperature range.     

An on-chip temperature compensation circuit for an InGaP/GaAs HBT RF power amplifier

A new on-chip temperature compensation circuit for a GaAs-based HBT RF amplifier applied to wireless communication is presented.The simple compensation circuit is composed of one GaAs HBT and five resistors with various values,which allow the power amplifier to achieve better thermal characteristics with a little degradation in performance.It effectively compensates for the temperature variation of the gain and the output power of the power amplifier by regulating the base quiescent bias current.The temperature compensation circuit is applied to a 3-stage integrated power amplifier for wireless communication applications,which results in an improvement in the gain variation from 4.0 to 1.1 dB in the temperature range between -20 and +80℃.     

一种应用于InGaP/GaAs HBT射频功率放大器的在片温度补偿电路

A new on-chip temperature compensation circuit for a GaAs-based HBT RF amplifier applied to wireless communication is presented.The simple compensation circuit is composed of one GaAs HBT and five resistors with various values,which allow the power amplifier to achieve better thermal characteristics with a little degradation in performance.It effectively compensates for the temperature variation of the gain and the output power of the power amplifier by regulating the base quiescent bias current.The temp...     

共源共栅两级运放的三种补偿结构分析和比较

提出了三种应用于两级CMOS运算放大器的米勒电容补偿结构,分析了三种结构的小信号等效电路,得到传递函数和零点、极点的位置,以此分析和实现三种结构的频率补偿。其中两种共源共栅米勒补偿结构与直接米勒补偿结构相比,能用更小的芯片面积实现更优的运放性能,得到更大的单位增益带宽积和相位裕度,实现更好的频率特性。通过使用0.18μm CMOS工艺对电路进行仿真,结果验证了共源共栅米勒补偿技术的优越性。     

无电阻低压低温漂的CMOS基准电压源

结合工作在亚阈值区、饱和区和线性区的MOS管,提出一种纯MOS结构的基准电压源,其结构能有效补偿MOS管的栽流子迁移率和亚闽值斜率的温度系数。基于SMIC0．13μm的CMOS工艺的仿真结果表明,在-5-90℃的范围内。输出电压的温度系数为5ppm／℃。在室温时,整个电路能在低到0．9V的电源电压下工作并消耗0．68μW的功耗。