共查询到18条相似文献,搜索用时 531 毫秒
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脉冲无氰镀银及镀层抗变色性能的研究 总被引:2,自引:0,他引:2
采用赫尔槽试验筛选出一种阴离子表面活性剂及含氮杂环化合物作为脉;中无氰镀银的添加剂,并初步确定了无氰镀银的工艺条件及脉冲条件一通过正交试验进一步化化脉冲条件及镀银添加剂含量分别为:脉宽1ms、占空比10%、平均电流密度0.6A/dm^2、阴离子表面活性剂及含氮杂环化合物含量分别为12mg/L、110mg/L测定了该镀银层的耐蚀性、抗变色性能及与基体的结合力,并用扫描电镜对其微观形貌进行了观察。结果表明,脉冲无氰镀银层的抗变色性能优于直流无氰镀银层;光亮镍打底后再脉冲无氰镀银,可获得更加光亮、结晶细致的镀银层,且抗变色性能及耐蚀性均增强. 相似文献
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无氰镀银的工艺与技术现状 总被引:6,自引:3,他引:3
介绍了无氰镀银的发展过程和技术现状。由于表面添加剂技术的进步,使以前开发的工艺中存在的某些工艺或技术问题得到了解决。这些添加剂或者提高了无氰镀银工艺的电流密度,或者提高了光亮度或表面活性,从而使无氰镀银工艺的工业化成为可能。 相似文献
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针对传统电镀银所使用的氰化物工艺,为解决剧毒氰化物对人类健康、环境造成的危害问题,设计开发了一种新型无氰镀银工艺来代替氰化镀银工艺,研究了双配位体系无氰镀银溶液、无氰浸锌溶液性能及所得镀银层性能影响.结果表明:采用双配位体系络合剂可以提高无氰镀银溶液稳定性,使各项性能达到氰化镀银指标;采用新型无氰浸锌溶液可以提高铸铝件镀银结合力;该工艺的实际应用,避免了氰化物的危害、降低了生产成本、有利于操作人员的身体健康和生命安全,属于绿色生产工艺,符合国家产业政策,极具推广价值. 相似文献
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无氰电镀工艺的研究现状及解决问题的途径 总被引:7,自引:0,他引:7
本文回顾了无氰电镀工艺的发展状况。指出了当前电镀生产无氰化过程中存在的问题。介绍了当前国内外主要的无氰电镀工艺——无氰镀锌、无氰镀铜、无氰镀金和无氰镀银等工艺的技术现状,指出了今后的研发重点和解决问题的主要途径。 相似文献
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氰化镀银具有与众不同的技术要求,因而操作较难掌握。本文介绍了其承处理工艺,归纳了不同基材,不同工艺制件上的镀银工艺,并强调了防变色处理的意义。 相似文献
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A phosphorus-modified electrolytic silver catalyst was prepared and used as catalyst in the oxidative dehydrogenation of glycoto glyoxal. The yield of glyoxal was observed as high as 82% at 98% conversion for the Ag-P catalyst, while 62% at 89% conversion for the pure electrolytic silver. The formation of the surface compounds between the phosphorus additives and the silver surface was demonstrated by means of XPS and SEM. It caused the decrease of the surface concentration of atomic oxygen species, and restrained the decomposition and total oxidation of adsorbed glycol to C1 products. 相似文献
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《Electrochimica acta》2001,46(1-2):61-66
The use of pulse reversal (PR) plating, as an alternative to the use of additives for electrochemical deposition of nickel, is studied. With optimised pulse plating parameters, and in some cases in combination with additives, substantial improvement of the deposit properties can be achieved. Utilising chloride-type baths, PR plating of pure nickel (and harder nickel–cobalt alloys) have been used to fabricate tools for micro-injection moulding (Polymer Structures for μTas, EuroSensors, Copenhagen, 27–30 August, 2000) and micromechanical structures. Furthermore, preliminary results from pulse plating experiments with ternary magnetic alloys, comprising 50–60% Co, 25–35% Fe and 10–20% Ni, will be reported. For both pure nickel and nickel alloys good chemically stable electrolytes have been developed, and the deposits are smooth with low residual stress. None of the electrolytes contain sulphur co-depositing additives (such as saccharin) nor wetting agents. 相似文献