Cu对Sn-9Zn无铅钎料电化学腐蚀性能的影响

对Sn-9Zn-xCu钎料在3.5%NaCl溶液中的电化学腐蚀行为进行研究,以揭示添加Cu对Sn-9Zn钎料耐蚀性的影响。结果表明:添加Cu元素使Sn-Zn钎料的腐蚀电位有所增加,即添加Cu元素可以改善Sn-Zn钎料的耐腐蚀性能;XRD检测发现Sn-9Zn-xCu钎料的腐蚀产物中存在Zn5(OH)8Cl2.H2O;随着Cu含量的增加,Zn5(OH)8Cl2.H2O的量逐渐减少,出现Cu的腐蚀产物,腐蚀表面趋于均匀平整,选择性腐蚀减弱,腐蚀产物的黏附性较好。     

Cu-Ti合金在模拟S2-污染海水中的腐蚀行为研究

通过浸泡实验与电化学测试,研究了固溶态Cu-4wt.%Ti合金在模拟污染海水(含S2-的3.5wt.% NaCl溶液)的腐蚀行为。借助扫描电子显微镜(SEM)、X射线衍射(XRD)以及X射线光电子能谱仪(XPS)对铜钛合金表面腐蚀产物进行测试分析。结果表明：含Cl-溶液中铜钛合金的腐蚀形式为点蚀,点蚀坑尺寸较小,分布均匀。添加S2-后点蚀更容易被诱发,点蚀坑尺寸较大。当NaCl溶液中的S2-浓度达到60ppm时,点蚀坑在合金表面相互连接,呈现出均匀腐蚀的形态;S2-<和Cl-对铜钛合金的腐蚀存在竞争吸附,S2-吸附性强对铜钛合金的腐蚀剧烈;在含S2-的NaCl溶液中腐蚀产物主要为CuS、Cu2S、Cu2O以及Cu2(OH)3Cl。S2-浓度较大时会导致溶液中OH-浓度增加,使腐蚀产物膜层厚度与致密度增加,因此当S2-浓度达到100ppm时铜钛合金能够发生钝化从而减缓腐蚀。     

Cu-Al-Mn-Zn-Zr形状记忆合金在NaCl溶液中的腐蚀行为

通过动态电位极化测量、电化学阻抗谱(EIS)和X射线光电子能谱(XPS)研究铜基形状记忆合金(Cu-Al-Mn-Zn-Zr)在3.5％NaCl(质量分数)溶液中的腐蚀行为.腐蚀开始时,形状记忆合金表面形成的氧化产物不断覆盖合金表面,导致腐蚀速率降低.合金在NaCl溶液中浸泡4 d后,腐蚀产物层变厚及更加疏松多孔,导致腐...     

铜在含氯薄液膜和杂色曲霉作用下的腐蚀行为

目的 研究纯铜在含氯液膜和霉菌共同作用下的腐蚀行为与机理。方法 将海南文昌采集的一株野生杂色曲霉接种到质量分数分别为0.9%和3.5%的NaCl溶液中制成孢子悬浮液,将孢子悬浮液均匀喷洒到铜试样表面后进行恒温恒湿试验,试验不同周期后采用体视学显微镜、扫描电子显微镜观察铜试样的腐蚀形貌,采用X射线光电子能谱仪分析试验14 d的试样表面和氩离子刻蚀15 s后的成分。结果 纯铜在NaCl薄液膜下的腐蚀产物具有明显的双层结构,内层靠近基体的为致密的Cu2O钝化层,外层为疏松的Cu2(OH)2CO3和Cu2(OH)3Cl组成的Cu(II)碱式盐;无菌时,铜表面出现大量蓝绿色的Cu(II)碱式盐,杂色曲霉存在时,铜表面腐蚀产物主要为红棕色的Cu2O钝化膜,仅有少量Cu(II)碱式盐零星分布在Cu2O膜外层;0.9% NaCl薄液膜与霉菌共同作用时,试样表面腐蚀产物主要为Cu2O,当薄液膜中盐的质量分数升高到3.5%时,霉菌数量减少,Cu(II)碱式盐较0.9% NaCl薄液膜组增多。结论 纯铜的腐蚀产物由内层的Cu2O钝化层、外层的Cu2(OH)2CO3和Cu2(OH)3Cl组成双层结构。杂色曲霉通过呼吸作用影响液膜中的O2浓度进而影响铜的腐蚀产物组成,霉菌存在时腐蚀产物中Cu(II)碱式盐显著减少。含氯液膜与霉菌共同作用时,液膜中的NaCl浓度通过影响杂色曲霉的生长活性而影响腐蚀产物组成。     

Behaviour of Cu-Ni alloys in natural sea water and NaCl solution

A series of Cu-Ni alloys, ranging from 30 to 90% copper was studied by electrochemical methods in 3.5% sodium chloride solution and in sea water. The composition of the corrosion layer and of the solution after various immersion times was determined by chemical methods and X-ray diffraction. The results are consistent with a corrosion process involving dissolution of copper and nickel enrichment at the surface. The corrosion resistance of all the alloys is better in NaCl solution than in sea water.     

Sn-0.75Cu钎料接头在NaCl溶液中的电化学腐蚀行为(英文)

采用动电位极化及浸出方法研究Sn-0.75Cu钎料及Sn-0.75Cu/Cu接头在3.5%NaCl溶液中的电化学腐蚀行为。极化曲线测试结果表明Sn-0.75Cu钎料的腐蚀速率比Sn-0.75Cu/Cu接头的低。在特殊电位时的形貌观察及相分析表明,在Sn-0.75Cu钎料表面活化溶解区形成腐蚀产物Sn3O(OH)2Cl2。从活化/钝化区开始,Sn-0.75Cu钎料的表面完全被腐蚀产物Sn3O(OH)2Cl2覆盖,并且在极化测试后出现蚀坑。与Sn-0.75Cu钎料合金相比,Sn-0.75Cu/Cu接头的钎料表面在活化区形成较多的Sn3O(OH)2Cl2,在极化测试结束时腐蚀坑的尺寸较大。浸出实验结果证实了Sn-0.75Cu/Cu接头较快的电化学腐蚀速率引起较多的Sn从中接头中释放出来。     

Corrosion and electrochemical behavior of Mg–Y alloys in 3.5% NaCl solution

The corrosion mechanism of Mg–Y alloys in 3.5% NaCl solution was investigated by electrochemical testing and SEM observation. The electrochemical results indicated that the corrosion potential of Mg–Y alloys in 3.5% NaCl solution increased with the increase of Y addition. The corrosion rate increased with the increase of Y addition because of the increase of Mg₂₄Y₅ intermetallic amounts. The corrosion gradually deteriorated with the increase of immersion time. The corrosion morphologies of the alloys were general corrosion for Mg–0.25Y and pitting corrosion for Mg–8Y and Mg–15Y, respectively. The main solid corrosion products were Mg(OH)₂ and Mg₂(OH)₃C1.4H₂O.     

泡沫SiC/Cu双连续相复合材料的盐雾腐蚀行为

用5.0 mass%的NaCl水溶液对泡沫SiC/Cu双连续相复合材料和对应的基体材料纯铜进行盐雾腐蚀实验.采用腐蚀失重法、扫描电子显微镜和X射线衍射仪对比研究这两种材料的腐蚀行为.结果表明:两种材料的腐蚀产物成分相同,为"铜绿"Cu2Cl(OH)3(碱式氯化铜),下层为Cu2O保护层;在NaCl水溶液中,该复合材料比纯铜材料的腐蚀敏感性大,主要是因为在含氧的Cl-水溶液中该复合材料的结构特性致使泡沫筋微孔中和两相界面处的Cu严重腐蚀.     

Study of initial stages of Al-Mg alloy corrosion in water, chloride and Cu(II) environment by a scanning Kelvin probe

Corrosion product layers formed during initial corrosion stages on Al-Mg alloy in water, 3.5% NaCl solution and 3.5% NaCl containing 50 ppm Cu(II) have been studied by scanning Kelvin probe (SKP) and X-ray photoelectron spectroscopy (XPS). The SKP spatio-temporal images reconstructed the solution-air boundary on corroded samples. The SKP sensitivity to detect the corrosion products layer on Al-Mg alloy was demonstrated to be in subnanometer scale. The Volta potential response on pre-corroded surfaces depended upon the immersion time (oxide layer thickness) and a kind of the solution used (oxide layer conductivity). The Volta potentials measured on the surfaces corroded in pure water were higher than those on the surfaces exposed to 3.5% NaCl or 3.5% NaCl + 50 ppm Cu(II) solutions. This difference has been explained in terms of higher conductivity of the corrosion product layers developed in the ion-containing media.     

Corrosion inhibition of copper in chloride media by 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methylpyrazolyl)pentane

The efficiency of 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methyl-pyrazolyl)pentane (BDTCPP) as copper corrosion inhibitor in 3.5% NaCl solutions was studied by electrochemical polarization methods (Tafel extrapolation and polarization resistance method), electrochemical impedance spectroscopy and immersion assays. Results obtained in this study reveal that BDTCPP is a good inhibitor and the potentiodynamic polarization studies clearly show that BDTCPP is a mixed-type inhibitor for copper in chloride solutions. It decreases the anodic reaction rate more strongly than the cathodic reaction rate and it renders the open circuit potential of copper more positive in 3.5% NaCl solutions. The UV analysis of the protective layer of BDTCPP after corrosion experiments shows that the inhibitor prevents copper corrosion by physisorption on the metal surface, followed by chemisorption of a protective Cu(II)-complex. This Cu(II) is generated by oxidation of the Cu(I) ion formed at the beginning of the corrosion process in the aerated solution of NaCl.     

Influence of Cu and Sn content in the corrosion of AISI 304 and 316 stainless steels in H2SO4

This paper addresses the influence of Cu and Sn addition on the corrosion resistance of AISI 304 and 316 stainless steels in 30 wt% H₂SO₄ at 25 and 50 °C. The corrosion process was evaluated by gravimetric tests, DC measurements and electrochemical impedance spectroscopy (EIS). The corrosion products were analysed by SEM, X-ray mapping and XPS before and after accelerated tests. The behaviour of both AISI 304 and 316 stainless steels in sulphuric acid solution was greatly improved by increasing Cu concentration and the synergic effect of Cu and Sn. Addition of Sn increased corrosion resistance, but less than addition of copper.     

3%NaCl溶液中铜的表面膜及BTA膜的光电化学研究

３％ＮａＣｌ溶液中铜的表面膜及ＢＴＡ膜的光电化学研究任聚杰，杨迈之，童汝亭，蔡生民（河北医学院石家庄０５００１７）（北京大学北京１００８７１）（河北师范大学石家庄０５００１６）１引言人们已经注意到Ｃｌ－对Ｃｕ有腐蚀作用［１，２］，关于ＢＴＡ对Ｃｕ的缓...     

Potent inhibition of copper corrosion in neutral chloride media by novel non-toxic thiadiazole derivatives

Inhibiting effect of two novel non-toxic thiadiazole derivatives on copper were investigated in 3.5% NaCl solution using weight loss and electrochemical measurements. Presence of inhibitors and increase of concentration greatly decrease corrosion rate, parameters determined from polarization curves and EIS plots show that inhibitors decrease both cathodic and anodic current densities, suppressing charge transfer process by adsorption on copper surface. Thermodynamic calculation indicates chemisorption obeys Langmuir isotherm. Surface layers were characterized by SEM coupled with EDX. Raman micro-spectroscopy reveals that inhibitor molecules suppress copper corrosion via formation of thiadiazole–Cu complex. Relationships between inhibition efficiency and molecular orbital were also evaluated.     

不同Mn含量Cu-Mn合金熔覆层的腐蚀特性（英文）

为研究不同Mn含量Cu-Mn合金熔覆层的腐蚀特性和防污性能，利用激光熔覆技术制备了成分均匀、稀释率低的Cu-Mn合金熔覆层。采用电化学测试、盐雾腐蚀实验、腐蚀形貌观察及铜离子释放试验对3种不同Mn含量的Cu-Mn合金熔覆层在3.5%（质量分数）NaCl溶液中的腐蚀特性进行研究，重点研究了Mn对腐蚀产物和铜离子释放率的影响。结果表明：在电化学测试中，随着Mn含量增多，熔覆层的耐腐蚀性降低。盐雾腐蚀实验中，随着Mn含量的增多，Cu-Mn合金熔覆层腐蚀程度加深，平均质量损失增大。对电解腐蚀后的熔覆层样品进行腐蚀形貌观察，Mn含量高的Cu-Mn合金样品生成的腐蚀产物较低Mn含量的样品更疏松，裂纹孔洞数量多，腐蚀产物更易剥落。铜离子释放试验中，3种Mn含量合金熔覆层样品都可以抑制海洋生物生长，且Mn含量越高，铜离子渗出率越大，在防污材料方面有良好的应用前景。     

Pitting corrosion behaviour of austenitic stainless steels with Cu and Sn additions

The influence of Cu and Sn on the pitting corrosion resistance of AISI 304 and 316 stainless steels in chloride-containing media has been investigated. The corrosion behaviour was evaluated by cyclic polarization, potentiostatic CPT measurements and electrochemical impedance spectroscopy in 3.5 wt% NaCl. The corrosion resistance was also studied in FeCl₃ under Standard ASTM G-48. According to the results, Cu addition favours pit nucleation but inhibits its growth, whereas Sn exerts the opposite effect, favouring pit growth and inhibiting its nucleation. Studies by SEM, X-ray mapping and EDS analysis showed Cu-, Cl- and O-rich corrosion products that reduce the extent of corrosion damage.     

Effects of copper on the corrosion properties of low-alloy steel in an acid-chloride environment

The influence of Cu addition on the corrosion resistance of low-alloy steel in an acid-chloride solution was investigated by electrochemical methods, such as potentiodynamic polarization tests and an electrochemical impedance spectroscopy (EIS). The XPS analysis of the corroded surfaces indicated the formation of protective Cu₂O and Cu(OH)₂ layers on the surface. The formation of Cu products on the surface reduced the uniform corrosion rate of the steel, but promoted localized corrosion due to the galvanic interaction between the covered areas of copper oxide/hydroxide and the uncovered areas on the surface of steel.     

Corrosion behaviour of Cu–2Ti and Cu–2Zr (wt%) alloys in neutral aerated sodium chloride solution

The corrosion behaviour of Cu–2Ti and Cu–2Zr (wt%) alloys has been assessed by open-circuit potential and electrochemical impedance spectroscopy measurements carried out in 3.5 wt% NaCl solution, at approximately neutral pH, without stirring and in contact with the air. For comparison, the electrochemical tests have also been carried out on unalloyed Cu. Electrochemical impedance results showed that Ti and Zr alloying additions significantly increased the corrosion resistance of copper, the best behaviour being observed for the Cu–2Zr alloy. This improvement may be ascribed to the formation of Ti- or Zr-enriched passive layer, which exhibits higher protective effectiveness compared with that of unalloyed Cu.     

Effect of Ti content on corrosion behavior of Cu-Ti alloys in 3.5% NaCl solution

The corrosion behavior of the Cu-Ti alloys with different Ti contents in 3.5% (mass fraction) NaCl solution was investigated using electrochemical measurements, immersion tests, mass loss measurements and SEM observation. The results show that Ti dissolved in the Cu matrix changes the corrosion process of the alloys. Pure Cu sample exhibits a typical active–passive– transpassive corrosion behavior. The anodic polarization current densities of the Cu-Ti alloys steadily increase with increasing applied potential, indicating that active dissolution of copper proceeds due to the potential difference in the galvanic coupling of Cu and Ti. The increase of Ti content decreases the corrosion resistance of the Cu-Ti alloys.     

Initial atmospheric corrosion of Zinc sprayed with NaCl

1　INTRODUCTIONAsamainacceleratorofatmosphericcorrosionofmetalsinmarineenvironments ,sodiumchloride ,Na Cl,canabsorbwatervaporfromhumidairtoformthinwaterfilmonthemetalsurface .Theroleofthiswaterlayeristoprovideamediumformobilizationofions.NaCldissolvedinthelayeralsoconsiderablyraisestheconductivityoftheelectrolyte .Thiswillgreatlyincreasetheelectrochemicalcorrosionandaf fectthecompositionofthecorrosionproducts .ItisthereforeofgreatinteresttostudytheeffectofNaClontheatmosphericcorrosiono…     

热处理对轧制态Mg5Gd合金腐蚀行为的影响

通过浸泡试验、电化学测试、扫描电化学显微镜和腐蚀形貌分析等手段研究热处理工艺对轧制态Mg5Gd合金在3.5 wt.％NaCl饱和Mg(OH)2溶液中腐蚀行为的影响及机理,以期达到提高镁合金耐蚀性的目的.结果表明:固溶处理能显著降低Mg5Gd合金的腐蚀速率,并且使其腐蚀变均匀,腐蚀坑变浅,这主要归因于固溶处理可以熔解镁基...