共查询到20条相似文献,搜索用时 125 毫秒
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在简要介绍我所现有的低温共烧陶瓷(LTCC)型陶瓷多芯片组件(MCM—C)主要组装工艺技术和常用封装型式的基础上,重点进行MCM-C组装封装基本工艺流程的设计研究。 相似文献
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虽然器件纯化技术已有所改进,但是,目前仍然广泛地采用气密封装技术,即使封装技术仍然落后于其它器件制造工艺技术,但是工艺线的最终目标是实现自动化生产。 相似文献
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倒装芯片组装集成电路的结构与常规封装不同,导致现行开封技术不完全适用于倒装芯片组装集成电路。对不同封装形式的倒装芯片组装集成电路结构分析,找出目前制约开封技术的关键因素。以陶瓷及塑封封装倒装芯片组装集成电路为例,运用热风枪、高温预处理、机械应力及化学腐蚀等方法,提出了一套适用性强、效率高的综合性倒装芯片组装集成电路开封工艺技术,并通过实例进行验证和总结。通过运用该技术可以有效解决倒装芯片组装集成电路的开封问题,为后续标准的修订及破坏性物理分析提供依据和帮助。 相似文献
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通信、汽车、医疗、工业、军事和宇航应用对电子系统高性能、高密度,高可靠的要求正在并继续对电子封装工程师提出挑战。这种挑战使得多芯片模块(MCM)成为必然的选择。这是由于多芯片模块不仅可以提高系统的封装密度,而且可以成数量级地提高系统的可靠性及其电气、散热和密封性能。
多芯片模块现在采用的有机层压板(MCM-L)、陶瓷(MCM-C)和沉积薄膜(MCM-D)的封装技术。其中尤以陶瓷封装技术—ITCC技术相对于其它封装技术显示出更巨大的魅力。它的优异的高频性能,散热性能和密封性能、可靠性和经济性使其成为无线通信、汽车电子、医疗电子和军事宇航应用的首选封装技术。展现了美好的技术和市场前景。
本文介绍了LTCC技术的现状及其成为陶瓷型多芯片模块主导封装技术的令人振奋的新发展。描述了工业界对其的接收和认可。勾画了该技术巨大的市场潜力。 相似文献
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文章通过对单器件的分立IGBT的封装结构进行分析,针对其结构特点和封装技术要求,特别是封装关键工艺芯片切割的影响,对装片、焊接方面进行工艺研究。并通过试验分析解决实际生产所出现的技术问题,由此形成一套适应于大批量封装生产的IGBT封装工艺技术,成功地应用于分立IGBT器件的批量生产,保证了产品的可靠性,取得了很好的生产效益。 相似文献
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提出了一种新型的MCM-C/D微波基板研制方法,克服了低温LTCC基板微带线耐焊性差及附着力差的缺点。研究了MCM-C/D基板的膜层结构特征及制作过程的工艺控制方法,并给出相应的试验结果,这对于微波电路基板的设计和应用有一定的参考价值。 相似文献
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M. Fayolle G. Passemard O. Louveau F. Fusalba J. Cluzel 《Microelectronic Engineering》2003,70(2-4):255-266
This paper presents a review of interconnect challenges for sub 65 nm node. From this generation, porous ultra low K (ULK) dielectric materials (dielectric constant k<2.1) are required. Their porosity makes integration very difficult, due to the mechanical weakness and process interaction issues (especially during stripping, CVD metal barrier deposition…). To overcome these process incompatibilities and keep the ‘effective dielectric constant’ low, dual damascene architecture becomes more and more complex and requires additional steps (porosity sealing treatment, degas steps, supercritical CO2 clean, low k dielectric barrier, self aligned barrier…). Possible contamination trapped in the porosity (moisture, metallic residues…), and lower thermo-mechanical properties of ULK will probably impede reliability. Copper resistivity increase with dimension shrinkage will also be an extra issue. 相似文献
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James Keating 《Microelectronics Reliability》1999,39(9):1399
Rigid flex circuits have historically been used in military and high-end performance electronic packaging to improve reliability, reduce weight and save space. This type of interconnect offers higher reliability and a tighter form factor when compared to more conventional interconnect techniques. Improvements in printed circuit fabrication processes and laminate materials have made possible unique opportunities for high density rigid flex circuitry. Recently MCM-L or laminate based multi chip modules have been gaining in popularity as a lower cost packaging alternative to traditional MCM-C or ceramic substrate based multi chip modules. This paper describes the steps taken to redesign existing modules from MCM-C technology to MCM-L(F). Several actual products that have been redesigned from ceramic substrate technology to laminate based packaging using rigid flex as the enabling technology are shown. Data is presented on thermal dissipation, mechanical reliability, electrical performance, and thermal reliability of the laminate substrate as well as assembly information. 相似文献
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Plasma display panels use gas plasma to produce light, with a technique very similar to that used for fluorescent tubes. This is currently the only flat panel technology available for very large flat-panel televisions. A newly developed plasma display panel utilizes a composition of glass, metal and frit glass sealing material, in addition to functional thin and thick film glass-powder-based laminate composites. This paper focuses on this new plasma display technology and discusses its structure and thermal reliability characteristics and challenges. 相似文献
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可伐合金气密封接的预氧化 总被引:3,自引:1,他引:3
可伐合金和硅硼硬玻璃是通过可伐合金表面的氧化物与玻璃互溶而紧密结合在一起的,所以可伐合金的预氧化是金属外壳制造的一个非常重要的工艺环节,是直接影响气密封接的一个重要因素。为实现气密封接,可伐合金预氧化需要得到的氧化物应是Fe_3O_4和FeO,而不希望得到Fe_2O_3。同时,氧化膜的厚度要控制在一定的范围内;氧化膜过薄则氧化物完全溶于玻璃,造成玻璃与金属基体表面的直接封接,使封接强度下降;氧化膜过厚则造成金属表面氧化物较粗糙疏松,封接件容易漏气。为达到上述两个目的,可以从可伐合金氧化的热力学和动力学出发,通过控制氧化气氛,氧化温度和时间来实现。 相似文献
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Residual gas analysis is a well-known technique used in the semi-conductor industry. This paper presents the RGA as an effective method to monitor wafer out-gassing during the degas process prior to barrier/copper seed deposition. The technique is easy to use, repeatable and very sensitive to the hydrophobic or hydrophilic nature of the surfaces. Moreover, it has been demonstrated that RGA is the technique of choice to evaluate the pore sealing efficiency of ultra low-k dielectric in high volume manufacturing environment. 相似文献