低电压Σ-Δ调制器关键技术及设计实例

介绍了低电压开关电容Σ-Δ调制器的实现难点及解决方案,并设计了一种1 V工作电压的Σ-Δ调制器.在0.18 μm CMOS工艺下,该Σ-Δ调制器采样频率为6.25 MHz,过采样比为156,信号带宽为20 kHz;在输入信号为5.149 kHz时,仿真得到Σ-Δ调制器的峰值信号噪声失真比达到102 dB,功耗约为5 mW.     

过采样Σ—Δ A／D转换器

对近采样Σ－ΔＡ／Ｄ转换器作了全面的描述。介绍了Σ－ΔＡ／Ｄ转换器的工作原理，着重推导了转换器中调制器阶数、过采样比和精度的关系，指出了调制器稳定工作的条件。最后，以１８位Σ－ΔＡ／Ｄ转换器稳定工作的条件。最后，以１８位Σ－ΔＡ／Ｄ转换器的调制器设计为例，详细阐述了Σ－ΔＡ／Ｄ转换器的设计过程，并给出了实验结果。     

一种流水线型高速过采样Σ—Δ调制器

提出了一种采用流水线采样输入的开关电容型Σ－Δ调制器的实现方法，该方法充分利用了时钟的每一时刻。用此方法设计的Σ－Δ调制器采样速率可提高３０％。实验表明，这种方法是完全可取的。     

基于Δ-Σ调制的PSM调制器控制方法的探讨

本文简要介绍了脉冲阶梯调制器（Pulse-Step Modulator,PSM）在短波发射机上的作用,及其输出信号的在时域和频域的基本特点。Δ-Σ是delta-Sigma的简写形式,在数字信号处理领域,利用上采样滤波和Δ-Σ调制技术,能够使一个低动态范围的量化器输出高动态范围的信号。PSM调制器实际上也是一个低动态范围的大功率数模转换器。本文讨论了Δ-Σ调制技术用于PSM调制器控制中的线性模型和性能特点。     

一种0.18m单层多晶硅CMOS音频-调制器

设计了一种应用于18位高精度音频模数转换器(ADC)的三阶Σ-Δ调制器。调制器采用2-1级联结构,优化积分器的增益来提高调制器的动态范围。采用栅源自举技术设计输入信号采样开关,有效提高了采样电路的线性度。芯片采用中芯国际0.18μm混合信号CMOS工艺,在单层多晶硅条件的限制下,采用MIM电容,实现了高精度的Σ-Δ调制器电路。测试结果表明,在22.05kHz带宽内,信噪失真比(SNDR)和动态范围(DR)分别达到90dB和94dB。     

一种低电压3阶4位前馈Σ-Δ调制器

介绍了一种应用于无线通信领域的低电压、带有前馈结构的3阶4位单环Σ-Δ调制器。为了降低Σ-Δ调制器的功耗,跨导放大器采用了带宽展宽技术。采用TSMC 0.13 μm CMOS工艺对电路进行仿真,仿真结果显示,当工作电压为1.2 V、采样频率为64 MHz、过采样比为16、信号带宽为2 MHz时,电路的SNDR达81 dB,功耗仅为7.78 mW。     

一种用于带通Σ-Δ调制器的25MHz低功耗开关电容谐振器

介绍了一种运用于带通Σ-Δ调制器的谐振频率为25MHz的低功耗开关电容DD谐振器电路.电路采用了运算放大器共享技术和双采样技术,同时对单元电路进行优化,达到功耗最小化.该谐振器电路采用SMIC 0.25μm混合信号CMOS工艺进行设计,整个电路模块面积仅为0.09mm2.测试结果表明,使用该谐振器电路的带通Σ-Δ调制器工作于100MHz采样频率时,对于信号带宽为1kHz的输入信号,调制器的输出在谐振频率处SFDR约为77dB.整个谐振器功耗为10.5mW.     

14-b400-ksps 2.5-mW连续时间Σ-Δ调制器

连续时间Σ-Δ调制器较之传统的开关电容Σ-Δ调制器具有更低的功耗、更小的面积,以及集成抗混叠滤波器等诸多优势。设计了一种应用于低中频GSM接收机的4阶单环单比特结构的连续时间Σ-Δ调制器。在调制器中,采用了开关电容D/A转换器,以降低时钟抖动对性能的影响。仿真结果显示,在1.8 V工作电压2、00 kHz信号带宽、0.18μm CMOS工艺条件下,采样频率21 MHz,动态范围(DR)超过90 dB,功耗不超过2.5 mW。     

Σ-Δ调制器在SIMULINK下的噪声模型

为了满足在行为级对Σ-Δ调制器进行完整仿真的需要,提出了在SIMULINK环境下Σ-Δ调制器的噪声模型,包括采样时钟抖动、开关热噪声(kT/C噪声)、运算放大器的有限增益、有限带宽、压摆及饱和电压等非理想因素。在给出具体噪声模型的基础上,构造出二阶Σ-Δ调制器模型。通过仿真,验证了噪声模型的正确性。     

Σ-Δ调制器的非理想特性行为级建模与仿真

分析了开关电容型(SC)Σ-Δ调制器的非理想特性,主要包括采样时钟抖动、开关热噪声(kT/C噪声)、运放增益等。在建立各自噪声模型的基础上,构造了一个二阶有色噪声和一个四阶白噪声Σ-Δ调制器模型;通过仿真结果的比较,在行为级上验证了噪声模型的正确性,所建电路更为实际地描述了Σ-Δ调制器的各项参数。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first