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1.
水基溶胶-凝胶法制备Ba0.5Sr0.5TiO3薄膜及其介电性能研究   总被引:8,自引:0,他引:8  
本文研究了一种以水为溶剂的Ba0.5Sr0.5TiO3(BST)液体源溶液,并用Sol-Gel技术制备出BST薄膜,实验中,对水基BST液体源浓缩凝胶进行了DTA/TGA分析,XRD谱分析显示,BST膜呈现纯钙钛矿相结构.从SEM电镜照片可以看到,BST薄膜厚度均匀一致,650℃热处理20min后,晶粒大小为200nm左右.性能测试结果表明,介电性能与膜厚有关,厚度为1250的BST薄膜具有较优良的介电性能,当测试频率为1kHz时,介电常数为330,介电损耗为0.043左右.  相似文献   

2.
交替中间热处理BST薄膜介电性能研究   总被引:1,自引:0,他引:1  
用溶胶凝胶(Sol-Gel)法制备了三种钛酸锶钡(Ba0.6Sr0.4TiO3, BST)薄膜:常规的四层薄膜, 在逐层制备过程中,对首层薄膜进行中间热处理(Preheat-treatment, PT)的四层薄膜及间隔或交替地对奇数层薄膜进行中间热处理(称为交替中间热处理(Alternate-preheat-treatment, APT))的八层薄膜. 用XPS研究薄膜表面成分化学态, 用SEM和AFM观察表面形貌及晶化, 并进行了介电性能测试. 结果表明, 常规薄膜介电性能差; 经PT, 薄膜裂纹和缩孔显著减少,形貌明显改善,表面非钙钛矿结构显著减少, 介电性能明显提高; 经APT, 薄膜形貌进一步改善,平均晶粒大小约30nm,非钙钛矿结构进一步减少, 介电损耗明显降低,介电稳定性和介电强度大幅度提高. APT为制备退火温度低及结构均匀致密的纳米晶BST薄膜提供了新方法, 可满足低频实用要求. 退火温度对薄膜厚度的影响也进行了讨论.  相似文献   

3.
采用改进的溶胶.凝胶(sol-gel)法在si衬底上制备了组分梯度Ba1-xSrxTiO3(x=0,0.1,0.2,0.3,0.4)(简称BST)薄膜。探讨了不同退火温度对组分梯度BST薄膜晶化的影响,应用X射线衍射(XRD)及原子力显微镜(AFM)分析了薄膜的微观结构。结果表明组分梯度薄膜的最佳制备工艺为600℃预烧5min,700℃退火1.5h,此时薄膜具有完整的钙钛矿相,薄膜表面平整、无裂纹、无孔洞。比较了单组分和组分梯度BST薄膜的微观结构。XRD测试结果显示,组分梯度BST薄膜的衍射峰峰位介于底层和硕层单组分BST薄膜之间,且衍射峰明显宽化;AFM测试结果表明,组分梯度BST薄膜的晶粒明显大于单组分BST薄膜,表面均方根粗糙度(RMS)也大于单组分BST薄膜,这可能是由于组分梯度薄膜较高的预烧温度促进晶粒生长造成的。  相似文献   

4.
用溶胶-凝胶法制备了(Pbx,Sr1-x)0.85Bi0.1TiO3薄膜,对其晶相结构、微观形貌和介电可调性进行了研究.结果表明,该薄膜以钙钛矿形式存在.快速热处理过程可分解得到高活性离子,直接形成比相应温度平衡状态析晶时更多的晶相量.这种晶相在一定条件下有分解和再结晶的趋势.随着Pb^2+离子增加和Sr^2+离子减少,钙钛矿相的四方相与立方相间的转变温度升高.薄膜处在铁电相和顺电相转变点附近时,可以获得较大的可调性.  相似文献   

5.
采用Sol-gel工艺在石英玻璃和硅衬底上成功地制备了纳米晶La1-xSrxFeO3(x=0~0.4)系列薄膜,薄膜为钙钛矿结构,平均粒度在30nm左右。XPS结果表明,随着Sr含量的增大薄膜表面吸附氧含量增大。  相似文献   

6.
张勤勇  蒋书文  李言荣 《材料导报》2006,20(11):115-118
采用射频溅射法在Si(111)基片上制备了(Ba,Sr)TiO3(BST)薄膜,并对制备的薄膜进行了快速退火热处理.采用X射线衍射和原子力显微镜分析了退火温度、退火时间和加热速度对BST薄膜晶化行为的影响.研究结果表明,BST薄膜的晶化行为强烈依赖于退火温度、退火时间和加热速度.BST薄膜的结晶度随退火温度的升高而提高.适当的热处理可降低BST薄膜的表面粗糙度,BST薄膜的表面粗糙度随退火温度的升高经历了一个先降低后增大的过程,但退火后BST薄膜的表面粗糙度都小于制备态薄膜的表面粗糙度.BST薄膜的晶粒尺寸随退火温度的升高经历了一个先增大后减小的过程.随退火时间的延长,BST薄膜的特征衍射峰越来越强,薄膜的晶化程度越来越高.随退火时问的延长,BST薄膜的晶粒尺寸和表面粗糙度也经历了一个先增大后减小的过程.BST薄膜的晶粒大小主要由退火温度决定.高的升温速率可获得较小的晶粒.  相似文献   

7.
采用sol-gel法,利用快速热处理工艺过程,保持烧结温度在最低温度(约500℃)以上,制备了多晶钙钛矿结构的PST(Pb0.4Sr0.6TiO3)薄膜.通过XRD、SEM、AFM等方法对晶相的形成与热处理条件之间的关系进行了测试.研究表明,利用溶胶-凝胶法制备PST薄膜的钙钛矿晶相形成过程及晶相含量受制备过程及晶相形成时离子的活性所控制.通过快速热处理方法,在凝胶分解过程中得到的高活性离子直接形成晶相,可以得到相应更多的晶体含量及在较低的温度下形成晶相.在600℃下RTP制备的PST薄膜的晶相含量比同温度下保温热处理薄膜增加约14%,利用RTP制备PST薄膜的晶相形成温度约在500℃,相应要降低约50℃.薄膜的表面形貌受制备热处理过程影响,快速热处理薄膜的表面保持形成时的形貌:非晶相薄膜以光洁表面出现,晶态膜以均匀分布山峰状的形貌出现.受气氛的浸蚀作用,长时间热处理后的薄膜表面出现了变化,在原形貌的基础上以细小颗粒状覆盖的表面出现.  相似文献   

8.
首先在低温下制备了粒径小于10nm的ZnO纳米晶,然后采用旋口法制备了ZnO纳米晶薄膜,XRD分析ZnO晶相是纤锌矿结构;SEN与AFM表明,纳米晶薄膜在300℃退火后薄膜的厚度明显地减小到130nm(未退火200nm),粒径明显增大,表面粗糙度减少到3.27nm(未退火4.89nm);紫外-可见吸收和透射比光谱表明,随着退火温度的增加,吸收边发生了红移,吸收肩更明显,薄膜具有高的透射率(75—85%),随着温度增加薄膜方阻增大,300℃以下退火方阻增加很小(小于8.5Ω/sq),400℃以上退火方阻大幅增加(大于21.1n/sq),假定存在最优退火温度点(300℃)。  相似文献   

9.
在低温下制备了粒径小于10nm的ZnO纳米晶,用旋涂法制备ZnO纳米晶薄膜,XRD分析ZnO晶相是纤锌矿结构;SEM与AFM表明,纳米晶薄膜在300%退火后薄膜的厚度明显减小到130nm,表面粗糙度降低到3.27nm,粒径明显增大;紫外-可见吸收和透射比光谱表明,随着退火温度的增加,吸收边发生了红移,吸收肩更明显,薄膜具有高的透射率(75—85%);薄膜方阻随温度增加而增大,300℃以下退火方阻增加很小(小于8.5Ω/sq),400℃以上退火方阻大幅增加(大于21.1Ω/sq),因此,ZnO纳米晶薄膜最优退火温度点为300℃。  相似文献   

10.
王群  董睿  陈立东 《无机材料学报》2004,19(5):1087-1092
混合价态的锰氧化物Pr1-xCaxMnO3薄膜是近年来国际上超导体以及巨磁电阻领域的研究热点之一.本文采用化学溶液沉积方法在Pt/Ti/SiO2/Si基底上制备出Pr1-xCaxMnO3薄膜,降低了材料成本;前驱体中不使用鳌和剂,简化了工艺.采用XRD、FT—IR、SEM、AFM、EPMA以及俄歇探针仪等方法对所制备的薄膜进行了表征.结果表明,实验中以较低的温度实现了PCMO钙钛矿结构的晶化;薄膜平整光滑致密,各组分分布均匀,C杂质含量处于很低的水平。  相似文献   

11.
B. Todorovi&#x    T. Joki&#x    Z. Rako   evi&#x    Z. Markovi&#x    B. Gakovi&#x    T. Nenadovi&#x 《Thin solid films》1997,300(1-2):272-277
This work reports on the effect of post-deposition rapid thermal annealing on the structural and electrical properties of deposited TiB2 thin films. The TiB2 thin films, thicknesses from 9 to 450 nm, were deposited by e-beam evaporation on high resistivity and thermally oxidized silicon wafers. The resistivity of as-deposited films varied from 1820 μΩ cm for the thinnest film to 267 μΩ cm for thicknesses greater than 100 nm. In the thickness range from 100 to 450 nm, the resistivity of TiB2 films has a constant value of 267 μΩ cm.

A rapid thermal annealing (RTA) technique has been used to reduce the resistivity of deposited films. During vacuum annealing at 7 × 10−3 Pa, the film resistivity decreases from 267 μΩ cm at 200 °C to 16 μΩ cm at 1200 °C. Heating cycles during RTA were a sequence of 10 s. According to scanning tunneling microscopy analysis, the decrease in resistivity may be attributed to a grain growth through polycrystalline recrystallization, as well as to an increase in film density.

The grain size and mean surface roughness of annealed films increase with annealing temperature. At the same time, the conductivity of the annealed samples increases linearly with grain size. The obtained results show that RTA technique has a great potential for low resistivity TiB2 formation.  相似文献   


12.
利用溶胶凝胶法在LaNiO3/SiO2/Si衬底上制备了0.7BiFeO3-0.3PbTiO3(BFPT7030)薄膜,研究了快速退火及常规退火两种不同的后续退火处理方式对薄膜铁电性能及漏电流性能的影响.XRD测试表明,经快速退火处理的BFPT7030薄膜结晶完好,呈现出单一的钙钛矿相.SEM测试结果显示,经快速退火处理的BFPT7030薄膜结晶充分,但经常规退火处理的BFPT7030薄膜表面致密性较好,且在升温速率为2℃/min时薄膜的晶粒更细小.经快速退火处理的BFPT7030薄膜的铁电性能较为优异,在升温速率为20℃/s时,其剩余极化Pr为22μC/cm2,矫顽场Ec为70 kV/cm,并具有较小的漏电流.XPS测试结果表明,经常规退火处理的BFPT7030薄膜其铁离子的价态波动较小.  相似文献   

13.
P.W. Kuo  W.T. Wu 《Vacuum》2009,84(5):633-637
Cu2O and two types of Cu2O-Ag-Cu2O (CAC) multilayered thin films were deposited on glass substrates using DC-magnetron sputtering. For CAC films, the mass thickness of Ag layer was controlled at 3 nm. After deposition, some of these films were annealed using a rapid thermal annealing (RTA) system at 650 °C, in order to create embedded Ag particles. AC films were used to study the clustering effect of Ag in Ar atmosphere, as well as for forming the 2nd type of CAC film by covering another Cu2O layer on the annealed AC structure. A UV-VIS-NIR photometer, a Hall measurement system, and a I-V measurement system were used to characterize the optical and electrical properties of these films with and without RTA. The results show that 2-dimensional Ag layer can transform into many individual particles due to its high surface tension at annealing temperature, no matter when the annealing was carried out. For CAC films, without annealing, the optical transmission and the resistivity are decreased with the inserted Ag layer. After annealing, both the transmission and resistivity are increased, possibly due to the clustering effect of Ag layer. Most importantly, it is found that the embedded Ag particles can increase the light absorption in the NIR-IR region, which can increase photo-induced current.  相似文献   

14.
Antimony-doped Tin oxide (ATO) films have been prepared by inkjet-printing method using ATO nanoparticle inks. The electrical and optical properties of the ATO films were investigated in order to understand the effects of rapid thermal annealing (RTA) temperatures. The decrease in the sheet resistance and resistivity of the inkjet-printed ATO films was observed as the annealing temperature increased. The film annealed at 700 degrees C showed the sheet resistance of 1.7 x 10(3) Omega/sq with the film thickness of 350 nm. The optical transmittance of the films remained constant regardless of their annealing temperatures. In order to further reduce the sheet resistance of the films as well as the annealing temperature, Ag-grid was printed in between two layers of inkjet-printed ATO. With 1.5 mm Ag line spacing, the Ag-grid embedded ATO film showed the sheet resistance of 25.6 Omega/sq after RTA at 300 degrees C.  相似文献   

15.
This work aimed to describe the sol-gel synthesis and preparation of a near-morphotropic phase boundary lead-magnesium-niobium titanate (PMNT) material system, and to investigate the influences of room-temperature-UV-irradiation and rapid thermal annealing (RTA) processes on the properties of its thin films. It was postulated that the use of UV-irradiation prior to thermal processing could play a role in the generation of a structural difference that would manifest itself via the formation of a higher film thickness, which was more pronounced at higher RTA temperatures The PMNT thin film system described here (particularly those annealed at higher temperatures) appeared to be potentially suitable for ultrahigh-value-capacitor applications; the unexposed film annealed at 750 °C exhibited the highest high k value (1425) with a strongly pronounced perovskite phase (97%).  相似文献   

16.
采用磁控溅射仪在高阻Si(100)衬底上沉积了[Fe(0.5nm)/Si(1.6nm)]120和[Fe(1nm)/Si(3.2nm)]60多层膜,并在Ar气气氛下进行了1000℃,10s的快速热退火。为了比较,也进行了880℃,30min的常规退火。采用X射线衍射仪、原子力显微镜、光谱仪和霍尔效应仪分析了样品的晶体结构、表面形貌、光吸收特性和电学性能。结果表明:Fe/Si多层膜法合成的样品均为β-FeSi2相且在(220)/(202)方向择优生长;经快速热退火合成的β-FeSi2薄膜光学带隙约为0.9 eV。[Fe(1nm)/Si(3.2nm)]60多层膜经快速热退火合成的β-FeSi2薄膜表面粗糙度最小,该薄膜样品为p型导电,载流子浓度为4.1×1017cm-3,迁移率为48cm2/V.s。  相似文献   

17.
采用氧化亚铜(Cu_2O)陶瓷靶,利用射频磁控溅射沉积法在氮气和氩气的混合气氛下制备了N掺杂Cu_2O(Cu_2O∶N)薄膜,并在N_2气氛下对薄膜进行了快速热退火处理,研究了N_2流量和退火温度对Cu_2O∶N薄膜的生长行为、物相结构、表面形貌及光电性能的影响。结果显示,在衬底温度300℃、N_2流量12sccm条件下生长的薄膜为纯相Cu_2O薄膜;在N_2气氛下对预沉积薄膜进行快速热退火处理不影响薄膜的物相结构,薄膜的结晶质量随退火温度(450℃)的升高而显著改善;快速热退火处理能改善薄膜的结晶质量和缺陷,降低光生载流子的散射,增强载流子的传输,预沉积Cu_2O∶N薄膜经400℃退火处理后展示出较好的电性能,薄膜的霍尔迁移率(μ)为27.8cm~2·V~(-1)·s~(-1)、电阻率(ρ)为2.47×10~3Ω·cm。研究表明低温溅射沉积和快速热退火处理能有效改善Cu_2O∶N薄膜的光电性能。  相似文献   

18.
Lead lanthanum zirconate titanate (PLZT) thin films were deposited on r-plane sapphire at low temperatures by RF triode magnetron sputtering using lead compensated hot-pressed targets. To obtain fully perovskite phase in the films, two types of post-deposition processing were investigated: rapid thermal annealing (RTA) and furnace annealing (FA). Dielectric and electro-optic properties of PLZT films were found to be strongly dependent on annealing conditions. The peak dielectric constant of the films were 1200 and 2800 with Curie temperatures of 110 degrees C and 190 degrees C after RTA and FA processing, respectively. The dielectric losses in the films were fairly low; tan deltas were less than 0.02 after RTA and less than 0.04 after FA processing. The films showed good optical transmission characteristics after annealing and an anomalously large effective quadratic electro-optic effect was observed in one furnace annealed film.  相似文献   

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