双固化聚氨酯丙烯酸酯的性能研究

将三种双固化聚氨酯丙烯酸酯低聚物与环氧丙烯酸酯组成不同的双固化体系,利用实时红外(FT-IR)的方法研究了不同固化顺序(先光固化后热固化和先热固化后光固化)对体系中-NCO反应基团和C=C双键转化率的影响,结果显示先光固化后热固化的固化顺序更有利于体系达到高转化率.通过测试不同体系固化后的硬度和柔韧性,证明后期的热固化能大幅度提高涂膜的硬度.     

紫外光固化丙烯酸酯聚硅氧烷防粘剂

以二端羟基二甲基聚硅氧烷和γ－甲基丙烯酰氧丙基三甲基硅烷为主要原料,合成制备了具有紫外光固化性能的丙烯酸酯聚硅氧烷防粘剂预聚体,以此为基础,配制成了具有较好性能的防粘剂,还对分子质量,稀释剂等因素树防粘性能的影响进行了分析。     

聚己内酯三元醇型双固化聚氨酯丙烯酸酯的合成及其固化膜性能研究

以聚己内酯三元醇、异佛尔酮二异氰酸酯和羟基丙烯酸酯为原料,合成了一种新型聚氨酯丙烯酸酯。该树脂含有C C双键和未封闭的—NCO基团,可同时进行光固化和热固化反应。研究了不同双键含量对体系成膜性能的影响。结果表明,随着双键含量的上升,体系光固化后的摆杆硬度变大,耐溶剂性、玻璃化转变温度、铅笔硬度提高,但是柔韧性下降。同时发现,后期的热固化对体系的硬度和热性能有补强的作用,但是会在一定程度上导致涂膜的柔韧性下降。     

UV-热双固化聚氨酯丙烯酸酯热反应性质的研究

研究了3种双固化型聚氨酯丙烯酸酯低聚物的固化过程,分别对3种低聚物及其与环氧丙烯酸酯组成的复合体系的热稳定性和反应性质进行了评价。利用实时傅里叶红外（RT—FTIR）方法测定了异氰酸酯基团和碳碳双键在不同条件下的反应过程。结果显示,这3种低聚物中,2396的异氰酸酯基团具有较高的反应活性,2510的碳碳双键具有较高的反应活性。     

紫外光固化丙烯酸酯硅氧烷防粘剂

以二端羟基二甲基聚硅氧烷和γ-甲基丙烯酰氧丙基三甲氧基硅烷为主要原料，合成制备了具有紫外光固化性能的丙烯酸酯聚硅烷防粘剂预聚体，以此为基础，配制成了具有较好性能的防粘剂，还对分子量，稀释剂等因素对防粘性能的影响进行了分析。     

紫外光固化环氧丙烯酸酯涂料的研制

研制了一种紫外光固化环氧丙烯酸酯涂料。研究了紫外光的辐射距离、辐射时间、偶联剂、二乙胺和活性稀释剂对涂膜固化速度、硬度和附着力等性能的影响，并用FTIR表征了环氧丙烯酸酯涂料固化前后的结构。     

活性稀释剂对聚氨酯丙烯酸酯紫外光固化的影响

分别以二官能度活性稀释剂三丙二醇二丙烯酸酯(TPGDA)和三官能度活性稀释剂三羟甲基丙烷三丙烯酸酯(TMPTA)作为聚氨酯丙烯酸酯紫外光固化体系的活性稀释剂,以2,4,6-三甲基苯甲酰基二苯基氧化膦(TPO)作为紫外光固化剂,研究了不同含量的稀释剂对紫外光固化体系的粘度、紫外光固化时间、紫外光固化膜表面粘力、拉伸性能和附着力的影响.结果表明:质量分数为30%的TPGDA可以大大降低体系的粘度,使涂膜皮革固化后的断裂伸长率达到最大,固化膜的附着能力也达到最佳;质量分数为15%的TMPTA可以缩短固化时间,提高涂膜皮革固化后的最大拉伸强度,又不使皮革过脆,固化膜的附着能力也达到最佳.     

紫外光固化聚硅氧烷防粘剂的新进展

本文介绍了紫外光固化的丙烯酸酯聚硅氧烷防粘剂和环氧聚硅氧烷防粘剂的新进展。     

双固化胶粘剂的制备及性能研究

以MDI(二苯基甲烷二异氰酸酯)、PPG(聚醚二元醇)为主要原料,制备了端—NCO基PU(聚氨酯)预聚体(热固化PU胶粘剂的A组分);然后以蓖麻油基聚酯多元醇、蓖麻油和PNA(聚己二酸新戊二醇酯)为固化剂,采用共混法得到混合多元醇(热固化PU胶粘剂的B组分);随后以Irgacure754和TPO-L为复合光引发剂、PUA(聚氨酯丙烯酸酯)为基体,制得光固化PUA胶粘剂(C组分);最后将上述A组分、B组分和C组分按比例共混后,得到双固化胶粘剂。研究结果表明:该双固化胶粘剂经UV辐照后,其初始剥离强度明显提高;双固化胶粘剂中C=C含量较低,而增加光引发剂掺量能提高该胶粘剂的光固化速率;当m(Irgacure754)∶m(TPO-L)=1∶1、w(复合光引发剂)=6%和w(PUA)=8%~10%(均相对于胶粘剂质量而言)时,双固化胶粘剂的剥离强度较大、综合性能较佳。     

Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask

The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using real‐time FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA cured film exhibited excellent thermal property, tensile strength and toughness, and chemical resistance. The decomposition temperature of PSUA was 402 °C. Thermal weight losses of pure PSUA cured film at 300 °C were only 5%. Elongation percentage of PSUA cured film was up to 59%. PSUA resin can be used for solder mask materials for printed circuit. Technology performances of photosensitive imaging flexible solder mask containing PSUA answers operating requirements of the solder masker for printing circuit board. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

有机硅聚氨酯丙烯酸酯预聚物的合成

以异佛尔酮二异氰酸酯（IPDI）、烷羟基硅油（SD9134）和丙烯酸β-羟乙酯（HEA）为原料,合成了一种UV固化有机硅聚氨酯丙烯酸酯预聚物（PSUA）。探讨了原料、催化剂用量、反应温度等因素对反应的影响。确定最佳反应条件为：以烷羟基硅油SD9134和IPDI为主要原料,DBTDL为催化剂,其加入量为0．05％～0．1％,反应前3步在20～40℃下反应,第4步反应温度不超过70℃,并通过IR和GPC表征了PSUA的结构。     

光敏有机硅聚氨酯丙烯酸酯预聚体性能的研究

考查了光引发剂、活性单体对光敏有机硅聚氨酯丙烯酸酯预聚体（PSUA）胶膜的耐水性、拉伸强度、伸长率、硬度、柔韧性和热稳定性的影响。结果表明，胶膜具有优良的耐水性，吸水性低于4％。含单官能度单体的PSUA胶膜的接触角大于含多官能度单体的，含有IBOA的体系接触角达103．6°；当选择引发效率高的裂解型光引发剂，用量为0.5％～1％时，胶膜具有较高的接触角。含多官能度单体胶膜的拉伸强度高于含单官能度单体的体系，但伸长率较小。含TMPTA体系的胶膜的硬度最大，为0．575。胶膜具有较好的柔韧性和热稳定性，其柔韧性达到1mm级，在300℃时失重为4.61％。     

Preparation and properties of novel high performance UV-curable epoxy acrylate/hyperbranched polysiloxane coatings

Novel high performance UV-curable coatings based on epoxy acrylate (EA) oligomer and hyperbranched polysiloxane (HPSi) were prepared, the effect of HPSi on the processing of uncured EA/HPSi system and integrated performance of cured resins is evaluated. Results show that a small addition of HPSi can greatly decrease the viscosity of EA oliogmer, while the viscosity almost does not reduces as the content of HPSi continuously increases owing to the interaction between HPSi and EA oligomer. The integrated performance of cured resins is closely related with the content of HPSi, those resins with suitable contents of HPSi have significantly improved toughness and stiffness as well as thermal and moisture resistance. The origin of all these changes in macro-performance are investigated and proved to be resulted from the variety in the chemical structure and crosslinking density induced by the addition of HPSi. These attractive features of EA/HPSi resins suggest that HPSi is an effective multi-functional diluent for UV-curable EA resin, and the method proposed herein is a new approach to develop high performance UV-curable coatings, solvent-free resins, etc., for cutting-edge industries.     

Preparation and characterization of UV/thermal dual-curable polyurethane acrylate adhesive for inertial confinement fusion experiment

A new type of polyurethane acrylate (APUE) oligomer, which contains both acrylic and epoxy group in its molecular structure, was synthesized. UV/thermal dual-curable adhesives were prepared using various contents of APUE oligomers, reactive diluent, photoinitiators and thermal-curing agent. The curing behaviors of the dual-curable adhesives were investigated using photo-DSC, on-line FT-IR spectroscopy, the determination of gel fraction and dynamic mechanical thermal analysis (DMTA). The reaction rate and extent of UV curing were studied and found to be strongly dependent on the concentration of C=C bonds in the APUE oligomers. The gel fraction was also evaluated as a function of C=C bond concentration, demonstrating that gel fraction increased with increasing C=C bond contents in the APUE oligomers. Moreover, when the dual-curable adhesive was thermally-cured, the gel fraction was largely improved, due to the thermal-curing agent initiating the unreacted epoxy groups to allow the formation of further crosslinking. The adhesion strength at −196 °C increased with increasing C=C bond content. The latent thermal-curing agent contributed to the enhancement of the adhesion strength.     

多巯基树脂固化聚氨酯丙烯酸树脂的研究

采用凝胶时间测试和实时红外光谱(RT-IR)研究了不同固化剂、稀释剂及促进剂用量对聚氨酯丙烯酸树脂(PUA)/稀释剂二缩三丙二醇二丙烯酸酯(TPGDA)/自制多巯基树脂固化剂(T-41)/促进剂1,8-二氮杂环[5,4,0]-十一烯(DBU)体系固化速度的影响及固化过程中转化率与反应时间的对应关系。结果表明,该体系中,TPG-DA用量存在一最佳值,使体系凝胶时间最短。凝胶时间随烯烃双键/巯基比例的增加而缩短,随促进剂用量的增加而缩短。通过改变各组分配比,体系的固化时间可控制在数分钟到数十分钟之间,实现PUA的快速固化。     

聚醚改性硅油的合成研究

以六水合氯铂酸为催化剂,烯丙基聚醚(F-6)与含氢硅油为原料,在无溶剂甲苯的条件下,加热反应生成聚醚改性硅油,通过测定硅氢键的残余量来计算反应的转化率。分别研究了催化剂量、温度、烯丙基聚醚(F-6)与含氢硅油的物质的量比对反应转化率的影响,得出了最优化的反应条件为:催化剂的质量分数为1.5×10-5,温度120℃,n(聚醚)∶n(硅油)=1.20∶1.00。实验表明,合成的聚醚改性硅油可以有效降低溶剂型聚氨酯树脂溶液(As)树脂的表面张力,使其由30.4mN/m降到27.0mN/m。     

UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Dual-curable adhesives were prepared using various epoxy acrylate oligomers, a reactive diluent, photoinitiators, a thermal-curing agent and a filler. The UV- and thermal-curing behaviors of the dual-curable adhesives were investigated using photo-differential scanning calorimetry (photo-DSC), Fourier transform infrared-attenuated total reflection (FTIR-ATR) spectroscopy, and the determination of the gel fraction, pendulum hardness and adhesion strength.The reaction rate and extent of UV curing were found to be strongly dependent on the concentration of CC bonds in the epoxy acrylate oligomers. The FTIR-ATR absorption peak areas representing the relative concentration of CC bonds in the epoxy acrylate oligomers and trifunctional monomer decreased with increase in UV dose because of photopolymerization. When the dual-curable adhesives were irradiated with UV light, the gel fraction increased with increase in CC bond contents in the epoxy acrylate oligomers. Also, after thermal curing, the gel fraction was highly enhanced due to the cross-linking reaction of the unreacted glycidyl groups in epoxy acrylate oligomers induced by the thermal-curing agent. This cross-linked structure of the dual-curable adhesives affects the pendulum hardness and adhesion strength.