Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003     

Interaction and properties of epoxy‐amine system modified with poly(phthalazinone ether nitrile ketone)

An epoxy based on the tetraglycidyl 4,4′‐diaminodiphenyl‐ methane (TGDDM)/bisphenol A type novolac(F‐51) cured with 4,4′‐diaminidiphenysulfone (DDS) has been modified with Poly (phthalazinone ether nitrile ketone)(PPENK). The interaction between the PPENK and epoxy resin have been investigated by differential scanning calorimetry (DSC), FT‐IR, and dynamic mechanical analysis (DMA). The thermal and mechanical properties were characterized by thermogravimetric analysis (TGA), thermomechanical analysis (TMA), flexural, impact strength, and the critical stress intensity factor tests. The results showed that a large number of physical crosslinks formed by intermolecular and intramolecular hydrogen bonding indeed existed in the TGDDM/F‐51/PPENK blends. These interactions gave good compatibility between PPENK and epoxy resin. So that any phase separation had not been detected by DMA and scanning electron microscope (SEM). Beyond that the interaction could also be a benefit to the thermal and mechanical properties. Compared with the neat epoxy resin, the critical stress intensity factor values reached the maximum at 10‐phr PPENK, as well as the impact strength. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42938.     

Epoxy toughening using low viscosity liquid diglycidyl ether of ethoxylated bisphenol‐A

Two new epoxy resins, diglycidyl ether of ethoxylated bisphenol‐A (BPA) with two and six oxyethylene units (DGEBAEO‐2 and DGEBAEO‐6) were synthesized and characterized. DGEBAEO‐6 was used to toughen the conventional epoxy resin diglycidyl ether of BPA (DGEBA). The blends of DGEBA with different amounts of DGEBAEO‐6 were cured by 4,4′‐diamino diphenylmethane (DDM), and their thermal and mechanical properties were examined. The DSC and DMA results presented that DGEBA/DGEBAEO‐6 blends exhibited a homogenous phase, and the glass transition temperature of the blends was inversely proportional to the content of DGEBAEO‐6. The impact strength of the cured blends was directly proportional to the content of DGEBAEO‐6, and reached five times higher than that of the neat DGEBA when 50 wt % DGEBAEO‐6 was used; the same impact strength was achieved for DDM‐cured DGEBAEO‐2. The viscosities of the blends decreased with increasing the DGEBAEO‐6 content, whereas the tensile and flexural strength and the thermal stabilities were not obviously affected. Scanning electron microscopic results confirmed that the plastic deformation inducing by the incorporated flexible oxyethylene units was responsible for the toughness improvement. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Influence of cyanate content on the morphology and properties of epoxy resins with phenolphthalein poly(ether ketone)

Phenolphthalein poly(ether ketone) (PEK‐C) was blended with the diglycidyl ether of bisphenol A epoxy resin and bisphenol A dicyanate ester. The effect of cyanate content on cure behaviors, thermal and mechanical properties of PEK‐C/epoxy/cyanate mixtures was investigated. As results, the increase of cyanate content slightly hindered the cure reaction of the mixtures. Fourier transform infrared results indicated that the curing reaction of the cured mixtures was complete. When the cyanate ester content increased, the flexural properties and T_g values were enhanced, and the initial thermal decomposition temperature was reduced. A significant improvement in fracture toughness was obtained when the cyanate group in the mixtures was excessive. The fracture toughness can be well explained by SEM observations. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.     

Curing of diglycidyl ether of bisphenol‐A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agent

BACKGROUND: Reactive thermoplastics have received increasing attention in the field of epoxy resin toughening. This paper presents the first report of using a novel polyaryletherketone bearing one pendant carboxyl group per repeat unit to cure the diglycidyl ether of bisphenol‐A epoxy resin (DGEBA). The curing reactions of DGEBA/PEK‐L mixtures of various molar ratios and with different catalysts were investigated by means of dynamic differential scanning calorimetry and Fourier transform infrared (FTIR) spectroscopy methods. RESULTS: FTIR results for the DGEBA/PEK‐L system before curing and after curing at 135 °C for different times demonstrated that the carboxyl groups of PEK‐L were indeed involved in the curing reaction to form a crosslinked network, as evidenced by the marked decreased peak intensities of the carboxyl group at 1705 cm^?1 and the epoxy group at 915 cm^?1 as well as the newly emerged strong absorptions of ester bonds at 1721 cm^?1 and hydroxyl groups at 3447 cm^?1. Curing kinetic analysis showed that the value of the activation energy (E_a) was the highest at the beginning of curing, followed by a decrease with increasing conversion (α), which was attributed to the autocatalytic effect of hydroxyls generated in the curing reaction. CONCLUSION: The pendant carboxyl groups in PEK‐L can react with epoxy groups of DGEBA during thermal curing, and covalently participate in the crosslinking network. PEK‐L is thus expected to significantly improve the fracture toughness of DGEBA epoxy resin. Copyright © 2009 Society of Chemical Industry     

Enhanced fracture toughness of epoxy resins with novel amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) triblock copolymers

Amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) (PES‐CTBN‐PES) triblock copolymers with controlled molecular weights of 15,000 (15K) or 20,000 (20K) g/mol were synthesized from amine‐terminated PES oligomer and commercial CTBN rubber (CTBN 1300x13). The copolymers were utilized to modify a diglycidyl ether of bisphenol A epoxy resin by varying the loading from 5 to 40 wt %. The epoxy resins were cured with 4,4′‐diaminodiphenylsulfone and subjected to tests for thermal properties, plane strain fracture toughness (K_IC), flexural properties, and solvent resistance measurements. The fracture surfaces were analyzed with SEM to elucidate the toughening mechanism. The properties of copolymer‐toughened epoxy resins were compared to those of samples modified by PES/CTBN blends, PES oligomer, or CTBN. The PES‐CTBN‐PES copolymer (20K) showed a K_IC of 2.33 MPa m^0.5 at 40 wt % loading while maintaining good flexural properties and chemical resistance. However, the epoxy resin modified with a CTBN/8K PES blend (2:1) exhibited lower K_IC (1.82 MPa m^0.5), lower flexural properties, and poorer thermal properties and solvent resistance compared to the 20K PES‐CTBN‐PES copolymer‐toughened samples. The high fracture toughness with the PES‐CTBN‐PES copolymer is believed to be due to the ductile fracture of the continuous PES‐rich phases, as well as the cavitation of the rubber‐rich phases. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1556–1565, 2002; DOI 10.1002/app.10390     

An investigation of epoxy/thermoplastic blends based on addition of a novel copoly(aryl ether nitrile) containing phthalazinone and biphenyl moieties

In this paper, a novel soluble copoly(aryl ether nitrile) containing phthalazinone and biphenyl moieties (PPBEN) was synthesized for the first time to improve the impact resistance of tetraglycidyl 4,4'‐diaminodiphenylmethane epoxy resin cured with 4,4‐diaminodiphenylsulfone. Then a series of blends were prepared via solution blending with different contents of PPBEN. The thermal and mechanical properties and the micromorphology of the cured blends were investigated by differential scanning calorimetry, dynamic mechanical analysis (DMA), parallel plate rheometry, mechanical property tests and SEM analysis, respectively. The results indicated that the incorporation of thermoplastic PPBEN delayed the epoxy curing reaction, and the crosslinking density of epoxies was also reduced. The no‐notch impact strength of the cured blend with 15% PPBEN was up to 16.7 kJ m^?2, higher by about 104% than that of pure epoxy resin without sacrificing the modulus due to a specific sea‐island structure. All the blends showed two‐phase morphology characterized by DMA and SEM. The size of the thermoplastic morphology was only 70?80 nm, much less than that of commonly used thermoplastics, due to the special segment structure of PPBEN. © 2015 Society of Chemical Industry     

Mechanical and morphological properties of epoxy resins modified by poly(phthalazinone ether sulfone ketone)

A series of blends have been prepared by adding a novel thermoplastic poly(phthalazinone ether sulfone ketone) (PPESK) in varying proportions to diglycidyl ether of bisphenol A epoxy resin (DGEBA) cured with p‐diaminodiphenylsulfone (DDS). All the blends showed two‐phase structures characterized by differential scanning calorimetry (DSC) and scanning electron microscopy (SEM). Addition of the PPESK resulted in great enhancement of glass transition temperatures (T_g) both in the epoxy‐rich phase and in the PPESK‐rich phase by reason of the special structure of PPESK. There was moderate increase in the fracture toughness as estimated by impact strength. Fracture mechanisms such as crack deflection and branches, ductile microcracks, ductile tearing of the thermoplastic, and local plastic deformation of the matrix were responsible for the increase in the fracture toughness of the blends. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Thermal and mechanical properties of PPO filled epoxy resins compatibilized by triallylisocyanurate

A series of blends has been prepared by adding a poly(phenylene oxide) (PPO), in varying proportions, to an epoxy resin cured with dicyandiamide. All the materials show two‐phase morphology when characterized by SEM and DMA. SEM and DMA indicate that partial mixing exists in all the blends especially with high PPO content. This implies that the epoxy oligomer or low crosslinking density epoxy exists in the PPO phase after curing. The tensile strength and modulus of these blends are nearly independent of the PPO content, while the fracture toughness (G_IC) is improved by PPO. However, the two‐phase particulate morphology is not uniform. In order to improve the uniformity and miscibility, triallylisocyanurate (TAIC) has been used as an in situ compatibilizer for the polymer blends of epoxy and PPO. SEM and DMA reveal improvement of miscibility and solvent resistance for this system. The fracture toughness of these TAIC‐modified systems are also improved by adding TAIC (0–20 phr). © 2000 Society of Chemical Industry     

Studies of the properties of a thermosetting epoxy modified with block copolymers

Poly[(n‐butyl acrylate)‐block‐poly(methyl methacrylate)‐co‐(glycidyl methacrylate)] (BMG) diblock copolymers incorporating an epoxy‐reactive functionality in one block have been synthesized and used as modifiers for the model epoxy resin E‐51 cured with 4,4′‐diaminodiphenyl methane (DDM). The properties and morphologies of the modified epoxy thermosets were investigated by dynamic mechanical analysis (DMA), impact testing and scanning electron microscopy (SEM). The results reveal that addition of the block copolymers leaves the glass transition temperatures of the blends relatively unchanged, with small decreases in the storage moduli at room temperature. The toughening effect is dependent on the chemical structures of the block copolymers and an increase in the impact strength by a factor of two was obtained by the addition of ‘relatively symmetrical’ block copolymers. Moreover, the impact test results are consistent with the morphologies of the fracture surfaces as evidenced by SEM. Copyright © 2005 Society of Chemical Industry     

Study on phenolphthalein poly(ether sulfone)‐modified cyanate ester resin and epoxy resin blends

In this work, the phenolphthalein poly(ether sulfone) (PES‐C)‐modified cyanate ester (CE) and epoxy (EP) blends were prepared. This work mainly discusses the curing behaviors, fracture toughness, dynamic mechanical properties, and thermal and mechanical properties of the blends. The Fourier transform infrared and differential scanning calorimetric analyses are used to confirm the curing behaviors, demonstrating that the main reaction pathways are not varied with the addition of PES‐C, but the reaction rate could be evidently accelerated. The fracture morphologies of the blends are observed by Scanning electron microscope (SEM) and the fracture causes of the failed surface are also analyzed. With the addition of PES‐C, the modified blends display higher fracture toughness (K_Ic) and impact strength when compared with neat CE. Domain sizes of the blends first increase then decrease with the addition of PES‐C. The results of dynamic mechanical analysis and thermogravimetric analysis show that the T_g, storage modulus, and thermal stability of the crosslink network slightly decreases with the addition of PES‐C. The mechanical strength of blends with the addition of PES‐C is far better than that of the blends without PES‐C both at ambient temperature and elevated temperature. POLYM. ENG. SCI., 55:2591–2602, 2015. © 2015 Society of Plastics Engineers     

Toughening of an epoxy resin with hydroxy‐terminated poly(arylene ether nitrile) with pendent tertiary butyl groups

Hydroxy‐terminated poly(arylene ether nitrile) oligomers with pendent tert‐butyl groups (PENTOH) were synthesized by the nucleophilic aromatic substitution reaction of 2,6‐dichlorobenzonitrile with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone medium with anhydrous potassium carbonate as a catalyst at 200°C in a nitrogen atmosphere. The PENTOH oligomers were blended with diglycidyl ether of bisphenol A epoxy resin and cured with 4,4′‐diaminodiphenyl sulfone. The curing reaction was monitored with infrared spectroscopy and differential scanning calorimetry. The morphology, fracture toughness, and thermomechanical properties of the blends were investigated. The scanning electron micrographs revealed a two‐phase morphology with a particulate structure of the PENTOH phase dispersed in the epoxy matrix, except for the epoxy resin modified with PENTOH with a number‐average molecular weight of approximately 4000. The storage modulus of the blends was higher than that of the neat epoxy resin. The crosslink density calculated from the storage modulus in the rubbery plateau region decreased with an increase in PENTOH in the blends. The fracture toughness increased more than twofold with the addition of PENTOH oligomers. The tensile strength of the blends increased marginally, whereas the flexural strength decreased marginally. The dispersed PENTOH initiated several toughening mechanisms, which improved the fracture toughness of the blends. The thermal stability of the epoxy resin was not affected by the addition of PENTOH to the epoxy resin. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Synthesis and characterization of bis(4‐cyanato 3,5‐dimethylphenyl) naphthyl methane/epoxy/glass fiber composites

Bis(4‐cyanato 3,5‐dimethylphenyl) naphthylmethane was prepared by treating CNBr with bis(4‐hydroxy 3,5‐dimethylphenyl) naphthylmethane in the presence of triethylamine at −5 to 5°C. The dicyanate was characterized by FT‐IR and NMR techniques. The prepared dicyanate was blended with commercial epoxy resin in different ratios and cured at 120°C for 1 hr, 180°C for 1 hr, and post cured at 220°C for 1 hr using diamino diphenyl methane (DDM) as curing agent. Castings of neat resin and blends were prepared and characterized by FT‐IR technique. The morphology of the blends was evaluated by SEM analysis. The composite laminates were also fabricated from the same composition using glass fiber. The mechanical properties like tensile strength, flexural strength, and fracture toughness were measured as per ASTMD 3039, D 790, and D 5528, respectively. The tensile strength increased with increase in cyanate content (3, 6, and 9%) from 322 to 355 MPa. The fracture toughness values also increased from 0.7671 kJ/m² for neat epoxy resin to 0.8615 kJ/m² for 9% cyanate ester epoxy modified system. The thermal properties were also studied. The 10% weight loss temperature of pure epoxy is 358°C and it increased to 398°C with incorporation of cyanate ester resin. The incorporation of cyanate ester up to 9% loading level does not affect the T_g to a very great extent. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

Isothermal curing by dynamic mechanical analysis of three epoxy resin systems: Gelation and vitrification

Times to gelation (t_gel) and times to vitrification (t_vit) during isothermal curing for the epoxy systems diglycidyl ether of bisphenol A (DGEBA)/1,3‐bisaminomethylcyclohexane (1,3‐BAC), tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM)/4‐4′‐diaminodiphenylsulfone (DDS), and TGDDM/epoxy novolac (EPN)/DDS were measured at different curing temperatures. This article reports on a method to determine t_gel and t_vit by dynamic mechanical analysis (DMA). Gelation was determined at the onset of the storage modulus or by the peak of the loss factor. Vitrification was defined as the curve of the storage modulus as the curve reached a constant level (endset) in DMA tests. The experimental values obtained for t_gel and t_vit were compared with values obtained by other experimental methods and with theoretical values (t_gel's) or indirect determinations (t_vit's). From kinetic analysis by differential scanning calorimetry, conversions corresponding to gelation were obtained for the three systems; this yielded a constant value for each system that was higher than theoretical value. Values of the apparent activation energies of the DGEBA/1,3‐BAC, TGDDM/DDS, and TGDDM/EPN/DDS epoxy systems were obtained from plots of t_gel's against reciprocal temperatures. They were 53.2, 58.2, and 46.5 kJ/mol, respectively. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 78–85, 2002     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Epoxy‐tert‐butyl poly(cyanoarylene ether) blends: Phase morphology,fracture toughness,and mechanical properties

Tert‐butyl hydroquinone–based poly(cyanoarylene ether) (PENT) was synthesized by the nucleophilic aromatic substitution reaction of 2,6‐dichlorobenzonitrile with tert‐butyl hydroquinone using N‐methyl‐2‐pyrrolidone (NMP) as solvent in the presence of anhydrous potassium carbonate in a nitrogen atmosphere at 200°C. PENT‐toughened diglycidyl ether of bisphenol A epoxy resin (DGEBA) was developed using 4,4′‐diaminodiphenyl sulfone (DDS) as the curing agent. Scanning electron micrographs revealed that all blends had a two‐phase morphology. The morphology changed from dispersed PENT to a cocontinuous structure with an increase in PENT content in the blends from 5 to 15 phr. The viscoelastic properties of the blends were investigated using dynamic mechanical thermal analysis. The storage modulus of the blends was less than that of the unmodified resin, whereas the loss modulus of the blends was higher than that of the neat epoxy. The tensile strength of the blends improved slightly, whereas flexural strength remained the same as that of the unmodified resin. Fracture toughness was found to increase with an increase in PENT content in the blends. Toughening mechanisms like local plastic deformation of the matrix, crack path deflection, crack pinning, ductile tearing of thermoplastic, and particle bridging were evident from the scanning electron micrographs of failed specimens from the fracture toughness measurements. The thermal stability of the blends were comparable to that of the neat resin. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3536–3544, 2006     

Morphologies and mechanical properties of polyethersulfone modified epoxy blends through multifunctional epoxy composition

Thermoplastic polyethersulfone (PES) modified multifunctional tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) and triglycidyl para‐aminophenol (TGAP) epoxy prepolymers cured with 4,4′‐diaminodiphenylsulfone (44DDS) were prepared using a continuous reactor method and their reaction‐induced phase separated morphologies and mechanical properties were measured and correlated with chemical compositions. ¹H nuclear magnetic resonance (¹H NMR) and near‐infrared spectroscopy (NIR) were used to quantify the chemical network formation. Atomic force microscopy (AFM) with nanomechanical mapping was employed to resolve the nanoscale phase‐separated morphologies. The extent of phase separation in cured networks and resultant domain sizes were determined to be controllable depending upon the multifunctional epoxy compositions. The results obtained from mechanical studies further indicated that tensile modulus was not largely affected by multifunctional epoxy compositions while fracture toughness increased with increase of TGAP content. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44775.     

Preparation and properties of bio‐based epoxy montomorillonite nanocomposites derived from polyglycerol polyglycidyl ether and ε‐polylysine

Glycerol polyglycidyl ether (GPE) and polyglycerol polyglycidyl ether (PGPE) were cured with ε‐poly(L ‐lysine) (PL) using epoxy/amine ratios of 1 : 1 and 2 : 1 to create bio‐based epoxy cross‐linked resins. When PGPE was used as an epoxy resin and the epoxy/amine ratio was 1 : 1, the cured neat resin showed the greatest glass transition temperature (T_g), as measured by differential scanning calorimetry. Next, the mixture of PGPE, PL, and montomorillonite (MMT) at an epoxy/amine ratio of 1 : 1 in water was dried and cured finally at 110°C to create PGPE‐PL/MMT composites. The X‐ray diffraction and transmission electron microscopy measurements revealed that the composites with MMT content 7–15 wt % were exfoliated nanocomposites and the composite with MMT content 20 wt % was an intercalated nanocomposite. The T_g and storage modulus at 50–100°C for the PGPE‐PL/MMT composites measured by DMA increased with increasing MMT content until 15 wt % and decreased at 20 wt %. The tensile strength and modulus of the PGPE‐PL/MMT composites (MMT content 15 wt %: 42 and 5300 MPa) were much greater than those of the cured PGPE‐PL resin (4 and 6 MPa). Aerobic biodegradability of the PGPE‐PL in an aqueous medium was ～ 4% after 90 days, and the PGPE‐PL/MMT nanocomposites with MMT content 7–15 wt % showed lower biodegradability. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009