Ultra-low cost porous mullite ceramics with excellent dielectric properties and low thermal conductivity fabricated from kaolin for radome applications

Near-net-shape mullite ceramics with high porosity were prepared from ultra-low cost natural aluminosilicate mineral kaolin as raw material and polystyrene micro-sphere (PS) as pore-forming agent. Microstructure, flexural strength, thermal conductivity and dielectric properties of the ceramics were systematically researched. Results show that the porous mullite ceramics possess fibrous skeleton structure formed by a large quantity of interlocked mullite whiskers, which results in good mechanical properties and low-to-zero sintering shrinkage. Flexural strength of the porous mullite ceramics can be up to 41.01 ± 1.12 MPa, even if the porosity is as high as 62.44%. The dielectric constant and loss tangent of the porous mullite ceramics at room temperature are lower than 2.61 and 5.9 × 10⁻³, respectively. Besides, dielectric constant is very stable with the rising of temperature, and the dielectric loss can be consistently lower than 10⁻² when the temperature is not higher than 800 °C. In addition, thermal conductivity at room temperature is as low as 0.163 W/m/K when the porosity of mullite ceramics is 80.05%. The infiltration of SiO₂ aerogels (SiO₂ AGs) can further decrease the thermal conductivity to 0.075 W/m/K, while has just little effects on the dielectric properties. Excellent mechanical, thermal and dielectric properties show that the porous mullite ceramics have potential applications in radome fields. The porous mullite ceramics prepared from kaolin not only have low cost, but also can achieve near-net-shape.     

Processing and properties of silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity

Silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity were prepared by sintering nano-SiC powder-carbon black template compacts at 600–1200 °C for 2 h in air. The microstructure of the silica-bonded porous nano-SiC ceramics consisted of SiC core/silica shell particles, a silica bonding phase, and hierarchical (meso/macro) pores. The porosity and thermal conductivity of the silica-bonded porous nano-SiC ceramics can be controlled in the ranges of 8.5–70.2 % and 0.057–2.575 Wm⁻¹ K⁻¹, respectively, by adjusting both, the sintering temperature and template content. Silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity (0.057 Wm⁻¹ K⁻¹) were developed at a very low processing temperature (600 °C). The typical porosity, average pore size, compressive strength, and specific compressive strength of the porous nano-SiC ceramics were ∼70 %, 50 nm, 2.5 MPa, and 2.7 MPa·cm³/g, respectively. The silica-bonded porous nano-SiC ceramics were thermally stable up to 1000 °C in both air and argon atmospheres.     

Effects of cerium doping on the microstructure,mechanical properties,thermal conductivity,and dielectric properties of ZrP2O7 ceramics

A two-step method, combined with cold isostatic pressing, was used to prepare CeO₂-doped ZrP₂O₇ ceramics, and their microstructure, mechanical properties, thermal conductivities, and dielectric properties were determined. It was found that CeO₂ doping could increase the Zr–P and P–O bond lengths, which in turn decreased the thermal conductivity of the ZrP₂O₇ matrix. Doping with 12 wt% CeO₂ simultaneously reduced the sintering temperature and improved the mechanical properties of the ZrP₂O₇ ceramics, while retaining its low thermal conductivity and good dielectric properties. The maximum cold modulus of rupture of a sample at 1250 °C was 75.91 MPa, which met most conditions for use at room temperature. A COMSOL model was used to predict the thermal conductivity, based on the microstructure, with a relatively high degree of accuracy. The thermal conductivity of the CeO₂-doped samples was lower than 1.083 W/(m·K). The dielectric constant was in the range of 5.93–6.52 at 20–40 GHz, and the dielectric loss was less than 4 × 10^?3. The ZrP₂O₇-doped ceramics have potential for application in millimetre wave technology, satellite communication, and vehicle radar fields, because they can meet the high thermal insulation requirements for these applications.     

Synthesis and characterization of porous Y2SiO5 with low linear shrinkage,high porosity and high strength

The emerging porous Y₂SiO₅ ceramic is regarded as a promising candidate of thermal insulator owing to its very low thermal conductivity. However, recent works on porous Y₂SiO₅ are confronted with severe problems such as large linear shrinkage (18.51–20.8%), low porosity (47.74–62%) and low strength (24.45–16.51 MPa) at high sintering temperatures (1450–1500 °C). In this work, highly porous Y₂SiO₅ ceramic with low shrinkage and excellent high-temperature strength was fabricated by in-situ foam-gelcasting method at 1550 °C. The as-prepared sample has unique multiple pore structures, low linear shrinkages of 6.3–4.5%, controllable high porosities of 60.7–88.4%, high compressive strengths of 38.2–0.90 MPa, and low thermal conductivities of 0.126–0.513 W/(m K) (porosity: 87.1–60.2%). The effects of relative density on relative strength, as well as porosity on thermal conductivity were quantitatively discussed. The present results indicate that porous Y₂SiO₅ is the potential high-temperature thermal insulation material of light weight, low thermal conductivity, and high strength.     

Hot-pressing sintered BN-SiO2 composite ceramics with excellent thermal conductivity and dielectric properties for high frequency substrate

High thermal conductivity and low dielectric constant are the more and more important properties for high-frequency substrate materials to enhance their heat radiation and reduce signal delay. In this work, a series of BN-SiO₂ composite ceramics for high frequency application were successfully synthesized by hot-pressing sintering method. And their structures, thermal and dielectric properties were systematically studied. According to the results, the excellent thermal conductivity with low dielectric constant and low dielectric loss has been obtained in the BN-SiO₂ ceramic. Compared to the pure SiO₂, the sample with 50?wt% BN addition sintered at 1650?℃ exhibited excellent physical properties, including a high thermal conductivity of 6.75?W/m?K which is almost five times higher than that of pure SiO₂ and a low dielectric constant of 3.73. The achieved high thermal conductivity and appropriate dielectric property of the BN-SiO₂ composite ceramic make it a promising candidate for high-frequency substrate application.     

Highly porous Y2SiO5 ceramic with extremely low thermal conductivity prepared by foam‐gelcasting‐freeze drying method

Foam‐gelcasting‐freeze drying method is developed to fabricate porous Y₂SiO₅ ceramic with ultrahigh porosity of 92.2%‐95.8% and isotropous multiple pore structures. As prepared porous samples have quite low shrinkages of 0.8%‐1.9% during demolding and drying processes, lightweights of 0.19‐0.35 g/cm³, and extremely low thermal conductivities of 0.054‐0.089 W·(m·K)^?1. Our approach combines the merits of foam‐gelcasting method and freeze drying method. It is a simple and effective method to fabricate porous ceramics with very high porosity and extremely low thermal conductivity through low shrinkage of green body and near net complex shape forming.     

Lightweight porous silica ceramics with ultra-low thermal conductivity and enhanced compressive strength

In recent years, the need for robust thermal protection for reusable spacecraft and vehicles has spurred strong demand for high-performance lightweight thermal insulation materials that exhibit high strength. Herein, we report silica porous ceramics prepared via the direct foaming technique with lightweight, ultra-low thermal conductivity and enhanced compressive strength. Silica particles (particle size: 500 nm and 2 μm) were used as the raw materials. The nano-sized silica particles were easily sintered, thereby improving the compressive strength of the ceramics, whereas the micro-sized silica particles maintained the pore structure integrity without deformation. The addition of nano-silica enhanced the compressive strength by 764% (from 0.039 to 0.337 MPa). In addition, the thermal conductivity of the ceramics was as low as 0.039 W m^?1 K^?1. Owing to these outstanding characteristics, these porous silica ceramics are expected to be employed as thermal insulation material in diverse fields, especially aerospace and space where weight is an important constraint.     

Preparation of porous Y2SiO5 ceramics with relatively high compressive strength and ultra-low thermal conductivity by a TBA-based gel-casting method

Porous Y₂SiO₅ ceramics with relative high compressive strength (as high as 24.45 MPa) and ultra-low thermal conductivity (～0.08 W/m K) were successfully fabricated by a tert-butyl alcohol based gel-casting method. The formation mechanism of the 3D interconnected pores and the properties of the green body are discussed. The porosity, pore size, compressive strength and thermal conductivity could be controlled by varying the initial solid loading and the sintering temperature. When regulating the initial solid loading (from 20 to 50 wt%) and sintering temperature (from 1200 to 1500 °C), the porosity can be controlled between 47.74% and 73.93%, and the compressive strength and the thermal conductivity of porous Y₂SiO₅ ceramics varied from 3.34 to 24.45 MPa and from 0.08 to 0.55 W/m K, respectively. It should be noted that the porous Y₂SiO₅ ceramics with 30 wt% solid loading and sintering at 1400 °C had an open porosity of 61.80%, a pore size of 2.24 μm, a low room-temperature thermal conductivity of 0.17 W/m K and a relatively high compressive strength of 13.91 MPa, which make this porous Y₂SiO₅ ceramics suitable for applications in high-temperature thermal insulators.     

Multilayered nacre-mimetic inspired flexible PEI film with high thermal conductivity and reliable dielectric performances

It is critically desired to integrate high in-plane thermal conductivity (TC) and distinguished electric insulation for thermal conductive film in modern electronic devices. Herein, integration of high TC and electric insulation in sandwich-like BNNSs@MWCNTs/PEI (S-BNNSs@MWCNTs/PEI) composite film has been successfully achieved by layer-by-layer spin coating and hot pressing inspired by highly ordered structure of natural nacre. The covalently bonded connections between BNNSs and MWCNTs are beneficial to create more efficient heat conduction path, which can partly decrease the interfacial thermal resistance and phonon scattering. The resultant S-BNNSs@MWCNTs/PEI composite films possess a high in-plane TC of 6.88 W m^?1K^?1. Meantime, benefiting from the alternating multilayer structure, the composite films exhibit satisfactory reliable dielectric performances with flexibility, which shows great potential in ceramics-filled polymer composite TIMs.     

Preparation of closed-pore MgO-MgFe2O4 aggregates with low thermal conductivity and high mechanical properties

MgO-MgFe₂O₄ refractory aggregates with high closed porosity were fabricated using MgO agglomerates and Mg(OH)₂ with introducing Fe₂O₃ additive. The evolutions of pores and microstructure and their relationship with the properties of the specimens were studied. The addition of Fe₂O₃ obviously promoted the MgO grain growth and conversion of large open pores into small closed pores, attributing to the formation of cationic vacancies and intergranular MgFe₂O₄ bonding phase. Owing to the presence of closed pores and networks of intergranular MgFe₂O₄, both thermal insulation and strength were enhanced significantly. Besides, the formed closed pores and MgFe₂O₄ phase could accommodate thermal stress and induce transgranular fracture and crack deflection, therefore effectively improving the thermal shock resistance. The specimen with 15 wt% Fe₂O₃ showed a apparent/closed porosity of 0.7%/10.1%, median pore diameter of 4.37 µm, thermal conductivity of 9.3 W/(m·K) (500 °C), flexural strength of 143.5 MPa, and residual flexural strength of 24.1 MPa after thermal shock.     

Carbothermal reduction synthesis of high porosity and low thermal conductivity ZrC-SiC ceramics via an one-step sintering technique

In this work, porous ZrC-SiC ceramics with high porosity and low thermal conductivity were successfully prepared using zircon (ZrSiO₄) and carbon black as material precursors via a facile one-step sintering approach combining in-situ carbothermal reduction reaction (at 1600 °C for 2 h) and partial hot-pressing sintering technique (at 1900 °C for 1 h). Carbon black not only served as a reducing agent, but also performed as a pore-foaming agent for synthesizing porous ZrC-SiC ceramics. The prepared porous ZrC-SiC ceramics with homogeneous microstructure (with grain size in the 50–1000 nm range and pore size in the 0.2–4 µm range) possessed high porosity of 61.37–70.78%, relatively high compressive strength of 1.31–7.48 MPa, and low room temperature thermal conductivity of 1.48–4.90 W·m^?1K^?1. The fabricated porous ZrC-SiC ceramics with higher strength and lower thermal conductivity can be used as a promising light-weight thermal insulation material.     

New multifunctional porous Yb2SiO5 ceramics prepared by freeze casting

New porous Yb₂SiO₅ ceramics were prepared by a water-based freeze casting technique using synthesized Yb₂SiO₅ powders. The prepared porous Yb₂SiO₅ ceramics exhibit multiple pore structures, including lamellar channel pores and small pores, in its skeleton. The effects of the solid content and sintering temperature on the pore structure, porosity, dielectric and mechanical properties of the porous Yb₂SiO₅ ceramics were investigated. The sample with 20 vol% solids content prepared at 1550 °C exhibited an ultra-low linear shrinkage (i.e. 4.5%), a high porosity (i.e. 79.1%), a high compressive strength (i.e. 4.9 MPa), a low dielectric constant (i.e. 2.38) and low thermal conductivity (i.e. 0.168 W/(m K)). These results indicate that porous Yb₂SiO₅ ceramics are good candidates for ultra-high temperature broadband radome structures and thermal insulator materials.     

Effects of porosity on electrical and thermal conductivities of porous SiC ceramics

The effects of porosity on the electrical and thermal conductivities of porous SiC ceramics, containing Y₂O₃–AlN additives, were investigated. The porosity of the porous SiC ceramic could be controlled in the range of 28–64 % by adjusting the sacrificial template (polymer microbead) content (0–30 wt%) and sintering temperature (1800–2000 °C). Both electrical and thermal conductivities of the porous SiC ceramics decreased, from 7.7 to 1.7 Ω⁻¹ cm⁻¹ and from 37.9 to 5.8 W/(m·K), respectively, with the increase in porosity from 30 to 63 %. The porous SiC ceramic with a coarser microstructure exhibited higher electrical and thermal conductivities than those of the ceramic with a finer microstructure at the equivalent porosity because of the smaller number of grain boundaries per unit volume. The decoupling of the electrical conductivity from the thermal conductivity was possible to some extent by adjusting the sintering temperature, i.e., microstructure, of the porous SiC ceramic.     

Lightweight porous silica-alumina ceramics with ultra-low thermal conductivity

Thermal protection has always been an important issue in the energy, environment and aerospace fields. Porous ceramics produced by the particle-stabilized foaming method have become a competitive material for thermal protection because of their low density and low thermal conductivity. However, the study of porous ceramics for composite systems using particle-stabilized foaming method was relatively rare. Here, silica-alumina composite porous ceramics were prepared by particle-stabilized foaming method, which was achieved by tailoring the surface charges of silica and alumina through adjustment of the pH. Porous ceramics exhibited porosity as high as 97.49% and thermal conductivity (25 °C) as low as 0.063 W m^?1 K^?1. The compressive strength of porous ceramics sintered at 1500 °C with a solid content of 30 wt% could reach 0.765 MPa. Based on the light weight and excellent thermal insulation properties, the composite porous ceramic could be used as a potential thermal insulation material in the spacecraft industry.     

Novel high-temperature-resistant Y2SiO5 aerogel with ultralow thermal conductivity

A novel Y₂SiO₅ ternary aerogel was prepared from tetraethoxysilane and yttrium chloride hexahydrate via the sol-gel method followed by high-temperature calcination. The effects of different calcination temperatures on the microstructure, mechanical and thermal stability of the Y₂SiO₅ aerogels were investigated. The aerogels exhibited low densities of 0.33-0.62 g/cm³, low thermal conductivities of 0.029-0.05 W/(m·K), and a relatively high strength of 0.16-56.47 MPa. Moreover, compared with the Al₂O₃–SiO₂ aerogel, the Y₂SiO₅ aerogel has higher thermal stability and more excellent high-temperature insulation, which has potential applications as a thermal protection material in hypersonic vehicles.     

Fabrication of high thermal conductivity silicon nitride ceramics by pressureless sintering with MgO and Y2O3 as sintering additives

The fabrication of silicon nitride (Si₃N₄) ceramics with a high thermal conductivity was investigated by pressureless sintering at 1800 °C for 4 h in a nitrogen atmosphere with MgO and Y₂O₃ as sintering additives. The phase compositions, relative densities, microstructures, and thermal conductivities of the obtained Si₃N₄ ceramics were investigated systemically. It was found that at the optimal MgO/Y₂O₃ ratio of 3/6, the relative density and thermal conductivity of the obtained Si₃N₄ ceramic doped with 9 wt% sintering aids reached 98.2% and 71.51 W/(m·K), respectively. EDS element mapping showed the distributions of yttrium, magnesium and oxygen elements. The Si₃N₄ ceramics containing rod-like grains and grain boundaries were fabricated by focused ion beam technique. TEM observations revealed that magnesium existed as an amorphous phase and that yttrium produced a new secondary phase.     

Highly porous nano-SiC with very low thermal conductivity and excellent high temperature behavior

Highly porous nano-SiC is fabricated by partial sintering and decarburizing process using SiC nano-powders as starting materials and graphite flakes as pore forming agents. The prepared porous nano-SiC ceramics possess multiple pore structures, including well-distributed meso-pores in the skeleton and interconnected flakelike micro-pores. The samples prepared at 1800 °C have relatively low thermal conductivities of 5.61 ～ 0.25 W m^?1 K^?1 with porosities of 55.5–76.1%. While the samples sintered at 1500 °C with porosities between 54.0% to 76.3% show very low thermal conductivities of 0.74 ～ 0.14 W m^?1 K^?1, which is attributed to the integrated nano-scale phonon-scattering mechanisms and duplex pore structures. Porous nano-SiC ceramics also show good retention of elastic stiffness up to 1350 °C and low thermal conductivity at 1400 °C. Our results shed light on porous nano-SiC as a promising thermal insulator used in extreme thermal and chemical environments.     

Analysis and modeling of the pore size effect on the thermal conductivity of alumina foams for high temperature applications

Analytical and finite element analyses were carried out to investigate the influence of the pore sizes on the effective thermal conductivity, which is the main physical property related to the ceramic microstructure insulating capacity at high temperatures. Thermal conductivity was estimated by analytical models using Litovsky's and Rosseland's approaches for a monodisperse pore distribution, whereas via finite element analysis a high porosity microstructure with three different pore sizes was investigated. Based on this, an ideal pore size range (0.5–3.0 µm) was found that optimizes the reduction of thermal energy transmission in the 1000–1700 °C range. Furthermore, the ideal pore size range seems to be independent of the ceramic foam material. When considering a pore size distribution, the ideal range is narrowed due to less effective thermal radiation scattering by sub-micron and large pores. The results obtained showed that nanopores (< 0.1 µm) are not the best option to reduce thermal conductivity at high temperatures. This statement is supported by experimental data on nanopore aerogels, which show a significant thermal conductivity increase at the high temperature range.     

Method for fabricating microwave absorption ceramics with high thermal conductivity

In this work, a high-performance microwave absorption ceramic together with high thermal conductivity was proposed through the introduction of phenolic resin as the carbon source into AlN ceramic substrate. The phenolic resin was initially mixed with AlN powder and sintering additives in ethanol to form homogeneous slurries, followed by drying, pyrolysis, dry pressing and pressureless sintering to develop nano carbon in situ in AlN substrate. The well controlled microstructure with homogeneous distribution of nano sized carbon lead to the high thermal conductivity and excellent microwave absorption properties. by adjusting the phenolic resin content, the ceramic showed a minimal reflection coefficient of about ?30 dB with an effective bandwidth of about 2 GHz together with a high thermal conductivity of about 135.1 W/m K.     

Low sintering shrinkage porous mullite ceramics with high strength and low thermal conductivity via foam-gelcasting

Excessive sintering shrinkage leads to severe deformation and cracking, affecting the microstructure and properties of porous ceramics. Therefore, reducing sintering shrinkage and achieving near-net-size forming is one of the effective ways to prepare high-performance porous ceramics. Herein, low-shrinkage porous mullite ceramics were prepared by foam-gelcasting using kyanite as raw material and aluminum fluoride (AlF₃) as additive, through volume expansion from phase transition and gas generated from the reaction. The effects of AlF₃ content on the shrinkage, porosity, compressive strength, and thermal conductivity of mullite-based porous ceramics were investigated. The results showed that with the increase of content, the sintering shrinkage decreased, the porosity increased, and mullite whiskers were produced. Porous mullite ceramics with 30 wt% AlF₃ content exhibited a whisker structure with the lowest shrinkage of 3.5%, porosity of 85.2%, compressive strength of 3.06 ± 0.51 MPa, and thermal conductivity of 0.23 W/(m·K) at room temperature. The temperature difference between the front and back sides of the sample reached 710°C under high temperature fire resistance test. The low sintering shrinkage preparation process effectively reduces the subsequent processing cost, which is significant for the preparation of high-performance porous ceramics.