InP上Al膜的阳极氧化及其特性研究

本文报道了半导体InP上Al膜阳极氧化的研究,并用AES,V-V,DLTS和椭圆仪等测试方法研究了氧化膜的稳定性、电学特性、组分的纵向分布以及Al_2O_3/InP的界面特性,研究结果表明,阳极氧化Al_2O_3的介电常数为11～12,Al_2O_3/InP界面存在一个能量上连续分布的电子陷阱,DLTS峰值对应的能级位置约在E_c-E_c=0.5eV,其俘获截面约为10~(-15)cm~2,Al_2O_3/InP的界面态密度为10~(11)cm~(-2)eV~(-1)。阳极氧化Al_2O_3的稳定性要比InP自身氧化物好得多,更适于用作器件的钝化保护和扩散掩蔽膜。     

CVD法淀积Al_2O_3膜及其与InP、Si的界面性质

本文介绍了用CVD方法分别在Si和InP上淀积了Al_2O_3膜.并用椭偏仪、高频C-V,准静态C-V、DLTS对Al_2O_3膜的性质及其与Si和InP的界面性质进行了测试分析.     

STUDY OF THE ANODIZATION OF Al FILM ON InP SUBSTRATE AND ITS PROPERTIES

The anodization of Al film on InP substrate and properties of anodic Al_2O_33/InPhave been investigated by AES,DLTS,I-V,C-V and ellipsometer.The results show that theanodic oxide Al_2O_3 has a permittivity of 11～12 and a resistivity of 1.3×10~(13) ohm-cm.Interfacestate density at Al_2O_3/InP is about 10~(11) cm~(-2)·eV~(-1).DLTS reveals that there is a continuouslydistributed interface electron traps at Al_2O_3/InP interface.Anodic Al_2O_3 exhibits good stabilityand electrical properties and could be used for passivation,diffusion mask and gate insulator,etc.     

不同介质膜的InP MIS结构界面陷阱的研究

对经 PECVD(Plasma Enhanced Chemical Vapor Deposition)生长的不同介质膜 InPMIS结构样品的界而陷阶进行了研究.样品介质膜的生长是在特定实验条件下进行.分别利用C-V(Capacitance-Voltage)和 DLTS(Deep Level Transient Spectroscopy)技术进行研究.结果表明,在介质膜和InP之间InP 一侧有若干界面陷阱存在,获得了与界面陷阱有关的深能级参数.这些陷阱的来源可能是:(1)介质膜淀积过程中InP表面部分P原子挥发造成的P空位;(2)InP衬底材料中的原生缺陷;(3)介质膜淀积过程中等离子体引进的有关辐照损伤.     

GaAs、InP阳极氧化薄膜的光电子能谱、俄歇电子能谱分析

使用一种新的不含水的阳极氧化液生长出厚度均匀、重复性好的～10~2A GaAs、InP阳极氧化膜.XPS和 AES分析表明:GaAs 氧化膜表面和膜内组分均匀,Ga_2O_3/As_2O_3=1; InP一氧化物界面过渡区较窄,未见到富p现象.     

阳极氧化法制备Al_2O_3超微筛膜

阳极氧化法制得的Al_2O_3超微筛膜,作为透射电镜试样载膜,除具有一般微筛膜的特点外,它的机械强度好,并且Al_2O_3的晶格条纹像可作为电镜倍率的内标,因其微筛孔尺寸较小,可载持微细的电镜试样。本文主要考察Al_2O_3超微筛制备时的各种困素如:铝箔表面形貌、阳极氧化电压,电流密度、氧化电解液的种类、浓度、温度及微筛膜的热处理等的影响。另外对所得Al_2O_3超微筛膜作了其筛孔大小分布的测定,最后提出了认为可取的制备条件(结果见图a、b)8％草酸水溶液作为氧化电解液阳极氧化电压为10V电流密度为2～5mA/(cm)_2时间取30s     

InGaAsP/InP双异质结发光管中的深能级

本文用DLTS谱仪研究了SiO2限制的InGaAsP/InP双异质结发光管中的深能级。结果表明:只有在p-n结位于p-InP/n-InGaAsP界面处的个别器件中,有△E=0.24eV的多子陷阱。     

高介电常数Ta/Al_2O_3复合膜的制备及性能研究

首次在溴的丙酮溶液中,以钽为阳极,氧化铝为阴极,通过直流电沉积方法制备了Ta/Al_2O_3复合膜。借助LCR数字电桥、SEM、EDS等测试手段对Ta/Al_2O_3复合膜的介电性能及微观结构进行了分析与表征。研究表明:Ta/Al_2O_3复合氧化膜的表面沉积了质量分数为41.77%的钽。与普通铝阳极(Al_2O_3)氧化膜相比,复合氧化膜的电容提高了50%以上,这主要归因于介电常数较高的钽在复合氧化膜表面的沉积。     

(Ga,Al)As/GaAs及GaInAsP/InP激光器中的深能级

采用深能级瞬态谱技术(DLTS),测定了用水平液相外延法生长的四层结构Ga_(0.7)Al_(0.3)A_3/GaAs,Ga_(0.26)In_(0.74)As_(0.6) P_(0.4)/InP 宽接触及质子轰击条形双异质结激光器中的深能级,对于这些深能级所引起的激光器退化问题进行了初步研究和讨论.     

钝化处理对Al2O3/InP MOS电容界面特性的影响

制备了Al/Al_2O_3/InP金属氧化物半导体(MOS)电容,分别采用氮等离子体钝化工艺和硫钝化工艺处理InP表面。研究了在150、200和300 K温度下样品的界面特性和漏电特性。实验结果表明,硫钝化工艺能够有效地降低快界面态,在150 K下测试得到最小界面态密度为1.6×10¹⁰ cm^-2·eV^-1。与硫钝化工艺对比,随测试温度升高,氮等离子体钝化工艺可以有效减少边界陷阱,边界陷阱密度从1.1×10¹² cm^-2·V^-1降低至5.9×10¹¹ cm^-2·V^-1,同时减少了陷阱辅助隧穿电流。氮等离子体钝化工艺和硫钝化工艺分别在降低边界陷阱和快界面态方面有一定优势,为改善器件界面的可靠性提供了依据。     

New dark current component of InGaAs／InP HPDs confirmed by DLTS

The dark current of In_(0.47) Ga_(0.53) As/InP heterojunction photodiodes (HPDs) was analysed. We found that there exists a new dark current component-deep level-assisted tunnelling current.DLTS was used to measure the In_(0.47)Ga_(0.53)As/InP HPDs. An electronic trap which has a thermal activation energy of O.44 eV, level concentration of 3.10×10^(13)cm^(-3) and electronic capture cross section of 1.72×10^(12)cm^2 has been found.It s existence results in the new tunnelling current.     

InP衬底上Ga_(0.47)In_(0.53)As/InP液相外延生长

用液相外廷获得了与InP晶格匹配的Ga_(0.47),In_(0.53)As单晶外延层.本文叙述在(100)和(111)InP衬底上Ga_(0.47)In_(0.53)As/InP液相外延生长方法.用常规滑动舟工艺生长的这种外延层,其表面光亮,Ga的组分x=0.46～0.48,晶格失配率小于2.77×10~(-4),禁带宽度E_g=0.74～0.75eV.使用这种Ga_(0.47)In_(0.53)As/InP/InP(衬底)材料研制的长波长光电探测器,在波长为0.9～1.7μm范围内测出了光谱响应曲线,在1.55μm处呈现峰值.     

XPS Investigation on Surface and Interface Electronic States of Alq3／ITO

The surface and interface electronic states of tris-(8-hydroxyquinoline)aluminum(Alq3)/indium-tin oxid(ITO)were measured and analyzed by X-ray photoelectron spectroscopy(XPS).The results indicated that, in Alq3 molecule,the binding energy(Eb)of Al atoms is 70.7eV and 75.1eV,corresponding to Al(O)and Al(Ⅲ）,respectively;The binding energy of C is 285.8eV,286.3eV,and 286.8eV,corresponding to C of C-C group,C-O,and C-N bond,respectively,N is the main peak locating at 401.0eV, corresponding to Natom of C-N=C.Oatoms mainly bond o H atom,with the binding energy of 533.2 eV.As the sputtering time of Ar^ ion bearn increases,Al2p,C1s,N1s,O1s,Ind3d5/2 and Sn3d5/2 peaks slightly shift towards lower binding energy,and Al2p,C1s and N1s peaks get weaker,which contributed to diffusing the oxygen,indium and tin in ITO into Alq3 layr.     

InP(100)的化学减薄与化学抛光

试验了四十多种腐蚀剂,给出了其中十六种对InP(100)的腐蚀结果.有的已在InP Gunn器件制造工艺中应用.其中有六种未见报导.叙述了两种不同类型的化学反应,进一步分析了HClBr_2-C_2H_5OH同InP的化学作用.由实验结果和Arrhenius公式求得HCl对InP(100)的化学反应激活能E_a=14kcal/mole.文章最后讨论了InP材料的腐蚀机理、抛光原理及化学反应类型的控制.     

Field screening in (111)B InAsP/lnP strained quantum wells

Low-temperature photoluminescence measurements were performed on InAsP/InP strained quantum wells grown on InP (lll)B substrates by gas-source molecular beam epitaxy. The emission energy was observed to increase as the pump-power density increased. This was attributed to the screening of the internal piezoelectric field by photo-generated carriers. The energy shift was as large as 35 meV for an InAs_0.28P_0.72/InP quantum well with a lattice mismatch of ~0.9%. A similar structure with a smaller strain showed saturation of the energy shift with increasing pump-power density. We performed a model calculation which includes the quantum confined Stark effect, and this saturation was correlated with a flat-band structure of the quantum well due to the nearly complete screening of the built-in electric field.     

Cu／AI比对P型透明导电铜铝氧薄膜性能的影响

采用将反应物沉淀后涂层及高温固相反应，在石英玻璃衬底上沉积了Cu／Al原子比不同的P型透明导电铜铝氧化物。XRD分析结果表明，样品的成分中包含黑铜矿结构的CuO、铜铁矿结构的CuAlO2、尖晶石结构的CuAl2O4和刚玉结构的Al2O3；X光能谱（EDAX）测试结果表明，样品中的Cu／Al比例随原料中Cu／Al比的增加而增加；导电类型测试表明，利用本方法制备的样品均是P型；电阻率测试表明，当Cu／Al原子比在1．0～1．5变化时试样的电阻率较低，而且电阻率变化不大。