Low-frequency noise of InP/InGaAs heterojunction bipolartransistors

The equivalent base noise SI_b of InP/InGaAs heterojunction bipolar transistors (HBT's) with a circular pattern emitter is investigated experimentally at a low frequency ranging from 10-10⁵ Hz. The measured SI_b exhibits the 1/f dependence in an overall frequency range without any accompanying burst noise. Furthermore, SI_b varies as I_b^γ for the base current I_b and as d^-2 for the emitter diameter d, where the value of γ ranges from 1.62-1.72 depending on d of HBT's used. The 1/f noise model, which rigorously deals with the recombination current at the base surface I_bs as a function of I_b as well as of d is proposed. Applying our noise model to the dependence of SI_b on I_b, as well as on d, reveals that even though γ is less than two, the origin of SI_b is due to the recombination of electrons at the exposed base surface near the emitter edges. On the basis of theoretical considerations for the diffusion length of electrons and traps at the base surface, the Hooge parameter α_H for the noise due to the base surface recombination is deduced to be in the order of 10 ^-2 for the first time     

Simulation and design of InAlAs/InGaAs pnp heterojunction bipolartransistors

The performance capabilities of InP-based pnp heterojunction bipolar transistors (HBT's) have been investigated using a drift-diffusion transport model based on a commercial numerical simulator. The low hole mobility in the base is found to limit the current gain and the base transit time, which limits the device's cutoff frequency. The high electron majority carrier mobility in the n⁺ InGaAs base allows a reduction in the base doping and width while maintaining an adequately low base resistance. As a result, high current gain (>300) and power gain (>40 dB) are found to be possible at microwave frequencies. A cutoff frequency as high as 23 GHz and a maximum frequency of oscillation as high as 34 GHz are found to be possible without base grading. Comparison is made with the available, reported experimental results and good agreement is found. The analysis indicates that high-performance pnp InP-based HBT's are feasible, but that optimization of the transistor's multilayer structure is different than for the npn device     

Intermodulation analysis of the collector-up InGaAs/InAlAs/InP HBTusing Volterra series

The intermodulation (IM) distortion of the collector-up InGaAs/InAlAs/InP heterojunction bipolar transistor (HBT) is analyzed using Volterra-series theory. A T-equivalent circuit is used for this analysis. The contribution and interaction of four nonlinear elements: base-emitter resistance, base-emitter capacitance, base-collector capacitance, and common base-current gain are analyzed. For the particular device under investigation, it is found that the cancellation effect is not significant and the base-emitter resistance nonlinearity dominates the third-order IM     

High-gain, high-speed InP/InGaAs double-heterojunction bipolartransistors with a step-graded base-collector heterojunction

We show that by using InP for the emitter and collector layers, and a thin high-doped base layer, it is possible to achieve both a high DC current gain and a high maximum frequency of oscillation. We have fabricated InP/InGaAs double heterojunction bipolar transistors (DHBT's) with cutoff frequencies f_T and f_max of 92 and 95 GHz, respectively, with a DC current gain of over 100. The maximum cutoff frequencies were 107 and 104 GHz     

High-current-gain submicrometer InGaAs/InP heterostructure bipolartransistors

Common-emitter current gains of 115 and 170 are achieved in transistors with emitter dimensions as small as 0.3×3 and 0.8×3 μm², respectively. These results are comparable with scaling experiments reported for Si bipolar devices and represent a significant improvement over AlGaAs/GaAs heterostructure bipolar transistors. Both the low surface recombination velocity and nonequilibrium carrier transport in the thin (800-Å) InGaAs base enhance the DC performance of these transistors     

InP/InAlAs/InGaAs quantum wires

Single InGaAs quantum wires and stacked InGaAs quantum wires with InAIAs barriers have been fabricated on V-grooved InP substrates by low pressure metal-organic chemical vapour deposition (MOCVD). We have found growth conditions where the InAIAs barrier exhibits a resharpening effect, similar to that of AlGaAs utilized for growth on GaAs substrates. The existence of structural and electronic quantum wires in the bottom of the grooves is proven.     

InP/InGaAs heterojunction phototransistors

We describe the fabrication and device characteristics of experimental back-illuminated InP/InGaAs n-p-n heterojunction phototransistors. These devices exhibit photoresponse in the wavelength range of0.95-1.6 mum. An optical gain of 40 at an input power of 1 nW (an improvement of 1000 in sensitivity over previously reported phototransistors) has been observed. Gains as high as 1000 have been achieved for higher incident power levels.     

High-speed InAlAs/InGaAs heterojunction bipolar transistors

InAlAs/InGaAs heterojunction bipolar transistors fabricated from wafers grown by molecular beam epitaxy are discussed. A cutoff frequency of 32 GHz for a collector current of 20 mA is achieved in the emitter area of devices 6×10 μm². The use of heavily doped and nondoped InGaAs layers as the emitter cap and collector, respectively, results in a reduction of the emitter and collector charging times; this, in turn, leads to improved microwave performance     

Microwave noise performance of InP/InGaAs heterostructure bipolartransistors

The authors report the first low-noise InP/InGaAs heterostructure bipolar transistor (HBT). Minimum noise figures of 0.46, 2.0, and 3.33 dB were measured at 2, 10, and 18 GHz, respectively. The noise performance of this InP/InGaAs HBT with an emitter size of 3.5×3.5 μm² is compared to that for FETs having a 1-μm gate length. The measured minimum noise figures agree well with calculated data using a modified Hawkins model. Broadband low-noise operation is observed because of the short transit time for injected nonequilibrium electrons to transverse the base and collector depletion region     

Avalanche InP/InGaAs heterojunction phototransistor

We report on the characteristics of an avalanche InP/InGaAs heterojunction phototransistor. Below the turnover voltage, the gain is bias dependent and avalanching can be used to achieve significant (sim5times) improvement in the gain-bandwidth product. The noise current in this bias region has been measured and is shown to be predominantly shot noise of the photocurrent and the leakage current. Above the turnover voltage, negative resistance is observed and extremely high gains (>10⁴) are achieved. In this mode, the pulse response is a narrow spike (rise time ≃ 20 ns) whose width is independent of the width of the incident optical pulse.     

High performance double-doped InAlAs/InGaAs/InP heterojunction FET with potential for millimetre-wave power applications

Lattice matched InAlAs/InGaAs/InP heterojunction field-effect transistors (HJFETs), which have carrier supplying layers on and beneath the undoped InGaAs channel layer, have been successfully fabricated. A selective recess of the InGaAs channel edge at a mesa sidewall together with the use of a wide recess gate structure leads to a 5.7 V gate-drain breakdown voltage without kink effects. The fabricated HJFET with a 0.15*100 mu m/sup 2/ T-shaped gate exhibits a 700 mA/mm maximum drain current, a voltage gain of 14, and a 345 GHz maximum frequency of oscillation.<>     

Symmetric P-n-P InAlAs/InGaAs double-heterojunction bipolartransistors fabricated with Si-ion implantation

The authors have successfully fabricated symmetric P-n-P InAlAs/InGaAs double-heterojunction bipolar transistors (DHBTs) using self-aligned Si-ion implantation and refractory emitter contacts with current gains of 115 and 30 in the emitter-up and the emitter-down configurations, respectively. Two thin Be-doped In_0.53Ga_0.47As layers inserted on both sides of base lead to the excellent I-V characteristics. The authors have shown that hole injection from the external portions of the emitter should be suppressed by a factor of 10^-5 to 10^-3 at a collector current density of about 10³ A/cm² , which is much smaller than that of N-p-n GaAs/AlGaAs HBTs and DHBTs are promising devices for applications to circuits with low power dissipation     

Optical effect in InAlAs/InGaAs/InP MODFET

Analytical results have been presented for an optically illuminated InAlAs/InGaAs/InP MODFET with an opaque gate. Partial depletion of the active region is considered. The excess carriers due to photo generation are obtained by solving the continuity equation. The energy levels are modified due to the generation of carriers. The surface recombination effect has also been taken into account. The results of I-V characteristics have been compared under dark conditions, since under illumination experimental results are not available. The offset voltage, sheet concentration, I-V, and transconductance have been presented and the effect of illumination discussed     

Microwave performance of InGaAs/InAlAs/InP SISFETs

Microwave S-parameter measurements and equivalent-circuit modeling of In_0.53Ga_0.47As/In_0.52Al_0.48 As/InP semiconductor-insulator-semiconductor FETs (SISFETs) of 1.1-μm gate length are discussed. The devices incorporated wide-bandgap buffers, self-aligned contact implants, and refractory air-bridge gates. Their DC I-V characteristics displayed sharp pinchoff, good output conductance of 10-20 mS/ss, and extrinsic transconductance up to 220 ms/mm at room temperature. The maximum unity-current-gain frequency was 27 GHz. Gate resistance was found to be the dominant factor limiting microwave power gain     

Microwave performance of InAlAs/InGaAs/InP MODFET's

Modulation-doped InAlAs/InGaAs/InP structures were grown by molecular beam epitaxy (MBE) and fabricated into FET's with excellent RF gain performance. The intrinsic transconductance was about 400 mS/mm at 300 K. Current gain cutoff frequencies of up to 26.5 GHz were obtained in 1-µm gate devices. Extremely small S12and large S21led to a very largef_{max}of 62 GHz. These results represent the best reported figures for 1-µm devices in this material system and slightly better than those obtained in recently developed pseudomorphic modulation-doped field effect transistors (MODFET's).     

InGaAs(InAlAs)/InP和InP/InAlAs湿法选择腐蚀研究

介绍了两种选择腐蚀液对InGaAs(InAlAs)I/nP和InPI/nAlAs异质结构材料选择腐蚀的实验结果,重点介绍在InAlAs上面生长InP的湿法选择腐蚀,用HClH∶3PO4C∶H3COOH系列腐蚀液,InPI/nAlAs选择比大于300。InPI/nAlAs湿法选择腐蚀的结果可以很好应用到OEIC芯片制作中,并取得了较好的器件及电路结果。     

InGaAs（InAIAs）／InP和InP／InAIAs湿法选择腐蚀研究

介绍了两种选择腐蚀液对InGaAs（InAlAs）／InP和InP／InAlAs异质结构材料选择腐蚀的实验结果，重点介绍在InAlAs上面生长InP的湿法选择腐蚀，用HCl：H3PO4：CH3COOH系列腐蚀液，InP／InAlAs选择比大于300。InP／InAlAs湿法选择腐蚀的结果可以很好应用到OEIC芯片制作中，并取得了较好的器件及电路结果。     

High-speed InP/InGaAs heterojunction bipolar transistors

Very-high-performance common-emitter InP/InGaAs single heterojunction bipolar transistors (HBTs) grown by metalorganic molecular beam epitaxy (MOMBE) are reported. They exhibit a maximum oscillation frequency (f_T) of 180 GHz at a current density of 1×10⁵ A/cm². this corresponds to an (R_BC_BC)_eff=f _T/(8πf²_max) delay time of 0.12 ps, which is the smallest value every reported for common-emitter InP/InGaAs HBTs. The devices have 11 μm² total emitter area and exhibit current gain values up to 100 at zero base-collector bias voltage. The breakdown voltage of these devices is high with measured BV_CEO and BV_CEO of 8 and 17 V, respectively     

Monte Carlo studies of the effect of emitter junction grading onthe electron transport in InAlAs/InGaAs heterojunction bipolartransistors

InAlAs/InGaAs HBTs with various emitter junction gradings are simulated using a self-consistent Monte Carlo simulator. The effects of the emitter junction grading and the shift of the emitter-base p-n junction into the emitter depletion region due to diffusion of the base dopant are investigated. A minimum transit time of 1.18 ps is predicted for an In(Ga_1-xAl_x)As grading with x=0.6 at the E-B interface and J_C=0.7×10⁵ A/cm². Graded-base designs do not offer any transit time performance improvement compared with the graded E-B approach. For transient performance, the device switching time is found to remain constant at about 2.2 ps up to x₀~0.7 but increases for larger values. A cutoff frequency as high as 270 GHz was observed for x₀=0.7, indicating that the best transport can be achieved from intermediately graded rather than abrupt E-B junction designs     

Ultra-high-speed InP/InGaAs heterojunction bipolar transistors

We report on the microwave performance of InP/In_0.53Ga _0.47As heterojunction bipolar transistors (HBT's) utilizing a carbon-doped base grown by chemical beam epitaxy (CBE). The f_T and f_max of the HBT having two 1.5×10 μm² emitter fingers were 175 GHz and 70 GHz, respectively, at I_C=40 mA and V_CE=1.5 V. To our knowledge, the f _T of this device is the highest of any type of bipolar transistors yet reported. These results indicate the great potential of carbon-doped base InP/InGaAs HBT's for high-speed applications