反渗透膜国产阻垢剂的阻垢性能试验

通过静态实验和动态模拟实验,在加药质量浓度4m/L时,考察进口Permatreat-191、进口ROC-0100和AMT-Z202三种反渗透膜阻垢剂的阻垢性能,探讨采用国产阻垢剂代替进口阻垢剂的可行性.动态及静态实验结果表明,国产AMT-Z202阻垢剂的阻垢性能最佳,能使溶液在浓缩因子Ki＞6.5、饱和指数LSI＞2.81时不出现结垢,基本满足现场实际需要.     

反渗透膜阻垢剂阻垢效果的比较研究

本试验采用正交实验法研究了水样含盐量（3个水平）,阻垢剂种类（3个水平）,阻垢剂量（3个水平）等三个因素及不同水平对反渗透阻垢剂的阻垢效果的影响。试验结果表明：反渗透阻垢剂ZD-01与国外具有代表性的阻垢剂如W-01和W-02,在CaCO3阻垢效能方面效果相当。在含盐量为1000—5000mg／L,阻垢剂量为3～7mg／L时,阻垢剂的阻垢率均超过85％。     

复配阻垢剂对碳酸钙阻垢效果正交实验研究

为了研究低浓度下不同类型的阻垢剂复配对碳酸钙垢阻垢效果的影响,采用钙离子络合滴定法对筛选出的阻垢剂两两复配,三种阻垢剂复配的阻垢效果进行实验研究。选择阻垢效果较好的三种阻垢剂进行复配实验研究,TH-1与EDTMPS复配时对碳酸钙的阻垢效果最好,在复配比为2︰1时,阻垢率最高为91.55%。TH-1、EDTMPS与PESA以2︰1︰1比例复配时对碳酸钙的阻垢率可达到93.61%。选择温度,pH,含盐量这三种因素设计正交实验,研究三种因素共同作用时对碳酸钙阻垢效果的影响。由正交实验结果可知,在温度为80℃,pH为7,含盐量为4 g/L时,复配阻垢剂对碳酸钙的阻垢率最大,为95.69%。三种因素对复配阻垢剂阻垢效果影响大小的顺序为:温度pH含盐量。     

新型反渗透阻垢剂YSM-11的阻垢性能

采用静态法考察新型反渗透阻垢剂YSM-11的性能,结果表明该阻垢剂对CaCO3和CaSO4垢都有较高的阻垢率,对钙离子容忍度高、药剂使用量低,且对硅垢也有较好阻垢效果。与国内常用进口阻垢剂大湖135对比．YSM-11是一种高性价比的环保型反渗透阻垢剂,完全能代替进121药剂应用于反渗透系统。     

聚醚型阻垢分散剂合成工艺条件的研究

以丙烯酸(AA)和聚乙二醇单甲醚甲基丙烯酸酯(MPEGMA)为共聚单体,以过硫酸铵-次亚磷酸钠为引发体系,以磷酸二氢钾为链转移剂,采用水溶液共聚的方法制备出具有长侧链醚基的聚醚型阻垢剂P(AA/MPEGMA);研究了单体配比、引发剂用量、链转移剂用量、反应温度及反应时间对共聚物阻碳酸钙垢率的影响。研究结果表明,当丙烯酸(AA)与聚乙二醇单甲醚甲基丙烯酸酯(MPEGMA)的质量比为3∶1,引发剂用量为单体质量的4.5%,链转移剂用量为单体质量的11%,反应温度为82℃,聚合反应时间为3.5 h时,共聚物阻碳酸钙垢率最大。     

离子沉淀法提取绿茶中的茶多酚

摘要：以绿茶为原料,水为浸提溶剂,采用离子沉淀法对茶叶中茶多酚的提取进行了研究。探讨了沉淀剂种类、沉淀剂用量、溶剂用量、浸提温度、浸提时间5个因素对茶叶中茶多酚提取的影响,优化了茶多酚提取的最佳工艺条件。结果表明,当以AlCl3为沉淀剂且m沉淀剂：m茶叶=1：5、溶剂用量m茶叶：m水=1：20、浸提温度为水浴75℃、浸提时间45min时,茶多酚的提取率最高,为14．12％。     

MAS阻垢剂的合成及性能评价

以含有羧基、磺酸基等官能团的烯类单体为原料,以过硫酸铵和亚硫酸氢钠组成的氧化-还原体系为引发剂,采用水溶液法进行加成聚合,合成了三元共聚物MAS,并采用静态阻垢实验对MAS的阻垢效果进行了评定。结果表明,MAS具有很好的络合Ca2+能力,最佳投加质量浓度为16 mg/L。     

碳酸钙改性高吸水树脂对铜离子的吸附研究

以丙烯酸(AA)为单体,碳酸钙为改性添加剂,N,N'-亚甲基双丙烯酰胺(NMBA)为交联剂,过硫酸铵(APS)/亚硫酸钠为氧化还原型引发剂,采用水溶液聚合法合成碳酸钙改性高吸水树脂。发现使用改性添加剂碳酸钙能够使改性高吸水树脂的吸附性能明显增强。通过正交实验和单因素实验进行条件优化,得出改性高吸水树脂对重金属铜离子吸附性能最佳的工艺条件为:以158 g丙烯酸为基准,反应温度为55℃,单体质量分数为20%,中和度为75%,改性添加剂质量为8 g,交联剂和引发剂质量分别为单体质量的1.0%和2.0%。在最佳工艺条件下,制备的改性树脂常温下在0.05 mol/L的硫酸铜溶液中吸附铜离子量达到213.7 mg/g。     

碳酸钙阻垢剂研究进展及阻垢作用机理

首先介绍了工业用水体系碳酸钙腐蚀结垢趋势的判定方法,着重论述了防止碳酸钙沉积所用阻垢剂的种类,阻垢剂改性和不同阻垢剂物理复配等研究进展。分析总结经典阻垢机理以及基于分子水平解释的最新阻垢机理。结合现有阻垢剂在实际工业水处理应用中存在的问题,对阻垢剂的未来发展趋势进行了展望。     

碳酸钙阻垢剂研究进展及阻垢作用机理

首先介绍了工业用水体系碳酸钙腐蚀结垢趋势的判定方法,着重论述了防止碳酸钙沉积所用阻垢剂的种类,阻垢剂改性和不同阻垢剂物理复配等研究进展.分析总结经典阻垢机理以及基于分子水平解释的最新阻垢机理.结合现有阻垢剂在实际工业水处理应用中存在的问题,对阻垢剂的未来发展趋势进行了展望.     

羧甲基葡聚糖的快速沉降法阻垢特性研究

工业循环冷却水中的碳酸钙污垢一直是困扰工业生产者的重要问题,使用快速沉降法（FCP）研究了不同浓度的羧甲基葡聚糖对于碳酸钙污垢的抑制作用。控制溶液中的钙离子浓度为200 mg/L,羧甲基葡聚糖的浓度分别为0.5、1、2和4 mg/L时,对羧甲基葡聚糖的阻垢性能进行分析。结果表明,羧甲基葡聚糖对于减缓碳酸钙的成核过程有明显效果,此外,它也显著降低了碳酸钙成核后晶体的生长速率。当羧甲基葡聚糖的浓度为4 mg/L时,羧甲基葡聚糖对于碳酸钙的成核及晶面生长起到了完全抑制的作用,对于工业应用中碳酸钙的防垢处理,提升换热效率具有借鉴意义。     

Investigation of copper corrosion inhibition by STM and EQCM techniques

The mechanism of copper corrosion and its inhibition were studied using electrochemical techniques, in situ scanning tunneling microscopy (STM) and electrochemical quartz crystal microbalance (EQCM) methods. The morphological changes of Cu (111) were followed in 0.1 M Na₂SO₄ solution at pH 2.95. The adsorption of 5-mercapto-1-phenyl-tetrazole (5-McPhTT) at different concentrations was studied. The anodic dissolution of copper in 0.1 M Na₂SO₄ was clearly modified and hindered by the addition of 5-McPhTT. The anodic current density was reduced sharply due to the adsorption of the inhibitor on the metal surface thus providing protection. EQCM data revealed that the addition of the inhibitor to the aggressive solution did not cause a continuous increase in the electrode mass. This fact indicates that the inhibitor effect in hindering copper corrosion was due to the adsorption of a monolayer or even a submonolayer.     

Investigation of copper on silica catalysts prepared by an ion exchange method

The preparation of copper on silica catalysts by the ion exchange method has been found to yield ion-exchanged copper and small copper crystallites (diameter 1.4 – 2 nm). The importance of the copper crystallites depend mainly on the concentration and amount of impregnating solution trapped in the filter cake and the acidity and amount of the wash solution.

Catalytic activity for the hydrolysis of acrylonitrile is found to depend on copper surface area. Fast deactivation during the early stages of reaction may depend on copper crystallite size. Slower deactivation as a result of copper oxidation is possible unless the solutions are deoxygenated.     

Fractionation of polymers on a preparative scale by precipitation chromatography

A preparative-scale elution chromatographic column is described which will fractionate 45 g. of polymer in a single operation. The size of the column is kept to manageable dimensions by reducing the temperature differential from 50 to 10°C. along the length of the temperature-gradient section. It appears that this change limits the range of molecular weights that are in this section of the column at any one time which leads to a more uniform distribution of a polymer along the column. The net result is that the ratio of polymer load to cubic capacity of the column as a whole can be increased about tenfold over that for the conventional analytical column. It is shown that the equation derived by Caplan is valid under a variety of conditions and that this equation supports the arguments which lead to a reduced temperature differential in the column.     

Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper

Ar ion beam etching (IBE) can be used to roughen a Cu surface and thus improve the adhesion of subsequently spin-coated polyimide (PI) films. During Ar IBE, the surface morphology of sputter-deposited Cu changes from round bumps to a rough cone structure. The ultimate tensile strength (UTS) of the PI/Cu interface is increased for certain specific beam conditions. Under optimal conditions, the UTS of the etched PI/Cu interface (6.2 MPa) is twice that of the unetched PI/Cu interface (3.1 MPa). Cu is detected in the deposited PI by Rutherford backscattering spectrometry (RBS). The amount of Cu at the top surface of the 2.5 μm thick PI film is 0.1 at. %; this is determined by RBS and XPS. While the Cu is dissolved by polyamic acid and diffuses into the PI, an oxygen-rich region is formed in the Cu. The oxygen-rich region in Cu grows from 50 A (approximately Cu₂O) before PI deposition to more than 2000 A (where the oxygen concentration is about 5 at. %) after PI deposition. The oxygen source is not the PI itself but either dissociated oxygen from the water vapor in the PI imidization process or a product of the chemical reaction between Cu and polyamic acid.     

沉淀法去除废水中氯离子

研究沉淀法去除含氯废水中的Cl-。选用CaO和NaAlO2作为处理剂,处理模拟含氯废水,并研究工艺参数的影响。实验结果表明:CaO/NaAlO2=5∶2、温度35℃、溶液初始p H值为10,搅拌反应2hCl-去除率最高。该条件下,二次除氯后Cl-浓度从2847.86mg·L-1降低到254.93mg·L-1,去除率为93.12%。     

Investigation of transport phenomena in a hybrid ion exchange-electrodialysis system for the removal of copper ions

Hybrid ion exchange electrodialysis processes allow the removal of metal ions from dilute waste liquids and the recovery of more concentrated solutions. The work reported here was aimed at investigating the two steps in the treatment process, namely, adsorption of metal ions onto the packed bed of resin and electromigration (i.e., the transport of these ions in the complex system under the applied electrical field). The case of copper sulfate was investigated. Dowex resins with a cross-linking degree of 2 and 8% were used. The flux of copper through the resin bed and the current efficiency for ion transfer to the cathode compartment were determined as a function of potential gradient and copper ionic fraction in the bed. Apparent diffusion coefficients of Cu²⁺ in the overall system were deduced from the experimental data.     

木质素磺酸钠缓蚀、阻垢性能的研究

测定了木质素磺酸钠(木钠)在循环冷却水中的阻垢、缓蚀性能,并和羟基亚乙基二膦酸(HEDP)、氨基三亚甲基膦酸(ATMP)进行了对比。结果表明,木钠对碳酸钙的静态阻垢率较低,20 mg/L时仅为8.24%,而HEDP达到49.86%,ATMP达到47.10%。在低投加量时,木钠的静态缓蚀率较低,并加快了碳钢的腐蚀。随着温度的升高,木钠的静态阻垢率及缓蚀率均降低。     

电站锅炉水垢中铜的形成特点及清洗除铜

简要分析了电站锅炉水垢中铜的形成特点，对化学清洗除铜的方法进行了讨论