Enhancement of thermal and electrical conductivities of cyanoacrylate by addition of carbon based nanofillers

Nanocomposites with addition of graphite nanoparticles, multi-walled carbon nanotubes (MWCNTs), and graphene in cyanoacrylate from 0.1 to 0.5 or 0.6 vol% were fabricated. The influences of morphology towards thermal and electrical conductivities of cyanoacrylate nanocomposites were studied. Microstructure based on field emission scanning electron microscopy and transmission electron microscopy images indicated that nanofillers have unique morphologies which affect the thermal and electrical conductivities of nanocomposites. The maximum thermal conductivity values were measured at 0.3195 and 0.3500 W/mK for 0.4 vol% of MWCNTs/cyanoacrylate and 0.5 vol% of graphene/cyanoacrylate nanocomposite, respectively. These values were improved as high as 204 and 233% as compared with the thermal conductivity of neat cyanoacrylate. Nanocomposites with 0.2 vol% MWCNTs/cyanoacrylate fulfilled the requirement for ESD protection material with surface resistivity of 6.52?×?10⁶ Ω/sq and volume resistivity of 6.97?×?10⁹ Ω m. On the other hand, 0.5 vol% MWCNTs/cyanoacrylate nanocomposite can be used as electrical conductive adhesive. Compared with graphene and graphite nanofillers, MWCNTs is the best filler to be used in cyanoacrylate for improvement in thermal and electrical conductivity enhancement at low filler loading.     

Superior thermal conductivity of single-layer graphene

We report the measurement of the thermal conductivity of a suspended single-layer graphene. The room temperature values of the thermal conductivity in the range approximately (4.84+/-0.44)x10(3) to (5.30+/-0.48)x10(3) W/mK were extracted for a single-layer graphene from the dependence of the Raman G peak frequency on the excitation laser power and independently measured G peak temperature coefficient. The extremely high value of the thermal conductivity suggests that graphene can outperform carbon nanotubes in heat conduction. The superb thermal conduction property of graphene is beneficial for the proposed electronic applications and establishes graphene as an excellent material for thermal management.     

Thermal conductivity of isotopically modified graphene

In addition to its exotic electronic properties graphene exhibits unusually high intrinsic thermal conductivity. The physics of phonons--the main heat carriers in graphene--has been shown to be substantially different in two-dimensional (2D) crystals, such as graphene, from in three-dimensional (3D) graphite. Here, we report our experimental study of the isotope effects on the thermal properties of graphene. Isotopically modified graphene containing various percentages of 13C were synthesized by chemical vapour deposition (CVD). The regions of different isotopic compositions were parts of the same graphene sheet to ensure uniformity in material parameters. The thermal conductivity, K, of isotopically pure 12C (0.01% 13C) graphene determined by the optothermal Raman technique, was higher than 4,000?W?mK(-1) at the measured temperature T(m)~320?K, and more than a factor of two higher than the value of K in graphene sheets composed of a 50:50 mixture of 12C and 13C. The experimental data agree well with our molecular dynamics (MD) simulations, corrected for the long-wavelength phonon contributions by means of the Klemens model. The experimental results are expected to stimulate further studies aimed at a better understanding of thermal phenomena in 2D crystals.     

Low Temperature Thermal Conductivity of PVC

At very low temperatures, the tunnelling theory for amorphous solids predicts a thermal conductivity κ α T^m, with m = 2. However, most of the data in the literature in the temperature range 0.1–1 K report an m < 2. We want to show that this discrepancy often disappears for T→ 0 K. Here we report the case of Polyvinyl Chloride (PVC) whose thermal conductivity is known in the 0.2–100 K temperature range. A new technique is described which makes the measurement of the exponent m of the thermal conductivity independent of the spurious thermal power. Such technique is particularly useful for measurements of κ when working with a low power refrigerator. We carried out measurements down to 50 mK, obtaining a thermal conductivity W/cm K for our PVC sample below 120 mK.     

High thermal conductivity of polymers: Possibility or dream?

Summary Using the simple kinetic formula of thermal conductivity, it is shown that the mean free path is the limiting factor of thermal conductivity. Standard arguments on phonon-phonon interaction lead to realize that isotropic polymers cannot exceed thermal conductivities k 1 W/mK. Orientation of polymers gives a strong enhancement of k in orientation direction, due to the effect of phonon focussing. For the simplest chain, the polyethylene molecule, up to 37 W/mK have been measured. Possible values of 70 W/mK can be extrapolated for material with the modulus of the chain. Even higher values can be envisaged for perfect crystalline material. The integration of such a material must take care of minimizing the boundary resistance to the adjacent solid.     

Graphene woven fabric-reinforced polyimide films with enhanced and anisotropic thermal conductivity

Due to the growing needs of thermal management in modern electronics, polyimide-based (PI) composites are increasingly demanded in thermal interface materials (TIMs). Graphene woven fabrics (GWFs) with a mesh structure have been prepared by chemical vapor deposition and used as thermally conductive filler. With the incorporation of 10-layer GWFs laminates (approximate 12 wt%), the in-plane thermal conductivity of GWFs/PI composite films achieves 3.73 W/mK, with a thermal conductivity enhancement of 1418% compared to neat PI. However, the out-of-plane thermal conductivity of the composites is only 0.41 W/mK. The in-plane thermal conductivity exceeds its out-of plane counterpart by over 9 times, indicating a highly anisotropic thermal conduction of GWFs/PI composites. The thermal anisotropy and the enhanced in-plane thermal conductivity can be attributed to the layer-by-layer stacked GWFs network in PI matrix. Thus, the GWFs-reinforced polyimide films are promising for use as an efficient heat spreader for electronic cooling applications.     

Comparison of the thermal properties between composites reinforced by raw and amino-functionalized carbon materials

Carbon materials, such as graphite oxides, carbon nanotubes and graphenes, have exceptional thermal conductivity, which render them excellent candidates as fillers in advanced thermal interface materials for high density electronics. In this paper, these carbon materials were functionalized with 4,4′-diaminodiphenyl sulphone (DDS), to enhance the bonding between the carbon materials and the resin matrix. Their visibly different properties were investigated. It seems that DDS-functionalization can obviously improve the interfacial heat transfer between the carbon materials and the epoxy matrix. The thermal conductivity enhancement of D-Graphene composites (0.493 W/m K) was about 30% higher than that of D-MWNTs composites (0.387 W/m K) at 0.5 vol.% loading. The different effects among EGO, D-EGO, MWNTs, D-MWNTs and D-Graphene in polymer composites were also discussed. It was demonstrated that DDS-functionalized carbon materials had an obvious effect on the thermal performances of composite materials and were more effective in thermal conductivity enhancement.     

A Superconducting Resonator with a Hafnium Microbridge at Temperatures of 50–350 mK

A high-quality superconducting resonator with a microbridge of hafnium film for use in a circuit for readout a terahertz-band imaging array with frequency division multiplexing is demonstrated experimentally. The variability of the impedance of the bridge at a frequency of 1.5 GHz, which is a key factor in the control of the quality of the resonator, is studied. The bridge, having a thickness of about 50 nm, a critical temperature T_C ≈ 380 mK, and a plan size of 2.5 × 2.5 μm, was connected as a load of a resonator made of niobium film with a thickness of about 100 nm (T_C ~ 9 K). It is shown that the bridge smoothly changes its impedance proportionally to the bias power in the entire temperature range. The effective thermal insulation of the bridge was measured in a dilution cryostat at temperatures of 50–300 mK. Thermal conductivity G of the bridge was calculated and found to be ~4 × 10^–13 W/K, which gives an estimate of the sensitivity of the structure in the bolometric mode NEP ≈ 8 × 10^–19 W/Hz^1/2 at a temperature of 150 mK.     

直接冷却中氮化铝与无氧铜低温真空接触热导的实验研究

以5W／20K小型G-M制冷机为冷源,对低温下氮化铝（AlN）与无氧铜（OFHC）界面的接触热导进行了实验研究和分析。在45～140K内,氮化铝／无氧铜界面接触热导随温度的升高而增大,同时亦随接触压力的增加而增大。实验中同时得到了氮化铝在低温下的热导率,随温度的升高,氮化铝热导率值逐渐增大。就氮化铝低温热导率及氮化铝／无氧铜接触界面热阻随温度变化规律进行了微结构机理分析。     

Enhanced thermal properties of graphene oxide-incorporated polymeric microspheres

Polystyrene (PS) microspheres coated with graphene oxide (GO) were prepared and the variation of their thermal properties according to the GO loading was examined. The GO content in the PS-GO nanocomposites was controlled by the GO dispersions at various concentrations. The GO was coated onto the surface of the PS microspheres through the strong ionic interaction between polyvinylpyrrolidone and the GO sheet. The thermal properties of the GO incorporated PS microspheres were affected by the GO, which disturbed the chain activity and exhibited effective heat shielding. It also delayed the permeation of oxygen and hindered the escape of volatile degradation products from the PS-GO nanocomposites. In addition, the thermal degradation temperature of the nanocomposites was increased above 15 degrees C and their T(g) was also increased above 4.0 degrees C. PS-GO exhibited higher thermal conductivity (0.173 W/mK) than that of pure PS (0.117 W/mK).     

Enhanced thermal conductivity of poly(L-lactide) composites with synergistic effect of aluminum nitride and modified multi-walled carbon nanotubes

Poly (ethylene glycol)-grafted multi-walled carbon nanotubes (PEG-MWNTs) were prepared and added into poly(L-lactide) (PLLA)/aluminum nitride (AlN) composites to obtain PLLA/AlN/PEG-MWNTs nanocomposites. Microstructure and thermal conductivity of the composites were investigated on the basis of the influence of PEG-MWNTs incorporated. The results showed that PEG-MWNTs were well-dispersed in the PLLA matrix and had strong interfacial adhesion with the matrix. The addition of PEG-MWNTs improved the thermal conductivity of PLLA/AlN composites. When 3 wt.% of PEG-MWNTs and 50 wt.% of AlN were both added into the PLLA matrix, the thermal conductivity reached 0.7734 W/mK with enhancement almost by 400% as compared to a neat PLLA. However, the thermal conductivity is 0.3401 W/mK for the PLLA composite with 3 wt.% of PEG-MWNTs and 0.4286 W/mK for the one with 50 wt.% of AlN. The synergistic effect of aggregated AlN particles and well-dispersed MWNTs could form efficient thermal conductive paths for improving the thermal conductivity of PLLA composites greatly.     

Calcined clays as binder for thermal insulating and structural aerogel incorporated mortar

Partial replacement of ordinary Portland cement with calcined clay as binder in the aerogel incorporated mortars (AIM) was shown to decrease their thermal conductivities while maintaining the mechanical strength. It was found that at an aerogel loading of between 40 vol% and 80 vol%, replacement of cement with calcined clay lowered the thermal conductivity by up to 20% when <70 vol% aerogel was present (0.410 W/(mK) to 0.370 W/(mK)), and by up to 40% with >70 vol% aerogel (0.164 W/(mK) to 0.145 W/(mK)), driven mainly by the innate thermal conductivity of the binders. At replacement level of up to ∼30% by weight of binder (%bwob), the properties of the mortar was independent of clay types. When the replacement increased to above 40%bwob, calcined smectite enriched clays were favoured for lowering the thermal conductivities of the mortars as compared to those containing kaolinite.     

Porous Y2SiO5 Ceramic with Low Thermal Conductivity

Porous Y2SiO5 ceramic was fabricated by freeze casting with tert-butyl alcohol as solvent. The porous Y2SiO5 ceramic possessed long straight pore structure. With decreasing solid loading from 20 to 10 vol.%, the porosity of the Y2SiO5 ceramic increased linearly from 45% to 72%, while the compressive strength declined from 23.2 to 3.1MPa. The thermal conductivity of Y2SiO5 decreased from 1.34W/mK for the dense bulk to 0.05 W/mK for the porous body with a porosity of 57%.     

Thermal characterization of gallium arsenic nitride epilayer on gallium arsenide substrate using pulsed photothermal reflectance technique

Thermal conductivity of gallium arsenic nitride (GaAsN) epilayer on gallium arsenide (GaAs) substrate prepared by molecular beam epitaxy technique was measured using pulsed photothermal reflectance technique. Three-layer model incorporated thermal boundary resistance was applied to extract the thermal properties from the sample's photothermal response. Within the thickness ranging from 20 to 80 nm, no thickness dependent relationship with thermal conductivity of GaAsN epilayer was found, and the average thermal conductivity is approximately 27 W/mK at room temperature. The thermal boundary resistance at the Au/GaAsN interface is in the order of 10⁻⁸ m²K/W.     

Magnetically-functionalized self-aligning graphene fillers for high-efficiency thermal management applications

We report on heat conduction properties of thermal interface materials with self-aligning “magnetic graphene” fillers. Graphene enhanced nano-composites were synthesized by an inexpensive and scalable technique based on liquid-phase exfoliation. Functionalization of graphene and few-layer-graphene flakes with Fe₃O₄ nanoparticles allowed us to align the fillers in an external magnetic field during dispersion of the thermal paste to the connecting surfaces. The filler alignment results in a strong increase of the apparent thermal conductivity and thermal diffusivity through the layer of nano-composite inserted between two metallic surfaces. The self-aligning “magnetic graphene” fillers improve heat conduction in composites with both curing and non-curing matrix materials. The thermal conductivity enhancement with the oriented fillers is a factor of two larger than that with the random fillers even at the low ~ 1 wt.% of graphene loading. The real-life testing with computer chips demonstrated the temperature rise decrease by as much as 10 °C with use of the non-curing thermal interface material with ~ 1 wt.% of the oriented fillers. Our proof-of-concept experiments suggest that the thermal interface materials with functionalized graphene and few-layer-graphene fillers, which can be oriented during the composite application to the surfaces, can lead to a new method of thermal management of advanced electronics.     

Synergistic Effect of Aligned Graphene Nanosheets in Graphene Foam for High‐Performance Thermally Conductive Composites

Graphene shows a great potential for high‐performance thermally conductive composite applications because of its extremely high thermal conductivity. However, the graphene‐based polymer composites reported so far only have a limited thermal conductivity, with the highest thermal conductivity enhancement (TCE) per 1 vol% graphene less than 900%. Here, a continuous network of graphene foam (GF), filled with aligned graphene nanosheets (GNs), is shown to be an ideal filler structure for thermally conductive composite materials. Compared to previous reports, a clear thermal percolation is observed at a low graphene loading fraction. The GNs/GF/natural rubber composite shows the highest TCE of 8100% (6.2 vol% graphene loading) ever reported at room temperature, which gives a record‐high TCE per 1 vol% graphene of 1300%. Further analyses reveal a significant synergistic effect between the aligned GNs and 3D interconnected GF, which plays a key role in the formation of a thermal percolation network to remarkably improve the thermal conductivity of the composites. Additionally, the use of this composite for efficient heat dissipation of light‐emitting diode (LED) lamps is demonstrated. These findings provide valuable guidance to design high‐performance graphene‐based thermally conductive materials, and open up the possibility for the use of graphene in high‐power electronic devices.     

Critical assessment of UO2 classical potentials for thermal conductivity calculations

This article reviews the thermal transport properties as predicted by 26 classical interatomic potentials for uranium dioxide, an important nuclear fuel material, determined using a lattice dynamics-based method. The calculations reveal structural instabilities for multiple potentials, as well as the presence of lower energy structures even for potentials in which the fluorite structure is stable. Both rigid atom and shell model potentials are considered, and general trends in their representation of the thermal conductivity are identified. Reviewed classical potentials predict thermal conductivity in the range of ~5–22 W/mK, compared to the experimental value of 8.9 W/mK. The quality of the anharmonicity correction that is based on the correlation between thermal expansion and thermal conductivity is investigated, and it found to generally improve thermal conductivities results.     

液相剥离法制备石墨烯及在导热硅橡胶中的应

采用高速剪切机液相剥离法, 在胆酸钠的水溶液中将鳞片石墨剥离, 离心得到石墨烯分散液。AFM、TEM、Raman表征结果发现, 剥离出的石墨烯厚度小于4层, 尺寸大约在2~3 μm, 高质量缺陷少(I_D/I_G≈0.15)。将石墨烯分散液冷冻干燥后与银粉共同添加到硅橡胶中, 制备出导热硅橡胶。利用稳态热流法测试导热硅橡胶的导热系数发现, 当添加3vol%石墨烯时, 复合材料的导热系数由未添加石墨烯时的4.900 W/(m·K)提高到12.367 W/(m·K)。综上所述, 通过液相剥离法成功制备出缺陷较少的少层石墨烯, 能够与银粉协同提高导热硅橡胶的导热系数。     

Electrical and thermal conductivity of low temperature CVD graphene: the effect of disorder

In this paper we present a study of graphene produced by chemical vapor deposition (CVD) under different conditions with the main emphasis on correlating the thermal and electrical properties with the degree of disorder. Graphene grown by CVD on Cu and Ni catalysts demonstrates the increasing extent of disorder at low deposition temperatures as revealed by the Raman peak ratio, IG/ID. We relate this ratio to the characteristic domain size, La, and investigate the electrical and thermal conductivity of graphene as a function of La. The electrical resistivity, ρ, measured on graphene samples transferred onto SiO2/Si substrates shows linear correlation with La(-1). The thermal conductivity, K, measured on the same graphene samples suspended on silicon pillars, on the other hand, appears to have a much weaker dependence on La, close to K～La1/3. It results in an apparent ρ～K3 correlation between them. Despite the progressively increasing structural disorder in graphene grown at lower temperatures, it shows remarkably high thermal conductivity (10(2)-10(3) W K(-1) m(-1)) and low electrical (10(3)-3×10(5) Ω) resistivities suitable for various applications.     

复合相变储冷材料的制备及性能研究

以十二烷基苯磺酸钠(SDBS)作为分散剂,多层石墨烯、TiO2/石墨烯(m(TiO2):m(石墨烯)=25∶75)和TiO2颗粒作为导热添加剂,加入到二元复合有机储冷材料中(m(壬酸):m(葵醇)=60:40),制备了复合相变储冷材料。通过吸光度、DSC和热导率测试等手段,对复合相变储冷材料的稳定性、相变温度、相变潜热及热导率进行了评价分析。结果表明,分散剂和导热添加剂的加入,对储冷材料的相变温度和相变潜热影响不大,但对热导率影响较大。当分散剂SDBS浓度为0.2 g/L,导热添加剂(分别为TiO2/石墨烯和TiO2颗粒)浓度为0.5 g/L时,复合相变储冷材料具有较好的稳定性,其热导率分别为为0.2211和0.2096 W/(m·K),相比没有加入任何导热添加剂的储冷材料的热导率(0.1738 W/(m·K)),分别提高了27.22%和20.61%;当分散剂SDBS浓度为0.3 g/L,导热添加剂多层石墨烯浓度为0.3 g/L时,复合相变储冷材料处于稳定状态,其热导率为0.2268 W/(m·K),相比0.1738 W/(m·K),提高了30.49%。由此可知,多层石墨烯可以更有效地增加复合相变储冷材料的热导率,这主要是由于石墨烯具有非常高的比表面积,有利于复合材料更加均匀地分散以及形成更加完善的网格结构,从而有效增加复合相变储冷材料的稳定性及热导率。选用多层石墨烯为导热添加剂(0.3 g/L),SDBS为分散剂(0.3 g/L),可以制备出体系最稳定、热导率最高的复合相变储冷材料。