Low-temperature deposition of iridium thin films by pulsed laser deposition

Extremely smooth iridium (Ir) thin films were deposited on Si(1 0 0) substrate at lower temperature than 300 °C by pulsed laser deposition (PLD) technique using Ir target in a vacuum atmosphere. The crystal orientation, surface morphology, and resistivity of the Ir thin films were systematically determined as a function of substrate temperature. Well-crystallized and single-phase Ir thin films with (1 1 1) preferred orientation were obtained at substrate temperature of 200-300 °C. The surface roughness increased with the increasing of substrate temperature. Likewise, the room-temperature resistivity of Ir thin films decreased with increasing substrate temperature, showing a low value of (10.7±0.1) μΩ cm at 300 °C.     

Cracking behavior of evaporated amorphous silicon films

The residual stress in amorphous silicon films deposited by evaporation is investigated with different substrate temperatures. The stress measured from all the films studied in this paper is tensile. The level of stress decreases from 580 MPa to 120 MPa with increasing substrate temperature from 60 °C to 350 °C. When the film becomes thicker, strain increases and cracks are formed for stress relaxation. 10 µm thick amorphous Si films are deposited at 350 °C without cracks. This cracking behavior is theoretically studied and confirmed by experiment.     

Growth and characterization of Bi2Se3 thin films by pulsed laser deposition using alloy target

Bi₂Se₃ thin films were deposited on the (100) oriented Si substrates by pulsed laser deposition technique at different substrate temperatures (room temperature −400 °C). The effects of the substrate temperature on the structural and electrical properties of the Bi₂Se₃ films were studied. The film prepared at room temperature showed a very poor polycrystalline structure with the mainly orthorhombic phase. The crystallinity of the films was improved by heating the substrate during the deposition and the crystal phase of the film changed to the rhombohedral phase as the substrate temperature was higher than 200 °C. The stoichiometry of the films and the chemical state of Bi and Se elements in the films were studied by fitting the Se 3d and the Bi 4d5/2 peaks of the X-ray photoelectron spectra. The hexagonal structure was seen clearly for the film prepared at the substrate temperature of 400 °C. The surface roughness of the film increased as the substrate temperature was increased. The electrical resistivity of the film decreased from 1 × 10⁻³ to 3 × 10⁻⁴ Ω cm as the substrate temperature was increased from room temperature to 400 °C.     

Low temperature annealing effects on the structure and optical properties of ZnO films grown by pulsed laser deposition

ZnO thin films were deposited on glass substrates at room temperature (RT) ∼500 °C by pulsed laser deposition (PLD) technique and then were annealed at 150-450 °C in air. The effects of annealing temperature on the microstructure and optical properties of the thin films deposited at each substrate temperature were investigated by XRD, SEM, transmittance spectra, and photoluminescence (PL). The results showed that the c-axis orientation of ZnO thin films was not destroyed by annealing treatments; the grain size increased and stress relaxed for the films deposited at 200-500 °C, and thin films densified for the films deposited at RT with increasing annealing temperature. The transmittance spectra indicated that E_g of thin films showed a decreased trend with annealing temperature. From the PL measurements, there was a general trend, that is UV emission enhanced with lower annealing temperature and disappeared at higher annealing temperature for the films deposited at 200-500 °C; no UV emission was observed for the films deposited at RT regardless of annealing treatment. Improvement of grain size and stoichiometric ratio with annealing temperature can be attributed to the enhancement of UV emission, but the adsorbed oxygen species on the surface and grain boundary of films are thought to contribute the annihilation of UV emission. It seems that annealing at lower temperature in air is an effective method to improve the UV emission for thin films deposited on glass substrate at substrate temperature above RT.     

Studies on the residual stress of fluorine-doped SnO2 film deposited by chemical vapor deposition

Fluorine-doped tin oxide films were deposited on Na-Ca-Si glass substrate at 650 °C by chemical vapor deposition, and then heat treatment was carried out at 200 °C, 400 °C and 600 °C for 4 min in a resistance furnace. The residual stress in SnO₂:F films was systematically measured using the sin²Ψ method based on X-ray diffraction. The incidence angle was adopted as Ψ = 0°, 15°, 20°, 25° and 30°. The results showed that the films were polycrystalline with tetragonal SnO₂ structure, together with a weak peak of SnO phase. All the films exhibited a preferred orientation with the (200) plane. The minimum value of residual stress (− 0.24 ± 0.01 GPa) was obtained when the films were heat-treated at 200 °C.     

Substrate temperature dependent morphology and resistivity of pulsed laser deposited iridium oxide thin films

Iridium oxide (IrO₂) thin films were deposited on Si (100) substrates by means of pulsed laser deposition technique at various substrate (deposition) temperatures ranging from 250 to 500 °C. Effects of substrate temperature on the crystalline nature, morphology and electrical properties of the deposited films were analyzed by using X-ray diffraction, Raman spectroscopy, Scanning electron microscopy and four-point probe method. It was found that the above properties were strongly dependent on the substrate temperature. The as-deposited films at all substrate temperatures were polycrystalline tetragonal IrO₂ and the preferential growth orientation changed with the substrate temperature. IrO₂ films exhibited fairly homogeneous thickness and good adhesion with the substrate, the average feature size increases with the substrate temperature. The room-temperature resistivity of IrO₂ films decreased with the increase of substrate temperature and the minimum resistivity of (42 ± 6) μΩ cm was obtained at 500 °C. The resistivity of IrO₂ films correlated well with the corresponding film morphology changes.     

Effects of substrate temperature on tin-doped indium oxide films deposited by dc arc discharge ion plating

Indium tin oxide (ITO) films were deposited on glass substrate at temperatures ranging from room temperature to 120 °C by the dc arc discharge ion plating technique. The electrical properties and crystallinity of ITO films were investigated. The resistivity of ITO films decreased with the increase of the substrate temperature in deposition, mostly due to increase in Hall mobility above 90 °C. The resistivity of ITO film obtained at temperature 120 °C was 1.33×10⁻⁴ Ω cm. The ITO films crystallized at the substrate temperature higher than 90 °C and the grain size estimated from the (2 2 2) peak in the direction parallel to the surface of the substrate became large with the increase of the substrate temperature. That the Hall mobility increased with the increase of the substrate temperature was speculated to be due to the increase of the grain size in the direction parallel to the surface.     

Novel properties of AZO film sputtered in Ar+H2 ambient at high temperature

AZO (ZnO:Al) transparent conductive thin film was prepared by RF magnetron sputtering with a AZO (98 wt% ZnO 2 wt% Al₂O₃) ceramic target in the same Ar+H₂ ambient at different substrate temperatures ranging from 100 to 300 °C. The minimum resistivity of AZO films was 7.9×10⁻⁴ Ω cm at the substrate temperature of 200 °C. The average transmission in the visible rang was more than 90%. Scanning electron microscopy and XRD analyses showed that the surface morphology of the AZO samples altered with the increasing of the substrate temperature. AZO film prepared at 200 °C in the pure Ar ambient was also made as comparison about the resistivity, carrier concentration and the average crystallite size. The resistivity became about 3 times higher. The carrier concentration became lower and the average crystallite size was smaller.     

Evolution of structure and properties of multi-component (AlCrTaTiZr)Ox films

(AlCrTaTiZr)O_x films were deposited at 350 °C by DC magnetron sputtering from high-entropy alloy target. Oxygen concentration increases with oxygen flow ratio, and saturates near 67 at.%. As-deposited films have an amorphous structure. Their hardness fall in the range of 8-13 GPa. All amorphous oxide films maintain their amorphous structure up to 800 °C for at least 1 h. After 900 °C 5 h annealing, crystalline phases with the structures of ZrO₂, TiO₂, or Ti₂ZrO₆ form. Annealing enhances mechanical properties of the films. Their hardness and modulus attain to the values about 20 and 260 GPa, respectively. The resistivity of the metallic films is around 10² μΩ cm but drastically rises to 10¹² μΩ cm when oxygen concentration increases.     

The electrical and optical properties of indium zinc tin oxide thin films with different Sn/Zn ratio

Indium zinc tin oxide (IZTO) thin films with two different chemical compositions, i.e. IZTO15 and IZTO25, where In content was fixed at 60 at.% and Sn content was 15 and 25 at.%, respectively, were deposited onto alkaline-free glass substrate at temperature from 37 °C to 600 °C. The deposition process was carried out in argon using an RF magnetron sputter. After deposition, the films were annealed in argon atmosphere at 450 °C for 30 min. The effect of substrate temperature and annealing treatment was investigated, and the minimum resistivity value of 3.44 × 10^− 4Ω.cm was obtained from the film deposited at 400 °C using IZTO25 target followed by rapid thermal annealing at 450 °C for 30 min. The average optical transmittance was kept fairly high over 80%. It was proven that both substrate temperature and thermal annealing were important parameters in lowering the electrical resistivity without deteriorating optical properties.     

C-Ti nanocomposite thin films: Structure, mechanical and electrical properties

Carbon-titanium nanocomposite thin films were deposited by DC magnetron sputtering on oxidized silicon substrates in argon. The films were prepared at different deposition temperatures between 25 and 800 °C. Transmission electron microscopy was used to determine the structure of the films. All the C-Ti nanocomposites consisted of columnar TiC structure with average column width ∼10 and 20 nm and a thin carbon matrix. The thickness of the carbon matrix between adjacent TiC columns was ∼2-5 nm.Mechanical properties (hardness, reduced modulus) of C-Ti films showed a distinct variation depending on the deposition temperature. Films deposited at 200 °C had the highest hardness ∼18 GPa and the highest reduced modulus ∼205 GPa.Temperature dependence of the film resistance was measured between 80 and 330 K. C-Ti nanocomposites have a non-metallic conduction mechanism characterized by a negative temperature coefficient of resistivity (TCR). The most negative TCR was observed for films showing high hardness and reduced modulus of elasticity.     

Effect of the [Al/Zn] ratio in the starting solution and deposition temperature on the physical properties of sprayed ZnO:Al thin films

Aluminum-doped zinc oxide thin films (ZnO:Al) were deposited on sodocalcic glass substrates by the chemical spray technique, using zinc acetate and aluminum pentanedionate as precursors. The effect of the [Al/Zn] ratio in the starting solution, as well as the substrate temperature, on the physical characteristic of ZnO:Al thin films was analyzed. We have found that the addition of Al to the starting solution decreases the electrical resistivity of the films until a minimum value, located between 2 and 3 at.%; a further increase in the [Al/Zn] ratio leads to an increase in the resistivity. A similar resistivity tendency with the substrate temperature was encountered, namely, as the substrate temperature is increased, a minimum value of around 475 °C in almost all the cases, was obtained. At higher deposition temperatures the film resistivity suffers an increase. After a vacuum-thermal treatment, performed at 400 °C for 1 h, the films showed a resistivity decrease about one order of magnitude, reaching a minimum value, for the films deposited at 475 °C, of 4.3 × 10^− 3 Ω cm.The film morphology is strongly affected by the [Al/Zn] ratio in the starting solution. X-ray analysis shows a (002) preferential growth in all the films. As the substrate temperature increases it is observed a slight increase in the transmittance as well as a shift in the band gap of the ZnO:Al thin films.     

Effect of annealing on the characteristics of Au layers grown on the high-temperature deposited Ni50Fe50 layers

80 nm-thick Ni₅₀Fe₅₀ layers were sputter-deposited on glass substrates at 400 °C and then Au layers were sputter-deposited on the Ni₅₀Fe₅₀ layers. The Au/Ni₅₀Fe₅₀ bilayer films were annealed in a vacuum of 5×10⁻⁴ Pa from 250 to 450 °C for 30 min or 90 min. The characteristics of the Au layers were studied by Auger electron spectroscopy, field emission scanning electron microscopy, X-ray diffraction and a four-point probe technique. When the annealing temperature reaches 450 °C, Fe and Ni atoms diffuse markedly into the Au layer and the Fe content is more than the Ni content. When the annealing temperature is lower than 450 °C, the grain size of the Au layers does not change markedly with annealing temperature. However, as the annealing temperature reaches 450 °C, the annealing promotes the grain growth of the Au layer. As the annealing temperature exceeds 300 °C, the resistivity of the bilayer films increases with increasing annealing temperature. The diffusion of Fe and Ni atoms into the Au layer results in an increase in the resistivity of the annealed bilayer film. Large numbers of Fe and Ni atoms diffusing into the Au layer of the annealed Au/Ni₅₀Fe₅₀ bilayer film lead to a significant decrease in the lattice constant of the Au layer.     

Effect of annealing temperature on ZnO:Al/p-Si heterojunctions

Al-doped, zinc oxide (ZnO:Al) films with a 1.2 at.% Al concentration were deposited on p-type silicon wafers using a sol-gel dip coating technique to produce a ZnO:Al/p-Si heterojunction. Following deposition and subsequent drying processes, the films were annealed in vacuum at five different temperatures between 550 and 900 °C for 1 h. The resistivity of the films decreased with increasing annealing temperature, and an annealing temperature of 700 °C provided controlled current flow through the ZnO:Al/p-Si heterojunction up to 20 V. The ZnO:Al film deposited on a p-type silicon wafer with 1.2 at.% Al concentration was concluded to have the potential for use in electronic devices as a diode after annealing at 700 °C.     

Effect of substrate temperatures on the electrical resistivity of thermally evaporated Mn thin films

Resistivity measurements have been performed on three samples of Mn thin films from 300 to 1.4 K using the van der Pauw four probe technique. The films were grown by thermal evaporation onto glass substrates held at 523, 323 and 77 K, respectively in a bell jar held at 6 × 10⁻⁶ Torr. The resistivity-temperature results of the three specimens reveal a variety of low temperature behaviours. A behaviour typical of the bulk α-Mn is obtained with the film grown at a substrate temperature of 523 K whilst with the film grown at a substrate temperature of 323 K, the resistivity tends to a saturation at low temperatures exhibiting a behaviour reminiscent of Kondo scattering. The resistivity-temperature behaviour of the sample held at a substrate temperature of 77 K may be regarded as typical of a metallic alloy glass with a negative temperature coefficient of resistivity at high temperatures and this turns to a T² dependence of resistivity at very low temperatures.     

Effect of deposition angle on the structure and properties of pulsed-DC magnetron sputtered TiAlN thin films

This article reports the comparison of structure and properties of titanium aluminum nitride (TiAlN) films deposited onto Si(100) substrates under normal and oblique angle depositions using pulsed-DC magnetron sputtering. The substrate temperature was set at room temperature, 400 °C and 650 °C, and the bias was kept at 0, − 25, − 50, and − 80 V for both deposition angles. The surface and cross-section of the films were observed by scanning electron microscopy. It was found that as the deposition temperature increases, films deposited under normal incidence exhibit distinct faceted crystallites, whereas oblique angle deposited (OAD) films develop a kind of “tiles of a roof” or “stepwise structure”, with no facetted crystallites. The OAD films showed an inclined columnar structure, with columns tilting in the direction of the incident flux. As the substrate temperature was increased, the tilting of columns nearly approached the substrate normal. Both hardness and Young's modulus decreases when the flux angle was changed from α = 0° to 45° as measured by nanoindentation. This was attributed to the voids formed due to the shadowing effect. The crystallographic properties of these coatings were studied by θ-2θ scan and pole figure X-ray diffraction. Films deposited at α = 0° showed a mixed (111) and (200) out-of-plane orientation with random in-plane alignment. On the other hand, films deposited at α = 45° revealed an inclined texture with (111) orientation moving towards the incident flux direction and the (200) orientation approaching the substrate normal, showing substantial in-plane alignment.     

Low-temperature preparation of phosphorus doped μc-Si:H thin films by low-frequency inductively coupled plasma assisted chemical vapor deposition

The phosphorus doped n-type hydrogenated microcrystalline silicon (n-μc-Si:H) thin films are prepared, at the two low substrate temperatures of room temperature and 200 °C, through a low-frequency inductively coupled plasma assisted chemical vapor deposition. The effect of the substrate temperature on the structural properties of the thin films, such as the X-ray Diffraction (XRD) patterns and the Raman spectra, is studied. The XRD measurements show that the diffraction orientations of the thin films present an obvious change when the radio frequency power is increased from 1300 W to 2300 W. The Raman spectra of the thin films deposited at room temperature unambiguously present a phase transition from the amorphous structure to microcrystalline structure whereas no structural phase transition is observed for the thin films deposited at 200 °C. The effect of the substrate temperature on the crystalline volume fraction of the thin films presents a large difference for the radio frequency power in the range of 1300 W-1700 W, while the difference becomes small when the power is increased from 1700 W to 2300 W. The deposition rate and the radio frequency power-sheet resistance curve of the thin films deposited at room temperature are obviously different from those of the thin films prepared at 200 °C. It is attributed to the joint effect of the radio frequency power and substrate temperature on the doping concentration. The electron energy distribution function of the species in the chamber is mainly distributed in a low energy range.     

Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature

Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s⁻¹, for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the technique. The components of the stress tensor were obtained using measurements at three different φ angles of 0°, 45° and 90°. The crystallite sizes as a function of substrate temperature and ψ angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with ψ angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed.     

Structural, optical, and electrical properties of tin sulfide thin films grown by spray pyrolysis

Tin sulfide (SnS) thin films have been prepared by spray pyrolysis (SP) technique using tin chloride and N, N-dimethylthiourea as precursor compounds. Thin films prepared at different temperatures have been characterized using several techniques. X-ray diffraction studies have shown that substrate temperature (T_s) affects the crystalline structure of the deposited material as well as the optoelectronic properties. The calculated optical band gap (E_g) value for films deposited at T_s = 320-396 °C was 1.70 eV (SnS). Additional phases of SnS₂ at 455 °C and SnO₂ at 488 °C were formed. The measured electrical resistivity value for SnS films was ∼ 1 × 10⁴ Ω-cm.     

Structural and optical analysis of nanocrystalline thin films of mixed rare earth oxides (Y1-xErx)2O3

Nanocrystalline thin films of mixed rare earth oxides (Y_1-xEr_x)₂O₃(0.1 ≤ x ≤ 1) were deposited by electron beam evaporation technique on polished fused silica glass at different substrate temperatures (200-500 °C). The effect of the substrate temperature as well as the mixing parameter (x) on the structural and optical properties of these films has been investigated by using X-ray diffraction (XRD), energy dispersive x-ray analysis and optical spectrophotometry. XRD investigation shows that mixed rare earth oxides film (Y_1-xEr_x)₂O₃ grown at lower substrate temperature (T_s ≤ 300 °C) are poorly crystalline, whereas films grown at higher substrate temperatures (T_s ≥ 400 °C) tend to have better crystallinity. Furthermore, the mixing parameter (x) was found to stabilize the cubic phase over the entire of 0.1 ≤ x ≤ 1. The crystallite size of the films was found to vary in the range from 25 to 39 nm. Optical band gap of the films was deterimined by analysis of the absoprtion coeffifcient. For films deposited at different substrate temperatures direct and indirect transitions occur with energies varied from 5.29 to 5.94 eV and from 4.23 to 4.51 eV, respectively. However, films of different composition x, give optical band gap varied from 6.14 to 5.86 eV for direct transition and from 5.23 to 4.22 eV for indirect transitions. Consequently, one may conclude that it is possible to tune the energy band gap by relative fraction of constituent oxides. It was found that optical constants increase with increasing the substrate temperature. Nevertheless, the values of n and k decrease with increasing the mixing parameter, x.