Investigation of the properties of diamond-like carbon thin films deposited by single and dual-mode plasma enhanced chemical vapor deposition

In this study diamond-like carbon (DLC) films were deposited by a dual-mode (radio frequency/microwave) reactor. A mixture of hydrogen and methane was used for deposition of DLC films. The film structure, thickness, roughness, refractive index of the films and plasma elements were investigated as a function of the radio frequency (RF) and microwave (MW) power, gas ratio and substrate substance. It was shown that by increasing the H₂ content, the refractive index grows to 2.63, the growth rate decreases to 10 (nm/min) and the surface roughness drops to 0.824 nm. Taking into consideration the RF power it was found that, as the power increases, the growth rate increases to 11.6 (nm/min), the variations of the refractive index and the roughness were continuously increasing, up to a certain limit of RF power. The Raman G-band peak position was less dependent on RF power for the glass substrate than that of the Si substrate and a converse tendency exists with increasing the hydrogen content. Adding MW plasma to the RF discharge (dual-mode) leads to an increase of the thickness and roughness of the films, which is attributed to the density enhancement of ions and radicals. Also, optical emission spectroscopy is used to study the plasma elements.     

Hydrogenated amorphous carbon and carbon nitride films deposited at low pressure by plasma enhanced chemical vapor deposition

Hydrogenated amorphous carbon (a-C:H) films were deposited by plasma enhanced chemical vapor deposition from methane, argon diluted methane, and nitrogen diluted methane at 26.7 Pa with a 13.56 MHz RF power supply. In this pressure regime, multiple-scattering of carbon species within the plasma phase is expected during the transport to the substrates placed on both the driven and the earthed electrodes. These films were analyzed using UV-VIS optical transmittance, monochromatic ellipsometry, Raman spectroscopy and current-voltage measurements. From these results, the effect of the plasma conditions and the effective flux of the carbon species controlled by the input power through the negative self bias are found to be important in the deposition process. The growth conditions at the higher pressure regime are important to synthesize a-C:H films from low energetic carbon species, since it reduces the defect density and improves the quality of the films. Furthermore, the effect of nitrogen on the growth conditions of a-C:H:N films is observed.     

Evolution of structural and optical properties of nanostructured silicon carbon films deposited by plasma enhanced chemical vapour deposition

Nanostructured silicon carbon films composed of silicon nanocrystallites embedded in hydrogenated amorphous silicon carbon matrix have been deposited by plasma enhanced chemical vapour deposition technique using silane and methane gas mixture highly diluted in hydrogen. The structural and optical properties of the films have been investigated by X-ray diffraction, Raman, Fourier transform infrared, ultra violet-visible-near infrared and photoluminescence spectroscopies while the composition of the films has been obtained from nuclear techniques. The study has demonstrated that the structure of the films evolves from microcrystalline to nanocrystalline phase with the increase in radio frequency (rf) power. Further, it is shown that with increasing the rf power the size of silicon nanocrystallites decreases while the optical gap increases and a blueshift of visible room temperature photoluminescence peak can be observed.     

Ultrafast deposition of silicon nitride and semiconductor silicon thin films by hot wire chemical vapor deposition

The technology of Hot Wire Chemical Vapor Deposition (HWCVD) or Catalytic Chemical Vapor Deposition (Cat-CVD) has made great progress during the last couple of years. This review discusses examples of significant progress. Specifically, silicon nitride deposition by HWCVD (HW-SiN_x) is highlighted, as well as thin film silicon single junction and multijunction junction solar cells. The application of HW-SiN_x at a deposition rate of 3 nm/s to polycrystalline Si wafer solar cells has led to cells with 15.7% efficiency and preliminary tests of our transparent and dense material obtained at record high deposition rates of 7.3 nm/s yielded 14.9% efficiency. We also present recent progress on Hot-Wire deposited thin film solar cells. The cell efficiency reached for (nanocrystalline) nc-Si:H n-i-p solar cells on textured Ag/ZnO presently is 8.6%. Such cells, used in triple junction cells together with Hot-Wire deposited proto-Si:H and plasma-deposited SiGe:H, have reached 10.9% efficiency. Further, in our research on utilizing the HWCVD technology for roll-to-roll production of flexible thin film solar cells we recently achieved experimental laboratory scale tandem modules with HWCVD active layers with initial efficiencies of 7.4% at an aperture area of 25 cm².     

Massive stress changes in plasma-enhanced chemical vapor deposited silicon nitride films on thermal cycling

Massive irreversible increases in tensile stress (up to 2 GPa) on thermal cycling are demonstrated for plasma-enhanced chemical vapor deposited (PECVD) silicon nitride films. Results give further evidence for the claim that this phenomenon is generic to PECVD films and is attributable to the removal of bonded hydrogen: the magnitude of stress increase is independent of the film stress and can be accounted for with a calculation involving the amount of evolved hydrogen. The massive stress changes cause film fracture in most of the films discussed here, with a large diversity of fracture behavior exhibited. The effects of deposition conditions (temperature, plasma frequency, substrate) on film modulus, hardness and coefficient of thermal expansion, as well as stress and stress hysteresis are also examined.     

Preparation of LaRuO3 films by microwave plasma-enhanced chemical vapor deposition

LaRuO₃ films were prepared by microwave plasma-enhanced chemical vapor deposition, and the effects of La/Ru supply ratio (R_La/Ru) and microwave power (P_M) on phase and microstructure were investigated. Amorphous films of carbonate or hydroxide of La were formed without microwave irradiation. At R_La/Ru < 1.0, RuO₂ films were obtained independent of P_M. At R_La/Ru = 1.6-3.2 and P_M = 0.6-1.2 kW (deposition temperatures of 973-998 K), LaRuO₃ single phase films were prepared. A product mixture of La₂RuO₅ and β-La₃RuO₇ was obtained at R_La/Ru = 4 and P_M = 1.2 kW, while a mixture of RuO₂ and La_4.87Ru₂O₁₂ was formed at R_La/Ru = 4.6 and P_M = 0.6 kW. LaRuO₃ single phase films showed metallic conduction with a high electrical conductivity of 1.6 × 10⁴ S m^− 1 at room temperature.     

Growth and properties of silicon nitride films prepared by low pressure chemical vapor deposition using trichlorosilane and ammonia

Amorphous silicon nitride (a-SiN_x) films were prepared by low pressure chemical vapor deposition from SiHCl₃(Trichlorosilane, TCS)---NH₃---N₂ system to obtain stoichiometric film with low hydrogen content. The growth kinetics was investigated as a function of total pressure, NH₃/TCS flow ratio and deposition temperature. The film compositions and topography were characterized by X-ray photoelectron spectroscopy, Auger depth profile, Fourier transform infrared spectroscopy, elastic recoil detection and atomic force microscopy, respectively. The growth rate of the films follows an Arrhenius behavior with apparent activation energy of 171 kJ mol⁻¹ between 730 and 830 °C. At lower NH₃/TCS flow rate ratios, silicon-rich a-SiN_x films were obtained while all deposits were stoichiometric with a N/Si atomic ratio of approximately 1.30–1.33 as the ratios is higher. The hydrogen content of the prepared a-SiN_x films is 1.2 at.% that is approximately 15 times lower than those of traditional PECVD films and approximately three times lower than those of previous LPCVD films using silane or dichlorosilane and ammonia. The surface topography of the prepared film is smooth and uniform with a root mean square roughness value of 0.47 nm.     

The effects of plasma pre-treatment and post-treatment on diamond-like carbon films synthesized by RF plasma enhanced chemical vapor deposition

Diamond-like carbon (DLC) films were synthesized by RF plasma enhanced chemical vapor deposition and the effects of plasma pre-treatment and post-treatment on the DLC films were investigated. Experimental results show that the surface roughness of the substrate, ranging from 0.2 to 1.2 nm, created by the plasma pre-treatment, will affect the surface roughness of the DLC films deposited using methane as the carbon source. However, the film surface roughness (0.1-0.4 nm) is much smaller than that of the substrate. Raman analysis and hardness measurement by nanoindentation indicate that the structure and the hardness of the DLC films are relatively unchanged for the film surface roughness investigated. For the argon or hydrogen plasma post-treatment of the DLC films deposited using acetylene as the carbon source, it is found that surface roughness decreases with the post-treatment time. Although the hardness decreases after post-treatment, it remains relatively constant with increasing post-treatment time.     

Properties of fluorinated silica glass deposited at low temperature by atmospheric plasma-enhanced chemical vapor deposition

The atmospheric pressure plasma-enhanced chemical vapor deposition of fluorinated silica glass was demonstrated at a temperature of 120 °C. The process was carried out by simultaneously feeding tetramethylcyclotetrasiloxane (TMCTS) and triethoxyfluorosilane (TEOFS) into the afterglow of helium and oxygen plasma. The effect of the flow rate of the fluorinated precursor on the growth rate, composition, and optical properties was examined. The ratio of atomic fluorine to atomic silicon increased up to 10% at a TEOFS/TMCTS atomic Si feed ratio of 1.3 and then leveled off. Coatings made from pure TMCTS and both precursors showed higher surface roughness and porosity, and more hydroxyl content compared to coatings made from pure TEOFS. The refractive indices at 633 nm of films produced using pure TMCTS, a TEOFS/TMCTS atomic Si feed ratio of 1.3 and pure TEOFS were 1.457, 1.449, and 1.411, respectively.     

Nanoindentation stress-strain curves of plasma-enhanced chemical vapor deposited silicon oxide thin films

Plasma-enhanced chemical vapor deposited (PECVD) silicon oxide (SiO_x) thin films have been widely used in Micro/Nano Electro Mechanical Systems to form electrical and mechanical components. In this paper, we explore the use of nanoindentation techniques as a method of measuring equivalent stress-strain curves of the PECVD SiO_x thin films. Four indenter tips with different geometries were adopted in our experiments, enabling us to probe the elastic, elasto-plastic, and fully plastic deformation regimes of the PECVD SiO_x thin films. The initial yielding point (σ_I) and stationary yielding point (σ_II) are separately identified for the as-deposited and annealed PECVD SiO_x thin films, as well as a standard fused quartz sample. Based on the experimental results, a shear transformation zone based amorphous plasticity theory is applied to depict the plastic deformation mechanism in the PECVD SiO_x.     

Bulge testing and fracture properties of plasma-enhanced chemical vapor deposited silicon nitride thin films

The mechanical properties and fracture behavior of silicon nitride (SiN_x) thin film fabricated by plasma-enhanced chemical vapor deposition is reported. Plane-strain moduli, prestresses, and fracture strengths of silicon nitride thin films deposited both on a bare Si substrate and on a thermally oxidized Si substrate were extracted using bulge testing combined with a refined load-deflection model of long rectangular membranes. The plane-strain moduli and prestresses of SiN_x thin films have little dependence on the substrates, that is, for the bare Si substrate, they are 133 ± 19 GPa and 178 ± 22 MPa, respectively, while for the thermally oxidized substrate, they are 140 ± 26 GPa and 194 ± 34 MPa, respectively. However, the fracture strength values of SiN_x films grown on the two substrates are quite different, i.e., 1.53 ± 0.33 GPa and 3.08 ± 0.79 GPa for the bare Si substrate and the oxidized Si substrate, respectively. The reference stresses were computed by integrating the local stress of the membrane at the fracture over the edge, surface, and volume of the specimens and fitted with the Weibull distribution function. For SiN_x thin film produced on the bare Si substrate, the volume integration gave a significantly better agreement between data and model, implying that the volume flaws are the dominant fracture origin. For SiN_x thin film grown on the oxidized Si substrate, the fit quality of surface and edge integration was significantly better than the volume integration, and the dominant surface and edge flaws could be caused by buffered HF attacking the SiN_x layer during SiO₂ removal.     

Growth of long aligned carbon nanotubes on amorphous hydrogenated silicon nitride by thermal chemical vapor deposition

Vertically aligned long carbon nanotubes in the range of 80-100 µm have been synthesized on amorphous hydrogenated silicon nitride (a-SiN_x:H) coated silicon substrate by thermal chemical vapor deposition of ferrocene and xylene. It is observed that high temperature annealing in oxygen ambient results in formation of crystalline silicon dioxide in the matrix of amorphous silicon nitride due to out diffusion of hydrogen. It is suggested that active sites created on silicon dioxide and a-SiN_x:H clusters provide mechanical support for the alignment of long carbon nanotubes. It is proposed that a thin layer of a-SiN_x:H prevents silicide formation between the catalyst (Fe) and silicon thus lengthening the catalyst life.     

Structural and optical properties of four-hexagonal polytype nanocrystalline silicon carbide films deposited by plasma enhanced chemical vapor deposition technique

Four-hexagonal polytype films of nanocrystalline silicon carbide (4H-nc-SiC) were deposited by plasma enhanced chemical vapor deposition method with more than 3×10⁴ W m⁻² threshold of power density, high hydrogen dilution ratio, and bias pretreatment. The source gases were silane, methane and hydrogen. Our work showed that under conditions similar to those used for the growth of μc-SiC—except a higher power densities over a threshold, a bigger bias pretreatment on substrates, and a moderate bias deposition—nc-SiC films could indeed be achieved. The Raman spectra and transmission electron microscopy diffraction patterns demonstrated that the as-grown films from the H₂-CH₄-SiH₄ plasma consist of amorphous network and phase-pure crystalline silicon carbide which has the 4H polytype structure. The microcolumnar 4H-SiC nanocrystallites of a mean size of approximately 1.6×10⁻⁸ m in diameter are encapsulated by amorphous SiC networks. The photoluminescence spectra of 4H-SiC at room temperature, peaking at 8.10×10⁻⁷ m using a wavelength of 5.145×10⁻⁷ m of argon ion laser, were obtained at room temperature; the luminescence mechanism is thought to be related to transitions in the energy band gap which could be ascribed to the surface states and defects in the structure of 4H-SiC nanocrystalline in these films due to its small size. The as-grown films showed an optical transmittance of 89% at 6.58×10⁻⁷ m. This higher transmittance is believed to be from the small size and amorphous matrix.     

Characterization and tribological application of diamond-like carbon (DLC) films prepared by radio-frequency plasma-enhanced chemical vapor deposition (RF-PECVD) technique

Diamond-like carbon (DLC) films were successfully prepared on glass substrates and surfaces of selenium drums via radio frequency plasma enhanced chemical vapor deposition method. The microstructure, surface morphology, hardness, film adhesion, and tribological properties of the films were characterized and evaluated by X-ray photoelectron spectroscopy, atomic force microscopy, and micro-sclerometer and friction-wear spectrometer. The results showed that DLC films have smooth surfaces, homogeneous particle sizes, and excellent tribological properties, which can be used to improve the surface quality of the selenium drums and prolong their service life.     

Optical study of ion-deposited diamond-like carbon films using spectroscopic ellipsometry

Spectroscopic ellipsometry was used for the characterization of ion-deposited diamond-like carbon (DLC) films, including the determination of film thickness and optical properties of DLC. The measured spectra in the wavelength range from 300 to 850 nm were analyzed with an appropriate fitting model, which was constructed according to the nominal sample structure in which the optical properties of DLC were described by a Cauchy dispersion model. Reasonably good agreement was found between the measured and calculated spectra for all samples studied, indicating that the models used were appropriate and that the calculated results were reliable. The results of our analysis suggest that, under the same deposition conditions (i.e., same substrate temperature and same chamber pressure), the optical properties of ion-deposited DLC film did not change much even if the film was prepared with quite different gas flow ratios.     

Effect of the substrate on the properties of ZnO-MgO thin films grown by atmospheric pressure metal-organic chemical vapor deposition

The ZnO-MgO alloys possess attractive properties for possible applications in optoelectronic and display devices; however, the optical properties are strongly dependent on the deposition parameters. In this work, the effect of the glassy and metallic substrates on the structural, morphological and optical properties of ZnO-MgO thin films using atmospheric pressure metal-organic chemical vapor deposition was investigated at relatively low deposition temperature, 500 °C. Magnesium and zinc acetylacetonates were used as the metal-organic source. X-ray diffraction experiments provided evidence that the kind of substrates cause a deviation of c-axis lattice constant due to the constitution of a oxide mixture (ZnO and MgO) in combination with different intermetallic compounds(Mg₂Zn₁₁ and Mg₄Zn₇) in the growth films. The substitutional and interstitial sites of Mg²⁺ instead of Zn²⁺ ions in the lattice are the most probable mechanism to form intermetallic compounds. The optical parameters as well as thickness of the films were calculated by Spectroscopic Ellipsometry using the classical dispersion model based on the sum of the single and double Lorentz and Drude oscillators in combination with Kato-Adachi equations, as well as X-ray reflectivity.     

Adherent amorphous hydrogenated carbon films on metals deposited by plasma enhanced chemical vapor deposition

This paper reports the findings of a study of the structural, mechanical, and tribological properties of amorphous hydrogenated carbon (a-C:H) coatings for industrial applications. These thin films have proven quite advantageous in many tribological applications, but for others, thicker films are required. In this study, in order to overcome the high residual stress and low adherence of a-C:H films on metal substrates, a thin amorphous silicon interlayer was deposited as an interface. Amorphous silicon and a-C:H films were grown by using a radio frequency plasma enhanced chemical vapor deposition system at 13.56 MHz in silane and methane atmospheres, respectively. The X-ray photoelectron spectroscopy technique was employed to analyze the chemical bonding within the interfaces. The chemical composition and atomic density of the a-C:H films were determined by ion beam analysis. The film microstructure was studied by means of Raman scattering spectroscopy. The total stress was determined through the measurement of the substrate curvature, using a profilometer, while micro-indentation experiments helped determine the films' hardness. The friction coefficient and critical load were evaluated by using a tribometer. The results showed that the use of the amorphous silicon interlayer improved the a-C:H film deposition onto metal substrates, producing good adhesion, low compressive stress, and a high degree of hardness. SiC was observed in the interface between the amorphous silicon and a-C:H films. The composition, the microstructure, the mechanical and tribological properties of the films were strongly dependent on the self-bias voltages. The tests confirmed the importance of the intensity of ion bombardment during film growth on the mechanical and tribological properties of the films.     

Lipon thin films grown by plasma-enhanced metalorganic chemical vapor deposition in a N2-H2-Ar gas mixture

Lithium phosphorus oxynitride (Lipon) thin films have been deposited by a plasma-enhanced metalorganic chemical vapor deposition method. Lipon thin films were deposited on approximately 0.2 μm thick Au-coated alumina substrates in a N₂-H₂-Ar plasma at 13.56 MHz, a power of 150 W, and at 180 °C using triethyl phosphate [(CH₂CH₃)₃PO₄] and lithium tert-butoxide [(LiOC(CH₃)₃] precursors. Lipon growth rates ranged from 10 to 42 nm/min and thicknesses varied from 1 to 2.5 μm. X-ray powder diffraction showed that the films were amorphous, and X-ray photoelectron spectroscopy (XPS) revealed approximately 4 at.% N in the films. The ionic conductivity of Lipon was measured by electrochemical impedance spectroscopy to be approximately 1.02 μS/cm, which is consistent with the ionic conductivity of Lipon deposited by radio frequency magnetron sputtering of Li₃PO₄ targets in either mixed Ar-N₂ or pure N₂ atmosphere. Attempts to deposit Lipon in a N₂-O₂-Ar plasma resulted in the growth of Li₃PO₄ thin films. The XPS analysis shows no C and N atom peaks. Due to the high impedance of these films, reliable conductivity measurements could not be obtained for films grown in N₂-O₂-Ar plasma.     

Aluminum-induced crystallization of amorphous silicon films deposited by hot wire chemical vapor deposition on glass substrates

Aluminum-induced crystallization of amorphous silicon films is discussed. Amorphous Si films were deposited by hot wire chemical vapor deposition onto Al coated glass substrates at 430 °C. Complete crystallization of a-Si films was achieved during a-Si deposition by controlling Al and Si layer thicknesses. The grain structure of the poly-Si films formed on glass substrate was evaluated by optical and electron microscopy. Continuous poly-Si films were obtained using Al layers with a thickness of 500 nm or less. The average grain size was found to be 10-15 μm, corresponding to a grain size/thickness ratio greater than 20.     

Studies of diamond-like carbon films prepared by ion beam-assisted deposition

Ion beam-assisted deposition offers a novel and unique process to prepare diamond-like carbon (DLC) films at room temperature, with particularly good interface adhesion. This advantage was explored in this study to deposit highly wear-resistant coating on bearing 52100 steel. Both dual ion beam sputtering and ion beam deposition were employed. Various bombarding species and energy were investigated to optimize the process. Raman, X-ray photoelectron and Auger electron spectroscopy were used to characterize the bonding structure of DLC. Extensive experiments were carried out to examine the tribological behaviour of the DLC/52100 system. A metal intermediate layer can help tremendously in wear resistance. The results are optimistic and may lead to useful applications.