Er related 1.53 μm emission from Er-Si-codoped ZnO multilayer film prepared by rf-sputtering

The near-infrared emission from Er and Si codoped ZnO film, synthesized by cosputtering from separated Er, Si, and ZnO targets, has been investigated. By building the multilayer film structure, controlling the Er concentration, and optimizing the annealing condition, the intensity of Er³⁺ related 1.53 μm photoluminescence (PL), which originates from the transition of Er³⁺: ⁴I_13/2 → ⁴I_15/2, can be modulated. It is shown that the maximum intensities of Er³⁺ related 1.53 μm PL are obtained when the Si:ZnO/Er:Si:ZnO/Si:ZnO sandwiched multilayer film and the alternate Er:ZnO/Si:ZnO multilayer film were annealed at 1000 °C and 950 °C, respectively. The Er³⁺ related 1.54 μm PL intensity of the multilayer film is higher than that of the Er:ZnO monolayer film. This can be attributed to the presence of the silicon nanocrystals that could act as sensitizers of Er³⁺ ions in the multilayer film. The PL of the sandwiched multilayer film and the alternate multilayer film were measured under different temperatures (15-300 K). The sandwiched multilayer film exhibits a nonmonotonic temperature dependence as well as the alternate multilayer film, which differs from that of Er-doped ZnO as previously reported.     

Study of epitaxial lateral overgrowth of semipolar (1 1 − 2 2) GaN by using different SiO2 pattern sizes

We investigated the growth mode and the crystal properties of lateral epitaxial overgrowth (LEO) semipolar (1 1 − 2 2) GaN by using the various SiO₂ pattern sizes of 6, 8, 10 and 12 μm with the window width of 4.0 μm. By using three-step growth technique, we successfully obtained the fully-coalescenced semipolar (1 1 − 2 2) LEO-GaN films regardless of the SiO₂ pattern sizes. However, the coalescence thickness of LEO-GaN film was decreased with decreasing SiO₂ pattern size, indicating that the coalescence of semipolar (1 1 − 2 2) GaN was easily formed by decreasing the pattern size of SiO₂ mask. The full width at half maximums (FWHMs) of X-ray rocking curves (XRCs) of LEO-GaN films decreased with increasing SiO₂ pattern size. In the pattern size of 4 × 10 μm, we achieved the minimum XRCs FWHM of 537 and 368 arc s with two different X-ray incident beam directions of [1 1 − 2 − 3] and [1 − 1 0 0], respectively. Moreover, the photoluminescence bandedge emission of semipolar (1 1 − 2 2) GaN was 45 times increased by LEO process. Based on these results, we concluded that the LEO pattern size of 4 × 10 μm would effectively decrease crystal defects of semipolar (1 1 − 2 2) GaN epilayer, resulting in an improvement of the optical properties.     

Electroluminescence from Er-doped SiO2/nc-Si multilayers under lateral carrier injection

Infrared photoluminescence (PL) and electroluminescence (EL) near 1.5 μm from Er-doped SiO₂/nc-Si multilayers are reported. A novel, effective method of lateral carrier injection is demonstrated in forward bias. The in-plane geometry increases the current density over those typically reported from Er doped SiO₂ layers containing Si nanocrystals under vertical carrier injection. The observed strong PL under off-resonance excitation for Er in SiO₂ and EL under forward bias are very promising for Si-based light sources – the missing link in an all-silicon on-chip optical interconnection system.     

Highly efficient 1.53 μm luminescence in ErxYb2-xSi2O7 thin films grown on Si substrate

Er_xYb_2-xSi₂O₇ thin films were grown on SiO₂/Si substrate by sputtering method and subsequent annealing process. By introducing Yb³⁺ into the lattices, the 1.53 μm emission intensity in Er_xYb_2-xSi₂O₇ is enhanced about 15 times, compared with Er₂Si₂O₇. Decay time measurements further show that the lifetime at 1.53 μm is about 3.9 ms at the Er concentration of 2 at.%, where the concentration is one order higher than the solubility limit of Er³⁺ in silica (10²⁰ cm^− 3). Our results indicate that such disilicate may have potential application for high-gain, compact waveguide amplifiers.     

Photoluminescence properties of the Yb:Er co-doped Al2O3 thin film fabricated by microwave ECR plasma source enhanced RF magnetron sputtering

The Yb:Er co-doped Al₂O₃ thin film was deposited on oxidized silicon wafers by microwave ECR plasma source enhanced RF magnetron sputtering, and annealed from 800 °C to 1000 °C. The photoluminescence at 1.53 μm of thin film was obtained under room temperature. The mixture phase structure of γ and θ is observed by XRD, and the compositions of the thin film are investigated by EPMA. The maximum PL intensity was achieved with O₂:Ar at 1:1, annealing temperature at 900 °C, and experimental ratio of Yb:Er at 1:3.6. The energy transfer mechanism between Er and Yb ions is supported by theoretical analysis and experiment results.     

Alteration of internal stresses in SiO2/Cu/TiN thin films by X-ray and synchrotron radiation due to heat treatment

A break of wiring by stress-migration becomes a problem with an integrated circuit such as LSI. The present study investigates residual stress in SiO₂/Cu/TiN film deposited on glass substrates. A TiN layer, as an undercoat, was first deposited on the substrate by arc ion plating and then Cu and SiO₂ layers were deposited by plasma coating. The crystal structure and the residual stress in the deposited multi-layer film were investigated using in-lab. X-ray equipment and a synchrotron radiation device that emits ultra-high-intensity X-rays. It was found that the SiO₂ film was amorphous and both the Cu and TiN films had a strong {1 1 1} orientation. The Cu and TiN layers in the multi thick (Cu and TiN:1.0 μm)-layer film and multi thin (0.1 μm)-layer film exhibited tensile residual stresses. Both tensile residual stresses in the multi thin-layer film are larger than the multi thick-layer film. After annealing at 400 °C, these tensile residual stresses in both the films increased with increasing the annealing temperature. Surface swelling formations, such as bubbles were observed in the multi thick-layer film. However, in the case of the multi thin-layer films, there was no change in the surface morphology following heat-treatment.     

Composition and optical properties of silicon nitride films grown on SiO2-glass and R-Al2O3 substrates by reactive RF magnetron sputtering

We have grown silicon nitride (Si₃N₄) films on SiO₂-glass and R-Al₂O₃ substrates by using reactive RF magnetron sputtering deposition methods with N₂ pure gas and N₂ + Ar mixture gas. The film composition, thickness and impurities have been examined by ion beam analysis. It is shown that the films have stoichiometric composition and are free from Ar contamination, when N₂ gas was used for the film deposition. Effects of impurities on the film properties, e.g., optical properties will be discussed.     

Removal of stacking faults in Ge grown on Si through nanoscale openings in chemical SiO2

Nucleation and eventual coalescence of Ge islands, grown out of 5 to 7 nm diameter openings in chemical SiO₂ template and epitaxially registered to the underlying Si substrate, have been shown to generate a low density of threading dislocations (?10⁶ cm^− 2). This result compares favorably to a threading dislocation density exceeding 10⁸ cm^− 2 in Ge films grown directly on Si. However, the coalesced Ge film contains a relatively high density of stacking faults (5 × 10⁷ cm^− 2), and subsequent growth of GaAs leads to an adverse root-mean-square roughness of 36 nm and a reduced photoluminescence intensity at 20% compared to GaAs grown on Ge or GaAs substrates. Herein, we find that annealing the Ge islands at 1073 K for 30 min before their coalescence into a contiguous film completely removes the stacking faults. However, the anneal step undesirably desorbs any SiO₂ not covered by existing Ge islands. Further Ge growth results in a threading dislocation density of 5 × 10⁷ cm^− 2, but without any stacking faults. Threading dislocations are believed to result from the later Ge growth on the newly exposed Si where the SiO₂ has desorbed from areas uncovered by Ge islands. The morphology and photoluminescence intensity of GaAs grown on the annealed Ge is comparable to films grown on GaAs or Ge substrates. Despite this improvement, the GaAs films grown on the annealed Ge/Si exhibit a threading dislocation density of 2 × 10⁷ cm^− 2 and a minority carrier lifetime of 67 ps compared to 4 to 5 ns for GaAs on Ge or GaAs substrates. A second oxidation step after the high temperature anneal of the Ge islands is proposed to reconstitute the SiO₂ template and subsequently improve the quality of Ge film.     

Substrate temperature effect on the SiC passivation layer synthesized by an RF magnetron sputtering method

This paper describes amorphous silicon carbide (a-SiC) film as an alternative material to silicon nitride (SiN) and silicon oxide (SiO₂) for the passivation layer of solar cells. We deposited the film on p-type silicon (100) wafers and glass substrates by RF magnetron sputtering using a SiC (99%) target. Structural and optical properties of the films were investigated according to the process temperature (room temperature, 300 °C, 400 °C, 500 °C and 600 °C). The structural properties were analyzed by Raman microscopy and XPS (X-ray Photoelectron Spectroscopy). The XPS showed that the content of SiC in the film is increased when the substrate temperature is higher. The optical properties of the films were examined by UV-visible spectroscopy and Ellipsometer. The optical characteristic measurement showed that the lowest refractive index of the film is 2.65. Also, using carrier lifetime measurement, we investigated the performance of SiC as the passivation layer. At the substrate temperature of 600 °C, we obtained a highest carrier lifetime of 7.5 μs.     

Detection of various self-assembled monolayers by AlN-based film bulk acoustic resonator

Various self-assembled monolayers such as carcinoembryonic antigen (CEA), beta actin, and bovine serum albumin (BSA) were detected using an AlN-based film bulk acoustic resonator (FBAR). AlN thin film was deposited by reactive RF magnetron sputtering, on a substrate of Mo (100 nm)/Ti (34 nm)/SiO₂ (480 nm)/Si (300 μm)/Si₃N₄ (300 nm). The film showed a strongly c-axis preferred orientation with a main (0 0 2) peak, as well as a good full width at half maximum (FWHM) of 2.50° in XRD and rocking curve results. The AlN-based FBAR was confirmed to have a resonant frequency of 2.477 GHz and a sensitivity of 3514 Hz cm²/ng. In beta actin, BSA, and CEA, the frequency properties showed variation values of 472.142, 932.573, and 685.421 kHz and mass sensitivities of 3530, 3506, and 3514 Hz-cm²/ng, respectively. The FBAR sensor was confirmed to be very useful for detecting target antigens through the binding of an antigen and an anti-body.     

Piezoelectric properties of PZT films prepared by the sol-gel method and their application in MEMS

Pb(Zr_0.52Ti_0.48)O₃ (PZT) piezoelectric thin films with thickness of 0.7-2.2 μm were prepared on Pt/Ti-coated SiO₂/Si (0.5 μm/300 μm) substrates by the sol-gel method. The piezoelectric coefficient e₃₁ of the PZT thin film was − 12.5 ± 0.3 C/m², which is evaluated by measuring the tip displacement of PZT-coated cantilevers of the dimensions 50 mm long, 4 mm wide, and 0.3 mm thick. The prepared PZT films demonstrated excellent piezoelectric properties and have large potential applications in MEMS devices. Micro-machined ultrasonic sensors, in which PZT-coated membrane functioned as sensing element, were fabricated and their properties were also characterized.     

Optimization of the structural, microstructural and optical properties of nanostructured Cr:ZnSe films deposited by magnetron co-sputtering for mid-infrared applications

In order to obtain optimally adherent films having the highest mid-infrared photoluminescence efficiency, nanostructured Cr²⁺:ZnSe films were deposited at room temperature on various substrates by magnetron radiofrequency co-sputtering of a SiO₂ target covered by a given number of ZnSe and Cr chips, at different Argon pressures and radiofrequency powers. The deposition parameter effect on the compositional, structural, microstructural and optical properties of the films has been investigated using X-ray reflectivity and diffraction, optical transmission spectroscopy, transmission electron microscopy, and photoluminescence studies. The corresponding films are composed by highly textured cubic and hexagonal ZnSe phases and exhibit strong tensile in-plane residual stresses. The evolution of the tensile residual stress and porosity values are consistent with the optical properties of the layers, and in particular the evolutions of both optical gap and refractive index. The room temperature mid-infrared (2-3 μm) photoluminescence measurements under direct excitation (1850 nm) revealed that chromium has been incorporated in the Cr²⁺ active state, and the corresponding fluorescence efficiency for an optimized thin film is only two times smaller than the one of a Cr²⁺:ZnSe reference bulk single crystal.     

Structural, optical and electrical properties of reactively sputtered Ag2Cu2O3 films

Ag₂Cu₂O₃ thin films were deposited on glass substrates by RF magnetron sputtering of an equiatomic silver-copper target (Ag_0.5Cu_0.5) in reactive Ar-O₂ mixtures. The reactive sputtering was done at varying power, oxygen flow rate and deposition temperature to study the influence of these parameters on the deposition of Ag₂Cu₂O₃ films. The film structure was determined by X-ray diffraction, while the optical properties were examined by spectrophotometry (UV-vis-NIR) and photoluminescence. Furthermore, the film thickness and resistivity were measured by tactile profilometry and 4-point probe, respectively. Additional mobility, resistivity and charge carrier density Hall effect measurements were done on a few selected samples. The best films in terms of stoichiometry and crystallography were achieved with a sputtering power of 100 W, oxygen and argon flow rates of 20 sccm (giving a deposition pressure of 1.21 Pa) and a deposition temperature of 250 °C. The optical transmittance and photoluminescence spectra of films deposited with these parameters indicate several band gaps, most prominently, a direct one of around 2.2 eV. Electrical characterization reveals charge carrier concentrations and mobilities in the range of 10²¹-10²² cm^− 3 and 0.01-0.1 cm²/Vs, respectively.     

Optical properties of HfO2 thin films deposited by magnetron sputtering: From the visible to the far-infrared

Hafnium oxide (HfO₂ or hafnia) holds promise as a high-index dielectric in optical devices and thermal barrier coatings, because of its transparency over a broad spectrum (from the ultraviolet to the mid-infrared) and chemical and thermal stability at high temperatures. In the present work, thin hafnia films of thicknesses from about 180 to 500 nm are deposited on Si substrates using reactive magnetron sputtering. The crystalline structure and surface topography are characterized by X-ray diffraction and atomic force microscopy, respectively. The optical and radiative properties of the film-substrate composites are measured at room temperature using spectroellipsometry and Fourier-transform infrared spectrometry. The optical constants are obtained from about 0.37 to 500 μm by fitting suitable models to the experimental results. Optical properties and dielectric function modeling are discussed with correlation to both film thickness and surface roughness. It is found that a single-oscillator dielectric-function model can describe radiative properties from about 1 to 20 μm. By combining Cauchy's formula (for the visible and near-infrared regions) with a multiple-oscillator Lorentz model (for the far-infrared region), a dielectric function is obtained for the HfO₂ films that is applicable from the visible to the far-infrared.     

Comparative study on the characteristics of network and continuous Ni films

Ni films were deposited on anodic aluminum oxide (AAO) and SiO₂/Si(100) substrates at 300 K by direct current magnetron sputtering with the oblique target. The film thickness was 80 nm, 160 nm and 260 nm. The films grown on AAO substrates have a network structure while those deposited on SiO₂/Si(100) substrates are continuous. The network film consists of granules and is formed by granule connection. The granule consists of many fine grains. The granule size increases with increasing film thickness. The 80 nm-thick network film has a honeycomb-like structure. The continuous films grow with a columnar structure and the transverse size of columnar grains increases with increasing film thickness. All the network films show a Ni(111) diffraction peak while the 160 nm- and 260 nm-thick continuous films exhibit the Ni(111) and Ni(200) diffraction peaks. The network films have higher coercivity and residual magnetization ratio compared with the continuous films. The coercivity and the residual magnetization ratio increase with increasing film thickness for the network films while they are almost independent of the film thickness for the continuous films. A temperature dependence of the resistance within 5-200 K reveals that the 80 nm-thick network Ni film exhibits markedly a minimal resistance at about 40 K. A logarithmic temperature dependence of the conductance is verified at temperatures below 40 K. The temperature coefficient of resistance is smallest for the 80 nm-thick network film and is largest for the 260 nm-thick continuous film.     

Preparation and thermoelectric properties of nc-Si:(Al2O3 + SiO2) composite film

A composite film of nanocrystalline Si (nc-Si) embedded in (Al₂O₃ + SiO₂) has been prepared on a quartz substrate by thermally evaporating a 400 nm thick Al film on a quartz substrate and annealing in air at 580 °C for 1 h. During annealing, the Al reacts with the SiO₂ of the quartz substrate and produces nc-Si, which is embedded in the (Al₂O₃ + SiO₂) film. The average size of nc-Si is ~ 22 nm and the thickness of the nc-Si:(Al₂O₃ + SiO₂) composite film is ~ 810 nm. It is found that the prepared film is thermoelectric with a Seebeck coefficient of − 624 μV/K at 293 K and − 225 μV/K at 413 K.     

Ferroelectricity of ultrathin ferroelectric Langmuir-Blodgett polymer films on conductive LaNiO3 electrodes

LaNiO₃ (LNO) films with a surface roughness rms of 0.384 nm and a sheet resistance of about 200 Ω were prepared on SrTiO₃ and Si/SiO₂ substrates respectively by rf magnetron sputtering technique. The surface of LNO on Si/SiO₂ substrate is smoother than that on SrTiO₃ substrate. A nominal 2-monolayer (ML) poly(vinylidenefluoride-trifluoroethylene) film with a thickness of about 3 nm was deposited on LNO coated Si/SiO₂ substrate by Langmuir-Blodgett (LB) technology. Piezoresponse force microscopy (PFM) measurements show that the LB films demonstrate an obvious feature of polarization switching and good voltage durability. The results suggest that the ultrathin polymer films may be utilized to explore ferroelectric tunnel junctions.     

Plastic substrate with gas barrier layer and transparent conductive oxide thin film for flexible displays

A novel plastic substrate for flexible displays was developed. The substrate consisted of a polycarbonate (PC) base film coated with a gas barrier layer and a transparent conductive thin film. PC with ultra-low intrinsic birefringence and high temperature dimensional stability was developed for the base film. The retardation of the PC base film was less than 1 nm at a wavelength of 550 nm (film thickness, 120 µm). Even at 180 °C, the elastic modulus was 2 GPa, and thermal shrinkage was less than 0.01%. The surface roughness of the PC base film was less than 0.5 nm. A silicon oxide (SiO_x) gas barrier layer was deposited on the PC base film by a roll-to-roll DC magnetron reactive sputtering method. The water vapor transmission rate of the SiO_x film was less than 0.05 g/m²/day at 40 °C and 100% relative humidity (RH), and the permeation of oxygen was less than 0.5 cc/m² day atm at 40 °C and 90% RH. As the transparent conductive thin film, amorphous indium zinc oxide was deposited on the SiO_x by sputtering. The transmittance was 87% and the resistivity was 3.5 × 10^− 4 ohm cm.     

Microstructure and electrochemical properties of magnetron-sputtered LiCoO2/LiNiO2 multi-layer thin film electrode

LiCoO₂ single-layer and LiCoO₂/LiNiO₂ multi-layer thin film electrodes were successfully fabricated by magnetron sputtering. Their microstructure and electrochemical properties were investigated. Once annealed, both films had the (0 0 3) preferred orientation to minimize the surface energy. The initial discharge capacity of the multi-layer thin film was approximately 53.1 μAh/cm² μm, which was higher than that of the LiCoO₂ single-layer thin film having similar thickness. The capacity retention of the multi-layer thin film was superior to that of the single-layer thin film. These findings indicate that the multi-layer thin film is a promising cathode material for the fabrication of high-performance thin film batteries.     

Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering

Aluminum nitride (AlN) piezoelectric thin films with c-axis crystal orientation on polymer substrates can potentially be used for development of flexible electronics and lab-on-chip systems. In this study, we investigated the effects of deposition parameters on the crystal structure of AlN thin films on polymer substrates deposited by reactive direct-current magnetron sputtering. The results show that low sputtering pressure as well as optimized N₂/Ar flow ratio and sputtering power is beneficial for AlN (002) orientation and can produce a highly (002) oriented columnar structure on polymer substrates. High sputtering power and low N₂/Ar flow ratio increase the deposition rate. In addition, the thickness of Al underlayer also has a strong influence on the film crystallography. The optimal deposition parameters in our experiments are: deposition pressure 0.38 Pa, N₂/Ar flow ratio 2:3, sputtering power 414 W, and thickness of Al underlayer less than 100 nm.