Determination of charge carrier mobility of hole transporting polytriarylamine-based diodes

Hole transport properties of three different side chain poly(triarylamines) have been determined by means of the analysis of steady-state current-voltage characteristics using co-planar diode structures. The interpretation is based on space-charge limited models with field-dependent mobility. Mobilities between ~ 10^− 8 and 10^− 6 cm² V^− 1 s^− 1 are obtained. The highest mobility is achieved for poly(tetraphenylbenzidine) devices and the lowest for poly(triphenylamine) devices. Electron-rich methoxy substituents increase the mobility of poly(triphenylamine)s. A comparison of the mobility values with those obtained using organic field-effect transistors is also given.     

Ammonia-free chemically deposited CdS films as active layers in thin film transistors

In this work we have grown CdS thin films using an ammonia-free chemical bath deposition process for the active layer in thin film transistors. The CdS films were deposited substituting sodium citrate for ammonia as the complexing agent. The electrical characterization of the as-deposited CdS-based thin film transistors shows that the field effect mobility and threshold voltage were in the range of 0.12-0.16 cm²V⁻¹ s⁻¹ and 8.8-25 V, respectively, depending on the channel length. The device performance was improved considerably after thermal annealing in forming gas at 250 °C for 1 h. The mobility of the annealed devices increased to 4.8-8.8 cm²V⁻¹ s⁻¹ and the threshold voltage decreased to 8.4-12 V. I_on/I_off for the annealed devices was approximately 10⁵-10⁶.     

Organic thin film transistor using silver electrodes by the ink-jet printing technology

We have developed a conductive ink containing silver nanoparticles from which the electrodes for organic thin film transistor were directly patterned by ink-jet printing. Nano-sized silver particles having ∼ 20 nm diameter was used for a direct metal printing. Silver conductive ink was printed on the heavily doped n-type silicon wafer with 200-nm thick thermal SiO₂ layer as a substrate. To achieve a high line resolution and smooth conductive path, the printing conditions such as the inter-drop distance, stage moving velocity and temperature of the pre-heated substrates were optimized. After the heat-treatment at temperatures of 200 °C for 30 min, the printed silver patterns exhibit metal-like appearance and the conductivity. To fabricate a coplanar type TFTs, an active material of semiconducting oligomer, α,ω-dihexylquaterthiophene (DH4T) in a chlorobenzene was deposited between the ink-jet printed silver electrodes by drop casting. The OTFT with the ink-jetted source/drain electrodes shows general performance characteristics with good saturation behavior and no significant contact resistance as compared to the one with vacuum deposited electrodes. The electrical characteristic parameters of OTFT show the mobility of 1.3 × 10^− 3 cm² V^− 1 s^− 1 in the saturation regime, on/off current ratio over 10³, and threshold voltage of about − 13 V.     

Transparent amorphous conductive Cd-In-Sb-O thin films for flexible devices

Transparent conductive amorphous Cd-In-Sb-O thin films were deposited on a flexible polyethylene naphthalate film by rf magnetron sputtering at room temperature. The large Hall mobility of ∼26 cm² V⁻¹ s⁻¹ was observed on the films with carrier density >10²⁰ cm⁻³. The carrier density varied from the order of 10²⁰ to 10¹⁷ cm⁻³ with increasing the oxygen partial pressure. The Hall mobility reached up to ∼17 cm² V⁻¹ s⁻¹, even at carrier density of ∼10¹⁷ cm⁻³. Flexible transparent filed-effect transistor was also fabricated using the Cd-In-Sb-O thin films as a channel layer and the device performance was investigated. The device exhibited a field-effect mobility of ∼0.45 cm² V⁻¹ s⁻¹ and an on-off ratio of ∼10² at room temperature.     

High performance low temperature solution-processed zinc oxide thin film transistor

Amorphous zinc oxide thin films have been processed out of an aqueous solution applying a one step synthesis procedure. For this, zinc oxide containing crystalline water (ZnO⋅ × H₂O) is dissolved in aqueous ammonia (NH₃), making use of the higher solubility of ZnO⋅ × H₂O compared with the commonly used zinc oxide. Characteristically, as-produced layers have a thickness of below 10 nm. The films have been probed in standard thin film transistor devices, using silicon dioxide as dielectric layer. Keeping the maximum process temperature at 125 °C, a device mobility of 0.25 cm²V^− 1s^− 1 at an on/off ratio of 10⁶ was demonstrated. At an annealing temperature of 300 °C, the performance could be optimized up to a mobility of 0.8 cm²V^− 1s^− 1.     

Mobility of holes in a Si/Si0.8Ge0.2/Si metal oxide semiconductor field effect transistor

Using all standard scattering mechanisms the hole mobility in a metal oxide semiconductor field effect transistor SiGe conduction channel at 17 K and room temperature was calculated. The mobility measurements were performed at different bath temperatures in the range of 4-300 K. The 4 K peak mobility at a sheet carrier concentration, n_h, of 2.1 × 10¹¹ cm^− 2 is 5100 cm² V⁻¹ s^− 1 while the 300 K mobility has a peak value of 350 cm² V⁻¹ s^− 1. By comparing between theory and measurements it is shown that the interface impurities and surface roughness more strongly limit the mobility than alloy scattering does.     

Structural and electrical properties of HfO2/Dy2O3 gate stacks on Ge substrates

In the present work we report on the structural and electrical properties of metal-oxide-semiconductor (MOS) devices with HfO₂/Dy₂O₃ gate stack dielectrics, deposited by molecular beam deposition on p-type germanium (Ge) substrates. Structural characterization by means of high-resolution Transmission Electron Microscopy (TEM) and X-ray diffraction measurements demonstrate the nanocrystalline nature of the films. Moreover, the interpretation of the X-ray reflectivity measurements reveals the spontaneous growth of an ultrathin germanium oxide interfacial layer which was also confirmed by TEM. Subsequent electrical characterization measurements on Pt/HfO₂/Dy₂O₃/p-Ge MOS diodes show that a combination of a thin Dy₂O₃ buffer layer with a thicker HfO₂ on top can give very good results, such as equivalent oxide thickness values as low as 1.9 nm, low density of interfacial defects (2-5 × 10¹² eV^− 1 cm^− 2) and leakage currents with typical current density values around 15 nA/cm² at V_g = V_FB − 1V.     

Thin-film transistors with sol-gel deposited Mg0.1Zn0.9O films as active channel layer

We report on field-effect transistors using Mg_0.1Zn_0.9O thin film as channel layer. The effect of Mg is to increase the band gap and decrease the electron carrier concentration. The Mg_0.1Zn_0.9O film deposited by sol-gel method has a highly c-axis orientation and excellent optical properties. The devices display a channel mobility of 0.76 cm² V^− 1 s^− 1 and an on/off ratio of 400.     

An investigation of the electrical transport properties of graphene-oxide thin films

The electrical transport properties of graphene-oxide (GO) thin films were investigated. The GO was synthesized by a modified Hummers method and was characterized by X-ray diffraction and UV-visible spectroscopy. The thin film of GO was made on a Si/SiO₂ substrate by drop-casting. The surface morphology of the GO film was analyzed by using scanning electron microscopy and atomic force microscopy techniques. Temperature dependent resistance and current-voltage measurements were studied using four-terminal method at various temperatures (120, 150, 175, 200, 250 and 300 K) and their charge transport followed the 3D variable range hopping mechanism which was well supported by Raman spectra analysis. The presence of various functional groups in GO were identified by using high resolution X-ray photo electron (XPS) and Fourier transform infra red (FT-IR) spectroscopic techniques. Graphene-oxide thin film field effect transistor devices show p-type semiconducting behavior with a hole mobility of 0.25 cm² V⁻¹ s⁻¹ and 0.59 cm² V⁻¹ s⁻¹ when measured in air and vacuum respectively.     

High-mobility molybdenum doped indium oxide

The effects of molybdenum doping (0-12 at.%) on the optical and electrical properties of In₂O₃ were investigated using combinatorial sputter deposition in combination with combinatorial analysis techniques. The electrical properties are highly dependent on the deposition temperature and the molybdenum doping concentration. A minimum temperature between 300 °C and 400 °C is needed to activate the carriers. The maximum mobility is observed at a Mo concentration of 4.4 at.% and is 65.3 cm² V^− 1 s^− 1. The maximum conductivity is observed at 5.9 at.% molybdenum doping and is equal to 5000 Ω^− 1 cm^− 1. The carrier concentration increases with increasing molybdenum doping to a maximum value of 6.6·10²⁰ cm^− 3 at a doping concentration of 8.6 at.%. The optical transparency is high (> 80%) in a wide spectral range that is dependent on the process parameters.     

The electrical measurements in poly(2-chloroaniline) based thin film sandwich devices

Al/P2ClAn(CH₃COOH)/p-Si/Al structure has been obtained by evaporation of the polymer P2ClAn(CH₃COOH) on the front surface of p-type silicon substrate, P2ClAn: the poly(2-chloroaniline). The P2ClAn emeraldine salt was chemically synthesized by using acetic acid (CH₃COOH). It has been seen that the current-voltage characteristics of the heterojunction obey to space charge-limited current model. Furthermore, P2ClAn(CH₃COOH) was characterized by using Fourier Transform Infrared (FTIR) and Ultraviolet-Visible (UV-Vis) spectroscopies. An average value of μ, 2.43 × 10^− 5 cm² V^− 1 s^− 1, was obtained for the mobility of the P2ClAn(CH₃COOH); this value is in agreement with the value of about 10^− 4 cm² V^− 1 s^− 1 given for the conjugated polymeric thin films in the literature. Low capacitance-voltage-frequency and conductance-frequency measurements have been made at the voltages of 0.00, 0.02 and 0.30 V in the frequency range of 100 Hz-2.0 MHz. An average value of 7.91 × 10¹¹ cm^− 2 eV^− 1 for interface state density has been obtained from the frequency-capacitance characteristics.     

Silicon oxide synthesized using an atmospheric pressure microplasma jet from a tetraethoxysilane and oxygen mixture

Local deposition of SiO_x was studied using an atmospheric pressure very-high-frequency (VHF) inductive coupling microplasma jet (AP-MPJ) from a tetraethoxysilane ((Si(OC₂H₅)₄), TEOS) and oxygen mixture. The SiO_x obtained showed the dielectric constant of 3.8 with a low leakage current of the order of ∼ 10^− 6 A ·cm^− 2 up to 8 MV ·cm^− 1. Bottom-gated sputtered-ZnO thin-film transistors with a AP-MPJ SiO_x as a gated dielectric layer exhibited a relatively high field-effect mobility of 24 cm² V^− 1 s^− 1, a threshold voltage of 14 V and an on/off current ratio of ∼ 10⁴, a performance comparable to that of thermal silicon dioxide. The TFT performance was also obtained for the top-gated ZnO-TFTs with a field-effect mobility of 1.4 cm² ·V^− 1 s^− 1, a threshold voltage of − 1.9 V, and an on/off current ratio of ∼ 10³.     

Polycrystalline films of tungsten-doped indium oxide prepared by d.c. magnetron sputtering

Electrical and optical properties of polycrystalline films of W-doped indium oxide (IWO) were investigated. These films were deposited on glass substrate at 300 °C by d.c. magnetron sputtering using ceramic targets. The W-doping in the sputter-deposited indium oxide film effectively increased the carrier density and the mobility and decreased the resistivity. A minimum resistivity of 1.8 × 10^− 4 Ω cm was obtained at 3.3 at.% W-doping using the In₂O₃ ceramic targets containing 7.0 wt.% WO₃. The 2.2 at.% W-doped films obtained from the targets containing 5.0 wt.% WO₃, showed the high Hall mobility of 73 cm² V^− 1 s^− 1 and relatively low carrier density of 2.9 × 10²⁰ cm^− 3. Such properties resulted in novel characteristics of both low resistivity (3.0 × 10^− 4 Ω cm) and high transmittance in the near-infrared region.     

Electrical behavior of p-type PbS-based metal-oxide-semiconductor thin film transistors

Chemically deposited lead sulfide (PbS) thin films were used as the semiconductor active layer in common-gated thin film transistors. The PbS films were deposited at room temperature on SiO₂/Si-p wafers. Lift-off was used to define source and drain contacts (gold, Au) on top of the PbS layer with channel lengths ranging from 10 to 80 μm. The Si-p wafer with a back chromium-gold contact served as the common gate for the transistors. Experimental results show that as-deposited PbS are p-type in character and the devices exhibit typical drain current versus source-drain voltage (I_DS-V_DS) behavior as a function of gate voltage. The values of threshold voltage of the devices were in the range from −7.8 to 1.0 V, depending on the channel length. Channel mobility was approximately 10^− 4 cm²V^− 1 s^− 1. The low channel mobility in the devices is attributed to the influence of the microstructure of the nanocrystalline thin films. The electrical performance of the PbS-based devices was improved by thermal annealing the devices in forming gas at 250 °C. In particular, channel mobility increased and threshold voltage decreased as a consequence of the thermal annealing.     

Transparent conducting Al and Y codoped ZnO thin film deposited by DC sputtering

Transparent conducting Al and Y codoped zinc oxide (AZOY) thin films with high transparency and low resistivity were deposited by DC magnetron sputtering. The effects of substrate temperature on the structural, electrical and optical properties of AZOY thin films deposited on glass substrates have been investigated. X-ray diffraction spectra indicate that no diffraction peak of Al₂O₃ or Y₂O₃ except that of ZnO (0 0 2) is observed. The AZOY thin film prepared at substrate temperature of 250 °C has the optimal crystal quality inferring from FWHM of ZnO (0 0 2) diffraction peak, but the AZOY thin film deposited at 300 °C has the lowest resistivity of 3.6 × 10⁻⁴ Ω-cm, the highest mobility of 30.7 cm² V⁻¹ s⁻¹ and the highest carrier concentration of 5.6 × 10²⁰ cm⁻³. The films obtained have disorderly polyhedral surface morphology indicating possible application in thin film solar cell with good quality and high haze factor without the need of post-deposition etching.     

Ohmic contacts and n-type doping on TixCr2 − xO3 films and the temperature dependence of their transport properties

A procedure to dope n-type Cr_2 − xTi_xO₃ thin films is proposed. Besides doping the material, at the same time the method forms ohmic contacts on Ti_xCr_2 − xO₃ films. It consists on the deposition of 10 nm Ti and 50 nm Au, followed by thermal annealing at 1000 °C for 20 min in N₂ atmosphere. Ohmic contacts were formed on three samples with different composition: x = 0.17, 0.41 and 1.07 in a van der Pauw geometry for Hall effect measurements. These measurements are done between 35 K and 373 K. All samples showed n-type nature, with a charge carrier density (n) on the order of 10²⁰ cm^− 3, decreasing as x increased. As a function of temperature, n shows a minimum around 150 K, while the mobilities have an almost constant value of 11, 28 and 7 cm²V^− 1 s^− 1 for x = 0.17, 0.41 and 1.07, respectively.     

Optimization of thermoelectric properties on Bi2Te3 thin films deposited by thermal co-evaporation

The optimization of the thermal co-evaporation deposition process for n-type bismuth telluride (Bi₂Te₃) thin films deposited onto polyimide substrates and intended for thermoelectric applications is reported. The influence of deposition parameters (evaporation rate and substrate temperature) on film composition and thermoelectric properties was studied for optimal thermoelectric performance. Energy-dispersive X-ray spectroscopy, X-ray diffraction, X-ray photoelectron spectroscopy and Raman spectroscopy confirmed the formation of Bi₂Te₃ thin films. Seebeck coefficient (up to 250 μV K^− 1), in-plane electrical resistivity (≈10 μΩ m), carrier concentration (3×10¹⁹-20×10¹⁹ cm^− 3) and Hall mobility (80-170 cm² V⁻¹ s^− 1) were measured at room temperature for selected Bi₂Te₃ samples.     

Oxide and nitride encapsulation of large-area graphene field effect devices

Room temperature magnetron sputtering is used to deposit SiO₂ and Si₃N₄ encapsulation layers on top of back gated graphene transistors, which are fabricated with CVD grown graphene transferred onto SiO₂ and Si₃N₄ substrates. Raman spectroscopy with 514 nm laser excitation was performed on bare and encapsulated devices. A small increase in D peak of the encapsulated spectrum indicates minimal increase in defect density for both SiO₂ and Si₃N₄ deposition. Graphene on Si₃N₄ exhibits an average mobility of ~ 4000 cm²/V.s at a carrier density of 10¹² cm^− 2 and up to 80% mobility is retained upon encapsulation with Si₃N₄, while on SiO₂ the average mobility is ~ 2000 cm²/V.s with mobility retention of up to 55% with SiO₂ encapsulation.     

Enhanced conductivity of pulsed laser deposited n-InGaZn6O9 films and its rectifying characteristics with p-SiC

Wide band gap InGaZn₆O₉ films of thickness ~ 350 nm were deposited on sapphire (0001) at room temperature by using the pulsed laser deposition technique. The transparent films showed the optical transmission of > 80% with the room temperature Hall mobility of ~ 10 cm²/V s and conductivity of 4 × 10² S/cm at a carrier density > 10²⁰ cm^− 3. The electrical properties as a function of deposition temperatures revealed that the conductivity and mobility almost retained up to the deposition temperature of 200 °C. The films annealed in different atmospheres suggested oxygen vacancy plays an important role in determining the electrical conductivity of the compound. Room temperature grown heterostructure of n-InGaZn₆O₉/p-SiC showed a good rectifying behavior with a leakage current density of less than 10^− 9 A/cm², current rectifying ratio of 10⁵ with a forward turn on voltage ~ 3 V, and a breakdown voltage greater than 32 V.     

Amorphous structure and electrical performance of low-temperature annealed amorphous indium zinc oxide transparent thin film transistors

The effect of low-temperature (200 °C) annealing on the threshold voltage, carrier density, and interface defect density of amorphous indium zinc oxide (a-IZO) thin film transistors (TFTs) is reported. Transmission electron microscopy and x-ray diffraction analysis show that the amorphous structure is retained after 1 h at 200 °C. The TFTs fabricated from as-deposited IZO operate in the depletion mode with on-off ratio of > 10⁶, sub-threshold slope (S) of ~ 1.5 V/decade, field effect mobility (μ_FE) of 18 ± 1.6 cm²/Vs, and threshold voltage (V_Th) of − 3 ± 0.7 V. Low-temperature annealing at 200 °C in air improves the on-current, decreases the sub-threshold slope (1.56 vs. 1.18 V/decade), and increases the field effect mobility (μ_FE) from 18.2 to 23.3 cm²/Vs but also results in a V_Th shift of − 15 ± 1.1 V. The carrier density in the channel of the as-deposited (4.3 × 10¹⁶ /cm³) and annealed at 200 °C (8.1 × 10¹⁷ /cm³) devices were estimated from test-TFT structures using the transmission line measurement methods to find channel resistivity at zero gate voltage and the TFT structures to estimate carrier mobility.