光电印制电路板用聚合物光波导研究进展

本文首先对用于光电印制电路板上的聚合物光波导的材料及特点进行了详细介绍并作比较,然后对聚合物光波导材料聚甲基丙烯酸甲酯性能的提高方法进行了详尽介绍,并对聚合物光波导材料含氟聚酰亚胺的单体及合成进行了简单介绍,最后对聚合物光波导的成型工艺和相关性能检测方法进行了详尽阐述。     

光电印制电路板的发展评述（2）——光电印制电路板的基本概述（上）

介绍了光互连的种类及进展,概述了光电印制电路板用聚合物光波导材料的要求,列举了主要的光波导线路用聚合物材料的性能。     

用于光电印制电路板(OEPCB)的聚合物光波导的制作

对应用于光电印制电路板(OEPCB)的聚合物材料的特性进行了讨论,提供了材料的制备、膜厚的控制、折射率控制以及光波导制备技术等方面的试验结果。测试了含氟聚酰亚胺的波导的通光性能,并给出了测量方法。     

光电印制板(OEPCB)制作工艺浅析

简述了光电印制板的工作原理,介绍了光电印制板用光波导材料及聚合物光波导层成型工艺,并简要介绍了光电印制电路板的测试方法。     

光电印制电路板的发展评述（3）——聚合物光波导层的成型工艺（1）

文章简述了光电印制电路板中聚合物光波导层的制作应该遵循的原则,介绍了光波导层的主要成型工艺,包括反应离子蚀刻、平版影印、激光烧蚀和加热模压等方法。     

文献与摘要（147）

高宽带应用的高分子有机硅波导〈br〉 Polymer Waveguide Silicones for High Bandwidth Applications 〈br〉 依托云计算和移动通讯,全球数据流动在爆炸式增长,网络需要高宽带。高宽带传输中铜导体互连技术将至极限,急需发展光纤维或聚合物波导连接技术。聚合物波导可以被集成到PCB中,得到低损耗的高效传输功能。这项技术由IBM和道康宁合作开发,采用挠性有机硅聚合物波导和电路板制造结合,在聚酰亚胺基材上制出光导PCB,具有优异的热、机械和光电稳定性,表明一个可靠的光学波导技术可以构建新型挠性PCB。     

低损耗聚合物互连光波导的制备及性能测试

对应用于宽带光互连的光印刷电路板(OPCB)制备技术进行了研究。作为光互连系统的传输介质,我们研究了互连光波导的性能。基于紫外光刻技术,在常规PCB基底上制备了聚合物光波导,研究了光波导的制备流程以及工艺参数;并且通过不断优化工艺参数,制备得到了低损耗的光波导;通过测试光波导的传输损耗以及眼图,分析了光波导的性能。光波导在850nm波长条件下的传输损耗可以达到0.13dB/cm,实现了10Gbit/s光通信信号的传输。     

基于ProtelDXP的印制电路板设计及实现

电路设计的最终目的是生产制作电子产品,各种电子产品的使用功能与物理结构都是通过印制电路板来实现的。印制电路板（PCB）是电子设备中的重要部件之一．其设计和制造是影响电子设备的质量、成本的基本因素之一。因此,印制电路板（PCB）设计质量直接影响着电子产品的性能。本文以ProtelDXP为设计平台对PCB板主要设计步骤及其内容进行了分析。以提高电路板各板的制作效率及可靠性。     

有机聚合物光波导制作工艺综述

有机聚合物光波导光互连已成为实现短距离计算通信设计目标的最佳解决方法。短距离光互连是未来互连方向,综合性能优良的聚合物多模光波导是光互连中的重要组成部分。有机聚合物光波导的制作工艺对光波导的性能具有重要影响,故此对有机聚合物光波导的制作工艺进行了综述,并提出了一些未来的研发方向。     

多层印制电路板热设计方法研究

电子器件高度集成化导致电路板级散热问题愈发严重,按以往粗放型设计方式无法满足需求。对多层印制电路板(PCB)进行热设计方法的研究,能准确剖析PCB热源演化机制,有助于快速控制其板级温度,提高电路板运行安全性能。通过对某产品波控单机的CPU功能电路板插件进行热设计及仿真分析,结果表明所提方法能够有效降低印制电路板级温度,具有较好的实用性。     

Fabrication and performance analysis of polymer light waveguides in EOPCB

A new method, named as doctor-blaring, is presented to fabricate light waveguides in electro-optical printed circuit board （EOPCB）. This new technology is proven to be suitable for the fabrication of the large size waveguides. The performance parameters of the light waveguides fabricated by the proposed method as well as the influence of the parameters on the performance of the waveguides are analyzed and simulated. The results demonstrate the feasibility of the method to fabricate the polymer waveguides.     

用ECRC-VD方法制备非晶氟化碳薄膜

以C4F8为源气体,Ar为稀释气体,用电子回旋共振化学汽相淀积的方法制作了非晶氟化碳薄膜;使用XPS和FTIR分析薄膜的化学组分和成键类型;研究了微波功率对于沉积速率和薄膜光学性质的影响。沉积速率随Ar在混合气体中比例的增大先增大后降低,随微波功率的增加而增加,并最终趋于饱和值。沉积的薄膜介电常数约为2.0,在可见光区薄膜具有良好的透光性。在较高的微波功率条件下,沉积薄膜的光学带隙减小。     

The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging

Polyimides have been considered as interlayer dielectrics for wafer scale integration (WSI) and wafer scale hybrid packaging (WSHP). However, high temperature curing steps for polyimide lead to large stresses in polyimide films. This is due to differing thermal expansion coefficients of the metal conductor, insulator and substrate materials causing yield and reliability problems. Polyimides also require the use of solvents, and tend to outgas during subsequent processing. They tend to absorb moisture with resulting degradation of dielectric constants. Also, the spin on method used to apply and planarize polyimide layers exhibits nonuniformity of thickness on large wafers. In this paper we examine parylene (Poly-p-xylylene) and some of its derivatives as possible interlayer dielectrics due to some of their attractive features. Parylene has a low dielectric constant. It can be vapor deposited at low temperatures and in vacuum. It is also highly resistant to corrosion and is a clear, transparent material with possible use for optical interconnections. This paper studies the reactive ion etching properties for polyimides and parylenes in an oxygen containing plasma under identical conditions. The etching rates of the parylenes and polyimides have been compared. The surface properties of these polymers are examined. Further, the film growth properties of aluminum deposited on the etched surfaces using the ionized cluster beam are investigated.     

Polymere für Anwendungen in der integrierten Optik — ein Überblick mit ausgewählten Beispielen

Within this paper the development of special polymers for their use in integrated optics is shown exemplarily for selected optical devices (thermooptical switches and arrayed waveguide gratings). Emphasis is put on long-range data transfer in a wavelength region around 1,550 µm. Fluorinated polyacrylates, polycyanurates and triazine-containing reactive polymers were investigated.     

低介电常数氟化非晶碳薄膜的制备与检测

氟化非晶碳(a-C∶F)薄膜具有介电常数低、热稳定性好等优点,普遍认为是下一代集成电路互联层绝缘介质的最佳候选材料之一。结合研究实践,综述了国内外低介电常数氟化非晶碳薄膜主要的制备技术、工艺参数及性能检测技术,指出了介电常数和热稳定性的矛盾是阻碍该薄膜实用化的主要原因。     

用于ULSI的低K氟化非晶碳膜研究

综述了用于超大规模集成电路中互连介质的氟化非晶碳膜（a-C:F)的制备,化学键结构,介电常数与热稳定,填隙能力,粘附性,热导率等性能,为开发具有新型功能的低介电常数材料提供了指导。     

侧链密度对聚酰亚胺取向膜性能的影响

成功地合成了二胺单体十二烷氧基苯-4′,4″-二氨基三苯胺(DPDTA),并用此单体与3,3′-二甲基-4,4′-二氨基二苯甲烷(DMMDA)和二苯醚四羧酸二酐(ODPA)共缩聚,采用低温缩聚-热酰亚胺化、通过调节共聚物组成制备了2种聚酰亚胺(PI)。利用FT-IR、NMR、UV-Vis与DSC等手段对合成二胺单体及PI进行了结构表征和性能测试。研究了其取向性能、透光性能和耐热性能。结果表明,在摩擦前,含10%DPDTA的PI不能诱导液晶分子取向,含25%DPDTA的PI能诱导液晶分子垂直取向,预倾角可达89.6°。而摩擦后,两种PI都能使液晶分子平行取向,预倾角分别为1.8°和2.4°。两种PI膜在500～800nm区域透光率都在80%以上,玻璃化温度都在230℃以上。     

纳米压印抗粘性技术研究进展

纳米压印是一种理想的光刻技术,它具有生产率和分辨率高的特点。脱模过程中,粘连限制了图形的精确转移,因此,抗粘连成为纳米压印技术需要解决的关键问题。氟化自组装单分子层是一种被广泛应用的抗粘连涂层,介绍和分析了其在耐热性和降解方面的最新研究进展。介绍了类金刚石碳膜、在光刻胶上喷涂脱模剂和含氟表面活化剂在纳米压印抗粘连研究上的进展,分析了这些方法所存在的问题及纳米压印抗粘连的发展趋势。     

Fluorinated polyimide waveguides with low polarization-dependentloss and their applications to thermooptic switches

Fluorinated polyimide waveguides with low polarization dependent loss (PDL) and thermooptic (TO) switches made from them were demonstrated. The waveguides showed loss of less than 0.3 dB/cm at the wavelength of 1.3 μm and 0.6 dB/cm at 1.55 μm for both TE and TM polarizations. The PDL's were less than 0.1 dB/cm. Extinction ratios of Y-branching-type TO switches fabricated from these waveguides were larger than 20 dB when over 160 mW of electric power was applied at 1.3 μm, and over 150 mW at 1.55 μm. The switching speed was faster than 8 ms     

Mold cleaning and fluorinated anti-sticking treatments in nanoimprint lithography

Fluorinated anti-sticking layers (F-ASLs) are generally used to prevent adhesion between molds and resists in nanoimprint lithography (NIL). Nevertheless, these layers are degraded after a certain number of imprints and the mold needs to be cleaned and re-treated. We have observed that the cleaning procedures before re-treatment impacts on the grafting of the fluorinated molecules and on the longevity of the ASL. We propose an efficient cleaning procedure of the damaged anti-sticking layers on both silicon and fused silica molds allowing a reproducible re-deposition. Surface chemistry analyses were conducted using a specific procedure based on X-ray photoelectron spectroscopy (XPS) experiments. This procedure was proven to be suitable for ultra thin organic layer composition analysis.