共查询到20条相似文献,搜索用时 31 毫秒
1.
Jie Chen Jun Shen Shiqiang Lai Dong Min Xiaochuan Wang 《Journal of Alloys and Compounds》2010,489(2):631-637
In this paper, the microstructural evolution of IMCs in Sn–3.5Ag–X (X = 0, 0.75Ni, 1.0Zn, 1.5In)/Cu solder joints and their growth mechanisms during liquid aging were investigated by microstructural observations and phase analysis. The results show that two-phase (Ni3Sn4 and Cu6Sn) IMC layers formed in Sn–3.5Ag–0.75Ni/Cu solder joints during their initial liquid aging stage (in the first 8 min). While after a long period of liquid aging, due to the phase transformation of the IMC layer (from Ni3Sn4 and Cu6Sn phases to a (Cu, Ni)6Sn5 phase), the rate of growth of the IMC layer in Sn–3.5Ag–0.75Ni/Cu solder joints decreased. The two Cu6Sn5 and Cu5Zn8 phases formed in Sn–3.5Ag–1.0Zn/Cu solder joints during the initial liquid aging stage and the rate of growth of the IMC layers is close to that of the IMC layer in Sn–3.5Ag/Cu solder joints. However, the phase transformation of the two phases into a Cu–Zn–Sn phase speeded up the growth of the IMC layer. The addition of In to Sn–3.5Ag solder alloy resulted in Cu6(Snx,In1?x)5 phase which speeded up the growth of the IMC layer in Sn–3.5Ag–1.5In/Cu solder joint. 相似文献
2.
The intermetallic compounds (IMC) in the solder and at the interface of Sn-3.0Ag-0.5Cu (SAC)/Cu and Sn-3.0Ag-0.3Cu-0.05Cr (SACC)/Cu joints were investigated after isothermal aging at 150 °C for 0, 168 and 500 h. Different shaped Ag3Sn phases were found near the IMC layer of the latter joint. Interestingly, fine rod-shaped and branch-like Ag3Sn were detected near the interface after soldering and long Ag3Sn changed into shorter rods and small particles during aging. It is investigated that the Cr addition and thermal aging have effect on the evolution of Ag3Sn morphologies and it is controlled by interfacial diffusion. Energy minimization theory and the redistribution of elements are used to explain the morphological evolution of Ag3Sn. Small Ag3Sn particles were also found on the IMC layer after aging, unlike the large Ag3Sn at that of SAC/Cu joints. In conclusion, a favorable morphology of the joint interface leads to better bonding properties for SACC/Cu joints against thermal aging than that for SAC/Cu. 相似文献
3.
Asit Kumar GainTama Fouzder Y.C. Chan Winco K.C. Yung 《Journal of Alloys and Compounds》2011,509(7):3319-3325
Nano-sized, nonreacting, noncoarsening ZrO2 particle-reinforced Sn-Ag-Cu composite solders were prepared by mechanically dispersing ZrO2 nano-particles into Sn-Ag-Cu solder and the interfacial morphology between the solder and organic solderability preservative (OSP)-Cu pads were characterized metallographically. At their interfaces, island-shaped Cu6Sn5 and Cu3Sn intermetallic compound (IMC) layers were found in solder joints with and without the ZrO2 particles and the IMC layer thickness was substantially increased with reaction time and temperature. In the solder ball region, needle-shaped Ag3Sn and spherically-shaped Cu6Sn5 IMC particles were found to be uniformly distributed in the β-Sn matrix. However, after the addition of ZrO2 nano-particles, Ag3Sn and Cu6Sn5 IMC particles appeared with a fine microstructure and retarded the growth rate of the IMC layers at their interfaces. From a kinetic analysis, the calculated activation energies for the total (Cu6Sn5 + Cu3Sn) IMC layers for Sn-Ag-Cu and Sn-Ag-Cu-1 wt% ZrO2 composite solder joints on OSP-Cu pads were about 53.2 and 59.5 kJ/mol, respectively. In addition, solder joints containing ZrO2 nano-particles displayed higher hardness due to the uniform distribution of ZrO2 nano-particles as well as the refined IMC particles. The hardness values of the plain Sn-Ag-Cu solder joint and solder joints containing 1 wt% of ZrO2 nano-particles after 5 min reaction at 250 °C were about 15.0 Hv and 17.1 Hv, respectively. On the other hand, their hardness values after 30 min reaction were about 13.7 Hv and 15.5 Hv, respectively. 相似文献
4.
Yee-Wen Yen Yu-Cheng ChiangChien-Chung Jao Da-Wei LiawShao-cheng Lo Chiapyng Lee 《Journal of Alloys and Compounds》2011,509(13):4595-4602
Sn-4.0Ag-0.5Cu (SAC) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG) lead-free solders reacting with the Au/Ni/Cu multi-layer substrate were investigated in this study. All reaction couples were reflowed at 240 and 255 °C for a few minutes and then aged at 150 °C for 100-500 h. The (Cu, Ni, Au)6Sn5 phase was formed by reflowing for 3 min at the interface. If the reflowing time was increased to 10 min, both (Cu, Ni, Au)6Sn5 and (Ni, Cu, Au)3Sn4 phases formed at the interface. The AuSn4 phase was found in the solder for all reaction couples. An addition of Ni and Ge to the solder does not significantly affect the IMC formation. After a long period of heat-treatment, the thickness of the (Cu, Ni, Au)6Sn5 and (Ni, Cu, Au)3Sn4 phases increased and the intermetallic compounds (IMCs) growth mechanism obeyed the parabolic law and the IMC growth mechanism was diffusion-controlled. The mechanical strengths for both the soldered joints decreased with increasing thermal aging time. The SACNG/Au/Ni/Cu couple had better mechanical strength than that in the SAC/Au/Ni/Cu couple. 相似文献
5.
H.R. Kotadia O. MokhtariM.P. Clode M.A. GreenS.H. Mannan 《Journal of Alloys and Compounds》2012,511(1):176-188
The effect of adding 0.5-1.5 wt.% Zn to Sn-3.8Ag-0.7Cu (SAC) solder alloy during reflow and solid state ageing has been investigated. In particular, the role of the Zn addition in suppressing interfacial Intermetallic Compound (IMC) growth on Cu and Ni-P substrates has been determined. Solder-substrate couples were aged at 150 °C and 185 °C for 1000 h. In the case of 0.5-1.0 wt.% Zn on Cu substrate, Cu3Sn IMC was significantly suppressed and the morphology of Cu6Sn5 grains was changed, leading to suppressed Cu6Sn5 growth. In the SAC-1.5Zn/Cu substrate system a Cu5Zn8 IMC layer nucleated at the interface followed by massive spalling of the layer into the solder, forming a barrier layer limiting Cu6Sn5 growth. On Ni-P substrates the (Cu,Ni)6Sn5 IMC growth rate was suppressed, the lowest growth rate being found in the SAC-1.5Zn/Ni-P system. In all cases the added Zn segregated to the interfacial IMCs so that Cu6Sn5 became (Cu,Zn)6Sn5 and (Cu,Ni)6Sn5 became (Ni,Cu,Zn)6Sn5. The effect of Zn concentration on undercooling, wetting angles and IMC composition changes during ageing are also tabulated, and a method of incorporating Zn into the solder during reflow without compromising solder paste reflow described. 相似文献
6.
研究了铜基板退火处理对Cu/Sn58Bi界面微结构的影响. 结果表明,在回流以及时效24 h后Cu/Sn58Bi/Cu界面只观察到Cu6Sn5. 随着时效时间的增加,在界面形成了Cu6Sn5和Cu3Sn的双金属间化合物(IMC)层,并且IMC层厚度也随之增加. 长时间时效过程中,在未退火处理的铜基板界面产生了较多铋偏析,而在退火处理的铜基板界面较少产生铋偏析. 比较退火处理以及未退火处理的铜基板与钎料界面IMC层生长速率常数,发现铜基板退火处理能减缓IMC层生长,主要归因于对铜基板进行退火处理能够有效的消除铜基板的内应力与组织缺陷,从而减缓Cu原子的扩散,起到减缓IMC生长的作用. 相似文献
7.
为了改善Sn-58Bi低温钎料的性能,通过在Sn-58Bi低温钎料中添加质量分数为0.1%的纳米Ti颗粒制备了Sn-58Bi-0.1Ti纳米增强复合钎料。在本文中,研究了纳米Ti颗粒的添加对-55~125 oC热循环过程中Sn-58Bi/Cu焊点的界面金属间化合物(IMC)生长行为的影响。研究结果表明:回流焊后,在Sn-58Bi/Cu焊点和Sn-58Bi-0.1Ti/Cu焊点的界面处都形成一层扇贝状的Cu6Sn5 IMC层。在热循环300次后,在Cu6Sn5/Cu界面处形成了一层Cu3Sn IMC。Sn-58Bi/Cu焊点和Sn-58Bi-0.1Ti/Cu焊点的IMC层厚度均和热循环时间的平方根呈线性关系。但是,Sn-58Bi-0.1Ti/Cu焊点的IMC层厚度明显低于Sn-58B/Cu焊点,这表明纳米Ti颗粒的添加能有效抑制热循环过程中界面IMC的过度生长。另外计算了这两种焊点的IMC层扩散系数,结果发现Sn-58Bi-0.1Ti/Cu焊点的IMC层扩散系数(整体IMC、Cu6Sn5和Cu3Sn IMC)明显比Sn-58Bi/Cu焊点小,这在一定程度上解释了Ti纳米颗粒对界面IMC层的抑制作用。 相似文献
8.
Lihua Qi Jihua Huang Hua Zhang Xingke Zhao Haitao Wang Donghai Cheng 《Journal of Materials Engineering and Performance》2010,19(1):129-134
The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear
cycling conditions was investigated. The results show that the morphology of (Cu
x
Ni1–x
)6Sn5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC
thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu
x
Ni1–x
)6Sn5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism
of formation of Cu6Sn5, (Cu
x
Ni1–x
)6Sn5 and Ag3Sn IMCs during thermal-shear cycling process was investigated. 相似文献
9.
Reaction properties and interfacial intermetallics for Sn−xAg−0.5Cu solders as a function of Ag content 总被引:1,自引:0,他引:1
Jong-Hyun Lee A-Mi Yu Jeong-Han Kim Mok-Soon Kim Namhyun Kang 《Metals and Materials International》2008,14(5):649-654
Wetting and interfacial reactions were investigated for Sn−xAg−0.5Cu alloys, in which the Ag content had a variation from
x=1.0 to x=4.0. Differential scanning calorimetry (DSC) was used to investigate the range of the melting temperature and the
solidification temperature by measuring the endothermic and the exothermic heat flow, respectively. Low Ag contents increased
the melting temperature ranges and deteriorated the wetting properties such as zero cross time and wetting force measured
at two seconds. The extent of undercooling increased and the thickness of intermetallic compounds (IMC) decreased as the Ag
content decreased. As the Ag content decreased, the initial IMC thickness decreased due to the large undercooling and, during
the solid aging at 170°C, the IMC growth slightly decelerated because of the small diffusion coefficient. For the application
of good drop shock reliability, Sn−Ag−Cu solder of low Ag content should be beneficial due to the restraint of the IMC growth
(Cu6Sn5 and Cu3Sn) and of the coarse plate-like IMC (Ag3Sn). 相似文献
10.
The effect of adding a small amount of rare earth cerium (Ce) element to low Ag containing Sn-1wt%Ag Pb-free solder on its interfacial reactions with Cu substrate was investigated. The growth of intermetallic compounds (IMCs) between three Sn-1Ag-xCe solders with different Ce contents and a Cu substrate was studied and the results were compared to those obtained for the Ce-free Sn-1Ag/Cu systems. In the solid-state reactions of the Sn-1Ag(-xCe)/Cu solder joints, the two IMC layers, Cu6Sn5 and Cu3Sn, grew as aging time increased. Compared to the Sn-1Ag/Cu joint, the growth of the Cu6Sn5 and Cu3Sn layers was depressed for the Ce-containing Sn-1Ag-xCe/Cu joint. The addition of Ce to the Sn-Ag solder reduced the growth of the interfacial Cu-Sn IMCs and prevented the IMCs from spalling from the interface. The evenly-distributed Ce elements in the solder region blocked the diffusion of Sn atoms to the interface and retarded the growth of the interfacial IMC layer. 相似文献
11.
The effect on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints, caused by adding Bi to eutectic
Sn-3.5Ag solder alloy, was examined at the aging temperatures of 150°C and 180°C. The Cu6Sn5 layer growth was significantly enhanced, but the Cu3Sn layer growth was slightly retarded by the addition of Bi, resulting in significant growth enhancement of the total (Cu6Sn5+Cu3Sn) IMC layer with increasing Bi addition. The IMC layer growth in the Bi-containing solder joints was accompanied by the
accumulation of Bi ahead of the Cu6Sn5 layer that resulted in the formation of a liquid layer at the Cu6Sn5/solder interface. A kinetic model was developed for the planar growth of the Cu6Sn5 and Cu3Sn layers in the solder joints, accounting for the existence of interfacial reaction barriers. Predictions from the kinetic
model showed that the experimental results could be well explained by the hypothesis that the formation of a Bi-rich liquid
layer at the Cu6Sn5/solder interface reduces the interfacial reaction barrier at the interface. 相似文献
12.
13.
研究了温度为150℃,电流密度为5.0×103A/cm2的条件下电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响.回流焊后在Sn3.0Ag0.5Cu/Ni和Sn3.0Ag0.5Cu/Cu的界面上均形成了(Cu,Ni)6Sn5型化合物.时效过程中界面化合物随时效时间增加而增厚,时效800 h后两端的化合物并没有发生转变,仍为(Cu,Ni)6Sn5型.电流方向对Cu基板的消耗起着决定作用.当电子从基板端流向芯片端时,电流导致基板端Cu焊盘发生局部快速溶解,并导致裂纹在Sn3.0Ag0.5Cu/(Cu,Ni)6Sn5界面产生,溶解到钎料中的Cu原子在钎料中沿着电子运动的方向向阳极扩散,并与钎料中的Sn原子发生反应生成大量的Cu6Sn5化合物颗粒.当电子从芯片端流向基板端时,芯片端Ni UBM层没有发生明显的溶解,在靠近阳极界面处的钎料中有少量的Cu6Sn5化合物颗粒生成,电迁移800 h后焊点仍保持完好.电迁移过程中无论电子的运动方向如何,均促进了阳极界面处(Cu,Ni)6Sn5的生长,阳极界面IMC厚度明显大于阴极界面IMC的厚度.与Ni相比,当Cu作为阴极时焊点更容易在电迁移作用下失效. 相似文献
14.
《Journal of Alloys and Compounds》2006,407(1-2):208-214
Intermetallic compound (IMC) formations of Sn–2.8Ag–0.5Cu solder with additional 1 wt% Bi were studied for Cu-substrate during soldering at 255 °C and isothermal aging at 150 °C. It was found that addition of 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder inhibits the excessive formation of intermetallic compounds during the soldering reaction and thereafter in aging condition. Though the intermetallic compound layer was Cu6Sn5, after 14 days of aging a thin Cu3Sn layer was also observed for both solders. A significant increase of intermetallic layer thickness was observed for both solders where the increasing tendency was lower for Bi-containing solder. After various days of aging, Sn–2.8Ag–0.5Cu–1.0Bi solder gives comparatively planar intermetallic layer at the solder–substrate interface than that of the Sn–2.8Ag–0.5Cu solder. The formation of intermetallic compounds during aging for both solders follows the diffusion control mechanism and the diffusion of Cu is more pronounced for Sn–2.8Ag–0.5Cu solder. Intermetallic growth rate constants for Sn–2.8Ag–0.5Cu and Sn–2.8Ag–0.5Cu–1.0Bi solders were calculated as 2.21 × 10−17 and 1.91 × 10−17 m2/s, respectively, which had significant effect on the growth behavior of intermetallic compounds during aging. 相似文献
15.
研究了Ti O2纳米颗粒掺杂影响回流焊过程中Sn-3.0Ag-0.5Cu-x Ti O2焊点界面Cu6Sn5金属间化合物(intermetallic compound,IMC)晶粒生长机理.基于Cu原子扩散通量驱动晶粒成熟生长(flux driven ripening,FDR)理论模型分析了Cu6Sn5IMC晶粒生长机理.结果表明,Ti O2纳米颗粒掺杂改变了焊点界面Cu6Sn5IMC晶粒形貌和尺寸.含Ti O2纳米颗粒的焊点Cu6Sn5IMC晶粒尺寸要小于不含Ti O2纳米颗粒的焊点,且晶粒分布要更加均匀.试验数据与FDR理论模型基本吻合.Cu6Sn5IMC晶粒生长指数分别为0.346,0.338,0.332和0.342,这说明Cu6Sn5IMC晶粒生长是由原子互扩散和晶粒成熟共同控制. 相似文献
16.
通过添加1% 和2%(质量分数)的Bi提高SAC305焊接接头的性能,并研究Bi掺杂对SAC305?xBi/Cu焊接接头显微组织、热性能和力学性能的影响.Bi掺杂通过细化初始β-Sn和共晶相改善焊接接头的显微组织.当Bi含量低于2% 时,Bi溶解到β-Sn基体中形成固溶体;而当Bi含量等于或高于2%时,β-Sn基体中形... 相似文献
17.
《Journal of Alloys and Compounds》2006,407(1-2):141-149
Sn–9Zn (in wt.%) solder ball was bonded to Cu pad, and the effect of aging on shear reliability was investigated. After reflow, the intermetallic compound (IMC) phase formed at the interface was Cu5Zn8, and the as-reflowed Sn–9Zn/Cu joint had sufficient shear strength. In the isothermal aging test, only Cu5Zn8 IMC was observed in the samples aged at temperatures between 70 and 120 °C. On the other hand, after aging at 150 °C for 250 h, Cu6Sn5 phase was observed at the interface between the interfacial Cu5Zn8 IMC layer and the Cu substrate. And, the layer-type Cu5Zn8 IMC layer was disrupted locally at the interface. In the ball shear test conducted after aging treatment, the shear strength significantly decreased after aging at all temperatures for initial 100 h, and then remained constant by further prolonged aging. The fracture mainly occurred at the interface between the solder and Cu5Zn8 IMC layer. The aged Sn–9Zn/Cu solder joint had an inferior joint reliability. 相似文献
18.
以Sn2.5Ag0.7Cu0.1RE0.05Ni无铅钎料合金为研究对象,基于石墨烯纳米片(GNS)独特的结构、优异的物理性能和力学性能,以其为复合钎料的增强相,开展基于Ni改性GNSs(Ni-GNSs)增强SnAgCuRE系复合钎料/Cu的钎焊和钎焊接头热老化试验,探讨Ni-GNSs对复合钎料组织及钎焊接头热老化失效断裂机制的影响。结果表明:Ni-GNSs的加入,抑制了复合钎料的线膨胀,产生晶格畸变,导致位错产生,金属间化合物(IMC)颗粒分布在位错线附近,与位错发生交互作用,阻碍位错运动,强化复合钎料,进而强化复合钎料接头。随着热老化时间延长,钎焊接头界面IMC层厚度增加,剪切强度降低;其中,添加0.05%(质量分数)GNSs的复合钎料接头剪切强度降幅最小,为8.9%,且热老化384 h后,其剪切强度仍高于Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu合金接头热老化前的剪切强度。Ni-GNSs的加入,使复合钎料钎焊接头界面IMC的生长系数明显降低,有效缓解了复合钎料/Cu钎焊接头热老化过程中力学性能的降低,进而改变复合钎料/Cu钎焊接头的热老化失效断裂机制,最终影响接头的可靠性。Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头的断裂位置由热老化前的钎缝区向钎缝/界面IMC移动,变为韧脆混合断裂;而添加0.05%(质量分数)GNSs复合钎料接头的断裂位置均在钎缝区,为韧性断裂,钎焊接头可靠性较高。 相似文献
19.
A comprehensive transmission electron microscopy (TEM) study was conducted to investigate the growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates in solder joints. On single crystalline Cu the solder reflow process resulted in the growth of columnar Cu3Sn grains aligned in a thin uniform layer perpendicular to the interface, while a thick Cu3Sn layer formed from fine equiaxed grains on the polycrystalline substrate. In the subsequent solid state aging, columnar growth of Cu3Sn continued on the single crystalline Cu before it was replaced by nucleation and growth of new triangular Cu3Sn grains at the triple junction sites of the Cu/Cu3Sn interface. On the polycrystalline Cu the solid state aging caused much more rapid growth of the Cu3Sn layer due to nucleation and the growth of new Cu3Sn grains at both the Cu/Cu3Sn and Cu6Sn5/Cu3Sn interfaces. These different growth behaviors of Cu3Sn were related to the diffusive supply of reactive elements. 相似文献
20.
Erika HodúlováMarián Palcut Emil Lechovi?Beáta Šimeková Koloman Ulrich 《Journal of Alloys and Compounds》2011,509(25):7052-7059
The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 °C for 5 s. The joints were subsequently aged at temperatures of 130-170 °C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu3Sn and Cu6Sn5. Cu6Sn5 is formed during soldering. Cu3Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu3Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu6(Sn,In)5 instead of Cu6Sn5, with a higher rate constant. The mechanism of the Cu6(Sn,In)5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented. 相似文献