共查询到20条相似文献,搜索用时 62 毫秒
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无焊剂软钎焊技术因其焊接过程中无焊剂残留,被广泛应用于光电器件和芯片倒装焊等方面。首先对无焊剂软钎焊的原理和工艺进行了阐述,并指出气氛保护和等离子处理是无焊剂软钎焊的两个主要技术途径。基于上述分析,采用无焊剂软钎焊工艺开展钎料润湿性研究。结果表明,还原气氛保护和等离子处理后,焊料的润湿铺展性能显著提高。 相似文献
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Sn-Zn无铅焊料由于熔点接近Sn-Pb,价格低廉、无毒性、力学性能优良等特点,倍受人们的关注。然而由于Zn的表面活性高,在钎焊过程中焊料容易氧化,导致了润湿性能下降。本文综述合金元素对Sn-Zn无铅焊料氧化性能、润湿性的影响。并对Sn-Zn焊料今后的研究方向进行了简要分析。 相似文献
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介绍了一种自动钎焊炉,它包括PLC控制器、温控表和一个带有钎焊焊料的带电回路。PLC控制器把温控表和带电回路联系在一起。通过对PLC控制器和温控表进行一些参数设置后,钎焊炉能自动完成工件的钎焊过程,大大提高了钎焊工艺的一致性和工件的钎焊质量。 相似文献
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F. Guo J. Lee J. P. Lucas K. N. Subramanian T. R. Bieler 《Journal of Electronic Materials》2001,30(9):1222-1227
The creep deformation behavior of eutectic Sn-3.5Ag based Ni particle rein forced composite solder joints was investigated.
The Ni particle reinforced composite solder was prepared by mechanically dispersing 15 vol.% of Ni particles into eutectic
Sn-3.5Ag solder paste. Static-loading creep tests were carried out on solder joint specimens at 25 C, 65 C, and 105 C, representing
homologous temperatures ranging from 0.6 to 0.78. A novel-design, miniature creep-testing frame was utilized in this study.
Various creep parameters such as the global and localized creep strain, steady-state creep rate, onset of tertiary creep and
the activation energy for creep were quantified by mapping the distorted laser ablation pattern imprinted on the solder joint
prior to testing. The Ni-reinforced composite solder joint showed improved creep resistance compared to the results previously
reported for eutectic Sn-3.5Ag solder, Sn-4.0Ag-0.5Cu solder alloys, and for eutectic Sn-3.5Ag solder reinforced with Cu or
Ag particle reinforcements. The activation energy for creep was ∼0.52 eV for Sn-3.5Ag and Sn-4Ag-0.5Cu solder alloys. The
activation energies ranged from 0.55–0.64 eV for Cu, Ag, and Ni reinforced composite solder joints, respectively. Most often,
creep fracture occurred closer to one side of the solder joint within the solder matrix. 相似文献
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C. Y. Liu Jian Li G. J. Vandentop W. J. Choi K. N. Tu 《Journal of Electronic Materials》2001,30(5):521-525
The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been
studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting
than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded
by an innerring of Cu−Sn compound and an outer ring of Pd−Sn compound. This implies that the molten SnAg solder had removed
the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior
were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that
the SnAgCu solders have a lower Cu consumption rate than the SnAg solder. 相似文献
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Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles 总被引:6,自引:0,他引:6
F. Guo J. Lee S. Choi J. P. Lucas T. R. Bieler K. N. Subramanian 《Journal of Electronic Materials》2001,30(9):1073-1082
Composite solders offer improved properties compared to non-composite solders. Ni reinforced composite solder was prepared
by mechanically dispersing 15 vol.% of Ni particles into eutectic Sn-3.5Ag solder paste. The average size of the Ni particle
reinforcements was approximately 5 microns. The morphology, size and distribution of the reinforcing phase were characterized
metallographically. Solid-state isothermal aging study was performed on small realistic size solder joints to study the formation
and growth of the intermetallic (IM) layers at Ni reinforcement/solder and Cu substrate/solder interfaces. Effects of reflow
on microstructure and solderability, were studied using Cu substrates. Regarding solderability, the wetting angle of multiple
reflowed Ni reinforced composite solder was compared to the solder matrix alloy, eutectic Sn-3.5Ag. General findings of this
study revealed that Ni particle reinforced composite solder has comparable wetting characteristics to eutectic Sn-3.5Ag solder.
Significant IM layers growth was observed in the Ni composite solder joint under isothermal aging at 150 C. Microstructural
evolution was insignificant when aging temperature was lower than 100 C. Multiple reflow did not significantly change the
microstructure in Ni composite solder joint. 相似文献
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John P. Ranieri Frederick S. Lauten Donald H. Avery 《Journal of Electronic Materials》1995,24(10):1419-1423
The aspect ratio (joint area/joint thickness) of thin (0.001-0.006 in.) surface mount solder (60S-40Pb) joints plays an important
role in determining the mechanical properties and fracture behavior of the joints. This study demon-strates that plastic constraint
of a large aspect ratio 60Sn-40Pb solder joint can develop triaxial (hydrostatic) stresses several times greater than the
average tensile strength of the bulk solder material. A four to sixfold increase in average joint stress and up to a tenfold
increase in peak stress was measured on joints with aspect ratios ranging from 400 to 1000. Although a direct relationship
of the aspect ratio to the average tensile stress is shown, as the Friction Hill model predicts, the observed stress increase
is not nearly as high but proportional to the classical prediction. This is attributed to the existence of internal defects
(oxide particles and micro-voids) and transverse grain boundaries which fail producing internal free surfaces. Thus, the actual
aspect ratio is thickness/d2, where d equals the distance between internal surfaces. The fracture of these constrained joints was brittle, with the separation
occurring between a tin-rich copper tin intermetallic at the interface and the solder matrix. Voids within the solder joint
are shown to relieve the plastic constraint and lower the average tensile stress of the joint. The Friction Hill model may
play an important role in explaining the small percentage of atypical solder joint failures which sometimes occur on electronic
assemblies. In particular, the sudden failure of a thin joint in a strain controlled environment may be attributed to the
development of a large hydrostatic stress component. Therefore, a flaw free, plastically constrained joint which develops
a high stress state will be a high risk candidate for failure. 相似文献
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Harvey D. Solomon 《Journal of Electronic Materials》1990,19(9):929-936
Creep plays an important role in the mechanical behavior of solder alloys. This paper presents creep and strain rate sensitivity
data for a Pb rich solder (92.5Pb, 2.5Ag, 5Sn-Indalloy 151) and compares it to the behavior of near eutectic 60Sn/40Pb solder.
The high Pb alloy is used for exposures to higher temperatures than can be withstood by eutectic Sn/Pb solders. The Pb rich
solder tested here is less strain rate sensitive than 60Sn/40Pb. There are also differences in the creep behavior. 相似文献
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Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints 总被引:1,自引:0,他引:1
The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5,
and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic
(IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth
and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from
the pad during reflow soldering resulted in a fine dispersion of Cu6Sn5 particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation
hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to
shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders.
The bulk solder strength decreased rapidly as the fine Cu6Sn5 precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders,
the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged
joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect
on the shear strength of BGA solderjoints, especially during system use at high temperatures. 相似文献
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In this work, we have systematically investigated the evolution of microstructure and of intermetallic compounds (IMCs), in
particular, for lead-free SnAgCuEr solders during isothermal aging tests. The effect of trace amounts of the rare earth element
Er on this process has also been studied. The results indicate that diffusion and reassembly occur in the solder matrix during
the aging process, and the major influence of the rare earth element Er is concentrated on the nucleation sites. ErSn3 IMCs formed from the molten solder provide heterogeneous nucleation sites for the IMCs in the soldering and aging process.
Subsequently, the Cu-Sn IMCs produced during soldering and Ag-Sn IMCs precipitated during the aging process have uniform size
and evenly distribute in the solder matrix, and the refinement effect has been achieved in Er-containing solder joints. In
addition, some cracks can be seen in Er-free solder joints, and the cracks may nucleate and propagate in the structure along
the compound/solder boundaries after long aging times. 相似文献