硅基HgCdTe光伏器件的暗电流特性分析

对硅基HgCdTe中波器件进行了变温电流电压特性的测试和分析。测量温度从30K到240K，得到R0对数与温度的1000／T的实验曲线及拟合结果。同时选取60K、80K及110K下动态阻抗尺与电压V的曲线进行拟合分析。研究表明在我们器件工作的温度点80K，零偏压附近主要的电流机制是产生复合电流和陷阱辅助隧穿电流。要提高器件的水平，必须降低陷阱辅助隧穿电流和产生复合电流对暗电流的贡献。     

硅基HgCdTe光伏器件的暗电流特性分析

对硅基HgCdTe中波器件进行了变温电流电压特性的测试和分析.测量温度从30K到240K,得到R0对数与温度的1000/T的实验曲线及拟合结果.同时选取60K、80K及110K下动态阻抗R与电压V的曲线进行拟合分析.研究表明在我们器件工作的温度点80K,零偏压附近主要的电流机制是产生复合电流和陷阱辅助隧穿电流.要提高器件的水平,必须降低陷阱辅助隧穿电流和产生复合电流对暗电流的贡献.     

光伏型碲镉汞长波探测器暗电流特性的参数提取研究

报道了一种适用于碲镉汞长波光伏探测器的由典型电阻电压(R-V)曲线提取器件基本特征参数的数据处理途径.拟合程序中采用的暗电流机制包括了扩散电流机制,产生复合电流机制,陷阱辅助隧穿机制以及带到带直接隧穿电流机制.本文详细地给出了该拟合计算所采用的方法和途径,分析了拟合参数的误差范围.通过对实际器件的R-V特性曲线的拟合计算,给出了实际器件的基本特征参数,验证了该数据处理途径的实用性.     

InAs/GaSb超晶格长波红外探测器暗电流特性分析

利用二极管电流解析模型分析了InAs/GaSb超晶格长波红外探测器暗电流的主导机制。首先,通过变面积二极管I-V测试证实77 K下采用阳极硫化加SiO₂复合钝化的InAs/GaSb超晶格长波红探测器的暗电流主要来自于体电流,而非侧壁漏电流;然后,利用扩散电流、产生复合电流、直接隧穿电流和陷阱辅助隧穿电流模型对InAs/GaSb超晶格长波红外探测器的暗电流进行拟合分析。结果表明:在小的反向偏压下(≤60 mV),器件暗电流主要由产生复合电流主导,而在高偏压下(>60 mV）,器件暗电流则主要由缺陷陷阱辅助隧穿电流主导。并分析了吸收层掺杂浓度对这两种电流的影响,证实5×1015~1×1016 cm?3是优化的掺杂浓度。     

长波碲镉汞探测器RV特性分析

对硼离子注入制备的N on P平面结长波碲镉汞探测器的RV曲线进行分析,研究不同偏压下暗电流机制,提取得到探测器的电学参数及理想因子,表明为提升器件性能,需要对探测器的陷阱辅助隧穿电流及产生复合电流进行抑制。通过对长波碲镉汞探测器RV曲线的拟合分析,表明RV拟合技术作为一种有效的分析方法,可用于评估器件性能和工艺状态,并指导工艺改进。     

平面型2.6μm InGaAs 红外探测器变温特性研究

通过闭管扩散方式,在NIN型InP/In0.82Ga0.18As/InP材料上制备了单元及八元平面型红外探测器件,研究了器件的光谱响应特性、变温电流-电压特性以及器件探测率的温度响应特性。研究表明,不同温度下,在较低的偏压下,器件的正向暗电流的主要成分为源于材料缺陷的产生-复合电流,随着电压增大,器件的电流将会受到串联电阻的限制而趋于饱和。在近室温(>250 K)下,器件的反向电流主要以扩散电流和产生-复合电流为主,随着温度降低(<158 K),与偏压成正比的隧穿电流将占优势。温度>158 K时,器件的R     

第二届全国先进焦平面技术研讨会论文摘要

碲镉汞二极管暗电流特性拟合参数的误差分析模型全知觉,李志锋,胡伟达,叶振华,陆卫(中国科学院上海技术物理研究所红外物理国家重点实验室,上海200083)摘要:介绍了一种分析光伏型碲镉汞器件拟合参数误差的理论模型。该模型适用于任何结构的碲镉汞同质材料形成的p-n结型光伏器件。本文以n-on-p型器件为例,详细完整地展示了该理论模型的推导和建立过程。涉及的暗电流物理模型包括了扩散电流机制、产生复合电流机制、陷阱辅助隧穿机制以及带到带直接隧穿电流机制,同时也考虑了实际器件的串联电阻效应。对真实器件拟合分析的结果表明,该模型能定…     

MMVCX光伏型HgCdTe中波探测器暗电流温度特性

研究了光伏型HgCdTe中波探测器的暗电流与烘烤时间的关系特性.编写了一种适用于n-on-p型的中波HgCdTe红外探测器的解析拟合程序.结合暗电流的主导机制有扩散机制、产生复合机制、带间直接隧穿机制和陷阱辅助隧穿机制.通过对样品不同烘烤时间的R-V曲线的解析拟合,得到了它们的暗电流成分,提取了6个特征参数.通过对比不同烘烤时间特征参数的变化,分析了烘烤对器件的影响.     

室温下nc-Si/SiO2多层膜结构中的共振隧穿现象

采用等离子体淀积和原位氧化技术,并结合后续的热退火处理制备了nc-Si/SiO2 多层膜结构。通过电流电压特性对室温下器件中的载流子输运过程进行了表征。在正向和反向偏压下的电流电压特性曲线中都表现出了由于共振隧穿引起的负微分电导。共振隧穿产生的峰值电流对应的电压值与器件结构中的势垒层厚度相关,势垒层越厚,发生隧穿的峰值电压越高。文中通过器件的能带结构简图和等效电路图对正向、反向偏压下的共振隧穿峰值电压差异进行了细致的分析。     

离子束刻蚀HgCdTe环孔pn结I—V、RD—V特性的研究（上）

本文推导了一种可简便、准确、直观计算和分析pn结I-V特性的公式和方法,并应用该方法对两类典型HgCdTe环孔pn结的I-V、RD-V特性进行了计算和拟合;得到了表面欧姆(反型沟道)漏电导、二极管理想因子n随电压的分布等反映二极管结特性的重要参数.计算结果表明,对于长波HgCdTe光伏器件而言,表面漏电流在整个暗电流中所占的比重相当大,表面漏电流严重地制约着器件性能.HgCdTe材料的晶体缺陷会使二极管的理想因子n增大,从而使产生-复合电流及陷阱辅助隧穿电流增加.     

甚长波碲镉汞光伏探测器伏安特性分析

分析了注入同质结N-on-P和液相外延异质结P-on-N碲镉汞甚长波红外探测器在不同工作温度下的I-V特性,并对R-V特性进行了仿真计算,对比了扩散电流、产生-复合电流、表面漏电流、带间隧穿电流和缺陷辅助隧穿电流等暗电流对两种器件R-V特性的不同影响。     

Analysis of 1/f noise in LWIR HgCdTe photodiodes

We study the 1/f noise currents and dark currents in LWIR HgCdTe photodiodes. The measured dark currents of the diodes processed by post implantation annealing with different annealing times are analyzed using current model fitting methods. The different dark current components, such as diffusion current, generation-recombination current, band-to-band tunneling current, and trap assisted tunneling current, at various bias voltages can be separated from the measured dark currents. By the fitting analysis, some physical parameters are extracted and different annealing effects can be explained by the parameters. The improvements in diode characteristics by post implantation annealing can be explained by the changes of trap density, donor concentration, minority carrier lifetime, and generation lifetime. The 1/f noise currents are measured over a wide range of reverse bias voltages, and correlated with the extracted dark currents by superposition of the noise generated by the different dark current mechanisms. It turns out that the band-to-band tunneling has a smaller correlation with the 1/f noise than other current components, and the trap center seems to be responsible for the 1/f noise characteristics of the LWIR HgCdTe photodiodes.     

Measurement of Enhanced Gate-Controlled Band-to-Band Tunneling in Highly Strained Silicon-Germanium Diodes

Strained silicon-germanium (Si_0.6Ge_0.4) gated diodes have been fabricated and analyzed. The devices exhibit significantly enhanced gate-controlled tunneling current over that of coprocessed silicon control devices. The current characteristics are insensitive to measurement temperature in the 80 K to 300 K range. Independently extracted valence band offset at the strained Si_0.6Ge_0.4/Si interface is 0.4 eV, yielding a Si_0.6Ge_0.4 bandgap of 0.7 eV, which is much reduced compared to that of Si. The results are consistent with device operation based on quantum-mechanical band-to-band (BTB) tunneling rather than on thermal generation. Moreover, simulation of the strained Si_0.6Ge_0.4 device using a quantum-mechanical BTB tunneling model is in good agreement with the measurements.     

A novel transient characterization technique to investigate trap properties in HfSiON gate dielectric MOSFETs-from single electron emission to PBTI recovery transient

A positive bias temperature instability (PBTI) recovery transient technique is presented to investigate trap properties in HfSiON as high-k gate dielectric in nMOSFETs. Both large- and small-area nMOSFETs are characterized. In a large-area device, the post-PBTI drain current exhibits a recovery transient and follows logarithmic time dependence. In a small-area device, individual trapped electron emission from HfSiON gate dielectric, which is manifested by a staircase-like drain current evolution with time, is observed during recovery. By measuring the temperature and gate voltage dependence of trapped electron emission times, the physical mechanism for PBTI recovery is developed. An analytical model based on thermally assisted tunneling can successfully reproduce measured transient characteristics. In addition, HfSiON trap properties, such as trap density and activation energy, are characterized by this method.     

Dependence of off-leakage current on channel film quality in poly-Si thin-film transistors and analysis using device simulation

The dependence of off-leakage current on channel film quality in poly-Si thin-film transistors has been analyzed using two-dimensional device simulation. It is found that the off-leakage current decreases as the intragrain trap density decreases for the low V_gs. This is because the Phonon-assisted tunneling with Poole-Frenkel effect is the dominant mechanism of the carrier generation and the generation rate of carrier pair decreases as the intragrain trap density decreases. On the other hand, the off-leakage current slightly increases as the intragrain trap density decreases for the high V_gs. This is because the band-to-band tunneling is the dominant mechanism and the influence of the intragrain trap density to the carrier conductance is larger than that to the generation rate.     

Temperature dependent IDS-VGS characteristics of an N-channel Si tunneling field-effect transistor with a germanium source on Si(110) substrate

在Si(110)衬底上制备了Ge源n型Si沟道隧穿场效应晶体管（TFET）。本文研究了温度对Ge源Si TFET器件的电学性能的影响。温度相关性研究显示器件漏电流主要由漏区的Shockley - Read - Hall (SRH) 产生于复合电流决定。器件开态电流随温度升高而增加,这是因为温度升高材料禁带宽度减小,隧穿几率增大。界面缺陷引起的隧穿电流的亚阈值摆幅随温度升高而变差,但是带间隧穿电流的亚阈值摆幅不随温度变化而变化。     

γ辐照导致中波碲镉汞光伏器件暗电流退化的机理研究

针对红外探测器在空间应用中受到高能粒子辐照后暗电流退化的问题,开展射线对中波碲镉汞（HgCdTe）光伏器件暗电流影响的研究。在室温和77 K温度下,利用60Co-射线对HgCdTe器件进行辐照试验,辐照试验结束后对低温辐照器件进行77 K低温退火和室温退火。通过比较辐照前后和退火后器件的I-V特性、R-V特性和零偏动态电阻R0参数,分析了辐照对HgCdTe器件暗电流的影响机制。试验结果表明:在总剂量为7 Mrad（Si）照条件下,器件暗电流未出现明显的退化;在77 K温度辐照条件下,器件暗电流随着总剂量的增加而增加,且暗电流退化幅度与辐照过程中的偏置有关。研究表明暗电流的退化源于辐照在器件中造成电离损伤,导致器件HgCdTe化层中的界面态和空穴陷阱电荷密度增加。     

Temperature-dependent light-emitting characteristics of InGaN/GaN diodes

Temperature-dependent light-emitting and current-voltage characteristics of multiple-quantum well (MQW) InGaN/GaN blue LEDs were measured for temperature ranging from 100 to 500 K. The measurement results revealed two kinds of defects that have pronounced impact on the electroluminescent (EL) intensity and device reliability of the LEDs. At low-temperature (<150 K), in addition to the carrier freezing effect, shallow defects such as nitrogen vacancies or oxygen in nitrogen sites can trap the injected carriers and reduces the EL intensity. At high temperature (>300 K), deep traps due to the structure dislocations at the interfaces significantly reduce the efficiency for radiative recombination though they can enhance both forward and reverse currents significantly. In addition, the significant enhancement of trap-assisted tunneling current causes a large heat dissipation and results in a large redshift of the emission peak at high temperature.     

A comprehensive study of hot carrier stress-induced drain leakagecurrent degradation in thin-oxide n-MOSFETs

The mechanisms and characteristics of hot carrier stress-induced drain leakage current degradation in thin-oxide n-MOSFETs are investigated. Both interface trap and oxide charge effects are analyzed. Various drain leakage current components at zero V_gs such as drain-to source subthreshold leakage, band-to-band tunneling current, and interface trap-induced leakage are taken into account. The trap-assisted drain leakage mechanisms include charge sequential tunneling current, thermionic-field emission current, and Shockley-Read-Hall generation current. The dependence of drain leakage current on supply voltage, temperature, and oxide thickness is characterized. Our result shows that the trap-assisted leakage may become a dominant drain leakage mechanism as supply voltage is reduced. In addition, a strong oxide thickness dependence of drain leakage degradation is observed. In ultra-thin gate oxide (30 Å) n-MOSFETs, drain leakage current degradation is attributed mostly to interface trap creation, while in thicker oxide (53 Å) devices, the drain leakage current exhibits two-stage degradation, a power law degradation rate in the initial stage due to interface trap generation, followed by an accelerated degradation rate in the second stage caused by oxide charge creation