共查询到19条相似文献,搜索用时 93 毫秒
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在总结有机硅离型剂的结构与性能以及固化反应机理的基础上,概述了近年来传统溶剂型、乳液型和无溶剂有机硅离型剂的应用研究进展,并介绍了紫外光固化、电子束固化和氟硅等新型有机硅离型剂,最后对有机硅离型剂的发展方向和前景进行了展望. 相似文献
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以八甲基环四硅氧烷、四甲基四乙烯基环四硅氧烷为单体,六甲基二硅氧烷为封端剂,碱胶为催化剂,合成了含乙烯基有机硅树脂;并研究了电子束辐射剂量对其固化行为的影响和固化涂层的热性能。红外谱图及凝胶率测试结果表明,有机硅树脂中的碳碳双键吸收峰强度随辐射剂量的增加而减弱,辐射诱导交联网络结构的形成导致固化涂层的凝胶率随剂量的增加而显著增加;辐射剂量为30 kGy时,凝胶率为46.2%;辐射剂量增加至60 kGy时为70.1%和100 kGy时为85.9%。差示扫描量热分析和热质分析结果表明,固化涂层具有优良的耐低温性和热稳定性。 相似文献
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利用FTIR研究了邻苯二甲酸二烯丙酯(DAOP)在高温条件下的固化反应,采用DSC研究确定了2,3-二甲基-2,3-二苯基丁烷(DMDPB)/邻苯二甲酸二烯丙酯(DAP)体系的固化行为及其动力学参数。结果表明:DMDPB可在180~210℃下引发DAOP树脂的固化反应,且体系固化过程中放热平缓;DMDPB用量为2%时,体系的凝胶温度、固化温度、后处理温度分别为:173.19℃、195.72℃、209.20℃;其表观活化能为93.488 kJ/mol,反应频率因子为1.02×1010,表观反应级数为0.9223。 相似文献
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Paola Amazio Maurizio Avella Maria Emanuela Errico Gennaro Gentile Francesco Balducci Alessio Gnaccarini Julian Moratalla Manuel Belanche 《应用聚合物科学杂志》2011,122(4):2779-2788
The effectiveness of acrylic resins as low formaldehyde emission binders for particleboard production was explored. In particular, a multifunctional methacrylic monomer, ethoxylated bisphenol A dimethacrylate, classified as nonskin and eyes irritant, was selected and tested. In comparison panels realized with classic urea‐formaldehyde (UF) binder were also prepared. No significant differences were found through the morpholocigal analysis of samples prepared with the two different binders. Moreover, particleboard panels realized with the acrylic binder showed better mechanical properties and lower water absorption and thickness swelling in comparison with corresponding panels realized with the UF binders. Furthermore, the replacement of the UF with the acrylic binder did not affect thermal insulation properties of the panels. Formaldehyde release tests revealed that particleboard panels obtained by applying the acrylic binder can be classified as E1 following the European classification and even F**** following the stricter Japanese classification. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011 相似文献
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用红外光谱分析了在环氧树脂中加入聚硫橡胶的固化及增韧过程,通过差示扫描量热法研究了增韧体系的反应动力学,探讨了聚硫橡胶用量对固化产物力学强度的影响,并对试样断口形貌进行了扫描电镜观察。结果表明,聚硫橡胶的加入降低了环氧树脂的表观活化能而没有改变反应级数,使得固化反应的总放热量减少、放热过程更加平均。聚硫橡胶对环氧树脂的增韧效果明显,二者通过化学键结合,韧性撕裂的冲击断面形貌验证了这种活性增韧。当聚硫橡胶用量为30份(质量)时,环氧树脂固化物的冲击强度可达到未增韧者的896%。 相似文献
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Alex Reichanadter Dave Bank Jan-Anders E. Mansson 《Polymer Engineering and Science》2021,61(6):1819-1828
Mold preparation, material layup, and cure times for thermoset-based composites often limit their use in high-volume applications. As such, new rapid cure epoxy resins are being developed to achieve a complete cycle time within 3 min. In this research, calorimetry and rheometry are used to examine and model two novel rapid cure epoxy resin systems with internal mold release. The rapid cure epoxy resins followed an autocatalytic cure kinetic and William–Landel–Ferry diffusion model. The rapid cure epoxy resin was shown to achieve 94% cure in 2 min at 150°C. However, adding an additional 2.5 wt% internal mold release hindered the first step of the reaction, which delayed the second reaction step since the final degrees of cure were similar. Furthermore, the resin viscosity followed a modified William–Landel–Ferry equation and at 120°C could maintain a viscosity below 5 Pa s for 4.1 min. These models provided valuable insight into the range of processing conditions these novel resins could experience during impregnation and molding processes. 相似文献
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Zuo‐min Zhan Hong‐qiang Yan Ping Yin Jie Cheng Zheng‐ping Fang 《Polymer International》2020,69(4):355-362
A novel bio‐based benzoxazine resin (diphenolic acid/furfurylamine benzoxazine resin, PDPA‐F‐Boz) was prepared by using bio‐based diphenolic acid, furfurylamine and paraformaldehyde as raw materials. The structure of DPA‐F‐Boz monomer was characterized by Fourier transform infrared spectroscopy, 1H NMR and 13C NMR, and then its curing reaction and the thermal stability of the cured PDPA‐F‐Boz were analyzed. Compared with the traditional fossil‐based benzoxazine (bisphenol A/aniline benzoxazine, BPA‐A‐Boz) and the bio‐based benzoxazine (diphenolic acid/aniline benzoxazine, DPA‐A‐Boz), DPA‐F‐Boz monomer showed the lowest curing temperature, and PDPA‐F‐Boz had the highest residual char ratio at 800 °C and the lowest degradation rate at the peak temperature. Meanwhile, the total heat release, peak heat release rate and heat release capacity of PDPA‐F‐Boz were much lower than those of PBPA‐A‐Boz and PDPA‐A‐Boz. Thus, PDPA‐F‐Boz showed excellent low‐temperature curing ability and thermal stability. © 2019 Society of Chemical Industry 相似文献
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环氧树脂/聚酰胺/DDM体系的固化行为及力学性能 总被引:2,自引:0,他引:2
通过非等温DSC法及拉伸性能测试研究了4,4'-二氨基二苯基甲烷(DDM)用量对环氧树脂/聚酰胺651体系的固化反应的影响,计算了固化反应的表观活化能和反应级数,确定了其胶粘剂体系的固化工艺参数。结果表明,胶粘剂中DDM的质量分数达到14%(以环氧树脂质量为基准)时,固化反应放热量达到最大值。固化体系的活化能为53.654 kJ/mol,反应级数为0.895。最佳起始固化温度为40℃,峰值温度为85℃,终止温度为120℃,体系的拉伸强度提高了约50%。 相似文献