Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

Influence of the synthesis conditions on the curing behavior of phenol–urea–formaldehyde resol resins

The curing behavior of synthesized phenol–urea–formaldehyde (PUF) resol resins with various formaldehyde/urea/phenol ratios was studied with differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The results indicated that the synthesis parameters, including the urea content, formaldehyde/phenol ratio, and pH value, had a combined effect on the curing behavior. The pH value played an important role in affecting the shape of the DSC curing curves, the activation energy, and the reaction rate constant. Depending on the pH value, one or two peaks could appear in the DSC curve. The activation energy was lower when pH was below 11. The reaction rate constant increased with an increase in the pH value at both low and high temperatures. The urea content and formaldehyde/phenol ratio had no significant influence on the activation energy and rate constant. DMA showed that both the gel point and tan δ peak temperature (T_tanδ) had the lowest values in the mid‐pH range for the PUF resins. A different trend was observed for the phenol–formaldehyde resin without the urea component. Instead, the gel point and T_tanδ decreased monotonically with an increase in the pH value. For the PUF resins, a high urea content or a low formaldehyde/phenol ratio resulted in a high gel point. The effect of the urea content on T_tanδ was bigger than that on the gel point because of the reversible reaction associated with the urea component. Too much formaldehyde could lead to more reversible reactions and a higher T_tanδ value. The effects of the synthesis conditions on the rigidity of the cured network were complex for the PUF resins. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 95: 1368–1375, 2005     

Properties of phenol‐formaldehyde resins prepared from phenol‐liquefied lignin

In this study, alkaline lignin (AL), dealkaline lignin (DAL), and lignin sulfonate (SL) were liquefied in phenol with sulfuric acid (H₂SO₄) or hydrochloric acid (HCl) as the catalyst. The phenol‐liquefied lignins were used as raw materials to prepare resol‐type phenol‐formaldehyde resins (PF) by reacting with formalin under alkaline conditions. The results show that phenol‐liquefied lignin‐based PF resins had shorter gel time at 135°C and had lower exothermic peak temperature during DSC heat‐scanning than that of normal PF resin. The thermo‐degradation of cured phenol‐liquefied lignin‐based PF resins was divided into four temperature regions, similar to the normal PF resin. When phenol‐liquefied lignin‐based PF resins were used for manufacturing plywood, most of them had the dry, warm water soaked, and repetitive boiling water soaked bonding strength fitting in the request of CNS 1349 standard for Type 1 plywood. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Master curve and time–temperature–transformation cure diagram of lignin–phenolic and phenolic resol resins

The aim of this work is to generate both a master curve of resol resins based on the time–temperature superposition principle and their TTT cure diagrams. The samples used for this purpose were lignin–phenolic and phenol–formaldehyde resol resins. A TMA technique was employed to study the gelation of resol resins. In addition, a DSC technique was employed to determine the kinetic parameters through the Ozawa method, which allowed us to obtain isoconversional curves from the data fit to the Arrhenius expression. Establishing the relationship between the glass‐transition temperature and curing degree allowed the determination of the vitrification lines of the resol resins. Thus, using the experimental data obtained by TMA and DSC, we generated a TTT cure diagram for each of resins studied. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 3362–3369, 2007     

Lignin–phenol–formaldehyde resin adhesives prepared with biorefinery technical lignins

In this study, four biorefinery technical lignins were used to synthesize lignin–phenol–formaldehyde (LPF) resin adhesives with a proposed formulation that was designed based on accurate analysis of the active sites in lignin with ³¹P nuclear magnetic resonance (NMR). The properties of the LPF resin adhesives and the plywoods prepared with them were tested. The structural features and curing behavior of the LPF resin adhesives were thoroughly investigated by solution‐ and solid‐state ¹³C NMR. Results indicated that the proposed formulation exhibited favorable adaptability for all four of these technical lignins for synthesis of LPF resin adhesives. High‐performance plywood with low emissions of formaldehyde could be successfully prepared with the synthesized LPF resin adhesives. All the LPF resin adhesives exhibited similar structure and curing behavior with the commercial phenol–formaldehyde (CPF) resin adhesive. However, the LPF resin adhesives showed relatively higher curing temperatures as compared with the CPF resin adhesive. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42493.     

Thermally resistant carbazole‐modified phenol–formaldehyde resins

Phenol–formaldehyde resins were modified with carbazole in order to improve their thermal resistance. Attempts to incorporate carbazole rings into novolac and resol resins were made using three methods: (1) the addition of N‐(hydroxymethyl)carbazole (HMC) into a phenol–formaldehyde mixture, (2) the addition of carbazole into a phenol–hydroxymethyl derivative of acetone mixture, where the hydroxymethyl derivative of acetone was used as formaldehyde donor, and (3) by prolonging the time of high‐temperature reaction between phenol, carbazole and formaldehyde. The temperature and time of reaction were critical for incorporation of carbazole, which successfully led to highly temperature‐resistant carbazole‐modified novolacs for the latter procedure. When carbazole was incorporated into novolac structure at a level of 8 mol%, the thermal resistance increased by 118 °C measured as 5% mass loss temperature. Other procedures led to solids containing carbazole or HMC as physical admixtures. The obtained composites revealed variable thermal resistance effects; the carbazole‐modified resol containing 9 mol% of carbazole showed 47 °C increase of thermal resistance in comparison with non‐modified resol, measured as 5% mass loss temperature. © 2015 Society of Chemical Industry     

Organic–inorganic hybrid boron‐containing phenol–formaldehyde resin/SiO2 nanocomposites

The organic–inorganic hybrid boron‐containing phenol–formaldehyde (BPFR) resin/SiO₂ nanocomposites was synthesized in‐situ from boric acid, phenol, and tetramethoxysilane. The structure of BPFR modified and the distributions of silicon element were studied by Fourier‐transform infrared spectroscopy, energy dispersive X‐ray spectrometry, and transmission electron microscope, respectively. The glass transition temperature (T_g) was determined by torsional braid analysis. The results show that silicon element distribution is homogeneous, and the size of nanosilica is about 40–60 nm. The thermal stability and kinetics parameters of thermal degradation were determined by thermogravimetry analysis (TGA). TGA results show that the resin modified has higher heat resistance property when the additive quantity of SiO₂ was 3 wt%. The temperature of 5% weight loss is 487.7°C, which is 12.4°C higher than that of common BPFR. The residual ratio of 3 wt% SiO₂/BPFR was 62.3% at the temperature of 900°C, which is 11.2% higher than that of common BPFR. The mechanics loss peak T_p of 3% SiO₂/BPFR is 33°C higher than common BPFR. Fiberglass‐reinforced BPFR modified by 3 wt% SiO₂ has better mechanical and dielectric properties than that of common BPFR. POLYM. COMPOS., 2008. © 2007 Society of Plastics Engineers     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Effects of crosslinking on physical properties of phenol–formaldehyde novolac cured epoxy resins

To clarify the relationship between crosslinking density and physical properties of phenol–formaldehyde novolac cured epxy resin and factors governing their physical properties, we studied various properties of cured resins having different crosslinking densities. The resins were prepared with various curing accelerators and raw epoxy resins having different molecular weights. We found that as the crosslinking density of a cured resin increases, glass transition temperature (T_g) rises and the relaxation time becomes longer. Furthermore, in the rubbery region, the coefficient of linear thermal expansion drops and the elastic modulus become larger, while, in the glassy region, the coefficient of linear thermal expansion, specific volume, water absorption, diffusion coefficient, and permeability all increase but the elastic modulus becomes smaller. The WLF analysis on the relaxation behaviors of typical cured resin showed that cured resin with a higher crosslinking density decreases in the fractional free volume. This behavior is completely opposite from the relationship predicted from the temperature dependency of specific volume. While the coefficient of thermal expansion of free volume decreases as the crosslinking density increases for the cured resin, it coincides well with the tendency predicted from the difference in coefficient of cubic thermal expansion in the rubbery and glassy regions of each cured resin. That the free volume obtained from WLF analysis shows a relationship opposite to the predicted free volume as based on the temperature dependency of specific volume is explained as follows: Namely, the free volume obtained from the WLF analysis is a hole free volume V_h which contributes to fluidity and V_h decreases with the crosslinking density. On the other hand, the free volume predicted from the specific volume is a sum of the interstitial free volume V_i and V_h. V_i increases with the crosslinking density and this V_i increase exceeds the decrease of V_h. Therefore, the free volume predicted from the specific volume increases with the crosslinking density. Consequently, the influence of free volume on the relationship between the crosslinking density and physical properties of cured resin can be interpreted as follows. As the crosslinking density increases on cured resins, T_g rises, the relaxation time is lengthened, and the coefficient of linear thermal expansion becomes smaller in the rubbery region because, as the crosslinking density increases, V_h decreases. Since crosslinking density increases on cured resins, the coefficient of linear thermal expansion, water absorption, diffusion coefficient, and permeability become larger, and the elastic modulus becomes smaller in the glassy region because, as the crosslinking density increases, V_i increases and, accordingly, molecular chain packing becomes looser; i.e., the specific volume increases. © 1993 John Wiley & Sons, Inc.     

Dynamic mechanical analysis study of the curing of phenol‐formaldehyde novolac resins

The curing reaction of typical commercial phenol‐formaldehyde novolac resins with hexamethylentetraamine (HMTA) was followed by dynamic mechanical analysis. The evolution of the rheological parameters, such as storage modulus G′, loss modulus G″, and tanδ (G″/G′), as a function of time, for samples of the phenolic resins on cloth, was recorded. The curing reaction, leading to the formation of a crosslinked structure, is described by a third‐order phenomenological equation. This equation takes into account a self‐acceleration effect, as a consequence not only of the chemical reaction of crosslinking after the gel point but of phase segregation as well. This rheokinetic model of the curing of phenolic novolac resins permits the determination of the numerical values of the kinetic equation constants. The influence of the composition, structure, and physical treatment on the curing kinetics of the novolac resins is evaluated. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1902–1913, 2001     

Comparisons of the cure of phenol–formaldehyde novolac and resol systems by differential scanning calorimetry

Comparisons were made of differential scanning-calorimetric (DSC) thermograms of both liquid and powdered commercial phenol–formaldehyde resins. By a combination of the results from analyses under a variety of conditions, such as ambient pressure, high pressure, using freeze-dried samples, and also by direct observation of the resin-curing process in wood-veneer assemblies, the curing reactions of phenol–formaldehyde resins were found to differ for resol and novolac systems. At a heating rate of 10°C/min, the resol resin showed endothermic curing reactions at temperatures of about 150°C, while the novolac-type resin showed an exothermic peak maximum at about 160°C. Results are presented to show how DSC can be used to differentiate between a resol and novolac system.     

The glass‐forming ability and thermal stability of novolac–phenolic resin

Glass‐forming ability and thermal stability of novolac–phenolic resin with different contents of curing agent hexamethylenetramine (HMTA) are investigated. Melt fragility (M_g) and T_gd (T_gd = T_g/T_d) are proposed to characterize glass‐forming ability and thermal stability of the novolac–phenolic resin, respectively. It is found that M_g has a negative linear relationship with T_gd. The lower M_g represents the better glass‐forming ability of liquid phenolic resin while the higher T_gd represents the better thermal stability of the fully cured phenolic resin. Further more, M_g establishes a kinetic relationship between glass‐forming ability of liquid uncured and thermal stability of fully cured novolac–phenolic resin in terms of comparing with T_gd. POLYM. COMPOS., 2012. © 2011 Society of Plastics Engineers     

Multifunctional formaldehyde resins as curing agent for epoxy resins

Formaldehyde resins (FR) at 1/1/2 molar ratios of monomers (Cl‐phenol/amino monomers/p‐formaldehyde) were synthesized under acid catalysis. The obtained resins were characterized using elemental analysis, FTIR and RMN spectroscopic methods, being used as crosslinking agents for epoxy resin formulations. The curing of epoxy resins with FR were investigated. The glass transition temperature (T_g) and decomposition behavior of crosslinked resins were studied by differential scanning calorimetry (DSC) and thermogravimetric (TGA) techniques. All DSC scans show two exothermic peaks, which implied the occurrence of cure reactions between epoxy ring and amine or carboxylic protons, in function of chemical structures of FR. The crosslinked products showed good thermal properties, high glass transitions, and low water absorption. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

13C‐NMR study on cure‐accelerated phenol–formaldehyde resins with carbonates

Both liquid‐ and solid‐state ¹³C‐NMR spectroscopies were employed to investigate the cure‐acceleration effects of three carbonates [propylene carbonate (PC), sodium carbonate (NC), and potassium carbonate (KC)] on liquid and cured phenol–formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure‐acceleration mechanism in the PC‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, while the addition of both NC and KC into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C‐CP/MAS‐NMR spectroscopy was smaller for the cure‐accelerated PF resins than for that of the control PF resin. The result indicated that cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 841–851, 2000     

Lignocellulosic substrates influence on TTT and CHT curing diagrams of polycondensation resins

Lignocellulosic substrates such as wood were found to have a marked modifying influence on a well‐defined region of CHT diagrams during hardening of phenol–formaldehyde (PF) and urea–formaldehyde (UF) polycondensates. This was ascribed to more complex resin phase transitions due to resin/substrate interactions peculiar to these substrates. The chemical and physical mechanisms of the interactions of the resin and substrate causing such CHT diagram modifications are presented and discussed. The Di Benedetto equation describing the glass transition temperature T_g of the system as a function of the resin degree of conversion p has been slightly modified to take into account the modified CHT diagram. The modified CHT diagram can be used to good effect to describe the behavior of polycondensation resins when used as wood adhesives during their curing directly into the wood joint. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 915–925, 1999     

Synthesis,characterization, and metal adsorption properties of tannin–phenol–formaldehyde resins produced using tannin from dried fruit of Terminalia chebula (Aralu)

In this study, tannin extracted from Terminalia chebula (Aralu) was used to produce tannin–phenol–formaldehyde resins. They were produced to obtain resins with different tannin to phenol ratio in an attempt to optimize the ion exchange capacities of resins produced. The resins made were sulfonated to improve their properties further. Bivalent cations, such as Zn²⁺, Pb²⁺, Ca²⁺, Mg²⁺, and Cu²⁺, were used to estimate the adsorption properties of both unsulfonated and sulfonated resins. The glass transitions of representative resins were estimated using differential scanning calorimeter thermograms. Fourier transform infrared spectroscopic analysis was used to gauge changes on resins by sulfonation and adsorption of cations. The glass transition values of unsulfonated, sulfonated, and metal‐adsorbed sulfonated resins showed a similar increasing trend with the increase of phenol content in the resin. The glass transition temperature values reach a plateau beyond the tannin/phenol ratio of 1 : 0.5, indicating the formation of large molar masses facilitating entanglements beyond that ratio. The phenol ratio of 1 : 0.5 has shown the highest adsorption capacity for all the metal ions used. The highest adsorption capacity was shown for sulfonated tannin–phenol–formaldehyde resin with the tannin/phenol ratio of 1 : 0.5 for Pb²⁺, which is 0.610 meq/g. The adsorption equilibrium data obtained using the column technique were found fitting Freundlich isotherm. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Controlled synthesis of high‐ortho‐substitution phenol–formaldehyde resins

The relationship between the use of 19 kinds of metal catalysts and the proportion of ortho–ortho links of novolac resins was studied. The proportion of ortho–ortho links of novolac resins was characterized with Fourier transform infrared, ¹H‐NMR, and ¹³C‐NMR. The effects of different catalysts and different reaction conditions, such as the molar ratio of phenol to formaldehyde, the pH value of the reaction, and the reaction time, were examined. Phenol–formaldehyde resins were synthesized with a certain proportion of the ortho position through the adjustment of the reaction conditions. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 652–658, 2005     

Synthesis and cure kinetics of liquefied wood/phenol/formaldehyde resins

Wood liquefaction was conducted at a 2/1 phenol/wood ratio in two different reactors: (1) an atmospheric three‐necked flask reactor and (2) a sealed Parr reactor. The liquefied wood mixture (liquefied wood, unreacted phenol, and wood residue) was further condensed with formaldehyde under acidic conditions to synthesize two novolac‐type liquefied wood/phenol/formaldehyde (LWPF) resins: LWPF1 (the atmospheric reactor) and LWPF2 (the sealed reactor). The LWPF1 resin had a higher solid content and higher molecular weight than the LWPF2 resin. The cure kinetic mechanisms of the LWPF resins were investigated with dynamic and isothermal differential scanning calorimetry (DSC). The isothermal DSC data indicated that the cure reactions of both resins followed an autocatalytic mechanism. The activation energies of the liquefied wood resins were close to that of a reported lignin–phenol–formaldehyde resin but were higher than that of a typical phenol formaldehyde resin. The two liquefied wood resins followed similar cure kinetics; however, the LWPF1 resin had a higher activation energy for rate constant k₁ and a lower activation energy for rate constant k₂ than LWPF2. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Modification of phenol–formaldehyde resol resins by lignin,starch, and urea

Lignin‐based chemicals, starch, and urea were used as modifiers for phenol–formaldehyde resol resins. The effects of the addition stage of the modifiers used in the synthesis of the resins and the type of modification reagent on the structures of the resins and their molar masses and reactivities were investigated. The modifications with corn starch and lignin promoted condensation; this was verified by increased molar masses and high ratios of methylene bridges to the sum of free ortho and para aromatic groups with respect to the corresponding reference resin without a modification reagent. The later the modifier was added to the resin condensation mixture, the more methylene bridges were formed with respect to the amounts of free ortho and para aromatic groups. In addition, when urea or wheat starch was added in the later condensation stage, the final condensation also reached high stages. The modifications with lignosulfonate and starch, as well as the early addition of urea, enhanced p–p′ bridge structures. The lowest condensation stage and, therefore, the highest reactivity were found when wheat starch was added with the starting reagents. The curing heat of the wheat‐starch‐modified resins decreased according to the deferred addition point of starch. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 582–588, 2003     

13C‐NMR study on cure‐accelerated phenol‐formaldehyde resins with carbonates

Both liquid‐ and solid‐state carbon‐13–nuclear magnetic resonance (¹³C‐NMR) spectroscopies were used to investigate the cure acceleration effects of three carbonates (propylene carbonate, sodium carbonate, and potassium carbonate) on liquid and cured phenol‐formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure acceleration mechanism in the propylene carbonate‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, whereas the addition of both sodium carbonate and potassium carbonate into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C cross polarization/magic‐angle spinning NMR spectroscopy was smaller for the cure‐accelerated PF resins than that of the control PF resin. The result indicated that the cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1284–1293, 2000