一种新型高速宽带数字下变频器的FPGA实现

数字下变频器是软件无线电宽带数字接收机的核心组成部分,经典的数字下变频结构难以实现高速率的混频与滤波,因此针对软件无线电系统小型化和低功耗的要求,提出一种新型的宽带数字接收机中数字下变频器的设计与FPGA实现方法,该方法采用基于多相滤波正交化处理从而实现数字接收机。文中分析了其设计原理以及FPGA实现,测试结果表明,设计具有良好的可扩展性和灵活性。     

多通道数字接收机的设计与实现

为了解决传统模拟中频接收机相位分辨率低等缺点,提出一种基于软件无线电的中频数字接收机技术。针对雷达信号的特点提出了脉宽匹配滤波器的设计方法。采用基于多相滤波的正交变换理论,以及基于脉宽匹配的数字滤波器方法完成了一种五通道中频数字接收机的设计。接收机利用五路高速A/D变换器对输入的模拟信号进行采样,然后将采样数据送入FPGA进行处理,最终完成了每两路信号相位差的提取。实验结果表明系统具有成本低、精度高、结构简单等特点,而且具有一定的工程应用价值。     

软件无线电中的正交解调新算法

软件无线电作为无线通信技术的又一次革命,是目前通信领域中最为重要的研究方向之一.文章基于多相滤波的数字正交变换技术,通过数学推导,提出了一种软件无线电中的数字化正交解调新算法.理论分析和仿真结果显示该解调方案的抗干扰性能有明显改善,与传统解调方法相比,省去了本地载波恢复,通用性强、简单易实现、计算量小且易于用DSP实现,适合在软件无线电接收机中使用.     

数字接收机正交基带信号提取方案的研究

数字正交基带信号提取技术是数字中频接收机的一项关键技术。当前的经典实现方法有:正交数字混频法和多相滤波正交变换法。软件无线电的数字接收机正交基带信号提取方案多采用多相滤波法,数字信号处理器使用软件编程的方法来实现。介绍了采用软硬件联合实现数字正交基带信号提取的方案,用硬件电路设计降低软件实现复杂度。     

空间谱估计系统中信道化接收机的实现

在对基于多相滤波结构的宽带数字信道化接收机理论分析的基础上,结合九阵元空间谱估计系统的实际要求,对宽带信道化接收机的处理算法与实现进行了研究,深入分析其具体化的处理结构,将处理中的多路并行结构转化为串行处理.针对多相滤波处理中具体的数据流结构,推导出FPGA实现的优化实现结构.给出了前述优化结构的详细推导和具体实现,最后在EP2S60 FPGA芯片上实现了包括数字下变频和多相滤波信道化处理的接收机系统,验证了优化结构的可实现性和有效性.     

一种高效的宽带数字信道化接收方法

宽带雷达对抗侦察数字接收机具有较宽的瞬时频率覆盖特性和较高的截获概率,并能处理同时到达的多个信号。多相滤波信道化接收机是实现宽带接收的一种方法,其抽取运算在滤波运算之前,运算量小,输出速率低,便于后续处理,是一种高效结构。给出了多相滤波信道化数字接收机的基本原理和实现方法,采用重叠一半多相滤波信道化数字接收机能够有效消除接收盲区,实现全概率接收并消除虚假输出,通过仿真试验证明了其有效性。     

基于FPGA的数字中频信号处理的设计与实现

中频信号处理技术是目前发展迅速的一项技术。随着软件无线电理论的发展,数字下变频技术得到了越来越普遍的应用。本文讨论了数字中频接收机中变频、滤波等关键技术,利用FPGA编程实现了下变频处理和FFT处理。给出了FPGA实现的数字下变频系统在测试中产生的波形和频谱,作了测试结果分析。在某无线电分析仪中,该技术被成功的应用在基于FPGA的数字信号处理系统中。     

数字下变频器在软件无线电接收机中的应用

在软件无线电（Software Radio)接收机中，数字下变频器（Digital DownConverter-DDC)技术是其核心技术之一。数字下变频技术是将宽带大数据流信号变成窄带低数据流信号，以便DSP实时处理。文章指出，作为过渡阶段的软件无线电，用数字变频器实现中频段的处理任务。着重介绍了其主要功能，内部结构的抽取滤波的特性。最后，以Interial公司的可编程DDCHSP50214B为例，给出了软件无线电接收机的原理图。     

Design and research of equally divided channel filter banks

信道化作为软件无线电系统和宽带数字接收机的关键技术之一,而多相滤波结构的信道化处理技术和滤波器组的设计一直是研究难点。根据多相滤波结构,本文给出一种有限冲激响应滤波器的设计方法,然后根据均匀信道化的要求设计出均匀滤波器组,设计出的原型滤波器能够无失真采样滤波并能重构。利用等波纹设计的同时,使优化所得通带波纹数量级达到10^3,衰减达到-100dB。利用MATLAB设计及仿真表明,该设计是可靠的,可作为高速率滤波器设计的方法。     

基于均匀信道化滤波器组的研究与设计

信道化作为软件无线电系统和宽带数字接收机的关键技术之一,而多相滤波结构的信道化处理技术和滤波器组的设计一直是研究难点。根据多相滤波结构,本文给出一种有限冲激响应滤波器的设计方法,然后根据均匀信道化的要求设计出均匀滤波器组,设计出的原型滤波器能够无失真采样滤波并能重构。利用等波纹设计的同时,使优化所得通带波纹数量级达到10-3,衰减达到-100dB。利用MATLAB设计及仿真表明,该设计是可靠的,可作为高速率滤波器设计的方法。     

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 °C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time. After aging for 200 h, the solder joints of SAC, SAC-0.5Ni and -1Ni presented duplex intermetallic compound (IMC) layers regardless of the initial interfacial structure on as-reflowed joints, whose upper and lower IMC layers were comprised of (CuNi)₆Sn₅ and (NiCu)₃Sn₄, respectively. Only a single (NiCu)₃Sn₄ IMC layer was ever observed at the SAC-2Ni/Ni interface on whole aging process. Based on the compositional analysis, the amount of Ni within the IMC regions increased as the proportion of Ni addition increased. The IMC (NiCu)₃Sn₄ layer thickness on the interface of SAC and SAC-0.5Ni grew more slowly when compared to that of SAC-1Ni and -2Ni, while for the (CuNi)₆Sn₅ layer the reverse is true. Except the IMCs sizes are increased with increased aging time, the interfacial IMCs tended to transfer their morphologies to polyhedra. In all composite joints testing, the shear strengths were approximately equal to non-composite joints. The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability.     

有机发光二极管中ADN掺杂ErQ的1.54μm电致发光

自行设计了基于8-羟基喹啉铒(ErQ)为发射层(EMLs)和二硝酰胺铵(ADN)为蓝光主体材料的近红外有机发光二级管.器件的基本结构为(p-Si/NPB/EML/Bphen/Bphen:Cs2CO3/Sm/Au),设计并比较了三套不同发射层结构(ErQ/ADN为双层结构器件,(ErQ/ADN)×3为多层结构器件,ErQ:ADN为掺杂结构器件)的器件.三组器件在一定的偏压下,均可发出1.54μm的光,对应三价铒离子4I13/2→4I15/2的跃迁.其中,ADN:ErQ(1∶1)掺杂结构的近红外电致发光强度是ADN/ErQ双层结构中的三倍.此外,不同掺杂浓度的ADN:ErQ复合膜做了以下表征:吸收谱、光致发光谱和荧光寿命谱.实验结果证实了在近红外电致发光过程中存在从ADN主体分子到ErQ发射分子的高效率的能量转移.     

BNBST无铅压电陶瓷的制备工艺研究

设计了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3（BNBST[100x-100a／100b]）无铅压电陶瓷新体系。该体系压电陶瓷具有工艺特性及压电响应好，压电常数高的特点，且有实际应用前景的新型压电陶瓷材料体系。采用传统的陶瓷工艺制备了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3无铅压电陶瓷，研究了制备工艺参数对其物化结构性能的影响。生料的热重-差热（TGA-DTA）分析表明，粉料合成过程中，先是SrTiO3、BaTiO3的形成，然后是（Bi0．5Na0．5）Tio，的形成，同时三者形成固溶体；密度测试表明，陶瓷的体积密度随烧结温度的升高而增大，可较易获得理论密度94％的陶瓷；X-射线能谱分析（EDAX）研究表明，陶瓷的Bi、Na的挥发随着烧结温度的升高而加剧。研究结果表明，要制备性能优良的无铅压电陶瓷，需要精确控制制备工艺。     

Emerging interconnects: a state-of-the-art review and emerging solutions

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years.     

钠离子对poly(dT).poly(dA).poly(dT)三螺旋DNA分子呼吸模式的影响

利用分子结构的螺旋对称性,建立了一个包括钠离子的三链DNA分子poly(dT)*poly(dA)*poly(dT)的晶格动力学模型,计算了poly(dT)*poly(dA)*poly(dT)的氢键呼吸模式.结果发现钠离子的加入明显地淬灭了位于较低频率的几个最为强烈的Hoogensteen氢键呼吸模式,而对Watson-Crick氢键呼吸模式影响不明显,这说明钠离子能提高poly(dT)*poly(dA)*poly(dT)三螺旋结构的稳定性.该计算结果很好地解释了poly(dT)*poly(dA)*poly(dT)的热融化实验.     

聚对苯撑苯并双(口恶)唑发光及其器件制备

采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加.     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

Arsenic deposition as a precursor layer on silicon (211) and (311) surfaces

We investigate the properties of arsenic (As) covered Si(211) and Si(311) surfaces by analyzing data from x-ray photoelectron spectroscopy (XPS) and low-energy electron diffraction (LEED) images. We then create a model using total surface energy calculations. It was found that both Si(211) and Si(311) had 0.68±0.08 surface As coverage. Si(211) had 0.28±0.04 Te coverage and Si(311) had 0.24±0.04 Te coverage. The Si(211) surface replaces the terrace and trench Si atoms with As for a lower surface energy, while the Si edge atoms form dimers. The Si(311) surface replaces all terrace atoms and adsorbs an As dimer every other edge site. These configurations imply an improvement in the mean migration path from the bare silicon surface by allowing the impinging atoms for the next epitaxial layer, tellurium (Te), to bind at every other pair of edge atoms, and not the step terrace sites. This would ensure a nonpolar, B-face growth.     

Joint estimation of TOA and DOA in IR-UWB system using a successive propagator method

Impulse radio ultra-wideband (IR-UWB) ranging and positioning require accurate estimation of time-of-arrival (TOA) and direction-of-arrival (DOA). With receiver of two antennas, both of the TOA and DOA parameters can be estimated via two-dimensional (2D) propagator method (PM), in which the 2D spectral peak searching, however, renders much higher computational complexity. This paper proposes a successive PM algorithm for joint TOA and DOA estimation in IR-UWB system to avoid 2D spectral peak searching. The proposed algorithm firstly gets the initial TOA estimates in the two antennas from the propagation matrix, then utilises successively one-dimensional (1D) local searches to achieve the estimation of TOAs in the two antennas, and finally obtains the DOA estimates via the difference in the TOAs between the two antennas. The proposed algorithm, which only requires 1D local searches, can avoid the high computational cost in 2D-PM algorithm. Furthermore, the proposed algorithm can obtain automatically paired parameters and has better joint TOA and DOA estimation performance than conventional PM algorithm, estimation of signal parameters via rotational invariance techniques algorithm and matrix pencil algorithm. Meanwhile, it has very close parameter estimation to that of 2D-PM algorithm. We have also derived the mean square error of TOA and DOA estimation of the proposed algorithm and the Cramer-Rao bound of TOA and DOA estimation in this paper. The simulation results verify the usefulness of the proposed algorithm.     

系统级封装新型埋入式电源滤波结构的研究

在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65～4GHz的频带内隔离深度可达-40～75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证.