共查询到20条相似文献,搜索用时 46 毫秒
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一种具有延时功能的报警电路 总被引:1,自引:0,他引:1
提出了一种具有延时功能的报警电路,该电路在达到报警要求,并维持规定的延迟时间后,才发出警报。电路的延迟时间、报警频率均可调,适用性较广。采用Spectre软件进行了模拟,获得了预期的效果。 相似文献
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Motorola公司的MC145012是一带I/O和瞬时图形扬声器驱目光电烟雾探测IC,它包含复杂的低q模拟电路和数字电路。此IC用一个幼光电盒。用感测来自微小烟雾粒子自他烟雾的散射光实现探测。当探测至I雾时,脉动报警经片上推挽驱动器利部压电传感器发声。MC145012功就图示于图1。可变增益光电放大器直接接EIR检测器(光电二极管),见应用硅(图2)。两个外部电容器CI和CZ(较大)确定增益设置。在大部分待和间IC选择低增益。在按钮测试期间冲增益。在待机期间,为降低的盒灵句而周期检测的特殊监控电路也用高增益。I/O弓I脚可用于互… 相似文献
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555定时器是一种数模混合的中规模集成电路,它使用灵活、方便,被广泛应用于脉冲的产生、整形变换等电路中。本文介绍了555定时器的组成、功能及由它构成的多谐振荡器的工作原理,论述了一种由555多谐振荡器实现的双音报警电路,说明在实际生产中,只要将555定时器各个功能加以综合应用,便可得到许多实用电路。 相似文献
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5G0602是CMOS工艺制造的报警振铃专用集成电路。它具有体积小、重量轻、功耗低、工作可靠等优点,配合不同控制元件,就可以构成各种报警器。5GC602可以广泛地用于光敏防盗报警、婴儿便尿报警、瓦斯煤气报警、电话振铃、仪器仪表振铃和门铃等方面。 相似文献
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台湾IC产业的发展 总被引:2,自引:0,他引:2
历史回眸中国台湾自上世纪的60年代从后道封装开始切入半导体产业,经历30多年“产、官、学、研”各界之共同努力,在世界半导体产业链中已占有举足轻重的地位。2000年集成电路产业产值为100亿美元,其专业代工量约占全球73%,封装业占3成,IC设计业仅次于美国而居世界第二位。回眸台湾IC业发展历程,可分为萌芽期、技术引进期、成长期和蓬勃发展期4个阶段(图1),从而形成了技术先进、结构完整、特色鲜明的现代产业。 萌芽期(1964~1974年)1964年台湾交通大学成立半导体实验室,将半导体课程列为教学重点,为IC业未来发展培养人才。1966年美商通用… 相似文献
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《Solid-State Circuits, IEEE Journal of》1979,14(3):532-538
A short review of the principal analog MOS basic building blocks is followed by a discussion of several representative LSI signal-processing circuits that combine analog and digital functions on the same chip. An echo-canceller speech-synthesizer IC, character-recognition circuit for reading wands, and beam-former circuit are implemented with MOS technology and discussed in detail. An example of I/SUP 2/L technology is presented in the form of a data-transmission IC. The evolution toward more complex, dedicated, signal-processing devices is briefly discussed in terms of the technology and engineering requirements. 相似文献
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Microprocessors have become important tools for the electronic designer. Prime motivators for their success have been the advantages they offer in cost reduction and design flexibility. These and other microprocessor advantages are discussed in this paper. Typical microprocessor-based applications are described as well as the direction of future trends. 相似文献
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Advanced IC packaging for the future applications 总被引:2,自引:0,他引:2
The performance of electronic equipment is improving rapidly. Portable electronic equipment requires smaller and thinner packaging systems for saving space and miniaturization. In addition, highly integrated, high-speed applications demand improved electrical performance to minimize noise effects. As a result of these considerations, the role of IC packaging has expanded from its traditional role of protecting the integrity and performance of an IC, to being a central factor in the development of electronic system concepts. In developing the optimum system, packaging technology must be a prime design consideration to ensure optimum performance, reliability, and cost. Soldering technology and Printed Wiring Board (PWB) routing density are two of the major technological issues facing miniaturized packaging systems today. Chip Scale Package (CSP), which is a new concept in packaging technology has been introduced. This is an ideal technology to enable the design and manufacture of the next generation of electronic equipment, while overcoming many of the technological issues facing system development 相似文献
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《Electron Devices, IEEE Transactions on》1986,33(12):1985-1991
Elementary process additions to 2-3-µm polygate CMOS provide enhanced high-voltage MOSFET's and broadband complimentary bipolars. This allows monolithic integration of a modern logic family and quality analog function with high-voltage high-current buffers and drivers. The technology is suitable for data conversion, telecommunication, analog switch, and industrial IC applications where low-voltage digital and analog control circuitry must be interfaced to high-voltage high-current outputs. 相似文献
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Advanced CMOS technology portfolio for RF IC applications 总被引:1,自引:0,他引:1
Chih-Sheng Chang Chih-Ping Chao Chern J.G.J. Sun J.Y.-C. 《Electron Devices, IEEE Transactions on》2005,52(7):1324-1334
A high quality 90-nm CMOS-based technology portfolio suitable for various RF IC applications is presented. The portfolio is built up by a wide selection of active and passive components and a user-friendly process design kit (PDK). Layout-optimized RF components are studied in details including state-of-the-art 90 nm RFMOS devices with 120-160 GHz f/sub T/ and very low noise figures, varactors with tradeoff between quality factor and tuning ratio, precision capacitors with metal-insulator-metal and metal-over-metal schemes, and a variety of inductor structures suitable for different RF designs. The effectiveness for isolating substrate RF noise is also compared among several layout schemes. Finally the guidelines and requirements for constructing a useful PDK are addressed. 相似文献
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《Solid-State Circuits, IEEE Journal of》1978,13(6):873-881
An all-bipolar building-block consisting of a linear light-to-current converter, a voltage comparator, and a voltage reference has been developed. This new general purpose IC combines the advantages of silicon photodiode light sensors with the linear signal processing capability of bipolar integrated transistors. In achieving this marriage, new circuit techniques were developed in order to operate at the very low current levels (<1 nA) and over the wide dynamic range of the light input. Besides their normal sensory function, photodiodes were made to serve as active elements in the circuit, taking part in biasing and acting as active loads in circuits that operate entirely on photocurrents. Use of these techniques boosted overall performance and eliminated the need for a light shield over the active-device portion of the die. 相似文献