金刚石与Co—Si合金的固相连接

分析了金刚石复合片中金刚石颗粒与粘结剂Ｃｏ－Ｓｉ合金之间的连接行为。通过扫描电镜、电子探针及Ｘ射线衍射分析，结果表明：在一定条件下，金刚石颗粒周围Ｓｉ元素偏聚；金刚石颗粒与结合剂之产是有效生化合物ＳｉＣ存在；烧结时间是影响ＳｉＣ生成的主要因素之一。     

SiCp／AZ80镁基复合材料凝固组织研究

研究表明：复合材料的基体晶粒尺寸约为ＡＺ８０合金晶粒尺寸的１／３；ＳｉＣ颗粒能够作为初生相形核的衬底，且它们之间的位向关系为：〔０００１〕Ｍｇ‖〔１５４０〕ＳｉＣ，（１０１０）Ｍｇ‖（０００１）ＳｉＣ；复合材料基体晶粒细化是ＳｉＣ颗粒引起的非均质形核和ＳｉＣ颗粒限制初生相晶粒生长共同作用的结果     

Si3N4复合陶瓷材料的微观组织和断裂机制

使用ＡＥＭ和ＨＲＥ他添加纳米ＳｉＣ颗粒和同时添加纳米ＳｉＣ颗粒及ＳｉＣ晶须的两种Ｓｉ３Ｎ４复陶瓷材料的微观组织和断裂机制。结果表明,部分ＳｉＣ颗粒分布在ＳｉＣ晶内,ＳｉＣ晶须分布在Ｓｉ３Ｎ４晶粒之间,ＳｉＣ颗粒和晶须与Ｓｉ３Ｎ４界面之间不存在第二相组织,非晶组织大多分布在Ｓｉ３Ｎ４三叉晶界。断裂裂纹主要沿晶界和相界面扩展,也可能穿过少数Ｓｉ３Ｎ４晶粒。当裂纹扩展遇到ＳｉＣ颗粒和／或ＳｉＣ晶须时,会     

颗粒增强铝合金叠层复合材料的制备与强度和耐磨性

介绍了ＳｉＣ颗粒增强ＡｌＣｕ合金叠层复合材料的制备方法，研究了叠层复合材料的抗弯强度和增强层的耐磨性与ＳｉＣ颗粒含量的关系。结果表明，ＳｉＣ颗粒体积分数为２０％时该材料的抗弯强度最大，磨损量最小；ＳｉＣ颗粒与基体结合强度及层间宏观应力影响材料的强度性能     

颗粒增强名合金叠层复合材料的制备与强度和耐磨性

介绍了ＳｉＣ颗粒增强Ａｌ－Ｃｕ合金叠层复合的制备方法，研究了叠层复合材料的抗弯强增强层的耐磨性与ＳｉＣ颗粒含量的关系。结果表明，ＳｉＣ颗粒体积分数为２０％时该的抗弯强度最大，磨损量最小；ＳｉＣ颗粒与基体结构强度及层间宏观应力影响材料的强度性能。     

玻璃与金刚石的相互作用及浸润性的研究

本文应用ＩＲ光谱和ＳＥＭ等技术，探讨了玻璃与金刚石之间的相互作用机理；研究了ＺｎＯ、ＣｄＯ和ＰｂＯ对Ｎａ２Ｏ－Ｂ２Ｏ３－ＳｉＯ２系统玻璃与金刚石表面的浸润性的影响。     

金刚石复合片掺杂烧结的微观结构研究

本实验选用ＴｉＨ２及其它微量元素做粘结剂，在ＤＳ－０２９Ｂ型六压机上烧结人造金刚石复合片，实验中，采取了ＴｉＨ２脱氢与金刚石净化同时进行了的工艺，在高真空和一定温度下脱氢，得到高活民生的新鲜钛，使其具有更强的粘结作用，以获得高磨耗比的金刚石复合片，从实验以及对复合片的的扫描电子显微镜，光电子能谱分析可知，在复合片金刚石层中金刚石颗粒间有粘结相存在，并通过这种粘结相粘结起来，其主成分是ＳｉＣ，ＴｉＣ     

稻壳合成β—SiCl晶须／颗粒及其增强复合材料的应用

本文对稻壳合成β－ＳｉＣ晶须及β－ＳｉＣ颗粒进行了研究，并对这两种产品进行了增强复合材料的应用，结果表明：稻壳合成β－ＳｉＣ晶须的反应中，β－ＳｉＣ颗粒的生成是不可避免的；β－ＳｉＣ晶须有效地改善了陶瓷复合材料的力学性能及耐磨性能，以β－ＳｉＣ颗粒增强的ＳｉＣ基质复合材料的热压制品磨耗比为标准砂轮的４９．５倍。     

稻壳合成β－SiC晶须／颗粒及其增强复合材料的应用

本文对稻壳合成β－ＳｉＣ晶须及β－ＳｉＣ颗粒进行了研究，并对这两种产品进行了增强复合材料的应用，结果表明：稻壳合成β－ＳｉＣ晶须的反应中，β－ＳｉＣ颗粒的生成是不可避免的；β－ＳｉＣ晶须有效地改善了陶瓷复合材料的力学性能及耐磨性能，以β－ＳｉＣ颗粒增强的ＳｉＣ基质复合材料的热压制品房耗比为标准砂轮的４９．５倍。     

颗粒增强Al—4%Mg复合材料中显微孔隙的分析

探讨了Ａｌ２Ｏ３、ＳｉＣ、ＳｉＯ２等三种颗粒增强Ａｌ－４％Ｍｇ复合材料凝固组织中显微孔隙的形成规律。结果表明：前者显微孔隙是由Ａｌ２Ｏ３颗粒加入导致熔体粘度增加、颗粒堵塞枝晶间的补缩流动通道以及颗粒与基体合金的热膨胀系数的差异三种因素所引起；第二种材料由于气孔易在ＳｉＣ颗粒表面形核，或者ＳｉＣ颗粒与基体结合较弱，使得该复合材料比前者易形成显微孔隙；第三种复合材料，是由于ＳｉＯ２颗粒与基体间发生了界     

粗磨粒金刚石砂轮精密磨削工程陶瓷的试验研究

为了实现粗磨粒金刚石砂轮延性域磨削加工SiC陶瓷材料,采用碟轮对粒径为297~420μm的粗磨粒金刚石砂轮进行了精密修整。然后,使用经过修整好的粗磨粒金刚石砂轮对SiC陶瓷进行磨削加工。在此基础上,对不同的砂轮线速度、工件进给速度、磨削切深对SiC陶瓷表面粗糙度和表面形貌的影响进行了研究。试验结果表明:经过精密修整的粗磨粒金刚石砂轮是能够实现SiC陶瓷材料的延性域磨削的,表面粗糙度值Ra达到0.151μm;随着砂轮线速度增大、工件进给速度和磨削切深减小,SiC陶瓷表面的脆性断裂减小,塑性去除增加。     

碟轮修整单层钎焊金刚石砂轮的试验研究

单层钎焊金刚石砂轮在制作完成之初由于砂轮基体加工存在误差以及磨粒粒径大小不一等原因造成磨粒等高性不一致,这使其难以在硬脆材料的精密磨削中得到广泛的应用。采用自制的钎焊碟轮对80/100#单层钎焊金刚石砂轮进行了修整试验研究。在修整试验前后跟踪了砂轮磨粒等高性的变化,进行了SiC陶瓷的磨削试验,并观测了工件表面质量的变化情况。试验结果表明:采用此方法能够实现单层钎焊金刚石砂轮的高效精密修整。修整试验结束后砂轮磨粒等高性较好,磨削SiC陶瓷的表面质量得到明显改善,表面粗糙度Ra值达到了0.1μm以下。     

固结金刚石聚集体磨料垫高效研磨氧化锆陶瓷背板

氧化锆陶瓷背板的高效低损伤研磨加工是其在5G通讯应用中的前提。针对氧化锆材料的硬脆特性造成磨粒磨损严重的特点,以金刚石单晶和聚集体为磨料,制备固结磨料垫（FAP）,并对比研究其加工性能,探索了研磨液中碳化硅磨粒在固结磨料研磨垫自修整过程中的作用机理。结果表明:采用金刚石聚集体作为固结磨料垫的磨料,辅以碳化硅砂浆,能够明显提高研磨速度,改善表面加工质量。采用粒度230/270的金刚石聚集体固结磨料研磨垫,辅以颗粒尺寸3~5 μm的绿碳化硅砂浆,氧化锆陶瓷研磨时材料去除率达2.5 μm/min以上,表面粗糙度值R_a为74.9 nm。      

砂浆辅助固结磨料研磨蓝宝石研究

金刚石固结磨料垫研磨蓝宝石晶片时,因磨屑细小导致研磨垫自修整能力严重不足,制约了其工业应用。本实验尝试用向研磨液中添加碳化硅颗粒的办法,辅助磨屑改善研磨垫的自修整能力。分别制备了不含磨料和含金刚石磨料（粒度尺寸为20~30 μm）的研磨垫,比较其在不同研磨条件下的材料去除率和研磨后工件表面形貌,探索研磨液中碳化硅颗粒的作用机制。结果表明:研磨液中添加的碳化硅颗粒加快了研磨垫基体的磨损,有利于亚表层金刚石颗粒的出露,实现了研磨垫的自修整过程,材料去除速率明显提高,提高近14倍。      

A study on laser touch dressing of electroplated diamond wheels using pulsed picosecond laser sources

An investigation to explore the possibility of touch dressing of electroplated diamond wheels using a pulsed picosecond laser (ps-laser) beam (Yb:YAG) is presented. The laser beam is irradiated on the wheel to cut the diamond grains within a defined grain protrusion without any thermal damage on the nickel bond. The laser parameters were systematically varied to achieve a reliable touch dressing process. The microscopic investigations prove thermal damages neither on the diamond grain nor on the bond. Series of SiC wheel dressing experiments were carried out to compare mechanical touch dressing of the electroplated diamond wheel with laser dressed wheels.     

Bonding performance of diamond grit to a Co-Si alloy

The bonding performance between synthetic diamond grit and adhesive (Co-Si alloy ) in polycrystalline dianond conpact (PDC) has been investigated.The results indicate that the carbide-forming element Si diffuses towards the diamond grit and the quantity of Si elenent in the inter layer of diamond grit-adhesives is about two timeshigher than that in the other area .New compound SiC exists in the inter layer of diamond-adhesives.The formation of SiC enhances the strength and prolongs the service life of PDC .The sintering time is important to the formation of SiC.     

Study on axial-feed mirror finish grinding of hard and brittle materials in relation to micron-scale grain protrusion parameters

An axial-feed mirror finish grinding of hard and brittle materials is proposed by controlling grain protrusion parameters. In this grinding, the grinding wheel feed is along the wheel axial direction rather than in the traditional wheel cutting direction. The objective is to understand how micron-scale grain protrusion parameters influence ductile-mode grinding and ultimately to realize efficient mirror finish grinding using a coarse diamond grinding wheel. In this study, the grain tip truncation (GT-truncation) was performed after dressing to improve grain protrusion topography. First, a formation model of axial-feed ground surface was constructed to analyze the effect of grain protrusion parameters and grinding parameters on the critical cutting depth transferred from brittle-mode removal to ductile-mode removal; then GC dressing and GT-truncation of #180 diamond grinding wheel were experimentally performed to investigate surface roughness and ductile-mode grinding behavior with reference to grinding parameters and grain protrusion parameters; finally, a truncated coarser #60 diamond grinding wheel was employed for mirror finish grinding to observe active grain number and grain protrusion angle. Theoretical analysis shows that this ductile-mode grinding is dominated by active grain number, active grain protrusion angle, wheel rotating speed and axial-feed speed, but it does not depend on the depth of cut assumed to be less than the grain protrusion height. Experimental results indicate that the GT-truncation may increase active grain number and grain protrusion angle for ductile-mode grinding when the axial-feed speed decreases to some extent. Moreover, the micro tip radius of diamond grain also influences the ground surface. It is confirmed that by increasing active grain number and grain protrusion angle synchronously, a truncated #60 diamond grinding wheel can be applied for efficient mirror finish grinding of the SiC ceramic plate at the axial-feed speed of 50 mm/min and the tool path interval of 0.1 mm.     

碳化硅环形金刚石线锯加工的裂纹研究

碳化硅晶体硬度高,属于难加工材料,环形金刚石线锯加工具有切缝窄、加工效率高、加工质量好、能加工硬度高尺寸大的脆性材料的优势。根据锯丝磨粒的分布特点,给出了单颗磨粒锯切力与总锯切力的关系式。建立了锯切表面裂纹深度与锯切力之间、表面粗糙度与锯切力之间的理论关系,此关系可用于碳化硅线锯加工裂纹的预测。最后,给出了减少加工裂纹的措施。     

SiC的添加量对树脂金刚石线切割能力的影响

制备不同SiC含量的树脂金刚石线,并进行硅片切割试验。通过记录切割过程中的扭矩和加切情况,研究不同SiC添加量对树脂金刚石线切割能力的影响。结果表明:当树脂液中SiC添加量增加时,树脂金刚石线的切割能力逐渐增强; 当SiC超过一定添加量时,切割能力有所降低。试验中,树脂液中SiC的添加量为600 g/L时,树脂金刚石线切割硅片产生的切割扭矩为96 N·m,且无加切情况,其切割能力最高;此时树脂固化后的邵氏硬度为91 HD,树脂层中的SiC分散均匀,无气孔等缺陷。      

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.