Microfluidic Surface‐Enhanced Raman Scattering Sensors Based on Nanopillar Forests Realized by an Oxygen‐Plasma‐Stripping‐of‐Photoresist Technique

A novel surface‐enhanced Raman scattering (SERS) sensor is developed for real‐time and highly repeatable detection of trace chemical and biological indicators. The sensor consists of a polydimethylsiloxane (PDMS) microchannel cap and a nanopillar forest‐based open SERS‐active substrate. The nanopillar forests are fabricated based on a new oxygen‐plasma‐stripping‐of‐photoresist technique. The enhancement factor (EF) of the SERS‐active substrate reaches 6.06 × 10⁶, and the EF of the SERS sensor is about 4 times lower due to the influence of the PDMS cap. However, the sensor shows much higher measurement repeatability than the open substrate, and it reduces the sample preparation time from several hours to a few minutes, which makes the device more reliable and facile for trace chemical and biological analysis.     

Plasma‐Induced Hetero‐Nanostructures on a Polymer with Selective Metal Co‐Deposition

Plasma‐induced pattern formation is explored on polyethylene terephthalate (PET) using an oxygen plasma glow discharge. The nanostructures on PET are formed through preferential etching directed by the co‐deposition of metallic elements, such as Cr or Fe, sputtered from a stainless‐steel cathode. The local islands formed by metal co‐deposition have significantly slower etching rates than those of the pristine regions on PET, generating anisotropic nanostructures in pillar‐ or hair‐like form during plasma etching. By covering the cathode with the appropriate material, the desired metallic or polymeric elements can be co‐deposited onto the target surfaces. When the cathode is covered by a relatively soft material composed of only carbon and hydrogen, such as polystyrene, nanostructures typically induced by preferential etching are not observed on the PET surface, and the surfaces are uniformly etched. A variety of metals, such as Ag, Cu, Pt, or Si, can be successfully co‐deposited onto the PET surfaces by simply using a cathode covered in the desired metal; high‐aspect‐ratio nanostructures coated with the co‐deposited metal are subsequently formed. Therefore this simple single‐step method for forming hetero‐nanostructures—that is, nanoscale hair‐like polymer structures decorated with metals—can be used to produce nanostructures for various applications, such as catalysts, sensors, or energy devices.     

Multiscale Plasma‐Catalytic On‐Surface Assembly

Controlled modification of surfaces is one of the key pursuits of the nanoscience and nanotechnology fields, allowing for the fabrication of bespoke materials with targeted functionalities. However, many surface modifications currently require painstakingly precise and/or energy intensive processing to implement, and are thus limited in scope and scale. Here, a concept which can enhance the capacity for control of surfaces is introduced: plasma‐assisted nucleation and self‐assembly at atomic to nanoscales, scalable at atmospheric pressures.     

Site‐Controlled Single‐Photon Emitters Fabricated by Near‐Field Illumination

Many of the most advanced applications of semiconductor quantum dots (QDs) in quantum information technology require a fine control of the QDs' position and confinement potential, which cannot be achieved with conventional growth techniques. Here, a novel and versatile approach for the fabrication of site‐controlled QDs is presented. Hydrogen incorporation in GaAsN results in the formation of N–2H and N–2H–H complexes, which neutralize all the effects of N on GaAs, including the N‐induced large reduction of the bandgap energy. Starting from a fully hydrogenated GaAs/GaAsN:H/GaAs quantum well, the N? H bonds located within the light spot generated by a scanning near‐field optical microscope tip are broken, thus obtaining site‐controlled GaAsN QDs surrounded by a barrier of GaAsN:H (laterally) and GaAs (above and below). By adjusting the laser power density and exposure time, the optical properties of the QDs can be finely controlled and optimized, tuning the quantum confinement energy over more than 100 meV and resulting in the observation of single‐photon emission from both the exciton and biexciton recombinations. This novel fabrication technique reaches a position accuracy <100 nm and it can easily be applied to the realization of more complex nanostructures.     

Writing,Self‐Healing,and Self‐Erasing on Conductive Pressure‐Sensitive Adhesives

A simple strategy for enabling conductive pressure sensitive adhesives (PSAs) to work as light‐responsive materials is reported. Direct laser‐writing of PSA substrates was achieved by means of a continuous‐wave He‐Ne laser focused through the objectives of an optical microscope. This approach takes advantage of cooperative interplay between viscoelastic properties of PSAs and enhanced thermal conductivity provided by an extra overlayer of gold. In particular, the thickness of the gold layer is a crucial parameter for tuning the substrate responsiveness. Self‐healing and self‐degradation processes can be exploited for controlling the lifetime of the written information, whereas additional protective coatings can be introduced to achieve permanent storage.     

Laser‐Assisted Large‐Scale Fabrication of All‐Solid‐State Asymmetrical Micro‐Supercapacitor Array

The micro‐supercapacitors are of great value for portable, flexible, and integrated electronic equipments. Here, the large‐scale and integrated asymmetrical micro‐supercapacitor (AMSC) array is fabricated in virtue of the laser direct writing and electrodeposition technology. The AMSC shows the ideal flexibility, high areal specific capacitance (21.8 mF cm^?2), and good rate capability. Moreover, its energy density reaches 12.16 µW h cm^?2, outperforming most micro‐supercapacitors reported previously. Meanwhile, large‐scale series‐connected AMSCs are integrated on the flexible substrates (e.g., indium tin oxide‐polyethylene terephthalate film), which can power a veriety of the commercial electronics. The combination of AMSCs array, solar cell, and electronic device proves the feasibility for practical application in the portable, flexible, and integrated electronic equipments.     

Influence of processing parameters of selective laser melting on high‐cycle and very‐high‐cycle fatigue behaviour of Ti‐6Al‐4V

Orthogonal experiment design together with the analysis of variance was used to examine the processing parameters (laser power, scan speed, layer thickness and hatch spacing) of selective laser melting (SLM) for superior properties of SLM parts, in which nine groups of specimens of Ti‐6Al‐4V were fabricated. The results clarify that the influence sequence of individual parameter on the porosity is laser power > hatch spacing > layer thickness > scan speed. Ultrasonic fatigue tests (20 kHz) were conducted for the SLMed specimens in high‐cycle fatigue (HCF) and very‐high‐cycle fatigue (VHCF) regimes. The S‐N data show that the fatigue strength is greatly affected by the porosity: the group with the smallest porosity percentage having the highest fatigue strength in HCF and VHCF regimes. Then, the tests on the validation group were performed to verify the optimal combination of SLM processing parameters. Moreover, the observations by scanning electron microscopy revealed that fatigue cracks initiate at lack‐of‐fusion defects in the cases of surface and internal crack initiation.     

Self‐Sealed Bionic Long Microchannels with Thin Walls and Designable Nanoholes Prepared by Line‐Contact Capillary‐Force Assembly

Long microchannels with thin walls, small width, and nanoholes or irregular shaped microgaps, which are similar to capillaries or cancerous vessels, are urgently needed to simulate the physiological activities in human body. However, the fabrication of such channels remains challenging. Here, microchannels with designable holes are manufactured by combining laser printing with line‐contact capillary‐force assembly. Two microwalls are first printed by femtosecond laser direct‐writing, and subsequently driven to collapse into a channel by the capillary force that arises in the evaporation of developer. The channel can remain stable in solvent due to the enhanced Van der Waals' force caused by the line‐contact of microwalls. Microchannels with controllable nanoholes and almost arbitrary patterns can be fabricated without any bonding or multistep processes. As‐prepared microchannels, with wall thicknesses less than 1 µm, widths less than 3 µm, lengths more than 1 mm, are comparable with human capillaries. In addition, the prepared channels also exhibit the ability to steer the flow of liquid without any external pump.     

Two‐Photon Vertical‐Flow Lithography for Microtube Synthesis

Two‐photon vertical‐flow lithography is demonstrated for synthesis of complex‐shaped polymeric microtubes with a high aspect ratio (>100:1). This unique microfluidic approach provides rigorous control over the morphology and surface topology to generate thin‐walled (<1 µm) microtubes with a tunable diameter (1–400 µm) and pore size (1–20 µm). The interplay between fluid‐flow control and two‐photon lithography presents a generic high‐resolution method that will substantially contribute toward the future development of biocompatible scaffolds, stents, needles, nerve guides, membranes, and beyond.     

Sub‐Micron Anisotropic InP‐based III–V Semiconductor Material Deep Etching for On‐Chip Laser Photonics Devices

Two InP‐based III–V semiconductor etching recipes are presented for fabrication of on‐chip laser photonic devices. Using inductively coupled plasma system with a methane free gas chemistry of chlorine and nitrogen at a high substrate temperature of 250 °C, high aspect ratio, anisotropic InP‐based nano‐structures are etched. Scanning electron microscopy images show vertical sidewall profile of 90° ± 3°, with aspect ratio as high as 10. Atomic Force microscopy measures a smooth sidewall roughness root‐mean‐square of 2.60 nm over a 3 × 3 μm scan area. The smallest feature size etched in this work is a nano‐ring with inner diameter of 240 nm. The etching recipe and critical factors such as chamber pressure and the carrier plate effect are discussed. The second recipe is of low temperature (?10 °C) using Cl₂ and BCl₃ chemistry. This recipe is useful for etching large areas of III–V to reveal the underlying substrate. The availability of these two recipes has created a flexible III–V etching platform for fabrication of on‐chip laser photonic devices. As an application example, anisotropic InP‐based waveguides of 3 μm width are fabricated using the Cl₂ and N₂ etch recipe and waveguide loss of 4.5 dB mm^?1 is obtained.