Thermal and dielectric properties of the aluminum particle/epoxy resin composites

Microsized aluminum/epoxy resin composites were prepared, and the thermal and dielectric properties of the composites were investigated in terms of composition, aluminum particle sizes, frequency, and temperature. The results showed that the introduction of aluminum particles to the composites hardly influenced the thermal stability behavior, and decreased T_g of the epoxy resin; moreover, the size, concentration, and surface modification of aluminum particles had an effect on their thermal conductivity and dielectric properties. The dielectric permittivity increased smoothly with a rise of aluminum particle content, as well as with a decrease in frequency at high loading with aluminum particles. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. The dielectric permittivity and loss increased with temperature, owing to the segmental mobility of the polymer molecules. We found that the aluminum/epoxy composite containing 48 vol % aluminum‐particle content possessed a high thermal conductivity and a high dielectric permittivity, but a low loss factor, a low electric conductivity, and a higher breakdown voltage. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

The order addition effect of carbon black/graphite on the electrical properties of rubber composites

Acrylonitrile‐butadiene rubber (NBR) filled with two types of fillers [high abrasion furnace carbon black (C), and graphite (G)] is made to find out the effect of order addition of C and G on the electrical conductivity of the composites. The temperature and frequency dependence of the (dc and ac) conductivity and dielectric constants have been measured. The values of the thermal expansion and thermal conduction coefficient of NBR rubber lead to the difference in I–V characteristics between CB‐ and G‐NBR rubber composites during the measurement. When graphite is first added to NBR, the electrical conductivity of (GC_20‐20) matrix is larger than that of the (CG_20‐20) matrix, whereas the carbon black is added first. At low temperature (T < 90°C), the higher values of the dielectric constant (ε′) for the sample GC_20‐20 compared with that of the CG_20‐20 sample is due to the conducting nature and structure of graphite, whereas the carbon shows less crystallinity and conductivity than graphite. Opposite behavior is noticed at temperature higher than 90°C. The dc conductivity of all composites increases with increasing temperature exhibiting a positive temperature coefficient of conductivity (PTCσ). The conductivity at high temperatures region is controlled by the thermal excitation transport mechanism, whereas at low temperatures region is dominated by tunneling process. The increase in the value of dielectric constant (ε′) with temperatures for the sample GC_20‐20 compared with the sample CG_20‐20 is due to the conducting nature and structure of graphite, and the carbon less crystalline than the graphite. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Polyarylene ether nitrile/divinyl siloxane-bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high-performance composite films were prepared by the method of post-solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane-bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot-disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (T_g: 208–400°C, T_5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high-temperature environments.     

Hot-pressing sintered BN-SiO2 composite ceramics with excellent thermal conductivity and dielectric properties for high frequency substrate

High thermal conductivity and low dielectric constant are the more and more important properties for high-frequency substrate materials to enhance their heat radiation and reduce signal delay. In this work, a series of BN-SiO₂ composite ceramics for high frequency application were successfully synthesized by hot-pressing sintering method. And their structures, thermal and dielectric properties were systematically studied. According to the results, the excellent thermal conductivity with low dielectric constant and low dielectric loss has been obtained in the BN-SiO₂ ceramic. Compared to the pure SiO₂, the sample with 50?wt% BN addition sintered at 1650?℃ exhibited excellent physical properties, including a high thermal conductivity of 6.75?W/m?K which is almost five times higher than that of pure SiO₂ and a low dielectric constant of 3.73. The achieved high thermal conductivity and appropriate dielectric property of the BN-SiO₂ composite ceramic make it a promising candidate for high-frequency substrate application.     

High permittivity ceramics loaded silicone elastomer composites for flexible electronics applications

The dielectric properties of silicone elastomer composites are important in designing flexible electronic devices. The recent explosive growth in wireless communication, automotive and biomedical applications increases the demand for flexible dielectric materials. However, it is very difficult to identify a homogeneous material which possesses these desired properties. Flexible silicone rubber- ceramic composites based BaTiO₃ (BT), SrTiO₃ (ST) and Ca_(1−x)Nd_(2x/3)TiO₃ (CNT) ceramic fillers have been prepared. The relative permittivity, thermal conductivity and water absorption increase whereas the coefficient of linear thermal expansion decrease as the volume fraction of filler increases. In the case of dielectric loss; a decreasing trend is shown by SR-ST and SR-CNT composites with filler volume fraction whereas SR-BT composites show a reverse trend since BT is a lossy material. The composites have εr in the range 3–14 in the microwave frequency range. The composites with high filler loading are suitable candidates for core of flexible dielectric waveguide and embedded capacitor applications and the composites with ST and CNT are suitable for cladding of flexible dielectric waveguide and also for microwave substrate applications     

Dielectric,Mechanical, and Thermal Properties of Low-Permittivity Polymer–Ceramic Composites for Microelectronic Applications

A new low-permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic-reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low-loss, low-permittivity Li₂MgSiO₄ (LMS) ceramics prepared by the solid-state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li₂MgSiO₄-reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models.     

Dielectric properties of epoxy/graphite flakes composites: Influence of loading and surface treatment

Epoxy-rich carbon-based composites are well recognized materials in industries owing to their good mechanical properties and thermal stability. Here, dielectric properties of composites based on bisphenol-A-epoxy resin loaded with 5, 6, 10, and 15 wt% of graphite flakes (GF) have been studied. The frequency and temperature dependence of the dielectric permittivity, dielectric loss, and ac conductivity have been examined in temperature (−103 to 97°C) and frequency (20 Hz–200 kHz) range. Influence of the filler surface chemistry have been studied for composites loaded with 5 wt% GF obtained: (i) under wet milling, without or with adding Triton-100x as a surfactant, or (ii) under dry milling in the presence of KOH. The composite made of epoxy loaded with 5 wt% exfoliated expanded graphite flakes (EEG), was also prepared. The surface treatment with KOH notably increased dielectric constant of the composite, keeping low dielectric loss, while treatment with Triton-100x significantly increased tanδ. The composite loaded with exfoliated expanded graphite shows higher ac conductivity than those obtained with flaky graphite, GF. Possibility to change dielectric properties of the composites without changing the loading content can be used as an approach in tailoring one with desired dielectric properties.     

Microstructure,Thermal Conductivity,and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

The microstructure, thermal conductivity, and electrical properties of pressureless densified SiC–BN composites prepared from in situ reaction of Si₃N₄, B₄C, and C were systematically investigated, to achieve outstanding performance as substrate materials in electronic devices. The increasing BN content (0.25–8 wt%) in the composites resulted in finer microstructure, higher electrical resistivity, and lower dielectric constant and loss, at the expense of only slight degradation of thermal conductivity. The subsequently annealed composites showed more homogeneous microstructures with less crystal defects, further enhanced thermal conductivities and electrical resistivities, and reduced dielectric constants and losses, compared with the unannealed ones. The enhanced insulating performance, the weakened interface polarization, and the reduced current conduction loss were explained by the gradual equalization of dissolved B and N contents in SiC crystals and the consequent impurity compensation effect. The schottky contact between graphite and p‐type SiC grains presumably played a critical role in the formation of grain‐boundary barriers. The annealed composites doped with 8 wt% BN exhibited considerably high electrical resistivity (4.11 × 10¹¹ Ω·cm) at 100 V/cm, low dielectric constant (16.50), and dielectric loss (0.127) at 1 MHz, good thermal conductivity [66.06 W·(m·K)^?1] and relatively high strength (343 MPa) at room temperature.     

Thermal and dielectric properties of the aluminum particle reinforced linear low‐density polyethylene composites

The possibility of obtaining relatively high thermal conductivity and dielectric constant but low dielectric loss polymeric composites by incorporating the core‐shell‐structured aluminum (Al) particles in a linear low‐density polyethylene (LLDPE) by melt mixing and hot pressing was demonstrated in this study. The morphology, thermal and dielectric properties of the composites were characterized using X‐ray diffractions, thermal analysis, scanning electron microscope, and dielectric analyzer. The Al particle decreases the degree of crystallinity and has no appreciable influence on the melting temperature of LLDPE. The thermal conductivity, dielectric constant and loss factor of the composites increase with an increase in Al content at all the frequencies (1 ～ 10⁶ Hz). The thermal conductivity and dielectric constant of the 70 wt% flaky Al particles filled LLDPE are 1.63 W/mK and 50, much higher than those of the spherical Al reinforced one. Moreover, the surface treatment of Al particles with γ‐Aminopropyltriethoxysilane silane coupler improves the thermal conductivity. The dielectric loss factors of the composites still remain at relatively low levels in the measured frequency range. Further, the dielectric permittivity frequency independence in the measured frequency range was observed due to the nanoscale‐Al‐oxide insulating shell of Al. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Simultaneously enhanced thermal conductivity and dielectric properties of borosilicate glass-based LTCC with AlN and h-BN additions

Microwave devices with reduced dielectric loss and electronic components with increased integration density necessitate the higher performance of electronic packaging materials. The h-BN/AlN/CaCO₃-MgO-B₂O₃-SiO₂-Li₂CO₃ glass composites were prepared via tape-casting and then sintered by pressureless and hot-pressing, respectively. The thermal conductivity of pressureless sintered composite was increased to 6.55 W/(m·K) by incorporating 3 wt% h-BN, and the thermal expansion of 4.47 ppm/K was achieved along with low dielectric constant of 5.76 and dielectric loss of 7.02 × 10⁻⁴ at 24 GHz. In contrast, the hot-pressing sintered composite containing 4 wt% h-BN exhibited higher thermal conductivity of 10.3 W/(m·K) and lower dielectric loss of 4.77 × 10⁻⁴. The microstructure characterization indicated the construction of heat conduction networks, and XRD analysis illustrated the formation of crystallization in the glass. Such low-temperature co-fired ceramic (LTCC) with high thermal conductivity and low dielectric loss would be a promising candidate for electronic packaging and 5G communication applications.     

Low-temperature-sintered MgO-based microwave dielectric ceramics with ultralow loss and high thermal conductivity

With the development of 5G/6G communication, the requirements of portable devices for miniaturization and multifunction make low-temperature co-fired ceramic (LTCC) more and more important. In the area of high-frequency high-density passive integration, microwave dielectric ceramics with a low dielectric loss and high thermal conductivity are urgently needed to ensure the effective signals transmission and system reliability. However, most microwave dielectric ceramics with a low dielectric loss were not applicable for the LTCC technology due to the high sintering temperature. In this work, a series of MgO-based ceramics [(100 − x) wt.% MgO–x wt.% (0.2SrF₂–0.8LiF) (x = 5,7,10)] were prepared by solid-state reaction method. The addition of sintering aid 0.2SrF₂–0.8LiF (S₂L₈) decreased the sintering temperature below 880°C without degrading the microwave dielectric properties of ceramics. Microwave dielectric properties of ceramics, including quality factor Q × f, relative permittivity ε_r, and temperature coefficient of resonant frequency τ_f, were investigated to find the optimum composition and sintering temperature. In general, MgO–7 wt.% S₂L₈ ceramic sintered at 860°C exhibits outstanding properties of Q × f = 180 233 GHz, ε_r = 9.11, τ_f = −40.33 ppm/°C, and a high thermal conductivity of 24.02 W/(m K). This series of ceramics are suitable to be co-fired with Ag electrodes. With all those great properties, this series of MgO-based ceramics are expected to be the candidates for LTCC applications in 5G/6G technology.     

New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

Three composites based on cyanate (CE) resin, aluminum nitride (AlN), surface‐treated aluminum nitride [AlN(KH560)], and silicon dioxide (SiO₂) for microelectronic packaging, coded as AlN/CE, AlN(KH560)‐SiO₂(KH560)/CE, and AlN‐SiO₂/CE composite, respectively, were developed for the first time. The thermal conductivity and dielectric constant of all composites were investigated in detail. Results show that properties of fillers in composites have great influence on the thermal conductivity and dielectric constant of composites. Surface treatment of fillers is beneficial to increase the thermal conductivity or reduce dielectric constant of the composites. Comparing with binary composite, when the filler content is high, ternary composites possess lower thermal conductivity and dielectric constant. The reasons leading to these outcomes are discussed intensively. POLYM. COMPOS., 2010. © 2009 Society of Plastics Engineers     

Polydimethylsiloxane–PbZr0.52Ti0.48O3 nanocomposites with high permittivity: Effect of poling and temperature on dielectric properties

Polydimethylsiloxane (PDMS)/lead zirconate titanate (PbZr_0.52Ti_0.48O₃, PZT)-based nanocomposites with high dielectric constant (permittivity, k) are prepared through room temperature mixing. The effect of PZT loading on electrical and mechanical properties of the PDMS–PZT composites is extensively studied. It is found that there is significant increase in permittivity with PZT loading and decrease in volume resistivity. All the composites have low dielectric loss compared to permittivity value. It is observed that there is increase in permittivity and decrease in volume resistivity of composites after poling, which is due to the dipolar polarization. It is found that both permittivity (ε′) and alternating current conductivity (σ_ac) are increased with temperature at low frequency (1 Hz) and decreased with temperature at high frequency (1 MHz). The above composites are sensitive to external pressure and can be used as pressure/force sensor. The tensile strength and % elongation at break decreases with PZT loading, which is due to the nonreinforcing behavior of PZT ceramic. PZT particles distribution and dispersion in PDMS matrix are observed through field emission scanning electron microscopy, high resolution transmission electron microscopy, and atomic force microscopy/scanning probe microscopy. Thermal stability of composites increased with the PZT loading which is due to higher thermal stability of PZT particles compared to PDMS matrix. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47307.     

Fabrication and characterization of poly(methyl methacrylate)/CaCu3Ti4O12 composites

Composites comprising Poly(Methyl Methacrylate) (PMMA) and CaCu₃Ti₄O₁₂ (CCTO) via melt mixing followed by hot pressing were fabricated. These were characterized using X‐ray diffraction, thermo gravimetric, scanning electron microscopy, and Impedance analyzer for their structural, morphology, and dielectric properties. Composites were found to have better thermal stability than that of pure PMMA. The composite, with 38 Vol % of CCTO (in PMMA), exhibited remarkably low dielectric loss at high frequencies and the low frequency relaxation is attributed to the space charge polarization/MWS effect. Theoretical models were employed to rationalize the dielectric behavior of these composites. At higher temperatures, the relaxation peak shifts to higher frequencies, due to the merging of both β and α relaxations into a single dielectric dispersion peak. The AC conductivity in the high frequency region was attributed to the electronic polarization. POLYM. ENG. SCI., 54:551–558, 2014. © 2013 Society of Plastics Engineers     

Melt compounded polylactic acid-hexagonal boron nitride-aluminum oxide hybrid composites for electronic applications: impact of hybrid fillers on thermophysical,dielectric, optical,and hardness properties

ABSTRACT

The dielectric, thermophysical, optical, and hardness of pure polylactic acid (PLA) and hBN micropowder and Al₂O₃ nanopowder (1% to 30%) reinforced PLA hybrid composites were investigated. Hybrid composites exhibit improved thermal conductivity (k – 0.54 W/mK), permittivity (?? – 4.6720 @ 1 MHz to 1 GHz) with very low loss tangent (tan δ < 0.02). High absorption in UV region was observed for all hybrid composites. Overall, the prepared hybrid composites can be used as a bio-based dielectric substrates, enclosures, thermal interface material for low temperature applications and UV-absorbable coating materials for fabric, packaging, and storage applications.     

Frequency and Temperature Dependence of Dielectric Properties of Au/Polyvinyl Alcohol (Co,Ni-Doped)/n-Si Schottky Diodes

The dielectric properties and AC conductivity of Au/polyvinyl alcohol (Co, Ni-doped)/n-Si Schottky diodes (SDs) were investigated in the frequency range 1 kHz–1 MHz and in the temperature range 80–400 K. The frequency and temperature dependence of dielectric constant (?′), dielectric loss (?″), loss tangent (tan δ), AC electrical conductivity (σ _ac ) and the real and imaginary parts of the electric modulus (M′ and M″) were found to be a strong function of frequency and temperature. The values of ?′, ?″ and tan δ decrease with increasing frequency, while they increase with increasing temperature, especially above 275 K. The values of σ _ac increase with both increasing frequency and temperature. Such temperature-related behavior of σ _ac can be attributed to the high mobility of free charges at high temperature. Electric modulus formalism was also analyzed to obtain experimental dielectric data. The values of M′ and M″ increase with increasing frequency, while they decrease with increasing temperature. The interfacial polarization, which more easily occurs at low frequencies and high temperatures, consequently contributes to the improvement of the dielectric properties of SDs.     

Effect of Al2O3 addition on thermo‐electrical properties of polymer composites: An experimental investigation

To develop a new class of composites with adequately high thermal conductivity and suitably controlled dielectric constant for electronic packages and printed circuit board applications, polymer composites are prepared with microsized Al₂O₃ particle as filler having an average particle size of 80–100 μm. Epoxy and polypropylene (PP) are chosen as matrix materials for this study. Fabrication of epoxy‐based composite is done by hand lay‐up technique and its counterpart PP‐based composite are fabricated by compression molding technique with filler content ranging from 2.5–25 vol%. Effects of filler loading on various thermal properties like effective thermal conductivity (k_eff), glass transition temperature (T_g), coefficient of thermal expansion (CTE) and electrical property like dielectric constant (ε_c) of composites are investigated experimentally. In addition, physical properties like density and void fraction of the composites along with there morphological features are also studied. The experimental findings obtained under controlled laboratory conditions are interpreted using appropriate theoretical models. Results show that with addition of 25 vol% of Al₂O₃, k_eff of epoxy and PP improve by 482% and 498% respectively, T_g of epoxy increases from 98°C to 116°C and that of PP increases from −14.9°C to 3.4°C. For maximum filler loading of 25 vol% the CTE decreases by 14.8% and 26.4% for epoxy and PP respectively whereas the dielectric constants of the composites get suitably controlled simultaneously. POLYM. COMPOS., 36:102–112, 2015. © 2014 Society of Plastics Engineers     

Enhanced thermal conductivity of low-temperature sintered borosilicate glass–AlN composites with β-Si3N4 whiskers

The effects of β-Si₃N₄ whiskers on the thermal conductivity of low-temperature sintered borosilicate glass–AlN composites were systematically investigated. The thermal conductivity of borosilicate glass–AlN ceramic composite was increased from 11.9 to 18.8 W/m K by incorporating 14 vol% β-Si₃N₄ whiskers, and high flexural strength up to 226 MPa were achieved along with low relative dielectric constant of 6.5 and dielectric loss of 0.16% at 1 MHz. Microstructure characterization and percolation model analysis indicated that thermal percolation network formation in the ceramic composites led to the high thermal conductivity. The crystallization of the borosilicate microcrystal glass also contributed to the enhancement of thermal conductivity. Such ceramic composites with low sintering temperature and high thermal conductivity might be a promising material for electronic packaging applications.     

Polytetrafluorethylene-based high-k composites with low dielectric loss filled with priderite (K1.46Ti7.2Fe0.8O16)

Composite materials with a high permittivity (high-k) and low dielectric loss represent an important research direction for the rapid development of modern electronic. This article is about high-k composite with low dielectric loss (dielectric constant is approximately 11, and dielectric loss is only 0.02 at 1 MHz and about 50 wt % of filler) based on a polytetrafluorethylene (PTFE) compounded with priderite (K_1.46Ti_7.2Fe_0.8O₁₆). The dielectric permittivity about ε' ≈ 10³ and the dielectric loss of tgδ ≈ 2 have been found for filler content about 50 wt % (30 vol %) and, respectively, ε' ≈ 11 and tgδ ≈ 0.02 for 1 MHz. To produce filler, amorphous potassium polytitanate was synthesized by molten salt method, modified in aqueous solution of iron sulfate, crystallized at 700 °C and further treated in the aqueous dispersion of PTFE. The obtained product was pressured, dried and investigated by X-ray diffraction and scanning electron microscopy. Dielectric properties of the composite with different ceramic filler content (1–90 wt %) were studied using impedance spectroscopy in the frequency range of 10⁻² to 10⁶ Hz. The influence of frequency on electric conductivity, permittivity, and dielectric losses was analyzed taking into account the experimental data on porosity, apparent density obtained for the composites. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48762.     

Modified BCZN particles filled PTFE composites with high dielectric constant and low loss for microwave substrate applications

The modified 0.7Ba (Co_1/3Nb_2/3)O₃-0.3Ba(Zn_1/3Nb_2/3)O₃ (BCZN) powders filled PTFE composites were synthesized by hot-pressing. The influences of BCZN content on the microstructure, dielectric, thermal, mechanical properties and moisture absorption were investigated systematically. The modified BCZN powders filled PTFE composites exhibited better microstructure and dielectric properties compared with untreated powders. Various mathematic models were utilized to predict the dielectric constant of different composites and the effective medium theory (EMT) showed perfect consistency with the experimental results. The modified BCZN/PTFE composites possess the best comprehensive properties at the powders content of 50 vol% with high dielectric constant (ε_r) of 7.7, low loss (tanδ) of 0.0014, acceptable temperature coefficient of dielectric constant (τ_ε) of −125.6 ppm/°C and temperature coefficient of resonant frequency (τ_f) of 29.4 ppm/°C at 7 GHz, low moisture absorption of 0.07% and low coefficient of thermal expansion (CTE) of 33 ppm/°C. All the results show modified BCZN/PTFE composites are the potential materials for microwave substrate applications.