REGINA test mask: research on EMC guidelines for integrated automotive circuits

This paper presents the results obtained with a specific test mask designed at Motorola for the study of the electromagnetic parasitic emissions in integrated circuits (IC). First, origins of parasitic emissions are presented for CMOS circuits, and electromagnetic compatibility (EMC) measurements of IC emissions are detailed: a radiated measurement method with respect to the IEC61967-2 standard and a conducted one with respect to the IEC61967-4 standard. The REGINA test chip is then described, with a focus on particular structures allowing to test and verify some design guidelines for EMC, like delay cell, emissive structure or on-chip sensor. The printed circuit board that is use to implement the test chip and the experiment test bench are also described. A set of measurements is presented and some guidelines are deduced and recommended as design rules.     

集成电路电磁兼容标准概述

随着集成电路新技术与应用的结合，增加了电磁兼容(EMC)符合性的复杂程度，对ICEMC性能的表征受到越来越多的关注。由此推动了对标准化测量规程的需求，使不同器件有一致的评价和比较。对标准化的需求进行了讨论，介绍了IECTC47／SC47A第9工作组在IC发射与抗扰度EMC试验方法标准化方面的工作进展情况。并探讨了ICEMC的发展趋势。     

An overview of standards in electromagnetic compatibility for integrated circuits

The characterization of the electromagnetic compatibility (EMC) performance of integrated circuits (ICs) is receiving increasing focus as new applications and technology trends combine to raise the complexity of EMC compliance. The increased focus is driving the need for standardized measurement procedures to enable consistent evaluation and comparison of different devices. This paper discusses the need for standardization, describes the work in process by IEC TC47/SC47A Working Group 9 to standardize emissions and immunity EMC test methods for ICs, and examines trends in IC EMC.     

Characterization of the Evolution of IC Emissions After Accelerated Aging

With the evolving technological development of integrated circuits, ensuring electromagnetic compatibility (EMC) is becoming a serious challenge for electronic circuit and system manufacturers. Although electronic components must pass a set of EMC tests to ensure safe operations, the evolution of EMC over time is not characterized and cannot be accurately forecast. This paper presents an original study about the consequences of the aging of circuits on electromagnetic emissions. Different types of standard applicative and accelerated life tests are applied on a mixed power circuit dedicated to automotive applications. Its conducted emissions are measured before and after these tests, showing variations in EMC performance. Comparisons between each type of aging procedure show that the emission level of the circuit under test is differently affected.      

集成电路中的ESD保护

随着科学技术的飞速发展、微电子技术的广泛应用及电磁环境越来越复杂,对静电的电磁场效应,如电磁干扰(EMI)及电磁兼容性(EMC)问题越来越重视.简要介绍静电放电(ESD)的产生及在集成电路工艺、器件中的防护措施,并提供了现今流行的保护电路.     

Power bus signal integrity improvement and EMI mitigation on multilayer high-speed digital PCBs with embedded capacitance

The continuous technology trend in the telecommunication market toward higher operating frequencies and high processing performances will give rise to new sophisticated chip sets, processors, and RF transceivers which will demand new feature to the PCB designs. As the complexity of the integrated circuits increases, signal integrity (SI) and electromagnetic compatibility (EMC) become key elements in the board design process. This paper analyzes the beneficial effects that a thin dielectric material between a pair of power and ground layers (embedded capacitance) has both in reducing power bus resonance amplitudes (SI approach) and radiated emissions (EMC approach) as well. Scattering parameter measurements carried out on the power bus of two production boards are presented and correlated with the electric field strength measurements conducted on the same boards in a semianechoic chamber.     

基于横电磁波小室的IC辐射发射测试方法研究

集成电路(IC)的发展呈现出小型化和集成化的趋势,使得IC电磁辐射越来越强,准确测试出IC电磁辐射对于集成电路电磁兼容设计有重要意义。横电磁波(TEM)小室法是目前最常用的IC辐射测试方法,它使用方形测试板,测试四个角度(0°, 90°, 270°, 360°)的IC辐射值,然而IC电磁辐射具有角度效应,仅用四个角度无法准确测试出IC最大电磁辐射水平。文中基于TEM小室全波仿真模型,使用单根微带线,验证了角度对于IC辐射的影响。设计了基于STM32芯片的圆形测试板和方形测试板,利用TEM小室测试了不同角度、不同模式下的STM32芯片电磁辐射,测量结果证实了不同模式下圆形测试板的测试结果都要大于方形测试板,最大偏差达到16 d Bm,因此圆形测试板更能准确测出芯片的最大电磁辐射水平。     

通信系统电磁兼容技术探讨

随着通信技术的发展,电子产品的功能越来越强大,线路也越来越复杂,对通信装备的质量要求也越来越高．电磁干扰（EMI）和电磁兼容（EMC）问题也越来越突出。探讨丁在通信系统的电路设计中。如何降低EMI,提高系统EMC能力的技术问题。     

Issues in electromagnetic compatibility of integrated circuits: emission and susceptibility

This paper is focused on the electromagnetic compatibility (EMC) of integrated circuits. The introduction gives general keyword definitions and principles for emission and susceptibility. The second part deals with the evolution of integrated circuit design and technology with its consequences on EMC. The third part describes the mechanisms for generating parasitic noise within integrated circuits and the role of the package and on-chip supply network. Next, the standardized measurement methods are described for both parasitic emission characterization (conducted and radiated) and immunity from 1 MHz to 1 GHz. Issues and proposals up to 18 GHz are discussed. The advances in modeling of emission are also addressed, as well as the issues in immunity prediction.     

汽车电子芯片EMC测试标准研究

在汽车电子产品所采用的电磁兼容测试标准的基础上,以功率驱动芯片为例,提出了汽车电子芯片级电磁兼容测试的必要性,并重点介绍了集成电路电磁发射测试标准IEC61967和集成电路电磁抗扰度测试标准IEC62132。     

Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables Using TEM Cell Measurements

One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involves mounting the IC on a printed circuit board (PCB) embedded in the wall of a transverse electromagnetic (TEM) cell. The signal voltages on the IC and its package produce electric fields that can couple to cables and other structures attached to the PCB, inducing common-mode currents that can be a primary source of unintentional radiated emissions. The signal currents in the IC and its package produce magnetic fields that can also result in common-mode currents on larger radiating structures. This paper describes a TEM cell measurement method employing a hybrid to separate the electric field coupling and the magnetic field coupling. The results of this measurement can be used to determine the product of the IC's self-capacitance and the effective voltage that drives this capacitance. This voltage-capacitance product characterizes the IC's ability to drive common-mode currents onto cables or enclosures due to electric field coupling. This information can then be used to estimate the resulting radiated emissions.     

The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future

Throughout the decades of continuous advances in semiconductor technology, from the discrete devices of the late 1950s to today's billon-transistor system-on-chip, there have always been concerns about the ability of components to operate safely in an increasingly disruptive electromagnetic environment. This paper provides a nonexhaustive review of the research work conducted in the field of electromagnetic compatibility (EMC) at the IC level over the past 40 years. It also brings together a collection of information and trends in IC technology, in order to build a tentative roadmap for the EMC of ICs until the year 2020, with a focus on measurement methods and modeling approaches.      

高速混合电路的EMC设计

高速混合电路在很多重要领域都有应用.高速混合电路中的主要噪声源和EMC设计方法都有新的重要特点,传统的EMC设计方法已难以满足实际需要.结合IC技术、PCB技术和EMC技术的新进展和发展趋势,讨论了高速混合电路中的主要噪声源(包括△I噪声、时钟噪声、电源噪声、ESD噪声等),研究了高速混合电路的若干值得重视与进一步研究的EMC设计方法(涉及IC封装技术、PCB技术、EMC预测技术、EDA技术、时钟展频技术、ESD防护技术等).对高速混合电路的EMC设计方法的研究与应用具有指导作用.     

舰船卫星设备电磁兼容性设计技术

随着现代舰船上各种类型电子设备的不断增多,在有限的舰船空间中,电磁干扰也正变得越来越严重,舰船电磁环境正变得越来越复杂,舰载卫星设备的电磁兼容性(EMC)设计已成为制约舰载卫星设备发挥效能的突出问题,得到越来越广泛的关注和重视。通过分析舰载卫星设备的电磁环境特点,结合实际工程经验,并在设计实现上采取了多种技术的有效措施,使电磁兼容性设计效果达到最优化,收到了事半功倍的效果。     

Distributed integrated circuits: an alternative approach tohigh-frequency design

Distributed integrated circuits are presented as a methodology to design high-frequency communication building blocks. Distributed circuits operate based on multiple parallel signal paths working in synchronization that can be used to enhance the frequency of operation, combine power, and enhance the robustness of the design. These multiple signal paths usually result in strong couplings inside the circuit that necessitate a treatment spanning architecture, circuits, devices, and electromagnetic levels of abstraction     

毫米波相控阵封装天线电磁兼容仿真分析与设计

提出了一种毫米波相控阵封装天线的建模方法,通过商业仿真软件搭建了相控阵封装天线集数字、模拟和射频于一体的系统级仿真模型。基于此模型,分析了毫米波相控阵封装天线典型电磁兼容问题机理。此外,提出了相控阵封装天线电磁兼容设计的基本原则。原理样机试验和装机试飞验证了所提出的电磁兼容建模、仿真、分析和设计方法的有效性与正确性。     

ICEM modelling of microcontroller current activity

Better prediction of electromagnetic compatibility (EMC) for components is becoming a topical demand due to technology improvements. It is requested by integrated circuit (IC) manufacturers as well as by equipment integrators. The French UTE standardisation group has proposed an EMC modelling methodology for ICs, called integrated circuit electromagnetic model (ICEM). This proposal improves and extends the IBIS standard towards conducted emission prediction (and later radiated emission) by providing additional information modelling the power network and the dynamic current activity of an IC, thus allowing the chip manufacturer to justify the package used as well as the number of power supply pins, and the equipment manufacturer to tune power supply and decoupling networks.After a brief introduction to the ICEM model and the associated methods, this article shows a way of obtaining dynamic current activity models by measuring the current consumed on the IC power supply pins. The use of ICEM for the optimisation of decoupling networks, the evaluation of power supply noise and the tuning of the surface of power and ground planes is presented for the first time with subsequent results.     

Die elektromagnetische Verträglichkeit, ein wichtiges und interessantes Arbeitsgebiet des Ziviltechnikers

The present paper covers achievements in EMC at the planning stage of complex buildings and of buildings for special equipment. These achievements are the more important and urgent, the higher integrated electronic devices, which shall work together without any impact on themselves or on others, are used in buildings. Achievements for EMC at the planning stage are done in high quality by independent consultants, who have a rich experience and practice in measuring and assessing of electromagnetic fields.     

Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging

The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10–11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3–5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.