共查询到17条相似文献,搜索用时 78 毫秒
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振动分析的有效工具--功率谱密度 总被引:8,自引:0,他引:8
功率谱密度是评价流通环境过程中随机振动的有效工具.阐述了功率谱密度的基本理论、如何获得功率谱密度;介绍了功率谱密度的具体应用.从而使流通环境中的振动分析更精确,更可靠. 相似文献
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二维谱分析在工程表面的研究中是有效和实用的,在介绍二维快速傅里叶变换基本概念的基础上,推导出了二维功率谱、角谱和半径谱在三维表面形貌中的应用计算方法,并对一些有代表性的精加工表面试件进行了实验研究。结论表明,二维谱分析技术可以表征表面纹理的方向性和不同波长对表面粗糙度高度均方根的影响。 相似文献
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基于功率谱密度的盲信号分离 总被引:1,自引:0,他引:1
提出一种新的基于功率谱密度的盲信号分离方法。该方法在传感器数与源数关系不明确情况下,且源信号相互独立时,直接通过混合信号功率谱密度函数比值求解混合阵,并通过混合阵判定观测信号是完备混合、超定混合还是欠定混合,由此进一步分离信号。理论分析、仿真数据证明了算法的有效性。同时还仿真了噪声对分离性能的影响。 相似文献
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目的为了确保氢能源汽车的使用安全性,研究氢能源汽车在行驶过程中,由路面凹凸不平和无规律性振动对能源供给装置的包装件-供氢系统随机造成的影响。方法通过Ansys Workbench有限元分析软件,采用模态叠加法,并输入GB/T4857.23—2012中的功率谱密度激励,对供氢系统进行随机振动分析。结果获得了在1σ,2σ,3σ下的应力与位移分布,得知最大应力发生在系统鞍座,而最大位移发生在系统框架。结论证明了氢系统的使用安全性,同时为今后的研究以及更多运输包装系统的PSD随机振动提供了依据和保障。 相似文献
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超精密车削单晶硅刀具振动频谱分析 总被引:1,自引:0,他引:1
为了在线监测单晶硅超精密车削的脆塑转变现象及分析单晶硅车削过程中材料的微纳去除方式,采用圆弧刃金刚石刀具对单晶硅(100)晶面进行了超精密车削,研究了单晶硅超精密车削时刀具振动频谱分布与切削参数的关系,并对刀具振动频谱的变化规律及其演变机理进行了分析.结果表明,刀具振动频谱分布与刀具和单晶硅接触方式、单晶硅微纳去除模式密切相关.当单晶硅的去除模式从脆性域过渡到塑性域时,材料由崩碎状脆性去除方式转变为以剪切滑移变形为主的塑性去除方式,刀具振动频谱高频段信号增多,且振动总能量增大;塑性域车削时,切削速度越小、切削深度越大、进给量越大,材料微观剪切变形区内位错滑移数量越多,刀具振动频谱高频段信号越多,刀具振动主总能量越大.切削速度、进给量、切削深度对刀具振动频谱分布的影响依次减小,采用合理的切削参数,可以降低切削系统的总体振动. 相似文献
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In the last decade, with a continued change in world economic conditions and global trade, transportation of goods has continued to increase. The opening of new and existing markets requires that products and packages move through various regions of the world using available logistical equipment and networks at a faster pace. It also requires that damage be kept at a minimum while providing maximum safety to individuals. This can be achieved by properly designing packages to transportation levels that occur in the supply chain. The purpose of this research is to both measure and analyse the vibration physical forces that occur during rail transport. Rail shipments are widely used across the world, and they are an integral part of the intermodal transfer of ISO containers from ships and trucks to rail. The aim of this paper is to provide vibration levels measured for rail shipments on a major railway line in Central Europe that has not been previously published. The vibration levels that were measured in this study were compared with American Society of Testing and Materials, United States Military Standards and United Kingdom Defense Standard standards and International Safe Transit Association procedures in the form of power spectral density spectrums. A composite power spectral density spectrum is provided which can be used to simulate the measured rail vibration levels in Central Europe. Results are also compared with rail travel in other international shipments for North America and Asia. Copyright © 2016 John Wiley & Sons, Ltd. 相似文献
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Niranjana Behera Vijay K. Agarwal Mark Jones Kenneth C. Williams 《Particulate Science and Technology》2015,33(5):510-516
In order to reveal the unsteady features of gas–solid flow, the pressure fluctuations were measured at different locations along the length of the pipeline while conveying powders through the pipeline. Power spectral density (PSD) functions were obtained for the analysis of the pressure fluctuation. Two types of powders (fly ash and alumina) were used in this analysis. The PSD analysis was conducted by taking into account different aspects such as flow conditions (dilute or dense), location of transmitter (top and bottom transmitters), location of transmitter along the length of the pipeline (three different locations), material property (fly ash or alumina), etc. Analysis of signals from top and bottom transmitters shows that it is not possible to identify the flow mode at upper and lower portions of pipeline. The magnitude of power is found to be higher for alumina as compared to fly ash. PSD parametric analysis reveals that frequency bandwidth and average power decreases exponentially with increase in solid loading ratio. 相似文献
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对碳纤维增强树脂基复合材料(CFRP)的细观结构成像方法进行了研究,利用涡流成像技术实现了CFRP层合板中纤维方向及纤维缺失、褶皱和空隙过大等缺陷的可视化。首先通过有限元仿真和电路理论分析了CFRP板中涡流的生成机制和分布特性,阐述了基于涡流法的CFRP细观结构成像机制。然后介绍了用于扫描成像的高频涡流检测(HF-ECT)实验系统并确定了涡流探头的形式及其参数。最后利用涡流成像技术分别对单层板、正交层合板和四方向斜交层合板进行了检测,绘制了涡流检测(ECT)信号的三维伪彩图并得到了清晰的纤维纹路分布。通过引入滤波去噪技术和二维快速傅里叶变换(2D-FFT)对图像进行进一步处理,提高了图像分辨率并完成了不同方向上纤维纹路的分离,从而实现对层合板每单向层中缺陷的精确定位。 相似文献
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地震动作为一类典型的非平稳随机过程可由演变谱刻画其能量的时-频分布。然而,演变谱的时-频耦合特性却限制了经典谱表示法的模拟效率。为提高非平稳地震动模拟效率,简化非平稳地震作用下结构随机响应分析,提出了基于非负矩阵分解(nonnegative matrix factorization,NMF)的地震动演变谱解耦方案,使结构在非平稳地震作用下的响应计算简化为各项均匀调制激励下的结构随机响应叠加。分析结果表明,基于非负矩阵分解的地震动演变谱解耦具有良好的精度,快速傅里叶变换技术的引入提高了经典谱表示法的模拟效率,模拟样本自相关函数与目标值吻合良好,非平稳地震作用下结构随机响应频域分析得到简化。 相似文献
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A simple gravity dam-reservoir system is selected for studying the interaction of structure-fluid systems under nonstationary random excitation. For an idealized random excitation with a zero start and a white power spectrum, the transient response mean square for the structural displacement is obtained by a simple time domain approach. Using this transient solution the random interaction effect is examined in detail. This transient interaction effect is important because it simulates random and time dependent earthquake ground accelerations. 相似文献
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Recently, piezoelectric thin films including zinc oxide (ZnO) and aluminium nitride (AlN) have found a broad range of lab-on-chip applications such as biosensing, particle/cell concentrating, sorting/patterning, pumping, mixing, nebulisation and jetting. Integrated acoustic wave sensing/microfluidic devices have been fabricated by depositing these piezoelectric films onto a number of substrates such as silicon, ceramics, diamond, quartz, glass, and more recently also polymer, metallic foils and bendable glass/silicon for making flexible devices. Such thin film acoustic wave devices have great potential for implementing integrated, disposable, or bendable/flexible lab-on-a-chip devices into various sensing and actuating applications. This paper discusses the recent development in engineering high performance piezoelectric thin films, and highlights the critical issues such as film deposition, MEMS processing techniques, control of deposition/processing parametres, film texture, doping, dispersion effects, film stress, multilayer design, electrode materials/designs and substrate selections. Finally, advances in using thin film devices for lab-on-chip applications are summarised and future development trends are identified. 相似文献