Effect of high temperature AlGaN buffer thickness on GaN Epilayer grown on Si(111) substrates

Crack-free GaN epitaxial layer was obtained through inserting 80 nm graded AlGaN buffer layer between GaN epilayer and high temperature AlN buffer on 2-in Si(111) substrates by metal organic chemical vapor deposition. This paper investigated the influence of AlGaN buffer thickness on the structural properties of the GaN epilayer. It was confirmed from the optical microscopy and scanning electronic microscopy that the graded AlGaN buffer with optimized thickness had a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and atomic force microscopy analysis showed that AlGaN buffer with proper thickness could improve the crystal quality and surface morphology of the GaN film. Transmission electron microscopy analysis revealed that a significant reduction in threading dislocations was achieved in GaN epilayer by the insertion of graded AlGaN buffer.     

Structural and photoluminescence study of thin GaN film grown on silicon substrate by metalorganic chemical vapor deposition

GaN epitaxial layer was grown on Si(111) substrate by metalorganic chemical vapor deposition (MOCVD). The structure consists of 50 nm thick high-temperature grown AlN buffer layer, 150 nm thick AlGaN layer, 30 nm low-temperature grown AlN layer, 300 nm GaN layer, 50 nm AlGaN superlattice layer, followed by 100 nm GaN epitaxial layer. The low-temperature AlN interlayer and AlGaN superlattice layer were inserted as the defect-blocking layers in the MOCVD grown sample to eliminate the dislocations and improve the structural and optical properties of the GaN layer. The dislocation density at the top surface was decreased to ∼ 2.8 × 10⁹/cm². The optical quality was considerably improved. The photoluminescence emission at 3.42-3.45 eV is attributed to the recombination of free hole-to-donor electron. The observed 3.30 eV emission peak is assigned to be donor-acceptor transition with two longitudinal optical phonon side bands. The relationship of the peak energy and the temperature is discussed.     

Buffer effects on the mosaic structure of the HR-GaN grown on 6H-SiC substrate by MOCVD

High-resistive GaN (>10⁸ Ω cm) layers have been grown with different buffer structures on 6H-SiC substrate using metalorganic chemical vapor deposition reactor. Different combination of the GaN/AlN super lattice, low temperature AlN, high temperature AlN and Al_xGa_1?xN (x ≈ 0.67) layers were used in the buffer structures. The growth parameters of the buffer layers were optimized for obtaining a high-resistive GaN epilayer. The mosaic structure parameters, such as lateral and vertical coherence lengths, tilt and twist angle (and heterogeneous strain), and dislocation densities (edge and screw dislocations) of the high-resistive GaN epilayers have been investigated using x-ray diffraction measurements. In addition, the residual stress behaviors in the high-resistive GaN epilayers were determined using both x-ray diffraction and Raman measurements. It was found that the buffer structures between the HR-GaN and SiC substrate have been found to have significant effect on the surface morphology and the mosaic structures parameters. On the other hand, both XRD and Raman results confirmed that there is low residual stress in the high-resistive GaN epilayers grown on different buffer structures.     

Synthesis and characterization of heteroepitaxial GaN films on Si(111)

We report crack-free and single-crystalline wurtzite GaN heteroepitaxy layers have been grown on Si (111) substrate by metal-organic chemical vapor deposition(MOCVD). Synthesized GaN epilayer was characterized by X-ray diffraction(XRD), atomic force microscope (AFM) and Raman spectrum. The test results show that the GaN crystal reveals a wurtzite structure with the <0001> crystal orientation and XRD ω-scans showed a full width at half maximum (FWHM) of around 583 arcsec for GaN grown on Si substrate with an HT-AlN buffer layer. In addition, the Raman peaks of E₂^high and A₁(LO) phonon mode in GaN films have an obvious redshit comparing to bulk GaN eigen-frequency, which most likely due to tensile strain in GaN layers. But the AO phonon mode of Si has a blueshit which shows that the Si substrate suffered a compressive strain. And we report that the AlN buffer layer plays a role for releasing the residual stress in GaN films.     

Influence of AlN buffer layer thickness and deposition methods on GaN epitaxial growth

A gallium nitride (GaN) epitaxial layer was grown by metal-organic chemical vapor deposition (MOCVD) on Si (111) substrates with aluminum nitride (AlN) buffer layers at various thicknesses. The AlN buffer layers were deposited by two methods: radio frequency (RF) magnetron sputtering and MOCVD. The effect of the AlN deposition method and layer thickness on the morphological, structural and optical properties of the GaN layers was investigated. Field emission scanning electron microscopy showed that GaN did not coalesce on the sputtered AlN buffer layer. On the other hand, it coalesced with a single domain on the MOCVD-grown AlN buffer layer. Structural and optical analyses indicated that GaN on the MOCVD-grown AlN buffer layer had fewer defects and a better aligned lattice to the a- and c-axes than GaN on the sputtered AlN buffer layer.     

Strain–Stress Analysis of AlGaN/GaN Heterostructures With and Without an AlN Buffer and Interlayer

Abstract: The strain–stress analysis of Al_xGa_1?xN/GaN (x = 0.3) heterostructures with and without a high‐temperature HT‐AlN interlayer (IL) grown on sapphire (Al₂O₃) substrates and AlN buffer/Al₂O₃ templates via metal organic chemical vapour deposition (MOCVD) was carried out based on the precise measurement of the lattice parameters by using high‐resolution X‐ray diffraction (HRXRD). The a‐ and c‐lattice parameters were measured from the peak positions that were obtained by rocking the theta axis at the vicinity of the symmetric and asymmetric plane reflection angles, followed by the in‐plane and out‐of‐plane strains. Then, the biaxial and hydrostatic components were extracted from the total strain values that were obtained and were then discussed in the present study as the effect of the HT‐AlN buffer and IL. The AlN buffer layer (BL) affects the strain values of the AlGaN ternary layer (TL). A further effect was realized by inserting an AlN IL between GaN BL and AlGaN TL. However, the experimental results also show that an AlN IL changes the strain behaviour in the a‐ and c‐directions of the AlGaN TL from the tensile to compressive and the compressive to tensile type, respectively. These similar behaviours were observed in hydrostatic strain, biaxial strain and stress. Their reasons are explained with an effective a‐lattice parameter, post‐growth cooling and lattice and thermal mismatches.     

Influence of double buffer layers on properties of Ga-polarity GaN films grown by rf-plasma assisted molecular-beam epitaxy

Ga-polarity GaN thin films were grown on sapphire (0001) substrates by rf-plasma assisted molecular beam epitaxy (MBE) using a double buffer layer, which consisted of an intermediate-temperature GaN buffer layer (ITBL) grown at 690 °C and a conventional AlN buffer layer deposited at 740 °C. Raman scattering spectra showed that the E₂ (high) mode of GaN film grown on conventional AlN buffer layer is at about 570 cm⁻¹, and shifts to 568 cm⁻¹ when an ITBL was used. This indicates that the ITBL leads to the relaxation of residual strain in GaN film caused by mismatches in the lattice constants and coefficients of thermal expansion between the GaN epilayer and the sapphire substrate. Compared to the GaN film grown on the conventional AlN buffer layer, the GaN film grown on an ITBL shows higher Hall mobility and substantial reduction in the flicker noise levels with a Hooge parameter of 3.87×10⁻⁴, which is believed to be, to date, the lowest reported for GaN material. These results imply that the quality of Ga-polarity GaN films grown by MBE can be significantly improved by using an ITBL in addition to the conventional low-temperature AlN buffer layer.     

GaN epilayer on separately deposited buffer layer by hot wall epitaxy

High quality GaN epilayers were grown on a sapphire substrate using a hot wall epitaxy method. We have investigated the crystal, optical, and electrical properties of GaN epilayers grown as functions of the nitridation condition of the substrate and the growth condition of GaN buffer layer. In order to study an effective method to grow a buffer layer for the growth of high quality GaN epilayer, the buffer layers were formed on the nitridated substrate using two different methods. One is separately deposited buffer layer (SDBL), and the other is co-deposited buffer layer (CDBL). It was observed that the growth condition of the buffer layer had a strong influence on the crystal and optical properties of GaN epilayer. A strong band edge emission peak at 3.474 eV was observed from the photoluminescence spectrum measured at 5 K for GaN epilayer grown at the optimum condition of the buffer layer. The carrier concentration and mobility of undoped GaN epilayer grown with a growth rate of 0.5 μm h⁻¹ were 2 × 10¹⁸ cm⁻³ and >50 cm³ V⁻¹ s⁻¹ at room temperature, respectively.     

Synthesis and characterization of 4H-SiC on C-plane sapphire by C60 and Si molecular beam epitaxy

4H-SiC (silicon carbide) films were grown on (0001) sapphire substrate at rather low temperatures(1000-1100 °C) with relative high deposition rate by using fullerene (C₆₀) and silicon solid sources molecular beam epitaxy with substrate nitridation and aluminum nitride (AlN) buffer layer deposition prior to the SiC deposition. The effects of substrate nitridation and AlN buffer layer to the adhesion of the SiC thin films on sapphire have been studied. X-Ray diffraction, pole figure, atomic force microscope, Fourier transform infrared spectroscopy and photoluminescence were employed for the analysis of composition, orientation of the film and surface morphology. Relative high deposition rate at ∼ 165 nm/h was achieved.     

Electrical and materials properties of AlN/ HfO2 high-k stack with a metal gate

In this study, aluminum nitride (AlN) was grown by molecular layer deposition on HfO₂ that had been deposited on 200 mm Si (100) substrates. The AlN was grown on HfO₂ using sequential exposures of trimethyl-aluminum and ammonia (NH₃) in a batch vertical furnace. Excellent thickness uniformity on test wafers from the top of the furnace to the bottom of the furnace (across the furnace load) was obtained. The equivalent oxide thickness was 16.5-18.8 Å for the AlN/HfO₂ stack on patterned device wafers with a molybdenum oxynitride metal gate with leakage current densities from low 10^− 5 to mid 10^− 6 A/cm² at threshold voltage minus one volt. There was no change in the work function with the AlN cap on HfO₂ with the MoN metal gate, even with a 1000 °C anneal.     

Epitaxy of gallium nitride in semi-polar direction on Si(210) substrate

The idea of a new method for growing gallium nitride (GaN) epilayers in semi-polar direction by hydride-chloride vapor-phase epitaxy (HVPE) is disclosed. We propose to use Si(210) substrates with the first buffer layer of silicon carbide (3C-SiC) and the second buffer layer of aluminum nitride (AlN). It is experimentally demonstrated for the first time that, under conditions of anisotropic deformation in the GaN/AlN/3C-SiC/Si(210) structure, a GaN epilayer exhibits growth in semi-polar directions.     

Characterization of an AlN buffer layer and a thick-GaN layer grown on sapphire substrate by MOCVD

An AlN buffer layer and a thick-GaN layer for high-electron-mobility transistors (HEMTs) were grown on sapphire substrate by metal–organic chemical vapor deposition (MOCVD). The structural and morphological properties of the layers were investigated by high resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM) techniques. The optical quality of the thick-GaN layer was also evaluated in detail by a photoluminescence (PL) measurement. It was found that the AlN buffer layer possesses high crystal quality and an atomically flat surface with a root-mean-square (rms) roughness of 0.16 nm. The screw- and edge-type dislocation densities of the thick-GaN layer were determined as 5.4 × 10⁷ and 5.0 × 10⁹ cm⁻² by means of the mosaic crystal model, respectively. It was observed that the GaN layer has a smooth surface with an rms of 0.84 nm. Furthermore, the dark spot density of the GaN surface was estimated as 6.5 × 10⁸ cm⁻² over a scan area of 4 μm².     

Determination of two-dimensional electron and hole gas carriers in AlGaN/GaN/AlN heterostructures grown by Metal Organic Chemical Vapor Deposition

Resistivity and Hall effect measurements on nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrates prepared by metal organic chemical vapor deposition have been carried out as a function of temperature (20-300 K) and magnetic field (0-1.4 T). Variable magnetic field Hall data have been analyzed using the improved quantitative mobility spectrum analysis technique. The mobility and density of the two-dimensional electron gas at the AlGaN/GaN interface and the two-dimensional hole gas at the GaN/AlN interface are separated by quantitative mobility spectrum analysis. The analysis shows that two-channel conduction is present in nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrate.     

CrN/AlN superlattice coatings synthesized by pulsed closed field unbalanced magnetron sputtering with different CrN layer thicknesses

CrN/AlN superlattice coatings with different CrN layer thicknesses were prepared using a pulsed closed field unbalanced magnetron sputtering system. A decrease in the bilayer period from 12.4 to 3.0 nm and simultaneously an increase in the Al/(Cr + Al) ratio from 19.1 to 68.7 at.% were obtained in the CrN/AlN coatings when the Cr target power was decreased from 1200 to 200 W. The bilayer period and the structure of the coatings were characterized by means of low angle and high angle X-ray diffraction and transmission electron microscopy. The mechanical and tribological properties of the coatings were studied using the nanoindentation and ball-on-disc wear tests. It was found that CrN/AlN superlattice coatings synthesized in the current study exhibited a single phase face-centered cubic structure with well defined interfaces between CrN and AlN nanolayers. Decreases in the residual stress and the lattice parameter were identified with a decrease in the CrN layer thickness. The hardness of the coatings increased with a decrease in the bilayer period and the CrN layer thickness, and reached the highest value of 42 GPa at a bilayer period of 4.1 nm (CrN layer thickness of 1.5 nm, AlN layer thickness of 2.5 nm) and an Al/(Cr + Al) ratio of 59.3 at.% in the coatings. A low coefficient of friction of 0.35 and correspondingly low wear rate of 7 × 10^− 7 mm³N^− 1m^− 1 were also identified in this optimized CrN/AlN coating when sliding against a WC-6%Co ball.     

金属有机化学气相沉积法生长AlN/Si结构界面的研究

采用金属有机化学气相沉积法在Si(111)衬底上生长了AlN外延层.高分辨透射电子显微镜显示在AlN/Si界面处存在非晶层,俄歇电子能谱测试表明Si有很强的扩散,拉曼光谱测试表明存在Si-N键,另外光电子能谱分析表明非晶层中存在Si3N4.研究认为MOCVD高温生长造成Si的大量扩散是非晶层存在的主要原因,同时非晶Si3N4层也将促使AlN层呈岛状生长.     

Fabrication and frequency response of solidly mounted resonators with 1/4λ mode configuration

A solidly mounted resonator (SMR) consists of a multilayered structure and requires material interfaces that confine waves to resonate as standing waves in order to avoid wave energy loss. The selection of high or low acoustic impedance for the first layer beneath piezoelectric layer results in 1/4λ mode and 1/2λ mode resonance configurations.In this study, Mo/SiO₂ is chosen to construct the Bragg reflector as the high/low acoustic impedance materials, respectively, and aluminum nitride (AlN) is used as the piezoelectric layer. For application at frequency of 2.5 GHz, the specific thicknesses of Mo, SiO₂, and AlN are considered individually in the deposition processes. AlN of 1/4λ thickness is deposited on a seven-layer Bragg reflector. The 1/4λ mode SMR shows the distinct resonant characteristics at 1.3 GHz (shear mode) and 2.4 GHz (longitudinal mode). The coupling coefficient K_eff² of 6.9% is in agreement with the theoretical analysis.     

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.     

Growth of GaN on SiC/Si substrates using AlN buffer layer by hot-mesh CVD

GaN films were grown on SiC/Si (111) substrates by hot-mesh chemical vapor deposition (CVD) using ammonia (NH₃) and trimetylgallium (TMG) under low V/III source gas ratio (NH₃/TMG = 80). The SiC layer was grown by a carbonization process on the Si substrates using propane (C₃H₈). The AlN layer was deposited as a buffer layer using NH₃ and trimetylaluminum (TMA). GaN films were formed and grown by the reaction between NH_x radicals, generated on a tungsten hot mesh, and the TMG molecules. The GaN films with the AlN buffer layer showed better crystallinity and stronger near-band-edge emission compared to those without the AlN layer.     

Optimization of ALD-(Zn,Mg)O buffer layers and (Zn,Mg)O/Cu(In,Ga)Se2 interfaces for thin film solar cells

(Zn,Mg)O films, fabricated by atomic layer deposition, ALD, are investigated as buffer layers in Cu(In,Ga)Se₂-based thin film solar cells. Optimization of the buffer layer is performed in terms of thickness, deposition temperature and composition. High efficiency devices are obtained for deposition at 105-135 °C, whereas losses in open circuit voltage are observed at higher deposition temperatures. The optimal compositional region for (Zn,Mg)O buffer layers in this study is for Mg/(Zn + Mg) contents of about 0.1-0.2, giving band gap values of 3.5-3.7 eV. These devices appear insensitive to thickness variations between 80 and 600 nm. Efficiencies of up to 16.2% are obtained for completely Cd- and S-free devices with (Zn,Mg)O buffer layers deposited with 1000 cycles at 120 °C and having a band gap of 3.6 eV.     

AlN钝化层对AlGaN/GaN异质结及其高温特性的影响

主要研究了A1N钝化介质层对AlGaN/GaN异质结势垒层应力的修改以及应力的变化对二维电子气高温输运性质的影响.研究结果表明:AlN介质层会对AlGaN势垒层产生附加的平面压应变;AlN和传统的si3N4钝化介质都能减轻AlGaN势垒层在高温下的应变弛豫,但AlN介质层效果更明显.和传统的Si,N4钝化介质相比较,AlN钝化层不仅会显著增加AlGaN/GaN异质结二维电子气密度度,还会明显提高二维电子气迁移率,同时,AlN钝化后二维电子气密度的温度稳定性也更好.因此,对AlGaN/GaN异质结器件来说,AIN是一种有潜力的钝化介质.