InP基及含磷化合物HBT材料的GSMBE生长与特性

通过对外延材料结构设计和GSMBE生长工艺的深入研究,解决了生长InP基及含磷化合物HBT外延材料的关键问题,建立了稳定优化的GSMBE生长工艺,研制出性能优良的φ50mm InP基HBT和φ100mm InGaP/GaAs HBT外延材料.所发展的GSMBE外延技术,在As/P气氛切换、基区p型重掺杂扩散抑制、双异质结HBT结构设计等方面具有自己的特色.器件单位采用所提供的外延材料研制出的InP基HBT和InGaP/GaAs HBT器件与电路,达到了目前采用国产HBT外延材料研制的最好水平.     

InP基及含磷化合物HBT材料的GSMBE生长与特性

通过对外延材料结构设计和GSMBE生长工艺的深入研究,解决了生长InP基及含磷化合物HBT外延材料的关键问题,建立了稳定优化的GSMBE生长工艺,研制出性能优良的φ50mm InP基HBT和φ100mm InGaP/GaAs HBT外延材料.所发展的GSMBE外延技术,在As/P气氛切换、基区p型重掺杂扩散抑制、双异质结HBT结构设计等方面具有自己的特色.器件单位采用所提供的外延材料研制出的InP基HBT和InGaP/GaAs HBT器件与电路,达到了目前采用国产HBT外延材料研制的最好水平.     

新型恒压控制型负阻HBT的研制进展

研究了HBT产生负阻的可能机制,通过对材料结构和器件结构的特殊设计,采用常规台面HBT工艺,先后研制出3类高电流峰谷比的恒压控制型负阻HBT.超薄基区HBT的负阻特性是由超薄基区串联电阻压降调制效应造成的,在GaAs基InGaP/GaAs和AlGaAs/GaAs体系DHBT中均得到了验证.双基区和电阻栅型负阻HBT均为复合型负阻器件.双基区负阻HBT通过刻断基区,电阻栅负阻HBT通过在集电区制作基极金属形成集电区反型层,构成纵向npn与横向pnp的复合结构,由反馈结构(pnp)的集电极电流来控制主结构(npn)的基极电流从而产生负阻特性.3类负阻HBT与常规HBT在结构和工艺上兼容,兼具HBT的高速高频特性和负阻器件的双稳、自锁、节省器件的优点.     

化合物半导体器件与电路的研究进展

介绍了GaAs,InP和GaN等几种重要化合物半导体电子器件的特点、应用和发展前景。回顾了GaAs,InP和GaN材料的材料特性及其器件发展历程与现状。分别讨论了GaAs基HEMT由PHEMT渐变为MHEMT结构和性能的变化,GaAs基HBT在不同电路应用中器件的特性,InP基HEMT与HBT的器件结构及工作特性,GaN基HEMT与HBT的器件特性参数。总体而言,化合物半导体器件与电路在高功率和高频电子器件方面发展较快,GaAs,InP和GaN材料所制得的各种器件电路工作在不同的频率波段,其在相关领域发展潜力巨大。     

基区设计对InGaP/GaAs HBT热稳定性的影响

研究了不同基区设计对多发射极指结构功率InGaP/GaAs异质结双极型晶体管热稳定性的影响。以发生电流增益崩塌的临界功率密度为热稳定性判定标准,推导了热电反馈系数Φ、集电极电流理想因子η和热阻Rth与基区掺杂浓度NB、基区厚度dB的理论公式。基于TCAD虚拟实验,观测了不同基区掺杂浓度和不同基区厚度分别对InGaP/GaAs HBT热稳定性的影响。结合理论公式,对仿真实验曲线进行了分析。结果表明,基区设计参数对热稳定性有明显的影响,其影响规律不是单调变化的。通过基区外延层参数的优化设计,可以改进多指HBT器件的热稳定性,从而为多指InGaP/GaAs HBT热稳定性设计提供了一个新的途径。     

具有超高掺杂基区的GaAs赝HBT分析

超高掺杂GaAs具有明显的禁带变窄(BGN)效应,因此采用超高掺杂基区的GaAs同质晶体管也可获得HBT的效果.故称之为赝HBT(p—HBT)。本文根据实验结果讨论了超高掺杂情况下GaAs的BGN效应及其对有效本征载流子浓度的影响,并对np~+n型结构GaAs p—HBT的发射极注入效率和共发射极电流增益进行了理论分析。结果表明,当基区掺杂浓度高于1×10~(20)/cm~3时可以获得较好的器件特性。     

GaAs、InP集成电路技术的发展——1992年IEEE GaAs IC讨论会评述

本文介绍了1992年IEEE GaAs IC讨论会的概况,并依据这次国际会议所发表的论文,以GaAs、InP集成电路的技术路线为主线,介绍和评述了GaAs基PHEMT,HBT,MESFET以及InP基HEMT、HBT等集成电路的现状与发展。     

GaAs,InP集成电路技术的发展——1992年IEEE GaAs IC讨论会评述

本文介绍了1992年IEEE GaAs IC讨论会的概况，并依据这次国际会议所发表的论文，以GaAs,InP集成电路的技术路线为主线，介绍和评述了GaAs基PHEMT，HBT，MESFET以及InP基HEMT，HBT等集成电路的现状与发展。     

InP/GaAsSb/InP双异质结双极晶体管技术发展现状(Ⅱ)

5 制作工艺和优化 Ⅱ型InP DHBT的工艺流程与传统Ⅰ型InP HBT和DHBT工艺基本相同,一般沿用传统的三台面工艺,所不同之处主要是基区材料不同而导致湿法腐蚀和工艺细节变化,此外,由于Ⅱ型DHBT集电区全部采用InP材料,从而减小了由于四元缓变层带来的形成集电区台面时的工艺难度.     

InP基长波长光发射OEIC材料的MOCVD生长

为了生长制作器件所需的外延片,采用低压金属有机物化学气相沉积方法在半绝缘InP衬底上生长了InP/InGaAs异质结双极晶体管(HBT)结构、1.55μm多量子阱激光二极管以及两者集成的光发射光电集成电路材料结构.激光器结构的生长温度为655℃,有源区为5个周期的InGaAsP/ InGaAsP多量子阱(阱区λ＝1.6μm,垒区λ＝1.28μm);HBT结构则采用550℃低温生长,其中基区采用Zn掺杂,掺杂浓度约为2×1019cm-3.对生长的各种结构分别进行了X射线双晶衍射,光致发光谱和二次离子质谱仪的测试,结果表明所生长的材料结构已满足制作器件的要求.     

The state-of-the-art of GaAs and InP power devices and amplifiers

Significant investments and R&D efforts over the past two decades have established GaAs and InP electronic device technologies from substrate manufacturing to MMIC amplifier design and testing. Today, GaAs and InP HBTs and HFETs, as far as gain, efficiency, and power are concerned, dominate the whole spectrum from S- to W-band and beyond. In this paper we discuss recent advances in device technologies and survey the state of the art performance of GaAs and InP HFETs and HBTs     

异质结晶体管的设计与性能

本文较详细地讨论了异质结晶体管的设计原理、材料选用和结构设计。在能带设计方面对宽发射区、缓变基区和多种收集区分别进行了讨论,比较了不同能带结构的优缺点。文章以晶体管的特征频率f_T和最高振荡频率f_(max)为例分析和比较了Ge/GaAs,Si/α-Si,GaAs/GaAlAs,InGaAsP/InP四种异质结晶体管的频率特性潜力。文章最后对目前常用的台面结构、平面结构、倒置结构作了介绍,并分析了它们的优缺点,简介了异质结的发展现状和发展方向。     

High-performance InP/In0.53Ga0.47As/InPdouble HBTs on GaAs substrates

InP/In_0.53Ga_0.47As/InP double heterojunction bipolar transistors (HBTs) were grown on GaAs substrates. A 140 GHz power-gain cutoff frequency f_max and a 207 GHz current-gain cutoff frequency f_τ were obtained, presently the highest reported values for metamorphic HBTs. The breakdown voltage BV_CEO was 5.5 V, while the dc current gain β was 76. High-thermal-conductivity InP metamorphic buffer layers were employed in order to minimize the device-thermal resistance     

Thermal properties and thermal instabilities of InP-basedheterojunction bipolar transistors

We investigate the physical parameters which are critical to the understanding of the thermal phenomena in InP-based heterojunction bipolar transistors. These parameters include thermal resistance, thermal-electric feedback coefficient, current gain, and base-collector leakage current. We examine the thermal instability behavior in multi-finger HBTs, and observe for the first time the collapse of current gain in InP-based HBTs. Based on both measurement and modeling results, we establish the reasons why the collapse is rarely observed in InP HBT's, in a sharp contrast to AlGaAs/GaAs HBT's. We compare the similarities and differences on how InP-based HBT, GaAs-based HBT, and Si-based bipolar transistors react once the thermal instability condition is met. Finally, we describe the issues involved in the design of InP HBTs     

Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP

This paper presents a comprehensive comparison of three state-of-the-art heterojunction bipolar transistors (HBTs); the AlGaAs/GaAs HBT, the Si/SiGe HBT and the InGaAs/InP HBT. Our aim in this paper is to find the potentials and limitations of these devices and analyze them under common Figure of Merit (FOM) definitions as well as to make a meaningful comparison which is necessary for a technology choice especially in RF-circuit and system level applications such as power amplifier, low noise amplifier circuits and transceiver/receiver systems. Simulation of an HBT device with an HBT model instead of traditional BJT models is also presented for the AlGaAs/GaAs HBT. To the best of our knowledge, this work covers the most extensive FOM analysis for these devices such as I-V behavior, stability, power gain analysis, characteristic frequencies and minimum noise figure. DC and bias point simulations of the devices are performed using Agilent's ADS design tool and a comparison is given for a wide range of FOM specifications. Based on our literature survey and simulation results, we have concluded that GaAs based HBTs are suitable for high-power applications due to their high-breakdown voltages, SiGe based HBTs are promising for low noise applications due to their low noise figures and InP will be the choice if very high-data rates is of primary importance since InP based HBT transistors have superior material properties leading to Terahertz frequency operation.     

Thermal design studies of high-power heterojunction bipolartransistors

A theoretical thermoelectro-feedback model has been developed for the thermal design of high-power GaAlAs/GaAs heterojunction bipolar transistors (HBTs). The power-handling capability, thermal instability, junction temperature, and current distributions of HBTs with multiple emitter fingers have been numerically studied. The calculated results indicate that power HBTs on Si substrates (or with Si as the collector) have excellent potential power performance and reliability. The power-handling capability on Si is 3.5 and 2.7 times as large as that on GaAs and InP substrates, respectively. The peak junction temperature and temperature difference on the chip decrease in comparison to the commonly used Si homostructure power transistor with the same geometry and power dissipation. Thereby HBTs are promising for high-speed microwave and millimeter-wave applications. It has been also found that the nonuniform distribution of junction temperature and current can be greatly improved by a ballasting technique that uses unequal-valued emitter resistors     

移动通信中的射频集成电路

介绍分析了在蜂窝和个人通信业务 (PCS)市场中适用于 RFIC的多种射频晶体管技术。Ga As HBT技术被作为介绍的基线 ,并且与目前已有的技术进行比较 ,得出对于射频应用 ,Ga AsHBT综合了 Si BJT和 Ga As FET两者优点的结论。文中还介绍了近年来国外 Ga As HBT MMIC,PHEMT MMIC和 In P HBT MMIC的研究进展情况。     

MBE-grown AlGaAs/GaAs HBTs on InP substrate

AlGaAs/GaAs HBTs are fabricated on InP substrates for the first time. Preliminary results show a current gain of 5 at a collector current density of 2 × 104A/cm2 in spite of a dislocation density higher than 109/cm2.     

Reliability characteristics of GaAs and InP-based heterojunction bipolar transistors

The reliability characteristics of Heterojunction Bipolar Transistor made on GaAs and InP substrates are reviewed and ways of improving them by design, growth and processing are described. Materials for HBTs are grown by a variety of techniques (MBE, MOCVD, CBE). Their choice is made based on considerations such as satisfaction of design requirements and manufacturing but also dopant incorporation without risk of diffusion, as well as, minimization of hydrogen incorporation which may result in device degradation. The minority carrier lifetime in the base is influenced by hydrogen incorporation in C-InGaAs. Conventional alloyed and non-alloyed, as well as, refractory metallization schemes are considered for best reliability performance. The dielectric deposition scheme used for passivation plays a major role on device reliability. Good reliability performance is reported for GaAs but also for InP-based HBTs. A correlation is finally reported to exist between the low-frequency noise properties of HBTs and their reliability characteristics.     

Thermal characteristics of InP, InAlAs, and AlGaAsSb metamorphic buffer layers used in In0.52Al0.48As/In0.53Ga0.47As heterojunction bipolar transistors grown on GaAs substrates

In_0.52Al_0.48As/In_0.53Ga_0.47As heterojunction bipolar transistors (HBTs) were grown metamorphically on GaAs substrates by molecular beam epitaxy. In these growths, InAlAs, AlGaAsSb, and InP metamorphic buffer layers were investigated. The InAlAs and AlGaAsSb buffer layers had linear compositional grading while the InP buffer layer used direct binary deposition. The transistors grown on these three layers showed similar characteristics. Bulk thermal conductivities of 10.5, 8.4, and 16.1 W/m K were measured for the InAlAs, AlGaAsSb, and InP buffer layers, as compared to the 69 W/m K bulk thermal conductivity of bulk InP. Calculations of the resulting HBT junction temperature strongly suggest that InP metamorphic buffer layers should be employed for metamorphic HBTs operating at high power densities.