Fabrication of Strain-Relaxed Si<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript>x</Subscript>/Si(001) Buffer Layers of Low Surface Roughness

The results are presented of the fabrication of strain-relaxed graded Si_{1 − x} Ge_x/Si(001) buffer layers with a maximum Ge fraction of about 0.25 that have a low density of threading dislocations (<10⁶ cm⁻²) and low surface roughness. The buffer layers are grown by atmospheric-pressure hydride CVD. It is found that chemical mechanical polishing can reduce their surface roughness to a level comparable with that of the original Si(001) substrates. It is shown that the polished buffer layers can serve as substrates for MBE-grown SiGe/Si heterostructures.__________Translated from Mikroelektronika, Vol. 34, No. 4, 2005, pp. 243–250.Original Russian Text Copyright © 2005 by Vostokov, Drozdov, Krasil’nik, Kuznetsov, Novikov, Perevoshchikov, Shaleev.     

Phase separation in Ga-doped MgZnO layers grown by plasma-assisted molecular-beam epitaxy

We report on the phase separation of Ga-doped MgZnO layers grown by plasma-assisted molecular-beam epitaxy. Based on X-ray diffraction, low-temperature (10 K) photoluminescence, and reflection high-energy electron diffraction observations, it is possible to classify the phase of Ga-doped MgZnO layers into three regions depending on the incorporated Ga concentration ([Ga]). Single-phase Mg_0.1Zn_0.9O layers are grown when [Ga] is less than 1×10¹⁸ cm⁻³. For [Ga] between 1×10¹⁸ cm⁻³ and 1×10²⁰ cm⁻³, ZnO and Mg_0.2Zn_0.8O coexist, where electron transport is considered to be via two-channel conduction. When [Ga] exceeds 1×10²⁰ cm⁻³, the Ga-doped MgZnO layers become polycrystalline, where carrier compensation takes place presumably due to grain boundaries.     

Examination and evaluation of La2O3 as gate dielectric for sub-100 nm CMOS and DRAM technology

High-k gate dielectric La₂O₃ thin films have been deposited on Si(1 0 0) substrates by molecular beam epitaxy (MBE). Al/La₂O₃/Si metal-oxide–semiconductor capacitor structures were fabricated and measured. A leakage current of 3 × 10⁻⁹ A/cm² and dielectric constant between 20 and 25 has been measured for samples having an equivalent oxide thickness (EOT) 2.2 nm. The estimated interface state density D_it is around 1 × 10¹¹ eV⁻¹ cm⁻². EOT and flat-band voltage were calculated using the NCSU CVC program. The chemical composition of the La₂O₃ films was measured using X-ray photoelectron spectrometry and Rutherford backscattering. Current density vs. voltage curves show that the La₂O₃ films have a leakage current several orders of magnitude lower than SiO₂ at the same EOT. Thin La₂O₃ layers survive anneals of up to 900 °C for 30 s with no degradation in electrical properties.     

Low-temperature conductance measurements of surface states in HfO2–Si structures with different gate materials

Metal-oxide-semiconductor capacitors based on HfO₂ gate stack with different metal and metal compound gates (Al, TiN, NiSi and NiAlN) are compared to study the effect of the gate electrode material on the trap density at the insulator–semiconductor interface.C–V and G–ω measurements were made in the frequency range from 1 kHz to 1 MHz in the temperature range 180–300 K. From the maximum of the plot G/ω vs. ln(ω) the density of interface states was calculated, and from its position on the frequency axis the trap cross-section was found. Reducing temperature makes it possible to decrease leakage current through the dielectric and to investigate the states located closer to the band edge.The structures under study were shown to contain significant interface trap densities located near the valence band edge (around 2×10¹¹ cm⁻²eV⁻¹ for Al and up to (3.5–5.5)×10¹² cm⁻² eV⁻¹ for other gate materials). The peak in the surface state distribution is situated at 0.18 eV above the valence band edge for Al electrode. The capture cross-section is 5.8×10⁻¹⁷ cm² at 200 K for Al–HfO₂–Si structure.     

The separation of generation lifetimes of Si and SiGe using capacitance-transient measurements on MOS capacitors formed by plasma anodisation of Si:Si0.9Ge0.1:Si substrates

A simple technique leading to the measurement of minority carrier lifetimes of UHV compatible LPCVD Si and SiGe by C–t depth profiling of Metal:Oxide:Si:SiGe:Si structures is reported. A high quality gate oxide is realised by low temperature (<100°C) plasma anodisation thereby reducing any oxidation effects on the underlying epitaxial layer quality. Capacitance response times were observed for an impurity concentration of 2.5×10¹⁷ cm⁻³, giving rise to generation lifetimes of the Si and Si_0.9Ge_0.1 of >0.55 and 2.6 μs respectively, reflective of very high quality epitaxial semiconductor material.     

Dislocation–impurity interaction in Si

The dynamic interaction between dislocations and impurities B, P and Ge in Si with concentrations up to 2.5×10²⁰ cm⁻³ is investigated by the etch-pit technique, in comparison with that of O impurity in Si. Dislocation generation from a surface scratch is strongly suppressed when the concentration of B and P impurities exceeds 1×10¹⁹ cm⁻³, originating from the immobilization by preferential impurity segregation. Dislocation velocity in motion enhances on increasing the concentration in B and P impurities. Neutral impurity Ge has weak effect on dislocation generation and velocity enhancement.     

Properties of Bi-doped PbTe epitaxial layers and pn junction diodes grown by TDM-CVP

Effects of Bi-doping in PbTe liquid-phase epitaxial layers grown by the TDM-CVP have been investigated. For Bi concentration in the solution, x_Bi, lower than 0.2 at.%, Hall mobility is low. In contrast, for x_Bi>0.2 at.%, Hall mobility is high, while carrier concentration is in the range 10¹⁷ cm⁻³. However, ICP emission analysis shows that, for x_Bi=1.0 at.%, Bi concentration in epitaxial layer is N_Bi=2.3–2.7×10¹⁹ cm⁻³.These results indicate that Bi behaves not only as a donor but also as an acceptor; the nearest neighbor or very near DA pairs are formed. Carrier concentration for Bi-doped layers takes a minimum value at a Te vapor pressure of 2.2×10⁻⁵ Torr for growth temperature 470°C, which is coincident with that of the undoped PbTe. And broad contact pn junctions with highly Bi-doped layers easily cause laser emission compared to undoped junctions. The result suggests that the nearest lattice site Bi–Bi DA pairs behave as strong radiative centers in PbTe.     

Effects of oxygen partial pressure on structural and electrical characteristics of HfAlO high-k gate dielectric grown on strained SiGe by pulsed-laser deposition

Dependence of oxygen partial pressures on structural and electrical characteristics of HfAlO (Hf:Al=1:1) high-k gate dielectric ultra-thin films grown on the compressively strained Si₈₃Ge₁₇ by pulsed-laser deposition were investigated. The microstructure and the interfacial structure of the HfAlO thin films grown under different oxygen partial pressures were studied by transmission electron microscopy, and the their electrical properties were characterized by capacitance–voltage (C−V) and conductance–voltage measurements. Dependence of interfacial layer thickness and C–V characteristics of the HfAlO films on the growth of oxygen pressure was revealed. With an optimized oxygen partial pressure, an HfAlO film with an effective dielectric constant of 16 and a low interface state density of 2.1×10¹⁰ cm⁻² eV⁻¹ was obtained.     

Valence band structures and optical transitions of Ga1−xInxNyAs1−y/GaAs compressively strained quantum wells

The electronic structures of the Ga_1−xIn_xN_yAs_1−y/GaAs compressively strained quantum wells (QW) are investigated using 6×6 k·p Hamiltonian including the heavy hole, light hole and spin–orbit splitting band. The curves of dependence of transition energy on well width and N mole fraction are obtained. The valence subband energy dispersion curves, density of state and TE and TM squared optical transition matrix elements of three possible QW structures for emitting 1.3 μm wavelength are given.     

Hooge parameter of InGaAs bulk material and InGaAs 2DEG quantum well structures based on InP substrates

The 1/f noise of various InGaAs layers lattice matched to InP is investigated systematically at room temperature. To elucidate the origin of the 1/f noise in this type of III–V compound semiconductor, thick n-type doped InGaAs layers, typical InP based InAlAs/InGaAs or InP/InGaAs heterostrucuture field-effect transistor (HFET) structures, respectively, as well as InP based InAlAs/InGaAs quantum well structures with doped InGaAs two-dimensional electron gas (2DEG) channel are analysed. From the experiments it is found that mobility fluctuation is the only origin for the 1/f noise observed both in InGaAs bulk material and in 2DEG heterostructures of high quality. A Hooge parameter attributed to phonon scattering α_Hphon in the bulk material is found to be about 7×10⁻⁶ and agrees with those obtained from HFET structures with the highest mobilities (α_H≈1.5×10⁻⁵). Furthermore, the Hooge parameter of 2DEG structures strongly depends on the channel design and on the doping concentration in the n-type doped 2DEG channels.     

Correlation between infrared transmission spectra and the interface trap density of SiO2 films

This work is an attempt to estimate the electrical properties of SiO₂ thin films by recording and analyzing their infrared transmission spectra. In order to study a big variety of films having different infrared and electrical properties, we studied SiO₂ films prepared by low pressure chemical vapor deposition (LPCVD) from SiH₄ + O₂ mixtures at 425 °C and annealed at 750 °C and 950 °C for 30 min. In addition thermally grown gate quality SiO₂ films of similar thickness were studied in order to compare their infrared and electrical properties with the LPCVD oxides. It was found that all studied SiO₂ films have two groups of Si–O–Si bridges. The first group corresponds to bridges located in the bulk of the film and far away from the interfaces, the grain boundaries and defects and the second group corresponds to all other bridges located near the interfaces, the grain boundaries and defects. The relative population of the bulk over the boundary bridges was found equal to 0.60 for the LPCVD film after deposition and increased to 4.0 for the LPCVD films after annealing at 950 °C. Thermally grown SiO₂ films at 950 °C were found to have a relative population of Si–O–Si bridges equal to 3.9. The interface trap density of the LPCVD film after deposition was found equal to 5.47 × 10¹² eV⁻¹ cm⁻² and decreases to 6.50 × 10¹⁰ eV⁻¹ cm⁻² after annealing at 950 °C for 30 min. The interface trap density of the thermally grown film was found equal to 1.27 × 10¹¹ eV⁻¹ cm⁻² showing that films with similar Si–O–Si bridge populations calculated from the FTIR analysis have similar interface trap densities.     

Influence of erbium ion implantation dose on characteristics of (111) Si:(Er, O) light-emitting diodes operating in p-n-junction breakdown mode

Characteristics of Si:(Er, O) light-emitting diodes (LEDs) fabricated by ion implantation on single-crystal (111) Si substrates and operating under the conditions of avalanche or tunneling breakdown of the p-n junction were studied. The Er³⁺ electroluminescence (EL) intensity depends nonmonotonically on the concentration of implanted rare-earth ions. An increase in the Er³⁺ ion EL intensity with temperature is observed in some tunneling diodes.     

SiO_2:Er和Si_xO_2:Er薄膜室温Er~(3+)1.54μm波长的电致发光

在 n+ -Si衬底上用磁控溅射淀积掺 Er氧化硅 (Si O2 :Er)薄膜和掺 Er富硅氧化硅 (Six O2 :Er,x>1 )薄膜 ,薄膜经适当温度退火后 ,蒸上电极 ,形成发光二极管 (LED)。室温下在大于 4V反偏电压下发射了来自 Er3+的 1 .5 4μm波长的红外光。测量了由 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品分别制成的两种 LED,其 Er3+1 .5 4μm波长的电致发光峰强度 ,后者明显比前者强。还发现电致发光强度与 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品的退火温度有一定依赖关系     

Influence of fluorine contamination on reliability of thin gate oxides

We analyze diffusion and segregation kinetics of fluorine atoms in poly-Si / SiO₂ / Si structures with gate oxides of 5 nm by means of secondary ion mass spectroscopy. Well defined doses of fluorine were introduced by ion implantation. Our results indicate fluorine segregation at interfaces to the gate oxide. This segregation is diffusion limited with an effective activation energy of 1.4 eV. The accumulation of fluorine influences the intrinsic reliability of thin oxides. The breakdown behavior was studied using constant voltage, constant current, and stepwise increasing constant current stress, respectively. Weibull plots before and after the heat treatments were analyzed. At low fluorine concentrations up to doses of 5 × 10¹⁵ cm⁻² fluorine segregation is beneficial, improving, for example the tails of the Weibull plots and slightly increasing the breakdown voltage. For fluorine doses higher than 1 × 10¹⁶ cm⁻², detrimental consequences were found, degrading the charge to breakdown values by about a factor of 5 after long - term thermal treatments.     

Si/Si<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript>x</Subscript> Superlattice Structure from X-ray-Scattering Data

An x-ray structural characterization is carried out for MBE-grown Si/Si_xGe_{1 − x} superlattices with nanometer layer thicknesses on Si(100) substrates. The characterization technique is a combination of x-ray reflectivity and x-ray diffraction in coplanar and noncoplanar arrangements. Detailed knowledge is gained of the superlattice structure, the crystalline quality of the layers, and the heterointerface morphology.__________Translated from Mikroelektronika, Vol. 34, No. 4, 2005, pp. 291–301.Original Russian Text Copyright © 2005 by Yakunin, Pashaev, Zaitsev, Subbotin, Rzaev, Imamov.     

An investigation of surface state capture cross-sections for metal–oxide–semiconductor field-effect transistors using HfO2 gate dielectrics

MOSFETs and MOSCs incorporating HfO₂ gate dielectrics were fabricated. The I_DS–V_DS, I_DS–V_GS, gated-diode and C–V characteristics were investigated. The subthreshold swing and the interface trap density were obtained. The surface recombination velocity and the minority carrier lifetime in the field-induced depletion region measured from the gated diodes were about 2.73 × 10³ cm/s and 1.63 × 10⁻⁶ s, respectively. The effective capture cross section of surface state was determined to be 1.6 × 10⁻¹⁵ cm² using the gated-diode technique in comparison with the subthreshold swing measurement. A comparison with conventional MOSFETs using SiO₂ gate oxide was also made.     

Electrically active defects induced by hydrogen and helium implantations in Ge

Results of a study of electrically active defects induced in Sb-doped Ge crystals by implantations of hydrogen and helium ions (protons and alpha particles) with energies in the range from 500 keV to 1 MeV and doses in the range 1×10¹⁰–1×10¹⁴ cm⁻² are presented in this work. Transformations of the defects upon post-implantation isochronal anneals in the temperature range 50–350 °C have also been studied. The results have been obtained by means of capacitance–voltage (C–V) measurements and deep-level transient spectroscopy (DLTS).It was found from an analysis of DLTS spectra that low doses (<5×10¹⁰ cm⁻²) of H and He ion implantations resulted in the introduction of damage similar to that observed after MeV electron irradiation. The Sb–vacancy complex was the dominant deep-level defect in the lightly implanted samples. After implantations with doses higher than 5×10¹⁰ cm⁻² peaks due to more complex defects were observed in the DLTS spectra. Implantations with heavy (5×10¹³ cm⁻²) doses of both H and He ions caused the formation of a sub-surface layer with a high (up to 1×10¹⁷ cm⁻³) concentration of donors. These donors were eliminated by anneals at temperatures in the range 100–200 °C. Heat treatments of the heavy proton-implanted Ge samples in the temperature range 250–300 °C resulted in the formation of shallow hydrogen-related donors, the concentration of which was the highest in a region close to the projected depth of implanted protons. The maximum peak concentration of the H-related donors was higher than 1×10¹⁵ cm⁻³ for a proton implantation dose of 1×10¹⁴ cm⁻².     

Charge trapping and interface states in hydrogen annealed HfO2–Si structures

Metal–oxide–semiconductor (MOS) capacitors based on HfO₂ gate stacks with Al and TiN gates are compared to study the effect of the gate electrode material to the properties of insulator–semiconductor interface. The structures under study were shown to contain interface trap densities of around 2 × 10¹¹ cm⁻² eV⁻¹ for Al gate and up to 5.5 × 10¹² cm⁻² eV⁻¹ for TiN gate. The peak in the surface state distribution was found at 0.19 eV above the valence band edge for Al electrode. The respective capture cross-section is 6 × 10⁻¹⁷ cm² at 200 K.The charge injection experiments have revealed the presence of hole traps inside the dielectric layer. The Al-gate structure contains traps with effective capture cross-section of 1 × 10⁻²⁰ cm², and there are two types of traps in the TiN-gate structure with cross-sections of 3.5 × 10⁻¹⁹ and 1 × 10⁻²⁰ cm². Trap concentration in the structure with Al electrode was considerably lower than in the structure with TiN electrode.     

Strain relaxation and dopant distribution in the rapid thermal annealing of Co with Si/Si1−xGex/Si heterostructure

The reaction of cobalt with the Si-sacrificial cap in the strained Si/Si_1−xGe_x/Si MBE grown heterostructure was studied. The Si-cap is added to prevent the relaxation of the SiGe and to guarantee uniform and reliable silicidation reaction. The Si_1−xGe_x epilayer, with Ge content between 18 and 28 at%, was highly B doped, while the Si-cap was undoped or B doped either during growth or by ion implantation. Cobalt evaporation was followed by rapid thermal annealing at 450–700°C for 30 sec in N₂ or Ar+10%H₂. When the silicide penetrated the Si-cap/Si_1−xGe_x interface, noticeable out-diffusion of Ge and B to the surface was observed. In spite of the presence of the Si-cap significant strain relaxation was observed in three cases: (1) in the implanted samples, although the implantation was confined to the Si-cap, (2) when the Co layer was too thick, such that the silicide penetrated the SiGe layer and (3) when the Ge content in the SiGe layer was relatively high (27.5%).     

Special features of the excitation spectra and kinetics of photoluminescence of the Si<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>:Er/Si structures with relaxed heterolayers

Luminescent properties of heteroepitaxial Si_{1 − x} Ge _x :Er/Si structures with relaxed heterolayers are studied. The results of combined studies of the excitation spectra and kinetics of photoluminescence (PL) are used to single out the components providing the largest contribution to the PL signal of the Si_{1 − x} Ge _x :Er/Si structures in the wavelength region of 1.54 μm. It is shown that relaxation of elastic stresses in the Si_{1 − x} Ge _x :Er heterolayer affects only slightly the kinetic characteristics of erbium luminescence and manifests itself in insignificant contribution of the defects and defect-impurity complexes to the luminescent response of the Si_{1 − x} Ge _x :Er/Si structures. In the excitation spectra of the erbium PL, special features related to the possibility of the rare-earth impurity excitation at energies lower than the band gap of the Si_{1 − x} Ge _x solid solution are revealed. It is shown that a peak the width of which depends on the band gap of the solid solution and the extent of its relaxation is observed in the excitation spectra of the erbium-related PL in the Si_{1 − x} Ge _x :Er/Si structures in the wavelength region of 1040–1050 nm. The observed specific features are accounted for by involvement of intermediate levels in the band gap of the Si_{1 − x} Ge _x :Er solid solution in the process of excitation of an Er³⁺ ion.