氮对重掺锑直拉硅中氧沉淀的影响

通过在不同条件下退火,研究氮杂质对重掺锑硅(HSb- Si)中氧沉淀的影响.实验结果表明,在高温单步退火(10 0 0～115 0℃)和低高两步退火(6 5 0℃+10 5 0℃)后,掺氮HSb- Si中与氧沉淀相关的体微缺陷的密度都要远远高于一般的HSb- Si.这说明在HSb- Si中,氮能分别在高温和低温下促进氧沉淀的生成.因此,可以认为与轻掺直拉硅一样,在HSb- Si中,氮氧复合体同样能够生成,因而促进了氧沉淀的形核.实验结果还表明氮的掺入不影响HSb硅中氧沉淀的延迟行为.     

重掺杂直拉硅单晶氧沉淀及其诱生二次缺陷

研究了重掺杂直拉硅单晶中掺杂元素硼、磷、砷、锑对氧沉淀及其诱生二次缺陷行为的影响 .实验结果表明 :重掺p型 (硼 )硅片氧沉淀被促进 ,氧沉淀密度高但无诱生二次缺陷 ;重掺n型 (磷、砷、锑 )硅片氧沉淀受抑制 ,氧沉淀密度低却诱生出层错 ;不同掺杂元素及浓度对重掺n型硅片氧沉淀抑制程度不同 ,并对氧沉淀诱生层错的形态产生影响 .讨论了重掺硅单晶中掺杂元素影响氧沉淀及其诱生二次缺陷的机理 ,并利用掺杂元素 本征点缺陷作用模型和原子半径效应模型对实验结果进行了解释 .     

Influence of surface texture on the defect‐induced breakdown behavior of multicrystalline silicon solar cells

The defect‐induced diode breakdown behavior in multicrystalline silicon solar cells, which is located at recombination active crystal defects, is influenced by the surface texturization because the wet chemical treatment selectively etches grain boundaries and dislocations, resulting in etch pits. On textured surfaces, the defect‐induced breakdown voltage is decreased, and the slope of the local reverse I–V characteristics in breakdown is steeper. We find that the local defect‐induced breakdown voltage correlates with the depth of the etch pits. It is suggested that the enhanced electric field in the space charge region at the tip could be superimposed by an electric field around metallic precipitates because of the internal Schottky contact formation with the surrounding silicon. The combined electric field could be responsible for the dependence of the defect‐induced breakdown behavior on the surface texture. Copyright © 2012 John Wiley & Sons, Ltd.     

Formation of thermal donors in SIMOX material

Thermal oxygen donor generation in SIMOX material formed in Czochralski (CZ) and oxygen free float zone (FZ) silicon was investigated by Hall and photoluminescence techniques. It was determined that residual interstitial oxygen was introduced to silicon by the SIMOX buried oxide formation process thus increasing the possibility of thermal donor creation. Significantly, thermal donor generation was identified and localized to the top silicon region in FZ material. The detected concentration of residual oxygen was on the order of 5 × 10¹³ cm^-3 and is negligible when compared to the intrinsic oxygen concentration of the starting CZ bulk material.     

大直径直拉硅中氮对原生氧沉淀的影响

研究了在大直径直拉硅单晶中掺氮 (N )对原生氧沉淀的影响 .通过高温一步退火 (10 5 0℃ )和低 -高温两步退火 (80 0℃ +10 5 0℃ )发现在掺 N直拉 (NCZ)硅中氧沉淀的行为与一般直拉 (CZ)硅是大不相同的 ,经过高温一步退火后 ,在氧化诱生层错环 (OSF- ring)区氧沉淀的量要小于空洞型缺陷 (voids)区 ,而经过低 -高温两步退火后 ,OSF-ring区的氧沉淀量要远远大于 voids区 .由此可得 ,在晶体生长过程中 ,N通过改变硅晶体中空位的浓度及其分布从而改变原生氧沉淀的尺寸和分布 .并在此基础上讨论了在大直径 NCZ硅中掺 N影响原生氧沉淀的机理 .     

Correlation between dark current RTS noise and defects for AlGaInP multiple-quantum-well laser diode

推导了AlGaInP多量子阱LD器件暗电流RTS 噪声与缺陷相关性模型,实验结果表明暗电流RTS 噪声由有源区异质结界面载流子数涨落引起。根据相关性模型,确定了缺陷类型,定量确定了缺陷能级。分析了暗电流RTS 噪声功率谱密度的转角频率。实验结果和理论预测一致。本文结论提供一种确定AlGaInP多量子阱LD器件有源区深能级的有效方法。     

氦诱生微孔对硅二极管漏电流特性的改善

高剂量的氦离子注入并热处理在硅中形成对金属具有高吸杂作用的微孔。以低金属杂质浓度的硅平面二极管的反向漏电流为指标，研究了吸除的热处理过程对微孔吸杂效果的影响。在适当的热处理温度和冷却条件下，观测到二极管反向漏电流的显著改善，部分样品漏电流可降低3个数量级。     

Changes in the state of phosphorus atoms in the silicon lattice as a result of interaction with radiation defects

Interaction of radiation defects with phosphorus atoms in silicon crystals subjected to electron irradiation and thermal treatments was studied under conditions of various degrees of supersaturation with respect to the equilibrium concentration of impurities and point defects. It is shown that, in the course of silicon irradiation, the electron-dose dependences of the phosphorus concentration at the lattice sites (P_s) level off (tend toward a constant value). This constant value is governed by the irradiation temperature. The stages of recovery of the concentration P_s as a result of heat treatments correlate with temperature intervals of dissociation of the vacancy complexes. The results indicate that there are two processes. One process involves the interaction of dopant atoms with silicon self-interstitials and the emergence of interstitial complexes; i.e., this process corresponds to the radiation-stimulated decomposition of a supersaturated solution of an impurity as a result of point-defect generation and ionization. The other process consists in the recombination of interstitial impurities with vacancies at sufficiently high temperatures or in the annihilation of vacancies released during heat treatments with interstitial atoms incorporated into composite defect complexes with the involvement of phosphorus atoms.     

大直径CZ硅单晶的控氧技术

描述了拉晶条件和磁拉法对大直径ＣＺ硅单晶中氧的控制作用，并讨论了近期发展的ＣＣＺ法和ＬＦＣＺ法中与控氧相关的问题。     

级联倍增InAlAs/InAlGaAs雪崩光电二极管暗电流成分分析

实验制备了级联倍增InAlAs/InAlGaAs雪崩光电二极管,对二极管暗电流随台面直径和温度的变化进行了研究分析。结合暗电流函数模型,利用Matlab软件对暗电流的各成分进行了数值计算,并仿真研究了芯片结构的缺陷浓度Nt和表面复合速率S对暗电流的影响。结果表明,二极管暗电流主要来自于体暗电流,而非表面漏电流。在工作点偏压90V处,受缺陷影响的缺陷辅助隧穿电流Itat在暗电流中占据了主导,并推算出了芯片结构的缺陷浓度Nt约为1019 m-3、吸收区中的缺陷浓度NInGaAs约为7×1015 m-3。由于芯片结构的缺陷主要来源于InAlAs/InAlGaAs倍增区和InGaAs吸收区,而吸收区缺陷占比很少,因此认为缺陷主要来自于异质结InAlAs/InAlGaAs倍增区。     

The manufacture and performance of diodes made in dielectricallyisolated silicon substrates containing buried metallic layers

Results are reported on the performance of diffused p⁺n diode structures manufactured on a novel silicon-on-metal-on-insulator (SMI) substrate. This substrate consists of a thin single crystal silicon layer on top of a tungsten disilicide covered oxidized silicon wafer. The diodes show excellent characteristics with an exponential current-voltage (I-V) relationship over nine orders of magnitude and an ideality factor of 1.005, under forward bias conditions. The reverse leakage current is low with a minority carrier lifetime of typically 500 μs. The diodes show no evidence of stress induced defects or degraded performance due to W migration during processing. The SMI substrate is therefore shown to be compatible with standard manufacturing processes     

Generation of powerful microwave voltage oscillations in a diffused silicon diode

The mechanism of the generation of powerful microwave voltage oscillations in a diffused silicon diode is studied. A reverse current 2 kA in amplitude is passed through a 0.5-cm² diode with a structure thickness of 320 μm, a p-n junction depth of 220 μm. At an average diode voltage of ～300 V and a microwave pulse duration of ～200 ns, the maximum voltage swing reaches 480 V. The oscillation frequency lies in the range 5 to 7 GHz; the power of the microwave pulse component is ～300 kW. A theoretical consideration shows that voltage oscillations are caused by periodically repeating processes of breakdown and structure filling with plasma followed by its removal by the reverse current. The frequency and voltage swing are controlled by the current density and dopant-concentration gradient in the vicinity of the p-n junction.     

硅单晶片中的氧及对后续缺陷的影响

通过测量硅晶棒不同部位的氧含量,分析了氧在硅晶棒中的分布规律。结合高温氧化后的缺陷观察结果,研究了氧含量及后续高温生产工艺对硅晶体中缺陷数量的影响。对不同氧含量的两种硅单晶片所生产的功率集成电路进行了失效分析。结果表明,硅单晶片中的氧含量对产品成品率具有重要影响。当氧含量在1.77×10¹⁸~1.87×10¹⁸atoms/cm³及以上时,硅单晶片边缘出现明显的位错排,断面存在大量层错和位错缺陷,部分缺陷进入外延层中的晶体管,造成该处晶体管结漏电。相反,当氧含量偏低时,硅单晶片内的缺陷较少且分布不均,使得硅单晶片受到金属污染时不能有效吸杂而产生失效。     

p型微氮直拉硅中氧施主的电学特性

研究了p型含氮以及不含氮直拉(CZ)硅中热施主(TD)以及氮氧(N-O)复合体的电学性质.硅片在350～850℃范围进行不同时间的退火后,利用四探针和通过室温傅里叶红外光谱(FTIR)分别测量其载流子浓度和间隙氧浓度的变化.实验结果表明:p型含氮直拉硅(NCZ)中热施主的电学特性基本与n型NCZ硅相同,但N-O复合体的消除温度明显低于n型NCZ硅,这是由于p型NCZ硅中硼促进了N-O复合体的消除.     

Carbon in silicon: Properties and impact on devices

The properties, origin and analysis of carbon in silicon and its influence on the electrical characteristics of devices are investigated and reviewed. The typical carbon concentrations in electronic-grade silicon are still some 10¹⁶ cm^?3. The small distribution coefficient (k₀ = 0.058) causes an inhomogeneous incorporation of carbon along the crystal axis and across the crystal diameter during crystal growth. Carbon concentrations exceeding about 5 × 10¹⁶ cm^?3 in float-zoned silicon can lead to the formation of process-induced defects in the fabrication of power rectifiers and thyristors. These defects which are frequently arranged in a swirl-like pattern strongly deteriorate the electrical characteristics of these devices. It is shown that carbon is involved primarily in the generation of the defect nuclei whereas the defects finally observed form via precipitation of oxygen and agglomeration of silicon interstitials. Reasons for the benign behavior of high carbon concentrations in the processing of integrated circuits are discussed. In powder device processing the formation of carbon-induced defects is safely avoided by application of silicon containing carbon less than 5 × 10¹⁶ cm^?3.     

Kinetics of light-induced degradation in compensated boron-doped silicon investigated using photoluminescence and numerical simulation

We use photoluminescence to observe light-induced degradation in silicon in real time. Numerical simulations are used to match our results and lifetime decay data from the literature with theoretical models for the generation of the light-induced boron–oxygen defects. It is found that the existing model of the slowly generated defect SRC, where its saturated concentration is a function of the majority carrier concentration, does not explain certain results in both p- and n-type samples. A new model is proposed in which the saturated SRC concentration is controlled by the total hole concentration under illumination.     

密闭式热场下<111>晶向Si单晶高晶转生长研究

在Kayex CG6000单晶炉上采用优化的350 mm密闭式热场,在23~25 r/min高晶转下用直拉法拉制出了Φ76.2~125 mm、n型高阻<111>晶向Si单晶,单晶的外形和径向电阻率均匀性良好。对<111>晶向Si单晶在高晶转下生长容易出现扭曲变形、棱面较宽现象的原因进行了分析。通过添加热屏,加强热场的保温和热屏的隔热作用,及缩小等径生长阶段熔Si液面与热屏间的距离,提高了晶体结晶前沿的温度梯度。从而避免了<111>晶向Si单晶的扭曲变形,减小了单晶棱面宽度,同时有利于消除晶体的漩涡缺陷。     

A study of grown-in impurities in silicon by deep-level transient spectroscopy

Deep levels due to various impurities incorporated into Czochralski silicon ingots during crystal growth have been delineated. The largest impurity-induced deep-level concentration, defined as the electrically active impurity concentration, is found to be a fraction of the metallurgical impurity content of the crystals. This fraction for a specific impurity depends on the thermal history of the sample and the ability of the impurity to diffuse. POCl₃ gettering of Ti and V produces a decreasing electrically active impurity concentration toward the surface of a silicon wafer, while there is no observable effect of this heat treatment on the Mo concentration. In the case of Cr, which diffuses much more rapidly than Mo, Ti, or V in silicon, a very significant reduction in the electrically active concentration is observed after heat treatment. Similarly, in metal-doped polysilicon wafers the electrically active Mo concentration appears unaffected by grain boundaries, but the electrically active Cr concentration at or near some grain boundaries is reduced by more than an order of magnitude compared to that at grain centers.     

Low threshold InGaAsP/InP buried crescent laser with double current confinement structure

An InGaAsP/InP laser diode emitting at 1.3 μm with a crescent shaped active region is described. The active region is completely embedded in InP by a two-step LPE technique, and a double current confinement scheme is incorporated with two reverse biased p-n junctions at both sides of the active layer. A threshold current as low as 20 mA has been achieved in CW operation at room temperature. Fundamental transverse mode operation with linear light output-current characteristics and single longitudinal mode oscillation have been obtained.     

Optical properties of silicon with a high content of boron

After exposure of silicon with a high content of boron and oxygen to light with the spectrum close to that of solar radiation and with the intensity 70–80 mW cm^?2, a new defect corresponding to the absorption band observed at liquid-helium temperature at the frequency 1026.7 cm^?1 is detected in the material. It is shown that the components of the defect are boron and oxygen atoms. The defect is formed at a considerable concentration of free charge carriers induced by exposure of the sample to light or by heat treatments at a low current flow through the sample. It is thought that the defect can be formed due to the direct interaction between the components as well as via the precursors of the stable form of the defect. It is shown that doping of silicon with germanium reduces the efficiency of the formation of the defect corresponding to the detected absorption band.