新书架

<正> 《PIC16F87X单片机实用软件与接口技术——汇编语言及其应用(含光盘)》刘和平等编著。2002年4月第1版,邮购价:45.00元。本书讨论了PIC16F87X系列单片机的汇编程序编程方法,书中介绍了大量的程序例程,涉及到PIC16F87X单片机的各个功能模块的编程应用,给出了应用实例的原理电路图和源程序清单,所有程序均在实验板上调试通过,且配有光盘。本书以重庆大学—美国微芯公司PIC单片机实验室开发的实验板样板为对象,以单片机的各种功能模块为线索,通过给出实验极的硬件连接方式和软件编程实例进行讲解,从简到繁,循序渐进,逐步深入。本书是单片机开发者和初学者的一本很好的参考书。也可作为大学本科学生单片机原理及应用课程的实验指导书。对单片机开发者来说也是一本很好的软件开发参考书。 《PIC16F87X单片机实用软件与接口技术——C语言及其应用(含光盘)》刘和平等编著。2002年4月第1版,邮购价:38.00元。本书讨论了PIC16F87X系列单片机的C语言程序编程方法。书中介绍了大量的 C语言程序例程,涉及到PIC16F87X单片机的     

新书架

<正> 《PIC系列单片机接口技术及应用系统设计》王有绪、许杰、李拉成编著。出版日期:2000年12月,书号:ISBN 7-81012—992—9/TP·406,定价:36.00元。本书共分六章,全面介绍了Microchip公司的PIC系列单片机的接口技术和应用实例。内容包括:PIC16C5X描述,PIC系列的各种单片机介绍。PIC与各种外部设备(各种串行E~2PROM、人机对话通道、A/D和D/A转换、串行异步通信、加密IC卡、串行实时时钟、固定宽度的脉冲信号检测等)的接口与编程,PIC单片机应用实例(包括PIC在PLD、低压低功耗实时时钟、串行鼠     

其他

微芯科技首推低价PICkit 1 闪存启动器工具包微芯科技(Microchip)首推的低成本、易用的编程、评估和开发工具包 —— PICkit 1闪存启动器工具包,适用于该公司8和14引脚的PIC12F629、PIC12F675、PIC16F630和 PIC16F676闪存系列单片机。该工具包包括可提供用户使用指南和软件代码范例的PICkit 1闪存启动器工具包光盘;具有HI-TECH PICC LiteC 编译器的MPLAB集成开发环境;用于8引脚单片机的微芯公司“软件及硬件使用技巧” 和USB 接口线缆。不仅为工程师和各教育院校的设计人员提供了8位闪存单片机设计的理想解决方案,同时,…     

PIC单片机应用技术

在1995年12期《实用电子文摘》的文章“PIC系统单片机编程器制作”一文中,简要介绍了PIC系列单片机的优点。今年将对PIC的实用技术作系统介绍,以促进其普及和应用。目前,在国内外均流行两种编程语言:一是PIC的汇编语言,精简指令集(RISC),只有30多条指令,二是PIC BASIC语言,即将BASIC语言注入PIC单片机,使编程更加容易。准备对这两方面都分别进行介绍,以适应不同的读者要求。     

PIC系列单片机及开发工具概述

一、引言 近年来在单片机世界中,美国Microchip公司推出的PIC系列大放异彩,成为主流产品,并受到国内用户的欢迎,被成功地应用到各种电子产品中。下面将PIC系列单片机的产品构成、各种规格型号、发展趋势以及开发工具等做一个归纳性的概述,以便读者在开发工作中参考。 二、PIC单片机的产品构成 Microchip公司把PIC系列单片机分成基本级、中级和高级三个层次来发展见表1。 PIC系列单片机的主要技术特点如下: 1.所有型号(除16C84是E~2PROM工艺外)都有低价位的一次性用户可编程型(OTP),非常适合产品开发和生产。     

PIC系列单片机编程器制作

近两年来,只要注意电子技术方面杂志的人,都会发现,在单片机世界出现了两样新东西,一是美国Microchip公司的PIC系列单片机,二是Philips公司的I~2C总线(串行总线)。这两种新东西都正在我国积极发展,迅速推广开来。之所以如此,是因为它们有独特的优点。下面介绍就是为配合PIC的普及和应用。关于I~2C总线单片机及其应用将另文介绍。     

PIC单片机的中断资源及应用

PIC系列单片机是美国Microdchip技术公司推出的8位入式控制器。它以其控制速度高、工作电压低、功耗小及性价比高等优点而备受青睐。本文以PIC16CXX系列单片机为例介绍了PIC单片机中断资源的特点、应用及应用中应注意的问题,并给出了具体的应用源程序。     

高速高性能单片机C8051F020及其在柜式电能表中的应用

C8051FXXX系列单片机是Cygnal公司最新推出的高速高性能单片机,与51系列单片机兼容.本文简单介绍了C8051F020的功能、特点,阐述了该芯片在电能表中的应用.     

高速高性能单片机C8051F020及其在柜式电能表中的应用

C8051Fxxx系列单片机是Cygnal公司最新推出的高速高性能单片机,与51系列单片机兼容.本文简单介绍了C8051F020的功能、特点,阐述了该芯片在电能表中的应用.     

单片机实现更简单的LCD设计

Microchip的LCD型PIC单片机系列最近新添了一款闪存单片机--PIC1 6F946.此款64脚PIC单片机集成了LCD表1:Microchip的LCD型PIC单片机系列具有丰富的特性驱动模块,同时具有PIC单片机常见的外设,如EEPROM、模数转换器及下文将讨论到的一些其它外设.集成LCD驱动模块同高度整合的外设这一组合,使得许多消费类应用的系统总成本得以降低且设计更加简化.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first