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《Advanced Packaging, IEEE Transactions on》2008,31(3):442-446
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A low-temperature bonding of vertical-cavity surface-emitting laser (VCSEL) chips on Si substrates was achieved by using plasma activation of Au films. After the surfaces of Au films were cleaned using an Ar radio frequency plasma, bonding was carried out by contact in ambient air with applied static pressure. The experimental results showed that surface morphological change (the reduction of asperity width) as well as removal of adsorbed organic contaminants by plasma treatment significantly improved the quality of joints. At a bonding temperature of 100degC, the die-shear strength exceeded the failure criteria of MIL-STD-883. 相似文献
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助焊剂涂敷是C4凸点焊料的倒装键合中的关键工艺步骤之一,涂敷均匀和稳定性决定了回流焊后整体成品的质量和可靠性,同时影响倒装键合设备的生产效率。在实际生产中,现有的助焊剂涂敷系统影响设备提升生产效率,并且暴露出生产过程中助焊剂泄漏量过大的问题。通过分析现有涂敷系统的问题和助焊剂泄漏的成因,优化设计了一种更高效的助焊剂涂敷系统,有效提升了设备生产率,使泄漏量对生产的影响降低到最小。 相似文献
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Yong Liu Irving S. Timwah Luk 《Electronics Packaging Manufacturing, IEEE Transactions on》2008,31(1):61-71
In this paper, a transient nonlinear dynamic finite element framework is developed, which integrates the wire bonding process and the silicon devices under bond pad. Two major areas are addressed: one is the impact of assembly 1st wire bonding process and another one is the impact of device layout below the bond pad. Simulation includes the ultrasonic transient dynamic bonding process and the stress wave transferred to bond pad device and silicon in the 1st bond. The Pierce strain rate dependent model is introduced to model the impact stain hardening effect. Ultrasonic amplitude and frequency are studied and discussed for the bonding process. In addition, different layouts of device metallization under bond pad are analyzed and discussed for the efforts to reduce the dynamic impact response of the bond pad over active design. Modeling discloses the stress and deformation impacts to both wire bonding and pad below device with strain rate, different ultrasonic amplitudes and frequencies, different friction coefficients, as well as different bond pad thickness and device layout under pad. The residual stress, after cooling down to a lower temperature, is discussed for the impact of substrate temperature. 相似文献
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Tong Hong Wang Yi-Shao Lai 《Electronics Packaging Manufacturing, IEEE Transactions on》2008,31(2):174-179
A design that optimizes package-level along with board-level thermomechanical reliability of a flip-chip package implemented with an organic or a silicon substrate is provided for the package subjected to an accelerated thermal cycling test condition. Different control factors including thickness of substrate, die, board, and polyimide or soldermask are considered. The optimal design is obtained using an L9 (34) orthogonal array according to the Taguchi optimization method. Importance of each of these control factors is also ranked. 相似文献
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Non-conductive adhesive (NCA) flip-chip interconnects are emerging as an attractive alternative to lead or lead-free solder
interconnects due to their environmental friendliness, lower processing temperatures, and extendability to fine-pitch applications.
The electrical connectivity of an NCA interconnect relies solely on the pure mechanical contact between the integrated circuit
(IC) bump and the substrate pad; the electrical conductivity of the contact depends on the mechanical contact pressure, which
in turns depends to a large extent on the cure shrinkage characteristics of the NCA. Therefore, it is necessary to monitor
the evolution of the electrical conductivity which could reflect the impact of cure- and thermal-induced stresses during the
curing and cooling process, respectively. In this article, in situ measurement of the development of contact resistance during the bonding process of test chips was developed by using a mechanical
tester combined with a four-wire resistance measurement system. A drop of resistance induced by the cure stress during the
bonding process is clearly observed. With decreasing bonding temperature, the drop of contact resistance induced by cure shrinkage
becomes larger, while the cooling-induced drop of resistance becomes smaller. The evolution of contact resistance agrees well
with experimental observations of cure stress build-up. It is found that vitrification transformation during the curing of
the adhesive could lead to a large cure stress and result in the reduction of the␣contact resistance. Furthermore, no obvious
changes were observed when the applied load was removed at the end of bonding. 相似文献
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Kun-Mo Chu Won-Kyoung Choi Young-Chul Ko Jin-Ho Lee Hyo-Hoon Park Duk Young Jeon 《Advanced Packaging, IEEE Transactions on》2007,30(1):27-33
A MEMS scanner has been flip-chip bonded by using electroplated AuSn solder bumps. The microelectromechanical systems (MEMS) scanner is mainly composed of two structures having vertical comb fingers. To optimize the bonding condition, the MEMS scanner was flip-chip bonded with various bonding temperatures. Scanning electron microscopy (SEM) with an energy dispersive X-ray (EDX) spectroscopic system was used to observe the microstructures of the joints and analyze the element compositions of them. The die shear strength increased as the bonding temperature increased. During the thermal aging test, the delamination occurred at the interconnection of the MEMS scanner bonded at 340 degC. It is inferred that the Au layer serving as pad metallization has been dissolved in the molten AuSn solder totally, and subsequently the Cr layer was directly exposed to the AuSn solder. Judging by the results of both die shear test and thermal aging test, the optimal bonding temperature was found to be approximately 320 degC. Finally, using this MEMS scanner, we obtained an optical scanning angle of 32deg when driven by the ac control voltage of the resonant frequency in the range of 22.1-24.5 kHz with the 100-V dc bias voltages 相似文献
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A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates
Ho-Young Son Gi-Jo Jung Byung-Jin Park Kyung-Wook Paik 《Journal of Electronic Materials》2008,37(12):1832-1842
The Cu/SnAg double-bump structure is a promising candidate for fine-pitch flip-chip applications. In this study, the interfacial
reactions of Cu (60 μm)/SnAg (20 μm) double-bump flip chip assemblies with a 100 μm pitch were investigated. Two types of thermal treatments, multiple reflows and thermal aging, were performed to evaluate
the thermal reliability of Cu/SnAg flip-chip assemblies on organic printed circuit boards (PCBs). After these thermal treatments,
the resulting intermetallic compounds (IMCs) were identified with scanning electron microscopy (SEM), and the contact resistance
was measured using a daisy-chain and a four-point Kelvin structure. Several types of intermetallic compounds form at the Cu
column/SnAg solder interface and the SnAg solder/Ni pad interface. In the case of flip-chip samples reflowed at 250°C and
280°C, Cu6Sn5 and (Cu, Ni)6Sn5 IMCs were found at the Cu/SnAg and SnAg/Ni interfaces, respectively. In addition, an abnormal Ag3Sn phase was detected inside the SnAg solder. However, no changes were found in the electrical contact resistance in spite
of severe IMC formation in the SnAg solder after five reflows. In thermally aged flip-chip samples, Cu6Sn5 and Cu3Sn IMCs were found at the Cu/SnAg interface, and (Cu, Ni)6Sn5 IMCs were found at the SnAg/Ni interface. However, Ag3Sn IMCs were not observed, even for longer aging times and higher temperatures. The growth of Cu3Sn IMCs at the Cu/SnAg interface was found to lead to the formation of Kirkendall voids inside the Cu3Sn IMCs and linked voids within the Cu3Sn/Cu column interfaces. These voids became more evident when the aging time and temperature increased. The contact resistance
was found to be nearly unchanged after 2000 h at 125°C, but increases slightly at 150°C, and a number of Cu/SnAg joints failed
after 2000 h. This failure was caused by a reduction in the contact area due to the formation of Kirkendall and linked voids
at the Cu column/Cu3Sn IMC interface. 相似文献
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传统的键合专用装备中,分为球焊设备和楔焊设备,两者使用不同的换能器,不同种类劈刀,不同的焊接形式。比对了两种焊接形式的共同点,通过改造设备,焊接试验得出凸点的形状,引线的拉断力测试,总结和分析利用球焊设备、劈刀来完成楔形焊接的可行性。 相似文献
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通过对铝线邦定在芯片上的可靠性进行研究和试验.结果表明影响其可靠性的因素非常多,如邦定功率、压力以及时间等。本文引用了国际上数篇有关邦定论文的结论,从实际应用出发,阐述了它们的失效状态、干扰因素及控制方法。最后介绍了邦定线在实际应用中的判定方法和技术革新.从而使工程师们在实际应用中能够进一步了解其特性。 相似文献
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The temperature-humidity reliability of anisotropic conductive film (ACF) and non-conductive film (NCF) interconnects is investigated
by measuring the interconnect resistance during temperature-humidity testing (THT) at 85°C and 85% relative humidity. The
four-point probe method was used to measure the interconnect resistance of the adhesive joints constructed with Au bumps on
Si chips and Cu pads on flexible printed circuits (FPCs). The interconnect resistance of the ACF joints was markedly higher
than that of the NCF joints, mainly due to the constriction of the current flow and the intrinsic resistance of the conductive
particles in the ACF joints. The interconnect resistances of both interconnects decreased with increasing bonding force, and
subsequently converged to about 10 mΩ and 1 mΩ at a bonding force of 70 N and 80 N, for the ACF and NCF joints, respectively.
During the THT, two different conduction behaviors were observed: increased interconnect resistance and the termination of
Ohmic behavior. The former was due to the decreased contact area caused by z-directional swelling of the adhesives, whereas the latter was caused by either contact opening in the adhesive joints or
interface cracking. 相似文献
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本文通过用于焊点形态预测软件SURFACE EVOLVER的输入数据文件,得到倒装焊焊点形态.参考模板开口指导说明(IPC-7525),拟定模板开口方案,得到相应的焊点形态.通过建立有限元模型,运用ANSYS软件对含铅焊点在热循环加载条件下的应力应变和疲劳寿命进行分析.根据预测得到的热疲劳寿命,找出了适合本文模型的模板结构参数,同时分析了其它设计与工艺参数和焊点可靠性之间的关系. 相似文献
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《Components and Packaging Technologies, IEEE Transactions on》2008,31(3):586-591